SYSTEMS AND METHODS FOR MOLDING

Abstract

A mold for molding an object having a section of increased thickness includes a mold cavity comprising a first zone and a second zone and a means for providing a different thermal conductivity at the first and second zone of the mold cavity.

Claims

1. A method for molding an object using a mold having at least two parts that when joined form a mold cavity between them, the mold cavity comprising a first zone having a first thermal conductivity, and a second zone having a second thermal conductivity lower than the first thermal conductivity, the method characterized by comprising: providing a material comprising molten plastic and a foaming agent to the mold cavity; and separating the at least two parts after a first portion of the molten plastic adjacent to the first zone has solidified, but before a second portion of the molten plastic adjacent to the second zone has solidified, to result in a desired section of increased thickness of the object.

2. The method according to claim 1, further comprising: after the separating, enabling expansion of the second portion until the second portion has solidified to produce the desired section of increased thickness.

3. The method according to claim 1, wherein the providing is performed at a rate permitting a temperature gradient within the material during and immediately following the providing to be minimized.

4. The method according to claim 1, wherein the material is provided to the mold cavity in a quantity calculated to permit an expansion of the material to completely fill the mold cavity by way of foaming pressure.

5. The method according to claim 4, wherein the material is provided to the mold cavity in a quantity calculated to permit an expansion of the material to completely fill the mold cavity by way of foaming pressure without application of holding pressure.

6. The method according to claim 1, wherein an opening time of the mold is calculated based on a desired expansion amount of the second portion.

7. The method according to claim 1, further comprising providing to the second zone an insert configured to modify the thermal conductivity of the second zone to result in the second thermal conductivity, the insert preferably being provided to a concavity present in the mold.

8. The method according to claim 1, further comprising providing to the second zone an insert configured to modify the thermal conductivity of the second zone to result in the second thermal conductivity, the insert being provided to a concavity present in the mold.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG. 1 is an exemplary mold according to currently available systems used for molding plastic parts;

[0042] FIG. 2 is an exemplary plastic part molded using systems and methods of the present disclosure;

[0043] FIG. 3A illustrates an exemplary mold according to embodiments of the present disclosure;

[0044] FIG. 3B illustrates another exemplary mold according to embodiments of the present disclosure;

[0045] FIG. 4A is an illustration of yet another exemplary mold according to embodiments of the present disclosure;

[0046] FIG. 4B illustrates yet another exemplary mold according to embodiments of the present disclosure; and

[0047] FIG. 5 is a block diagram showing exemplary steps for molding plastic objects according to the present disclosure.

DESCRIPTION OF EMBODIMENTS

[0048] Reference will now be made in detail to exemplary embodiments of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

[0049] FIG. 3 illustrates an exemplary mold according to embodiments of the present disclosure, this mold being configured to form a part substantially similar to that shown at FIG. 2, while avoiding drawbacks of other molding systems such as that shown at FIG. 1. As shown in FIG. 3, such a mold includes at least one injection nozzle 3, a first part 1, and a second part 2, where the first and second parts 1 and 2 are configured to be joined together to form mold cavity 5 between them.

[0050] First and second parts 1 and 2 may be formed from any suitable material capable of withstanding temperatures associated with injection molding. For example, first and second parts 1 and 2 may be formed from aluminum and alloys thereof. Additionally, first and second parts 1 and 2 can each be of the same material or each may be a different material.

[0051] First and second parts 1 and 2 may be formed from material having a coefficient of thermal conductivity which is sufficiently high to enable rapid cooling of a molten material (e.g., molten plastic) introduced within mold cavity 5 of mold 10.

[0052] Surfaces associated with mold cavity 5 may be formed in one or more parts of first and second parts 1 and 2 by removing a portion material from one or more of first and second parts 1 and 2 so as to produce a desired cavity shape. Such removal may be performed by, for example, a milling machine (e.g., computer numerical control (CNC) milling in conjunction with computer aided drafting (CAD) tools), or other suitable devices. Alternatively, surfaces of mold cavity 5 may be formed by way of a stamping process or other process configured to result in a void within one or more of the first and second parts 1 and 2 such that upon joining of first and second parts 1 and 2, a desired shape of mold cavity 5 results therebetween.

[0053] Various techniques may be employed for joining of first part 1 and second part 2. For example, first and second parts 1 and 2 may be joined at a desired location by an optional articulation 20 (e.g., a hinge, see FIG. 4B), enabling opening and closing of the mold for access to mold cavity 5 as desired. Alternatively first and second parts 1 and 2 may be freely separable from one another, and may be joined by alignment and contact between surfaces of first and second parts 1 and 2. One of skill in the art will recognize that various devices may be utilized for purposes of maintaining mold 10 in a closed state as desired, for example, hydraulic jacks may enable opening and closing of the mold, alternatively, or in addition, fasteners (e.g., clamps, bolts, etc.) may be used. When desirable, no such devices may be used, for example, based on a particular mold design.

[0054] For example, first and second parts 1 and 2 may be configured such that no holding pressure is applied during injection and solidification of an object. In other words, high pressures typically used to prevent shrinkage of the material may be avoided in view of the foaming agent.

[0055] Injection nozzle 3 is configured to provide a molten material (e.g., molten plastic) to mold cavity 5 during an injection molding process. Therefore, injection nozzle 3 may comprise a channel within one or more of first and second parts 1 and 2, this channel being configured for fluid communication with a provider of molten material (not shown). The molten material injected via injection nozzle 3 may comprise at least a desired plastic material from which an object is to be formed, the plastic material being heated to a temperature exceeding its melting point. The molten material may further comprise, where desired, a foaming agent, among other things such as pigments, reflective elements, magnetic particles, etc. Importantly, while the various components of the injected material are described here with regard to FIG. 3, such components may be applicable and utilized with any molding system and method falling within the scope of the present disclosure.

[0056] Injection nozzle 3 is also in fluid communication with mold cavity 5 such that upon introduction of fluid material (e.g., molten plastic) via injection nozzle 3, such material is provided to mold cavity 5. Injection nozzle 3 in conjunction with the material provider may be configured to provide the molten material rapidly so as to minimize a temperature gradient within the material during and immediately following injection into mold cavity 5.

[0057] Mold cavity 5 may take any desired shape associated with a molded object to be formed. For example, FIG. 2 shows a molded object having a flat surface first portion 5B corresponding to zone 5b of mold 10, and second portions comprising two sections of locally increased thickness 5A. These sections of locally increased thickness 5A correspond to zones 5a of mold cavity 5. As noted above, first portion refers to sections outside of sections of desired increased thickness (e.g., sections 5B), while second portion refers to sections of desired increased thickness (e.g., sections 5A).

[0058] A cross-section taken along line A-A of the object shown in FIG. 2 conforms with the cross-section of mold cavity 5 shown in the figures of the present application. It is to be understood that the shape is merely exemplary in that mold cavity 5 may have any desired shape, for example, a steering column cover, a fan blade, a mobile phone mount, a cup holder, etc., with sections of desired increased thickness located at any desired position.

[0059] According to the present disclosure, mold 10 includes means for providing different thermal conductivity at one or more zones within mold cavity 5. Importantly, different thermal conductivities may be provided in a number of ways, for example, a portion of a secondary material having a different coefficient of thermal conductivity may be provided within mold 10 to result in a thermal conductivity different than the primary material comprising mold 10. In such an example, mold 10 may be primarily comprised of aluminum having a thermal conductivity coefficient k of approximately 215 watts per meter per Kelvin (W/(mK)) at 125 C., while a zone in mold 10 at a section of desired increased object thickness within mold cavity 5 may comprise stainless steel having a thermal conductivity coefficient k of approximately 17 W/(mK) at 125 C.

[0060] In embodiments comprising materials having different coefficients of thermal conductivity, mold 10 may be fabricated including the desired materials. Alternatively, or in conjunction therewith, different molten materials may be provided within mold 10 by way of one or more inserts 4 configured to be placed in zones within mold cavity 5. Inserts 4 may be of any desired thickness suitable for modifying thermal conductivity in a zone of mold cavity 5 so as to result in a desired retardation, or acceleration depending on the configuration, in cooling and solidification of an injected molten material.

[0061] Importantly, mold 10 may include concave areas 9 configured to receive inserts 4. In other words, concave areas 9 may be formed having shapes substantially similar to shapes of inserts 4. Positions of concave areas 9 correspond with sections of desired increased thickness.

[0062] One of skill in the art will recognize that the materials listed are exemplary only and that any combination of suitable materials may be used for the primary material and secondary material comprising mold 10. For example, copper may be used as a primary material of mold 10 with an iron or steel secondary material, thereby producing a desired difference in thermal conductivity.

[0063] One of skill in the art will also recognize that the selection of materials need not be limited to two materials, and that any number of different materials may be used to affect varying levels of thickness at different sections of an object to be molded. For example, mold 10 may comprise a primary material of aluminum with a secondary material a first section of desired increased thickness comprising iron, and a tertiary material at a second section of desired increased thickness comprising stainless steel. As will be discussed below, such a configuration may result in the ability to obtain greater thickness in the second section of desired increased thickness than that obtained at the first section of desired increased thickness.

[0064] FIG. 3B illustrates another exemplary mold according to embodiments of the present disclosure. As shown at FIG. 3B, mold 10 may be provided with one or more thermal circuits 15 configured to modify thermal conductivity of particular zones of mold 10 associated with mold cavity 5. Thermal circuit 15 may, for example, comprise a series of channels and/or tubes within mold 10 that may be supplied with a cooling fluid, for example, compressed air and/or water such that a greater portion of thermal energy in a zone in and around thermal circuit 15 is carried away by the cooling fluid, than is conducted by the material of mold 10 and/or inserts 4 outside of zones in and around thermal circuits 15. Alternatively, thermal circuits 15 may instead be heating circuits and may comprise, for example, resistive heating elements serving to reduce thermal conductivity of zones of mold 10 within mold cavity 5 by way of provision of additional thermal energy. In such a scenario, the heating circuits may be provided corresponding to zones of desired increased thickness.

[0065] Based on the above, thermal circuits may be located in correspondence with sections other than where an increased thickness is desired, such that more rapid cooling of a molten material occurs via of heat removal by thermal circuit 15. Notably, thermal circuits 15 may be used either alone or in conjunction with different materials (e.g., inserts 4) for purposes of modifying thermal conductivity in desired zones of mold 10 within mold cavity 5.

[0066] As noted, by providing such thermal circuits 15, it becomes possible to vary the thermal conductivity of mold 10 within mold cavity 5 with or without the use of different materials having different coefficients of thermal conductivity. Further, by controlling the flow rate of the cooling fluid or the heat produced in a heating circuit, and/or the locations of thermal circuit 15, it may be possible to create a number of different sections of desired increased thickness each having a different thickness.

[0067] FIG. 4A is an illustration of another exemplary mold according to some embodiments of the present disclosure. As shown in FIG. 4A, concave areas 9 may be provided with a depth greater than a thickness of inserts 4, so as to enable a greater amount of material to accumulate at a section of desired increased thickness. Such a configuration may be used to further enhance the zone of increased thickness, and this adaptation may be made to any mold described in conjunction with the present disclosure.

[0068] FIG. 4B is similar to FIG. 4A, except a thermal circuit 15, as described above has been provided. Further, optionally provided is a thermal circuit 16 which may further modify thermal conductivity of the mold as already discussed herein, but evenly across a section of the mold. One of ordinary skill in the art will recognize that optional thermal circuit 16 may function similarly to thermal circuit 15 (e.g., heat or cool) and also may be provided to any of the molds discussed herein despite it being shown in FIG. 4B only.

[0069] FIG. 5 is a block diagram 500 showing exemplary steps for molding plastic objects according to the present disclosure. Such steps may be carried out using any mold presenting at least two zones of different thermal conductivity.

[0070] Mold 10 being comprised of first and second parts 1 and 2 can be assembled so as to form mold cavity 5 therebetween (step 502). As noted above, such assembly may be accomplished by suitable methods such as fastening, superposing, etc., as long as mold cavity 5 is properly defined therein.

[0071] A molten material can then be provided to mold cavity 5 (step 505). This molten material may comprise for example, molten plastic and, where desired, a foaming agent or other suitable substance configured to cause expansion of a molten plastic material, among other things (e.g., pigments, reflective materials, magnetic materials, etc.) The molten material may be provided via injection nozzle 3 and may be provided under varying levels of pressure to facilitate injection. Further, the providing may be performed at a rate permitting a temperature gradient within the material during and immediately following the providing to be minimized.

[0072] Further, the material can be provided to mold cavity 5 in a quantity calculated to permit an expansion of the material to completely fill mold cavity 5 by way of, e.g., foaming pressure, particularly where a foaming agent has been provided to the material. For example, for a particular mold cavity 5, a particular molten material, and a desired object final weight, it may be determined that an amount of material approximately equal to 80 percent or greater, better 90 percent or greater of the volume of mold cavity 5 should be injected during the providing phase.

[0073] Following the providing step, first and second parts 1 and 2 may remain assembled (i.e., closed mold) (step 510: no) until such time that the first portion has solidified. As noted above, the first portion shall be considered to be that portion of the molded object lying outside regions of desired increased thickness 5A and 5B.

[0074] Once it is determined that the first portion has solidified (step 510: yes), the mold may be opened (step 515), e.g., first and second parts 1 and 2 may be separated, and the second portion of material allowed to expand. Such a determination may be made based on a predetermined time map for example, for a particular material and mold configuration. In addition, or alternatively, one or more sensors may be provided for determining a temperature of portions of mold 10 and/or the object being molded. Data from these sensors may be provided to a computer loaded with software for determining an opening time of mold 10 based on various inputs from an operator.

[0075] For example, the determination of when to open the mold may be based not only on solidification of the first portion, but also on a desired amount of increased thickness (e.g., expansion). In other words, mold (10) may be opened immediately upon solidification of first portion 1, or may remain closed beyond a point where the first portion has solidified to allow further cooling of the second portion prior to opening of the mold. By waiting in this fashion, the extent to which the second portion may expand, and thereby the resulting thickness, can be reduced.

[0076] Throughout the description, including the claims, the term comprising a should be understood as being synonymous with comprising at least one unless otherwise stated. In addition, any range set forth in the description, including the claims should be understood as including its end value(s) unless otherwise stated. Specific values for described elements should be understood to be within accepted manufacturing or industry tolerances known to one of skill in the art, and any use of the terms substantially and/or approximately and/or generally should be understood to mean falling within such accepted tolerances.

[0077] Where any standards of national, international, or other standards body are referenced (e.g., ISO, etc.), such references are intended to refer to the standard as defined by the national or international standards body as of the priority date of the present specification. Any subsequent substantive changes to such standards are not intended to modify the scope and/or definitions of the present disclosure and/or claims.

[0078] Although the present disclosure herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present disclosure.

[0079] For example, it is possible to utilize an insert having a higher thermal conductivity that that of the mold material, such that the insert corresponds to a desired section of decreased thickness. In other words, a portion of the molded object may be cooled more rapidly by the insert, and upon opening the mold, the remaining un-solidified material of the object may expand to result in increased thickness.

[0080] It is intended that the specification and examples be considered as exemplary only, with a true scope of the disclosure being indicated by the following claims.