CONFORMABLE REVERSIBLE ADHESIVES WITH SHAPE MEMORY ASSISTED DELAMINATION

Abstract

A shape memory elastomeric composite that has temperature-controlled, shape memory, and reversible adhesive properties, and is soft enough to confirm to an irregular surface. The composite is formed from a synthesized polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer and poly(-caprolactone) by electrospinning the two components separately and simultaneously and then hot compacting the electrospun composition to form a dense film.

Claims

1. A reversible adhesive, comprising: a composite mat having a first set of fibers and a second set of fibers that are dispersed and intertwined together; wherein the first set of fibers comprise poly(-caprolactone); and wherein the second set of fibers comprise a polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer.

2. The adhesive of claim 1, wherein the poly(-caprolactone) fibers have a melting point of around 56 degrees Celsius.

3. The adhesive of claim 2, wherein the polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer fibers have a glass transition temperature of around minus 54 degrees Celsius, a first melting point of around degrees Celsius, and a second melting point of around 116 degrees Celsius.

4. The adhesive of claim 3, wherein the poly(-caprolactone) fibers comprise between two and 38 weight percent of the composite mat.

5. The adhesive of claim 4, wherein the composite mat is characterized by at least one thousand percent strain prior to failure.

6. The adhesive of claim 5, wherein the composite mat has a Young's modulus from 6 to 30 MPa.

7. A method of providing a reversible adhesive, comprising: providing a composite mat having a first set of fibers and a second set of fibers that are dispersed and intertwined together, wherein the first set of fibers comprise poly(-caprolactone) and the second set of fibers comprise a polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer; heating the composite mat above a melting temperature of the poly(-caprolactone) fibers; and contacting the heated composite mat to a substrate.

8. The method of claim 7, further comprising the step of simultaneously electrospinning the first set of fibers with the second set of fibers to form the composite mat of dispersed and intertwined fibers.

9. The method of claim 8, wherein the poly(-caprolactone) fibers have a melting point of around 56 degrees Celsius.

10. The method of claim 9, wherein the polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer fibers have a glass transition temperature of around minus 54 degrees Celsius, a first melting point of around degrees Celsius, and a second melting point of around 116 degrees Celsius.

11. The method of claim 10, wherein the poly(-caprolactone) fibers comprise between two and 38 weight percent of the composite mat.

12. The method of claim 11, wherein the composite mat is characterized by at least one thousand percent strain prior to failure.

13. The method of claim 12, wherein the composite mat has a Young's modulus from 6 to 30 MPa.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0009] The present invention will be more fully understood and appreciated by reading the following Detailed Description in conjunction with the accompanying drawings, in which:

[0010] FIG. 1 is a schematic of a reaction mechanism used to synthesize a multiblock polyurethane elastomer according to the present invention;

[0011] FIG. 2 is a schematic of a dual-electrospinning setup used to simultaneously electrospin PCL and the synthesized POSS-TPU where syringes containing each solution were placed on opposing sides of the rotating and translating collector drum to minimize interference from the electric fields.

[0012] FIGS. 3(a) through 3(c) are scanning electron microscopy images of (a) composite fibers, (b) SMEC film surfaces, and (c) cross-sections of the SMEC films with (i) 2, (ii) 12, (iii) 17, and (iv) 38 wt % PCL;

[0013] FIG. 4 is a graph of DSC second heating curves for the PCL/POSS-TPU SMECs containing: (i) 0 (neat POSS-TPU), (ii) 2, (iii) 12, (iv) 17, (v) 38, and (vi) 100 (neat PCL) wt % PCL, where all heating and cooling rates were 10 C. min.sup.1;

[0014] FIGS. 5(a) and 5(b) are tensile stress-strain curves indicating: (a) the high elongation and (b) the Young's moduli of the SMECs containing (i) 0 (neat POSS-TPU), (ii) 2, (iii) 12, (iv) 17, (v) 38, and (vi) 100 (neat PCL) wt % PCL;

[0015] FIGS. 6(a) through 6(d) are three-dimensional stress-temperature-strain plots demonstrating the shape memory capabilities of the SMECs containing (a) 2, (b) 12, (c) 17, and (d) 38 wt % PCL. In (a), the steps of the shape memory cycle are indicated by arrows as follows: (i) shape programming; at 60 C., dog bone shaped films (ASTM D63, scale) were stretched to 20% strain by ramping the tensile force at 0.02 N min.sup.1; (ii) shape fixing; the temporary shape was fixed into the composite by ramping the temperature to 20 C. (below PCL's crystallization temperature); (iii) unloading; the shape fixing ability was observed by unloading the applied force at 0.05 N min.sup.1 to 0.001 N; (iv) shape recovery; the programmed strain was recovered by heating the films to 80 C., which melted the PCL, allowing elastic contraction; and

[0016] FIGS. 7(a) through 7(c) are graphs of the adhesive characterization of the SMEC films as follows: (a) apparent pull-off strengths for the SMECs with varying PCL content. The adhesive strength was tested at 20 C. (gray) with the PCL crystallized (adhered) to the steel clamp and at 70 C. (blue) with the PCL melted (debonded). The adhesive strength was significantly reduced by melting the PCL, indicating reversibility in adhesion. (b) Effect of applied load on adhesive strength for the SMEC containing 12 wt % PCL. With increasing applied load, the apparent pull-off strength increased. Thus, the SMECs behave also as pressure-sensitive adhesives. (c) Comparison of pull-off strengths for the 12 wt % SMEC adhered at 20 C. (bonded, gray), 70 C. (debonded, blue), and 70 C. with shape memory assisted delamination (debonded, red). Exploitation of the shape memory properties reduced the delamination force to nearly 0 N.

DETAILED DESCRIPTION OF THE INVENTION

[0017] Referring now to the drawings, wherein like reference numerals refer to like parts throughout, there is seen in FIG. 1 a reaction mechanism for synthesizing an elastomer that is soft enough to conform to an irregular surface. Poly(-caprolactone) (PCL, M.sub.n=70-90 kg mol.sup.1) and a synthesized polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer (POSS-TPU), with the synthesis mechanism also seen in FIG. 1, were used to form the soft, shape memory polymer composite. More specifically, the polyhedral oligomeric silsesquioxane-containing thermoplastic polyurethane elastomer was formed from 1,2 propane diol isobutyl polyhedral oligomeric silsesquioxane (POSS) and low molecular weight poly(-caprolactone) (PCL1k, 1.25 kg mol.sup.1) that were combined in a 70:30 mass ratio PCL1k:POSS. Hexamethylene diisocyanate (HDI) was added to achieve initially a 0.95:1 molar ratio HDI:monomer. The components were dissolved in toluene, heated to 100 C., and isobutyl tin POMS catalyst was added (0.1 wt %). Additional HDI was added in 12 L increments until a molar ratio of 1.05:1 HDI:monomer was achieved. The synthesized product, POSS-TPU, was subsequently precipitated in cold n-hexanes, washed in deionized water, and dried.

[0018] PCL and POSS-TPU were separately dissolved in 80:20 volume ratio chloroform:N,N-dimethylformamide (DMF) mixtures to obtain 20 and 40% (w/v) solutions, respectively. The two polymer solutions were then electrospun separately and simultaneously, as seen in FIG. 2, with the resulting fibers collected on the same mandrel to obtain composite mats with well dispersed and intertwined fibers of both polymers. More specifically, the electrospinning system 10 comprised a syringe pump 12 for delivering a polymer solution 14 through the metallic needle 16 of a syringe 18. The metallic needle 16 and a metal collector 20 are coupled to a high voltage supply 22 so that a charged jet 24 from needle 16 can be collected by metal collector 20. A second syringe 26 is similarly used to provide a second charged jet 28 for collection on metal collector 20.

[0019] The flow rates and voltages used to electrospin the fibers were varied to adjust the relative composition of the composite. Table 1 below contains the electrospinning parameters used for each composition. The needle-to-mandrel distances were kept constant at about 6 cm. The composite fibers were subsequently subjected to hot compaction (80 C., 1 metric ton), during which the PCL was melted to form a dense film, as seen in FIG. 3.

TABLE-US-00001 TABLE 1 Summary of dual-electrospinning conditions used to fabricate the SMECs Nominal PCL content.sup.a PCL content.sup.b (wt %) Dual-electrospinning conditions (wt %) 5 PCL0.2 mL h.sup.1, 10 kV 2 POSS-TPU5.0 mL h.sup.1, 14.5 kV 18 PCL0.8 mL h.sup.1, 11 kV 12 POSS-TPU5.0 mL h.sup.1, 14.5 kV 26 PCL0.4 mL h.sup.1, 10 kV 17 POSS-TPU1.5 mL h.sup.1, 14 kV 31 PCL1.0 mL h.sup.1, 12 kV 38 POSS-TPU3 mL h.sup.1, 12 kV .sup.aBased on relative flow rates used in dual electrospinning .sup.bCalculated from the ratio of enthalpies of melting of PCL in the SMEC to neat PCL

[0020] Differential scanning calorimetry (DSC) was used to measure the transition temperatures of the composites and components and to estimate the PCL incorporation, as seen in FIG. 4. The neat POSS-TPU exhibited a glass transition temperature around 54 C., a melting point around 20 C., and a second melting point around 116 C. The PCL melting point was measured around 56 C. The composites exhibited all transitions of the neat components with unchanged temperatures. The PCL content was measured by comparing the enthalpy of melting of PCL in the composite to that of neat PCL. The PCL content ranged from 2 to 38 wt % PCL (calculated values provided in Table 1). Such calculated values have been used to define the composition. Control over composition is pertinent to material properties and performance, and the dual-electrospinning method enables adjustment of composition.

[0021] The soft, elastomeric nature of the SMECs is one of the unique attributes of the reversible adhesive system of the present invention. To demonstrate the low modulus and high elongation of the composites, tensile mechanical testing was utilized. Dog bone shaped samples (ASTM D638, scale) were stretched at 33 m s.sup.1 to failure. Referring to FIG. 5, the SMECs of the present invention had high strain-to-failures, with all compositions reaching over 1000% strain prior to failure, as seen in FIG. 5(a). Furthermore, the moduli were relatively low, as is indicative of elastomers. The Young's moduli, taken as the slopes of the initial regions of the stress-strain curves, as seen in FIG. 5(b), ranged from 6 to 30 MPa, with increasing modulus with more PCL incorporation.

[0022] Referring to FIG. 6(a) through (d), the shape memory capabilities of the dual-spun SMECs of the present invention were tested using a dynamic mechanical analyzer. At elevated temperature, the films were stretched to 20% strain in a tensile configuration. After cooling and unloading, the fixing ability was observed. Subsequent heating recovered the permanent form, and the shape recovery was measured. The shape fixing, characterized by degree of strain maintained during unloading, improved with increasing PCL content since PCL crystallization fixed the temporary shape. All compositions had good shape recovery, as was indicated by the return of the strain to near the initial value after heating.

[0023] The adhesive strength of the SMECs of the present invention was tested using the dynamic mechanical analyzer in compression mode. Circular shaped samples were compressed with 1 N force, and then the temperature was ramped to 70 C. At 70 C., the PCL was melted, softening the film further. The temperature was subsequently cooled to 20 C. to crystallize the PCL and adhere the SMEC of the present invention to the steel clamps. The force was then ramped in the reverse direction until a tensile force high enough to delaminate the film from the clamp was applied. The measured force at delamination was normalized by the initial cross sectional area in contact with the clamp to obtain the apparent pull-off strength of the adhesive. This method was used for all compositions to determine the effect of PCL on the adhesive strength. With increasing PCL content, the apparent pull-off strength increased as seen in FIG. 7(a). Similarly, the effect of the applied load was determined by varying the applied compressive force between 0.1 and 3 N. Referring to FIG. 7(b), for a SMEC film with 12 wt % PCL, the apparent pull-off strength increased with applied load, indicating that the SMECs of the present invention perform as pressure-sensitive adhesives.

[0024] As reversible adhesives, the SMECs of the present invention should easily delaminate from the steel clamps at temperatures above PCL's melting point. Under such conditions, the PCL, which is the component adhering the SMEC to the surface, is melted, and thus the adhesive abilities are reversed. Similar methods to those describe previously were used, but prior to unloading the 1 N force, the temperature was again ramped to 70 C. At this elevated temperature, the compressive force was unloaded, and a tensile force was applied until the film delaminated from the clamps. With the PCL melted, the apparent pull-off strengths were less than half of the values measured when PCL was crystallized, as seen in FIG. 7(a). Hence, the SMECs are reversible adhesives.

[0025] While the adhesive force necessary to delaminate the SMECs of the present invention was reduced upon heating, a significant force was still required to separate the SMEC from the clamp surface. To further reduce the adhesive strength, the shape memory properties were exploited. Prior to loading the SMEC for reversible adhesive testing, the film was stretched to 50% tensile strain above PCL's melting point and this strain was fixed upon cooling and crystallization of the PCL, exploiting the shape memory fixing phenomenon exhibited by the SMEC. When the compressive force was unloaded during delamination (at elevated temperature), the film length decreased as the strain was recovered. This change in length resulted in reduced surface area in contact with the clamp, while also disrupting physical interactions between the SMEC and the steel surfaces, and the adhesive strength was reduced to <1 N/cm.sup.2, perceived as negligible, as seen in FIG. 7(c).

[0026] Reversible adhesive properties can be utilized in home improvement or medical adhesives, in manufacturing as a clamping mechanism (for example, the mounting of an optical lens for polishing), or in packaging materials. The unique combination of reversible adhesion and flexibility differentiates the SMEC system of the present invention from other reversible adhesives and such flexibility is advantageous for conformation to curved or textured surfaces.

[0027] In lieu of the POSS-based thermoplastic elastomer, other thermoplastic elastomers that are soluble in a solvent for electrospinning and have a hard-block T.sub.m at least 20 C. higher than the T.sub.m of the PCL component (about 58 C.). For example, Pellethane, PEBAX, or other commercial elastomers such as THERMOLAST, HIPEX, COPEC, and For Tec E (KRAIBURG TPE), Santoprene (ExxonMobil), Termoton by Termopol Polimer, Arnitel (DSM), Solprene (Dynasol), Engage (Dow Chemical), Hytrel (Du Pont), Dryflex and Mediprene (ELASTO), Kraton (Kraton Polymers), Pibiflex may be configured for use instead of the POSS-based thermoplastic elastomer.