CURABLE RESIN COMPOSITION AND DISPLAY DEVICE

Abstract

There is provided a curable resin composition containing quantum dots (A), a resin (B), a photopolymerizable compound (C), and a photopolymerization initiator (D), in which the photopolymerization initiator (D) contains an oxime compound having a first molecular structure represented by the formula (1).

Claims

1. A curable resin composition comprising: quantum dots (A); a resin (B); a photopolymerizable compound (C); and a photopolymerization initiator (D), wherein the photopolymerization initiator (D) contains an oxime compound having a first molecular structure represented by the following formula (1): ##STR00026## wherein R.sup.1 represents R.sup.11, OR.sup.11, COR.sup.11, SR.sup.11, CONR.sup.12R.sup.13, or CN; R.sup.11, R.sup.12, and R.sup.13 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; the hydrogen atoms of the group represented by R.sup.11, R.sup.12, or R.sup.13 are optionally replaced by OR.sup.21, COR.sup.21, SR.sup.21, NR.sup.22Ra.sup.23, CONR.sup.22R.sup.23, —NR.sup.22—OR.sup.23, —N(COR.sup.22)—OCOR.sup.23, —C(═N—OR.sup.21)—R.sup.22, —C(═N—OCOR.sup.21)—R.sup.22, CN, a halogen atom, or COOR.sup.21; R.sup.21, R.sup.22, and R.sup.23 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; the hydrogen atoms of the group represented by R.sup.21, R.sup.22, or R.sup.23 are optionally replaced by CN, a halogen atom, a hydroxy group, or a carboxy group; when the group represented by R.sup.11, R.sup.12, R.sup.13, R.sup.21, R.sup.22, or R.sup.23 has an alkylene moiety, the alkylene moiety is optionally interrupted one to five times by —O—, —S—, —COO—, —OCO—, —NR.sup.24—, —NR.sup.24CO—, —NR.sup.24COO—, —OCONR.sup.24—, —SCO—, —COS—, —OCS—, or —CSO—; R.sup.24 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; when the group represented by R.sup.11, R.sup.12, R.sup.13, R.sup.21, R.sup.22, or R.sup.23 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic, and R.sup.12 and R.sup.13, and R.sup.22 and R.sup.23 are each optionally joined together to form a ring; and * represents a bond with a second molecular structure which is a molecular structure other than the first molecular structure of the oxime compound.

2. The curable resin composition according to claim 1, wherein the second molecular structure is a structure represented by the following formula (2): ##STR00027## wherein R.sup.2 and R.sup.3 each independently represent R.sup.11, OR.sup.11, SR.sup.11, COR.sup.11, CONR.sup.12R.sup.13, NR.sup.12COR.sup.11, OCOR.sup.11, COOR.sup.11, SCOR.sup.11, OCSR.sup.11, COSR.sup.11, CSOR.sup.11, CN, or a halogen atom; a plurality of R.sup.2, when present, are optionally the same or different; a plurality of R.sup.3, when present, are optionally the same or different; R.sup.11, R.sup.12, and R.sup.13 have the same meaning as described above; s and t each independently represent an integer of 0 to 4; L represents a sulfur atom, CR.sup.31R.sup.32, CO, or NR.sup.33; R.sup.31, R.sup.32, and R.sup.33 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms; when the group represented by R.sup.31, R.sup.32, or R.sup.33 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic, and R.sup.31, R.sup.32, and R.sup.33 are each independently and optionally joined together to form a ring with any of adjacent benzene rings; R.sup.4 represents a hydroxy group, a carboxy group, or a group represented by the following formula (2-1):
[Formula 3]
(R.sup.4a).sub.v-L.sup.2-L.sup.1-  (2-1) wherein L.sup.1 represents —O—, —S—, —NR.sup.22—, —NR.sup.22CO—, —SO.sub.2—, —CS—, —OCO—, or —COO—; R.sup.22 has the same meaning as described above; L.sup.2 represents a group obtained by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms; when the group represented by L.sup.2 has an alkylene moiety, the alkylene moiety is optionally interrupted one to five times by —O—, —S—, —COO—, —OCO—, —NR.sup.22—, —NR.sup.22COO—, —OCONR.sup.22—, —SCO—, —COS—, —OCS—, or —CSO—, and the alkylene moiety is optionally branched or cyclic; R.sup.4a is each independently OR.sup.41, SR.sup.41, CONR.sup.42R.sup.43, NR.sup.42COR.sup.43, OCOR.sup.41, COOR.sup.41, SCOR.sup.41, OCSR.sup.41, COSR.sup.41, CSOR.sup.41, CN, or a halogen atom; a plurality of R.sup.4a, when present, are optionally the same or different; R.sup.41, R.sup.42, and R.sup.43 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an aralkyl group having 7 to 30 carbon atoms, and when the group represented by R.sup.41, R.sup.41, and R.sup.43 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic, and R.sup.41 and R.sup.43 are optionally joined together to form a ring; and v represents an integer of 1 to 3; and * represents a bond with the first molecular structure of the oxime compound.

3. The curable resin composition according to claim 2, wherein L is a sulfur atom.

4. The curable resin composition according to claim 2, wherein R.sup.4 is a group represented by the formula (2-1), L.sup.1 is —O—, and R.sup.4 is OH.

5. The curable resin composition according to claim 1, wherein the second molecular structure is a structure represented by the following formula (3): ##STR00028## wherein R.sup.5 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; when the group represented by R.sup.5 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic; the hydrogen atoms of the group represented by R.sup.5 are optionally replaced by R.sup.21, OR.sup.21, COR.sup.21, SR.sup.21, NR.sup.22R.sup.23, CONR.sup.22R.sup.23, —NR.sup.22—OR.sup.23, —N(COR.sup.22)—OCOR.sup.23, NR.sup.22COR.sup.21, —OCOR.sup.21, COOR.sup.21, —C(═N—OR.sup.21)—R.sup.22, —C(═N—OCOR.sup.21)—R.sup.22, SCOR.sup.21, OCSR.sup.21, COSR.sup.21, CSOR.sup.21, a hydroxyl group, a nitro group, CN, a halogen atom, or COOR.sup.21; R.sup.21, R.sup.22, and R.sup.23 have the same meaning as described above; the hydrogen atoms of the group represented by R.sup.21, R.sup.22, or R.sup.23 are optionally replaced by CN, a halogen atom, a hydroxy group, or a carboxy group; when the group represented by R.sup.21, R.sup.22, and R.sup.23 has an alkylene moiety, the alkylene moiety is optionally interrupted one to five times by —O—, —S—, —COO—, —OCO—, —NR.sup.24—, —NR.sup.24CO—, —NR.sup.24COO—, —OCONR.sup.24—, —SCO—, —COS—, —OCS—, or —CSO—; R.sup.24 has the same meaning as described above; when the group represented by R.sup.21, R.sup.22, and R.sup.23 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic, and R.sup.22 and R.sup.23 are optionally joined together to form a ring; wherein R.sup.6, R.sup.7, Re, and R.sup.9 are each independently R.sup.61, OR.sup.61, SR.sup.61, COR.sup.62, CONR.sup.63R.sup.64, NR.sup.65COR.sup.61, OCOR.sup.61, COOR.sup.62, SCOR.sup.61, OCSR.sup.61, COSR.sup.62, CSOR.sup.61, a hydroxy group, a nitro group, CN, or a halogen atom; R.sup.61, R.sup.62, R.sup.63, R.sup.64, and R.sup.65 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; the hydrogen atoms of the group represented by R.sup.61, R.sup.62, R.sup.63, R.sup.64, or R.sup.65 are optionally replaced by OR.sup.21, COR.sup.21, SR.sup.21, NR.sup.22Ra.sup.23, CONR.sup.22R.sup.23, —NR.sup.22—OR.sup.23, —N(COR.sup.22)—OCOR.sup.23, —C(═N—OR.sup.21)—R.sup.22, —C(═N—OCOR.sup.21)—R.sup.22, CN, a halogen atom, or COOR.sup.21; R.sup.6 and R.sup.7, R.sup.7 and R.sup.8, and R.sup.8 and R.sup.9 are each optionally joined together to form a ring; and * represents a bond with the first molecular structure of the oxime compound.

6. The curable resin composition according to claim 1, wherein the second molecular structure is a structure represented by the following formula (4): ##STR00029## wherein R.sup.71 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an aralkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; when the group represented by R.sup.71 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic; the hydrogen atoms of the group represented by R.sup.71 are optionally replaced by R.sup.21, OR.sup.21, COR.sup.21, SR.sup.21, NR.sup.22R.sup.23, CONR.sup.22R.sup.23, —NR.sup.22—OR.sup.23, —N(COR.sup.22)—OCOR.sup.23, NR.sup.22COR.sup.21, OCOR.sup.21, COOR.sup.21, —C(═N—OR.sup.21)—R.sup.22, —C(═N—OCOR.sup.21)—R.sup.22, SCOR.sup.21, OCSR.sup.21, COSR.sup.21, CSOR.sup.21, a hydroxyl group, a nitro group, CN, a halogen atom, or COOR.sup.21; R.sup.21, R.sup.22, and R.sup.23 have the same meaning as described above; the hydrogen atoms of the group represented by R.sup.21, R.sup.22, or R.sup.23 are optionally replaced by CN, a halogen atom, a hydroxy group, or a carboxy group; when the group represented by R.sup.21, R.sup.22, and R.sup.23 has an alkylene moiety, the alkylene moiety is optionally interrupted one to five times by —O—, —S—, —COO—, —OCO—, —NR.sup.24—, —NR.sup.24CO—, —NR.sup.24COO—, —OCONR.sup.24—, —SCO—, —COS—, —OCS—, or —CSO—; R.sup.24 has the same meaning as described above; when the group represented by R.sup.21, R.sup.22, and R.sup.23 has an alkyl moiety, the alkyl moiety is optionally branched or cyclic, and R.sup.22 and R.sup.23 are optionally joined together to form a ring; wherein R.sup.72, R.sup.73, and three R.sup.74 each independently represent R.sup.61, OR.sup.61, SR.sup.61, COR.sup.62, CONR.sup.63R.sup.64, NR.sup.65COR.sup.61, OCOR.sup.61, COOR.sup.62, SCOR.sup.61, OCSR.sup.61, COSR.sup.62, CSOR.sup.61, a hydroxy group, a nitro group, CN, or a halogen atom; R.sup.61, R.sup.62, R.sup.63, R.sup.64, and R.sup.65 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms; the hydrogen atoms of the group represented by R.sup.61, R.sup.62, R.sup.63, R.sup.64, or R.sup.65 are optionally replaced by OR.sup.21, COR.sup.21, SR.sup.21, NR.sup.22Ra.sup.23, CONR.sup.22R.sup.23, —NR.sup.22—OR.sup.23, —N(COR.sup.22)—OCOR.sup.23, —C(═N—OR.sup.21)—R.sup.22, —C(═N—OCOR.sup.21)—R.sup.22, CN, a halogen atom, or COOR.sup.21; R.sup.72 and R.sup.73 and two R.sup.74 are each optionally joined together to form a ring; and * represents a bond with the first molecular structure of the oxime compound.

7. The curable resin composition according to claim 1, wherein a content ratio of the quantum dots (A) is 10% by mass or more and 50% by mass or less based on a total amount of a solid content of the curable resin composition.

8. The curable resin composition according to claim 1, wherein the photopolymerization initiator (D) contains the oxime compound and an acylphosphine compound.

9. The curable resin composition according to claim 1, further comprising an antioxidant (E), wherein a ratio of contents of the antioxidant (E) to the photopolymerization initiator (D) in the curable resin composition is greater than 1 in terms of mass ratio.

10. A cured film formed from the curable resin composition according to claim 1.

11. The cured film according to claim 10, wherein a difference between a maximum value and a minimum value of a film thickness is 1.0 μm or less.

12. A display device comprising the cured film according to claim 10.

13. A cured film formed from a curable resin composition, the composition comprising: quantum dots (A); a resin (B); a photopolymerizable compound (C); and a photopolymerization initiator (D), wherein the cured film has a unit emission intensity of 65 μW/μm or more, and a difference between a maximum value and a minimum value of a film thickness of 1.0 μm or less.

Description

EXAMPLES

[0478] Hereinafter, the present invention will be described in more detail by way of examples. Unless otherwise specified, “%” and “part” in the example are % by mass and parts by mass.

[Measurement of Unit Emission Intensity]

[0479] Onto a 5-cm square glass substrate (Eagle 2000; manufactured by Corning Incorporated), a curable resin composition was applied by a spin coat method so that the film thickness set to 10 μm, and then prebaked at 100° C. for 3 minutes, to form a curable composition layer. This curable composition layer was subjected to light irradiation in an exposure amount (basis: 365 nm) of 80 mJ/cm.sup.2 under an air atmosphere using an exposure device (TME-150RSK; manufactured by TOPCON CORPORATION) and after development, post-baking was performed 180° C. for 60 minutes, to obtain a substrate having a cured film.

[0480] A narrow directional angle type sensing backlight illumination (OPF series; manufactured by OPTEX FA CO., LTD.) equipped with an LED lamp having an emission wavelength of 444 nm and a scratch resistant cover was prepared as a backlight. A backlight was placed with the scratch resistant cover facing upward, and an optical fiber for detecting light emission connected to the following spectrometer was installed at a position 4 cm high from the surface of the scratch resistant cover. A glass substrate (Eagle 2000; manufactured by Corning Incorporated) as a reference was placed on the surface of the scratch resistant cover of the backlight. In this state, the backlight was turned on, and the light amount of the backlight was adjusted so that the total radiant flux (μW) of the backlight was 5000 μW through a reference glass substrate (Eagle 2000; manufactured by Corning Incorporated).

[0481] Next, the substrate having the cured film prepared above was disposed on the surface of the glass substrate. In this state, the backlight was turned on, and the emission intensity (unit: μW) of the light emitted from the cured film was measured as an integrated radiant flux in a range of wavelengths of 485 nm or more and 780 nm or less. The emission intensity was measured using a spectrum analyzer (Spectrum meter, manufactured by Ocean Optics, Inc). The value of the obtained emission intensity was divided by the average film thickness of the cured film obtained below to obtain the unit emission intensity.

[Measurement of Film Thickness Unevenness and Average Film Thickness]

[0482] A substrate having a cured film was obtained by the same method as described in the above [Measurement of emission intensity].

[0483] With respect to the substrate having the obtained cured film, the film thickness of the cured film was measured using a film thickness measuring device (Dektak XT; manufactured by ULVAC, Inc.), and the film thickness unevenness ΔT (unit: μm) was obtained as the difference between the maximum value and the minimum value of the film thickness. Specifically, the film thickness was measured using the above film thickness measuring device under the following setting conditions by linearly scanning a stylus so as to pass through the center of the substrate having the cured film.

[0484] Length: 1000 μm

[0485] Speed: 100 μm/s

[0486] Range: 65.5 μm

[0487] The average film thickness of the cured film was measured by the following procedure. First, the cured film was removed so that the glass substrate was exposed at the center of the substrate having the cured film. Next, under the same setting conditions as described above, the film thickness measuring device was used to scan the stylus linearly over a range of 1000 μm so that the portion where the cured film exists and the portion where the glass substrate is exposed are halved. The average value T1 of the film thickness obtained in the range of 300 μm in the middle of the 500 μm scanned area where the cured film exists was obtained, and the average value T2 of the film thickness obtained in the range of 300 μm in the middle of the 500 μm scanned area where the glass substrate is exposed was obtained. Then, the average film thickness of the cured film was obtained as T1−T2.

[0488] The average film thickness of the cured film obtained was 10 μm in both of the following Examples and Comparative Examples.

[Weight-Average Molecular Weight]

[0489] The weight-average molecular weight (Mw) of the resin (B-1) was measured by the GPC method under the following conditions.

[0490] Equipment: K2479 (manufactured by Shimadzu Corporation)

[0491] Column: SHIMADZU Shim-pack GPC-80M

[0492] Column temperature: 40° C.

[0493] Solvent: tetrahydrofuran

[0494] Flow rate: 1.0 mL/min

[0495] Detector: RI

[0496] Standard for calibration; TSK STANDARD POLYSTYRENE F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[Acid Value]

[0497] 3 g of the resin (B-1) solution was finely weighed, dissolved in a mixed solvent of 90 g of acetone and 10 g of water, and the acid value of the resin (B-1) solution was measured by an automatic titrator (manufactured by HIRANUMA Co., Ltd., trade name: COM-555) using the KOH aqueous solution specified in 0.1 as the titrant, and the acid value (AV) per 1 g of solid content was determined from the acid value of the solution and the solid content of the solution.

[Solid content]

[0498] About 1 g of the resin (B-1) solution was weighed in an aluminum cup, dried at 180° C. for 1 hour, and then the mass was measured. The solid content (% by mass) of the resin (B-1) solution was calculated from the mass reduction amount.

Production Example 1: Preparation of Dispersion of Quantum Dots (A-1)

[0499] A toluene dispersion of InP/ZnSeS quantum dots coordinated with oleic acid as a ligand was prepared. The dispersion was distilled under reduced pressure to remove toluene. To 30 parts of the solid content, 70 parts of cyclohexyl acetate was added to obtain a dispersion (solid content: 30%) of quantum dots (a-1).

Production Example 2: Preparation of Dispersion of Light Scattering Agent (H-1)

[0500] DISPERBYK21116 (manufactured by BYK Japan KK) was added to 70 parts of titanium oxide nanoparticles in a solid content of 3 parts and propylene glycol monomethyl ether acetate (hereinafter referred to as “PGMEA”) in a total amount of 100 parts, and the mixture was stirred with a paint shaker until it was sufficiently dispersed to obtain a dispersion (solid content: 73%) of a scattering agent (H-1).

Production Example 3: Preparation of Resin (B-1) Solution

[0501] After 110 parts of PGMEA was put into a flask equipped with a stirrer, a reflux cooling tube with a thermometer, a dropping funnel, and a nitrogen introduction tube, the mixture was stirred while purging nitrogen, and the temperature was raised to 80° C. A solution obtained by dissolving 25 parts of dicyclopentanyl methacrylate, 23 parts of methyl methacrylate, 19 parts of methacrylic acid, and 10 parts of 2,2′-azobis(2,4-dimethylvaleronitrile) in 110 parts of PGMEA was dropped from a dropping funnel into a flask, and stirred at 80° C. for 3 hours.

[0502] Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2′-methylenebis(4-methyl-6 tert-butylphenol), and 0.8 parts of triphenylphosphine were put into a flask, and the temperature was raised to 110° C. and stirred for 8 hours to react the carboxylic acid in the polymer with the epoxy group to introduce a polymerizable unsaturated bond. Then, 17 parts of 1,2,3,6-tetrahydrophthalic acid anhydride was added and the reaction was continued for 3 hours to introduce carboxylic acid groups into the side chains. The reaction solution was cooled to room temperature to obtain a resin (B-1) solution.

[0503] The resin (B-1) had a weight-average molecular weight of 8400 and an acid value of 120 mg KOH/g in terms of standard polystyrene, and the solid content in the resin (B-1) solution was 40% by mass.

Examples 1 to 5, Comparative Examples 1 to 2

[0504] A curable resin composition was prepared by mixing quantum dots (A-1) dispersion obtained in Production Example 1, a light scattering agent (H-1) dispersion obtained in Production Example 2, a resin (B-1) solution obtained in Production Example 3, and other components shown in Table 1 in a predetermined amount.

[0505] The content of each component in the curable resin composition obtained from the addition amount is as shown in Table 1. In Table 1, the contents of components other than the solvent (F) are in terms of solid content (unit: parts by mass). The unit of the content of the solvent (F) is parts by mass. For example, the quantum dots (A-1) are blended as a dispersion of the quantum dots (A-1) in the preparation of the curable resin composition, and the content shown in Table 1 is the amount of the quantum dots (A-1) itself contained in the solution. The solvent (F) in Table 1 contains a solvent contained in the dispersion or solution used for preparing the curable resin composition.

[0506] The content of oleic acid (the organic ligand of the quantum dot) in the curable resin composition shown in Table 1 was calculated based on the measurement of the concentration of oleic acid in the solid content contained in the dispersion of the quantum dots (A-1) obtained in Production Example 1 according to the method [a] below.

[A] Measurement of Oleic Acid Concentration

[0507] After the solvent was removed by vacuum-drying the dispersion of the quantum dots (A-1) at 150° C., the weight change of the remaining solid content was measured at a temperature increasing rate of 5° C./min from 50° C. to 550° C. using a thermogravimetric analyzer “TGDTA 6200”. The weight changed from 50° C. to 500° C. was taken as the weight of oleic acid. From this, the concentration of oleic acid in the solid content was calculated to be 28% by mass.

[0508] The unit emission intensity and the film thickness unevenness ΔT of the obtained curable resin composition were measured and evaluated according to the above. The results are also shown in Table 1.

TABLE-US-00001 TABLE 1 Comparative Example Example 1 2 3 4 5 1 2 Quantum dots (A) A-1 16.6 16.6 16.6 23.1 23.1 16.6 16.6 Organic ligand 6.4 6.4 6.4 8.9 8.9 6.4 6.4 Resin (B) B-1 42.5 42.5 42.2 37.3 36.2 42.5 40.0 Photopolymerizable C-1 10.0 10.0 9.7 8.7 8.4 10.0 9.4 compound (C) C-2 13.3 13.3 13.1 11.6 11.1 13.3 12.5 Photopolymerization D-1 2.1 initiator (D) D-2 2.1 1.9 1.8 1.6 D-3 2.1 6.3 D-4 1.6 Antioxidant (E) E-1 4.0 4.0 5.0 3.5 4.0 4.0 3.7 Solvent (F) F-1 163.0 163.0 163.0 147.0 147.0 163.0 163.0 F-2 42.0 42.0 42.0 58.0 58.0 42.0 42.0 Leveling agent (G) G-1 0.1 0.1 0.1 0.1 0.1 G-2 0.1 0.1 Light scattering H-1 5.0 5.0 5.0 5.0 5.0 5.0 5.0 agent (H) Unit emission (μW/um) 84.2 85.7 86.1 113.2 114.5 72.1 63.6 intensity Film thickness (μm) 0.16 0.03 0.13 0.28 0.12 2.32 0.05 unevenness ΔT

[0509] The details of the abbreviations of the components shown in Table 1 are as follows.

[1] Photopolymerizable compound (C-1): M-510 (polybasic modified acrylate, manufactured by Toagosei Co., Ltd., solid content: 100%)
[2] Photopolymerizable compound (C-2): A-9550 (dipentaerythritol polyacrylate, manufactured by SHIN-NAKAMURA CHEMICAL Co., Ltd., solid content: 100%)
[3] Photopolymerization Initiator (D-1): TR-PBG-3057 (compound represented by the following formula, manufactured by Changzhou Tronly Chemical Co., Ltd., solid content: 100%)

##STR00024##

[4] Photopolymerization Initiator (D-2): compound represented by the following formula. Production was performed by the method disclosed in Japanese Patent Laid-Open No. 2011-132215 (solid content: 100%).

##STR00025##

[5] Photopolymerization Initiator (D-3): Irgacure OXE01 (manufactured by BASF Japan Ltd., solid content: 100%)
[6] Photopolymerization Initiator (D-4): Omnirad 819 (acylphosphine-based photopolymerization initiator, manufactured by IGM Resins B.V., solid content: 100%)
[7] Antioxidant (E-1): SUMILIZER-GP (phosphorus/phenol composite antioxidant, manufactured by Sumitomo Chemical Co., Ltd., solid content: 100%)
[8] Solvent (F-1): PGMEA (propylene glycol monomethyl ether acetate)
[9] Solvent (F-2): cyclohexyl acetate
[10] Leveling agent (G-1): F-554 (fluorine-based leveling agent, manufactured by DIC Corporation, solid content: 100%)
[11] Leveling agent (G-2): SH8400 (silicone-based leveling agent, manufactured by Dow Corning Toray Co., Ltd., solid content: 100%)