Method for manufacturing metallic reflector for LED package

Abstract

A metallic reflector manufacturing method for an LED package. The method includes preparing a metal plate, and processing a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body. A reflection surface that is slanted by a predetermined angle is formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside. A fixation portion is formed to fix the lower body on a substrate that the LED chip is mounted on. The method further includes sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface. The stamping processing includes a piercing step, a drawing step, a first noting step, a half etching step that forms the fixation portion, and a second notching step.

Claims

1. A method of manufacturing a metallic reflector having a reflection surface formed to surround an LED chip that is disposed on a substrate at a predetermined height and having a predetermined slant angle to reflect the light of the LED chip to the outside, the method comprising: (a) preparing a metal plate; (b) processing, by stamping, a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body, a reflection surface that is slanted by a predetermined angle formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside, and a fixation portion to fix the lower body on the substrate that the LED chip is mounted on; and (c) sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface; wherein the stamping processing of step (b), comprises: (b-1) piercing a base hole for each stage of the stamping process at an upper and lower edge of the metal plate in a length direction of the metal plate; (b-2) draw forming the reflection surface on the metal plate between the base holes; (b-3) eliminating scrap from the metal plate by a first notching step; (b-4) forming the fixation portion by a half etching step; (b-5) forming an opening by a second notching step, wherein the opening is a through hole defined by and surrounded by the lower body, such that the LED chip and the substrate are exposed to the outside through the opening while the lower body is disposed on the substrate on which the LED chip is disposed, wherein the method further comprises: forming, by a bending step, a catching portion, which fixes the stamping reflector on the substrate, during the stamping process; and eliminating, by a cutting step, unnecessary parts from the stamping reflector, after step (b-5), wherein a step portion is formed outside the lower body and the upper body to distinguish the lower body and the upper body in step (b-2), wherein the metal plate includes a Cu plate, and wherein the catching portion is formed to include a hook part which protrudes towards an inner side of the stamping reflector.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a cross-sectional view of an LED package according to a conventional art.

(2) FIG. 2 is a plane view of a conventional LED package that improves a conventional art of FIG. 1.

(3) FIG. 3 is a cross-sectional view showing a section along line I-I of FIG. 2.

(4) FIG. 4 is a cross-sectional view of a conventional molding type LED package that a reflector is molded by resin molding material to fix the reflector.

(5) FIG. 5 is a front perspective view showing an exemplary embodiment of a metallic reflector that a metallic reflector manufacturing method for an LED package is applied thereto according to the present invention.

(6) FIG. 6 is a front view of FIG. 5.

(7) FIG. 7 is a rear perspective view of FIG. 5.

(8) FIG. 8 is a cross-sectional view showing an LED package that a metallic reflector of FIG. 5 is applied thereto.

(9) FIG. 9 is a front perspective view showing another exemplary embodiment of a metallic reflector that a metallic reflector manufacturing method for an LED package is applied thereto according to the present invention.

(10) FIG. 10 is a rear perspective view of FIG. 11.

(11) FIG. 11 is a cross-sectional view showing an LED package that a metallic reflector is applied thereto of FIG. 9.

(12) FIG. 12 is a schematic flowchart sequentially showing a metallic reflector manufacturing method for an LED package according to the present invention.

(13) FIG. 13 is a plane view of a metal plate that a metallic reflector manufacturing method for an LED package according to the present invention.

(14) FIG. 14 to FIG. 17 is a processing flowchart showing a stamping processing in a metal plate of FIG. 13.

DETAILED DESCRIPTION OF THE EMBODIMENTS

(15) Hereinafter, referring to the drawings, a desirable exemplary embodiment will be described according to the present invention.

(16) FIG. 5 is a front perspective view showing an exemplary embodiment of a metallic reflector that a metallic reflector manufacturing method for an LED package is applied thereto according to the present invention, and FIG. 6 is a front view of FIG. 5, and FIG. 7 is a rear perspective view of FIG. 5.

(17) Also, a cross-sectional view showing an LED package that a metallic reflector of FIG. 5 is applied thereto is shown in FIG. 8.

(18) Referring to FIG. 5 and FIG. 8, a metallic reflector 130 that a metallic reflector manufacturing method for an LED package is applied thereto according to the present invention includes a reflection surface that has a predetermined height to surround an LED chip 120 that is mounted on a substrate 110 and has a reflection surface that is slanted by a predetermined angle to reflect the light of the LED chip 120 to the outside.

(19) More specifically, the metallic reflector 130 includes a lower body 134 that the lower surface thereof is bonded on a substrate 110, an upper body 132 that is extended from an upper portion of the lower body 134 and a catching projection 132a protrudes in a predetermined directions, and a catching portion 133 that faces each other at both sides of edges of the upper body 132 and a hook part 133a protrudes toward an inner side at a lower end portion such that a reflector 130 can be fixed on a substrate 110.

(20) Also, as shown in FIG. 7, a lower body 134 of a lower portion of the catching projection 132a includes a taper 134a and 134b that becomes narrower as it goes to a lower side.

(21) Accordingly, as shown in FIG. 5 and FIG. 8, a resin molding material is molded between an inner side (S) of the catching portion 133 and an outer side of the taper 134a and 134b of the lower body 134 of a lower side of the catching projection 132a such that a metallic reflector 130 is securely fixed on a substrate 110.

(22) And, because a hook portion 133a is formed at the catching portion 133, the reflector 130 of metallic material can be further strongly fixed.

(23) Also, because the outside of the upper body 132 and the catching portion 133 are exposed and is not molded by molding material, the heat radiation problem of an LED chip 120 is resolved.

(24) And, a through hole 160 is formed at an inner surface of the lower body 134 and the upper body 132 such that the LED chip 120 of a substrate 110 is exposed outside the metallic reflector 130, and a reflection surface is formed on an interior circumference of the through hole 160.

(25) The reflection surface includes four main reflection surfaces 131a and 131b of substantially quadrangle shape and sub reflection surface 131c that is formed at each edge of the main reflection surfaces 131a and 131b and has an area smaller than that of the main reflection surfaces.

(26) And, two reflection surfaces that face each other of the main reflection surfaces 131a and 131b has a slant angle increment surface 131b that the slant angle thereof is increased in a predetermined height.

(27) It is desirable that the slant angle increment surface 131b is formed at a surface that intersects in rectangular with the catching portion 133 during a stamping processing.

(28) As described above, because the sub reflection surface 131c is formed between the main reflection surfaces 131a and 131b, a reflection blind spot of a conventional rectangular edge is eliminated such that the reflection efficiency of the LED chip 120 can be improved.

(29) Also, the slant angle increment surface 131b is formed on the main reflection surfaces 131a and 131b of front and rear or left and right of the said reflections, for example, in a case that a shape (rectangle) or a mounting position of the LED chip 120 is changed, it deals with a case that the main reflection surfaces 131a and 131b are formed with an equal width.

(30) Accordingly, it can be dealt in accordance with the shape and the mounting position of the LED chip 120 such that the reflection efficiency is not deteriorated.

(31) Meanwhile, reference numerals 150a and 150b that are not described in FIG. 8 denotes a terminal lid.

(32) And, in a case that the LED chip 120 is bonded by a wire, an inside hole (through hole 160) of the reflection surface is charged with an encapsulant (not shown).

(33) A front perspective view of another exemplary embodiment of a metallic reflector that a metallic reflector manufacturing method for an LED package is applied thereto is shown in FIG. 9 according to the present invention, and a rear perspective view of FIG. 11 is shown in a FIG. 10.

(34) And, a cross sectional view showing an LED package that a metallic reflector of FIG. 9 is applied thereto is shown in FIG. 11.

(35) Referring to FIG. 9 to FIG. 11, the metallic reflector 300 that the metallic reflector manufacturing method for an LED package is applied thereto according to the present invention includes an upper body 301 and a lower body 302 that is extended in a lower portion of the upper body 301 and is integrally formed with the upper body 301.

(36) And, as shown in FIG. 11, because a first opening 303a, which a reflection surface 303 having a predetermined angle is formed, is formed at a central portion of the upper body 301 and the lower body 302, the light of the LED chip 120 that is disposed on the substrate 304 is reflected by the reflection surface 303 outside the metallic reflector 300.

(37) Particularly, a second opening 304 is formed inside a lower end portion of the lower body 302, and the lower body 302 is fixedly inserted into an insertion hole 311a of the substrate 311. That is, the lower body 134 and 302 of the metallic reflector 130 according to an exemplary embodiment of FIG. 5 or a metallic reflector 300 according to an exemplary embodiment of FIG. 9 function as a fixation portion that is fixed on the substrate 110 and 304.

(38) Accordingly, because the metallic reflector 130 and 300 according to the present invention is fixed on the substrate 110 and 304, the bonding strength of them is not less than that of the adhesive, the assembly of them is easy, and the structure of the metallic reflector 130 and 300 is reinforced.

(39) Besides, because of a fixation structure of the lower body of the metallic reflector according to the present invention, most of the part of the outer surface of the upper body can be exposed to the atmosphere, and as described in FIG. 4, there is no need to seal all of the reflector 40 by the housing 10 and the encapsulant 30.

(40) Accordingly, it is advantageous to radiate the heat of the LED chip 120 to the outside, and the performance, the durability, and the reliability of the LED package can be improved.

(41) The metallic reflector manufacturing method for an LED package according to the present invention having the above structure will be described.

(42) A schematic flowchart sequentially shows a metallic reflector manufacturing method for an LED package according to the present invention in FIG. 12.

(43) A metallic reflector manufacturing method for an LED package according to the present invention, as shown in FIG. 13, a metal plate (e.g., Cu plate) 200 having a predetermined width, length, and thickness is prepared (step 410). Subsequently, the metallic reflector 130 of FIG. 5 or FIG. 9 is formed by a stamping process (Step 420).

(44) That is, a reflector product 130a is formed by a stamping process, wherein the reflector product 130a includes a lower body 134 and 302 and an upper body 132 and 301 that is extended from an upper side of the lower body 134 and 302 and is integrally formed with the lower body 134 and 302, reflection surfaces 131a, 131c, 303 that are slanted at a predetermined angle is formed at a central portion of the upper body 132 and 301 and the lower body 134 and 302 to reflect the light of the LED chip 120 to the outside, openings 160 and 303a are formed at a lower portion of the reflection 131a, 131c, 303 to expose the LED chip 120, and a fixation portion is formed to fix the lower body 134 and 302 on the substrate 110 and 304 that the LED chip 120 is mounted.

(45) Subsequently, Ni plating is formed on the surface of the refection surface 131a, 131c, 303 or the reflector product 130a, and Ag plating is sequentially performed (Step 430).

(46) Meanwhile, before the Ni plating is performed, Cu strike plating of a thin film (1-2 m) can be formed on the surface of the refection surface 131a, 131c, 303 or the reflector product 130a within in a short time so as to improve the plating reliability.

(47) Accordingly, the metallic reflector 130 and 300 for the LED package according to the present invention is plated at least twice such that the lifting phenomenon of the surface plating layer of the reflection surface 131a, 131c, 303 or the reflector product 130a can be prevented.

(48) Also, an oxidation process or a color change prevention process is performed on the surface of the reflector product 130a that is plated as described above (step 440).

(49) Meanwhile, as described above, because a conventional metallic reflector is formed by a die casting forming, a trimming process has to be performed after the die casting forming.

(50) Accordingly, a manufacturing process of the metallic reflector 130 according the present invention is simple compared to a conventional process without the trimming process.

(51) And, the metal plate 200 can use Zn or Al besides Cu plate.

(52) However, the metal plate 200 can include Fe, Al, or Au besides the above element.

(53) On the other hand, a stamping process of the step 420 will be described in more detail. Hereinafter, a metallic reflector according to an exemplary embodiment of FIG. 5 will be described as an example.

(54) Firstly, as shown in FIG. 13, a piercing (step 420a) is performed, wherein a base hole 201 for each course of a stamping process is formed at an upper and a lower edge of a metal plate in a length direction of the metal plate 200 by a piercing punch (not shown).

(55) Subsequently, as shown in FIG. 14, a drawing punch 301b of a stamping mold is used to perform a drawing (step 420b) that forms a reflection surface 131a and 131c on the metal plate 200 between the base holes 201.

(56) In the 420b step, a step portion is formed outside the lower body 134 and the upper body 132 to distinguish the lower body 134 and the upper body 132.

(57) And, a first notch punch (not shown) of the stamping mold is used to perform a first notching (step 420c) to eliminate a scrap from the metal plate.

(58) Also, as shown in FIG. 15, a half etching punch 302b of a stamping mold is used to perform a half etching (step 420d) to form a fixation portion or a catching portion 133 such as the lower body 134.

(59) Subsequently, as shown in FIG. 16, a second notching punch 303b of a stamping mold is used to perform a second notching (step 420e) to form an opening 160.

(60) And, in a case that the catching portion 133 is formed to fix the reflector product 130a on the substrate 110 in the stamping process, as shown in FIG. 17, a bending punch 350b of the stamping mold is used to perform a bending to form a catching portion 133.

(61) And, after the step 420e, a cutting punch 306b of a stamping mold is used to perform a cutting (step 420f) to eliminate unnecessary parts from the reflector product or to drop the reflector product 130a from the metal plate 200.

(62) Also, in the step 430, the Ni plating and the Ag plating can be formed by one of a rack plating and a barrel plating. That is, the plating that is performed in a metallic reflector manufacturing method for a led package according to the present invention can be a rack plating that plates the metal plate 200 that the reflector product 130a is formed as shown in FIG. 13 or can be a barrel plating that aggregates the reflector products to plate them after the cutting process.

(63) While this invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

DESCRIPTION OF SYMBOLS

(64) 100. LED package

(65) 110,304. substrate

(66) 120. LED chip

(67) 130,300. metallic reflector

(68) 131a,131b. main reflection surface

(69) 131c. sub reflection surface

(70) 132,301. upper body

(71) 132a. catching projection

(72) 133. catching portion

(73) 134,302. Lower body