Method for producing portable data carriers

Abstract

A method for producing a portable data carrier includes a spatial structure printed on a first foil. Electroconductive lines are applied first, and components are subsequently inserted in the structure, wherein the structure corresponds to the dimensions or the shape and size of the inserted components. The components are electroconductively connected to the lines therein. A cover is printed over the components. A second foil can be applied to the cover, wherein a design print can be applied to both foils. A gap can be incorporated in the structure and the foils, in order to insert a chip module.

Claims

1. A method for producing a portable data carrier, wherein at least one spatial structure is three dimensionally printed, wherein the shape and the size of the at least one spatial structure corresponds to at least one component to be inserted in the at least one spatial structure, and wherein the at least one spatial structure is printed on at least one first foil.

2. The method according to claim 1, further comprising at least one conductive path wherein the at least one conductive path is applied to the at least one spatial structure, such that the at least one conductive path is connected electroconductively at least with one component to be inserted.

3. The method according to claim 2, wherein the at least one conductive path is produced by spraying on or casting.

4. The method according to claim 1, wherein before placing the at least one component in the at least one spatial structure an adhesive is applied to the at least one spatial structure or to the at least one component, in order to fixate the at least one component or in order to compensate an uneven area of the at least one spatial structure or in order to electroconductively connect the at least one component with at least one conductive path.

5. The method according to claim 1, wherein the at least one component placed in the at least one spatial structure is covered at least partially by means of a printed cover, such that an even outer surface of the data carrier results.

6. The method according to claim 5, further comprising at least one second foil wherein the at least one second foil is applied to the cover.

7. The method according to claim 1, wherein an electronic component is placed as component in the at least one spatial structure.

8. The method according to claim 7, wherein as electronic component a chip or an antenna coil or a contact area according to ISO 7810 or a sensor or an electronic display or a feeler is placed.

9. The method according to claim 1, further comprising a first foil or a second foil wherein at least the first or at least the second foil is made available in the form of a foil sheet or in the form of a foil web unwound from a roll.

10. The method according to claim 1, further comprising at least one gap wherein the at least one gap is incorporated in the at least one spatial structure or in the at least first or in the at least second foil.

11. The method according to claim 10, wherein the at least one gap has the shape of a chip module to be inserted in the gap.

12. The method according to claim 1, wherein at least the first and/or at least the second foil is printed.

13. The method according to claim 1, wherein data carriers are punched out from the foil sheet or from the foil web.

14. A portable data carrier produced in a method according to claim 1.

15. A method for producing a portable data carrier, wherein at least one spatial structure is three dimensionally printed, wherein the shape and the size of the at least one spatial structure corresponds to at least one component to be inserted in the at least one spatial structure, wherein before placing the at least one component in the at least one spatial structure an adhesive is applied to the at least one spatial structure or to the at least one component, in order to fixate the at least one component or in order to compensate an uneven area of the at least one spatial structure or in order to electroconductively connect the at least one component with at least one conductive path.

16. A method for producing a portable data carrier, wherein at least one spatial structure is three dimensionally printed, wherein the shape and the size of the at least one spatial structure corresponds to at least one component to be inserted in the at least one spatial structure, wherein the at least one component placed in the at least one spatial structure is covered at least partially by means of a printed cover, such that an even outer surface of the data carrier results.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) In the following, exemplary embodiments of the invention will be described in detail with reference to the attached figures.

(2) FIGS. 1 to 8 represent the individual steps for producing a portable data carrier according to the method of the invention.

(3) FIG. 9 represents an alternative embodiment with a module inserted from the outside.

DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS

(4) At the start of the production of a portable data carrier, e.g. a chip card, a SIM card or a credit card, according to the method of the invention, in FIG. 1 a light-transmissive or a light non-transmissive foil 2 is made available in the form of a sheet or in the form of foil unwound from a roll. For example a light-transmissive foil 2 is utilized for display cards or a light non-transmissive foil 2 is utilized for cards with electronic components which are not to be visible from the outside. Alternatively, also a partly transparent foil can be utilized, e.g. a foil having light-transmissive and light non-transmissive stripes.

(5) To at least one side of the foil 2 a design or an artwork or other print 4 is applied in FIG. 2. All suitable printing methods can be used for this purpose. For example, a digital printing method is suitable in particular for a so-called roll-to-roll method, meaning that at least one foil 2 is made available for the process from the roll. The foil 2 is unwound, fed to the process and for example wound up again after the processing, in order to further process the foil 2 or for example in order to punch out data carriers from the processed foil 2. The foil 2 can be printed by means of the digital printing method among other things during one passage through the process.

(6) To the side of the foil 2 that lies opposite the print 4, in FIG. 3 a structure 6 is imprinted by means of a three-dimensional printer 8. As printer 8, any suitable printer can be utilized for creating three-dimensional structures. For example, for the present invention printers for a so-called rapid-prototyping process can be utilized. The structure 6 has the shape and size or the dimensions of components to be inserted in the structure 6 at a later time. The structure 6 can also be slightly larger than the component to be inserted.

(7) Before inserting components in the structure 6, in FIG. 4 at least one conductive path 12 is applied by means of a metering head 10. The conductive path 12 can for example be imprinted or sprayed on or cast on. The conductive path 12 is laid such that the conductive path 12 connects in corresponding electroconductive fashion corresponding contacts of components to be placed at a later time.

(8) In FIG. 5 components 14 are placed in the structure 6 and possibly connected to the conductive path 12. Optionally, an adhesive can be applied to the component 14 or to the structure 6 in order to fixate the component 14 or in order to compensate uneven areas on the structure 6.

(9) After inserting and connecting the components 14, a cover 16 is applied to the components 14 by means of the three-dimensional printer 8, as represented in the FIGS. 6 and 7. The components 14 are enclosed entirely for this purpose. Alternatively, also hollow spaces can result between the components 14 and the cover 16, in order to use the hollow spaces for a later function of the components 14, e.g. for a vibrating component.

(10) In FIG. 8 a foil 18 is applied to the cover 16. The foil 18 can have an imprint 20 on at least one side. The foil 18 itself can be attached to the cover 16 by means of an adhesive. The adhesive can be activatable by heat or be cured at room temperature.

(11) In order to electroconductively connect a contact of a component to a conductive path 12, it is possible to use an electroconductive adhesive especially in the region of an electroconductive connection between the contact of a component and the conductive path 12.

(12) When the foil 2 and/or 18 was processed in sheet form or web form, a finished portable data carrier, e.g. a SIM card, can be punched out from the created composite.

(13) FIG. 9 represents an alternative embodiment with a module 22 inserted from the outside. In this embodiment, a gap was provided in the foil 2 and in the imprint 4. The gap has a size such that a module 22, e.g. a chip module, is inserted from the outside, wherein the size of the gap can also be slightly larger than the module 22 to be inserted. In order to avoid a milling out of the structure 6 in order to create a gap for the module 22, the shape and/or the size of the module 22 can be left out upon printing the structure 6.

LIST OF REFERENCE NUMBERS

(14) 2 light-transmissive or light non-transmissive foil or a foil having both light-transmissive and light non-transmissive regions 4 design, artwork, imprint 6 printed structure 8 three-dimensional printer 10 metering head for applying a conductive path 12 conductive path 14 components inserted in the structure, e.g. electronic components 16 cover of the inserted components 18 light-transmissive or light non-transmissive foil or a foil having both light-transmissive and light non-transmissive regions 20 design, artwork, imprint 22 inserted module