THERMAL CROSS-TALK RESISTANT FLOW REACTOR
20180161747 ยท 2018-06-14
Inventors
Cpc classification
B01J19/0093
PERFORMING OPERATIONS; TRANSPORTING
F28F3/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28D9/0037
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01J2219/00867
PERFORMING OPERATIONS; TRANSPORTING
F28F13/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B01J2219/00869
PERFORMING OPERATIONS; TRANSPORTING
International classification
B01J19/00
PERFORMING OPERATIONS; TRANSPORTING
F28D9/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F13/06
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A flow reactor has a module (12) that comprises at least first (20), second (30), and third (40) parallel plates stacked temporarily or permanently together and defining a first thermal fluid layer (25) between the first (20) and second plates (30) and a process fluid layer (35) between the second (30) and third plates (40), the process fluid layer (35) comprising a process fluid passage (32) having two or more U-bends and three or more successive process fluid passage segments joined by respective U-bends, the first thermal fluid layer (25) comprising at least two open thermal fluid channels (26) in the second plate (30), the at least two open channels (26) positioned, when viewed in a plan view of the module (12), between respective adjacent process fluid passage segments.
Claims
1. A fluidic module (12) for a flow reactor, the module (12) comprising: at least first, second, and third parallel plates (20,30,40) stacked temporarily or permanently together and defining, between the first and second plates, a first thermal fluid layer (25), and, between the second and third plates, a process fluid layer (35); within the process fluid layer (35) between the second and third plates (20,30), a process fluid passage (32) having one or more U-bends (34) and three or more successive process fluid passage segments (36), the successive process fluid passage segments (36) joined by respective U-bends (34), each of the three or more successive process fluid passage segments (36) lying adjacent to at least one other of the three or more successive process fluid passage segments (36), each successive process fluid passage segment (36) having a respective process fluid passage segment centerline (PCL); in the first thermal fluid layer (25), in a surface (28) of the second plate (30), at least two first-thermal-layer open thermal fluid channels or open thermal fluid channel segments (26), each first-thermal-layer open thermal fluid channel or open thermal fluid channel segment (26) comprising two sidewalls (24) and an open top (23) and having a respective channel or channel segment centerline (CCL1), the respective channel or channel segment centerlines (CCL1) positioned, when viewed in a plan view of the module (12), between respective adjacent process fluid passage segment centerlines (PCL).
2. The module according to claim 1 further comprising a fourth generally planar and parallel plate (50) stacked temporarily or permanently together against the third plate (40) and defining together with the third plate, between the third and fourth plates, a second thermal fluid layer (45) comprising, in a surface (48) of the third plate, at least two second-thermal-layer open thermal fluid channels or open thermal fluid channel segments (46), each second-thermal-layer open thermal fluid channel or open thermal fluid channel segment (46) comprising two sidewalls (44) and an open top (43) and having a respective channel or channel segment centerline (CCL2), the respective channel or channel segment centerlines (CCL2) positioned, when viewed in a plan view of the module (12), between respective adjacent process fluid passage segment centerlines (PCL).
3. The module (12) according to claim 1, wherein at least one of the open thermal fluid channels or open thermal fluid channel segments (26,46) comprises a straight channel sidewall (24,44).
4. The module according claim 1, wherein at least one of the open thermal fluid channels or open thermal fluid channel segments (26,46) comprises a wavy channel sidewall (24,44).
5. The module according to claim 4, wherein the wavy channel sidewall (24,44) has a shape complementary to a shape of a respective adjacent process fluid passage segment (36).
6. The module according to claim 1 wherein at least one of the sidewalls (24,44) forms an angle of 90 with an associated bottom wall (22,42).
7. The module according to claim 1 wherein at least one of the sidewalls (24,44) forms an angle of greater than 90 with an associated bottom wall (22,42).
8. The module according to claim 1 wherein the second plate (30) comprises a material having a thermal conductivity of at least 15 W/m.Math.K at 20 C.
9. The module according to claim 1 wherein the second plate (30) comprises a material having a thermal conductivity of at least 20 W/m.Math.K at 20 C.
10. The module according to claim 1 wherein the second plate (30) comprises a material having a thermal conductivity of at least 30 W/m.Math.K at 20 C.
11. The module according to claim 1 wherein the second plate (30) comprises a material having a thermal conductivity of at least 60 W/m.Math.K at 20 C.
12. A reactor (10) comprising two or more modules (12) according to claim 1 fluidically coupled together.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0026] In the drawings, relative size, position and dimension are for illustration only and are not to scale. For the purposes of this disclosure, a first thing is considered adjacent to a second thing, in the case that the second thing is considered as belonging to a particular category or a particular type or having a particular property, when no third thing falling within the same particular category or a particular type or having the same particular property is positioned between the first thing and the second thing. Plate as defined herein refers to either structure as in a plate-like structure or plate-like half of a larger monolithic structure regardless of the fabrication history of the structure, as well as to plate-like structure which forms, by assembly, with temporary or permanent attachment, a part of a larger structure.
[0027]
[0028] However, if the fluidic module (12) is relatively compact such that fluid passage segments (36) are relatively close together, and/or if the second and third plates (30,40) comprise material having a relatively high thermal conductivity (such as 10 or 15 W/m.Math.K at 20 C. or more, for example), then a problem can easily arise in the form of thermal cross-talk between adjacent pairs of process fluid passage segments (36). Volumes of reactant near a reaction-produced hot spot can be heated excessively, even if the distance along the process fluid flow-path from the hot spot is relatively long, by heat diffusion perpendicular to the flow direction(s) in the fluid passage segments (36). Increasing the flow of the thermal fluid can mitigate the problem, but to a limited degree. The result of thermal cross-talk will be, in the best case, nonhomogeneous product. In other cases, exposing closer-to-exit volumes to higher temperatures favors unwanted side products, leading to undesired products which, in certain cases, might be hazardous. The present disclosure provides an elegant way to reduce or eliminate problems caused by thermal cross-talk, without the use of hybrid or exotic materials or particularly difficult fabrication processes.
[0029]
[0030] As may be best seen in
[0031] As may be further seen with reference to
[0032] Further to
[0033] Further to
[0034]
[0035] With reference to
[0036] With reference to
[0037] In the embodiment shown in
[0038] In the embodiment shown in
[0039] In the embodiment shown in
[0040] The embodiment of
[0041] Embodiments of the present disclosure are particularly well suited for use with process fluid layer plates second and third plates (30,40) which comprise (or consist of) materials having relatively high thermal conductivity, since such materials manifest the tendency to produce detrimental thermal cross-talk. According to embodiments, the second plate (30) can comprise a material having a thermal conductivity of at least 10, at least 15, at least 30, or even at least 60 W/m.Math.K at 20 C.
[0042] The present embodiments provide a simple but effective solution to avoid or reduce thermal cross-talk between adjacent portions of the process fluid passage (32) located in the same process fluid layer (35). The disclosed solution does not involve additional insulating plates, materials having anisotropic thermal conductivity, or plates made of different materials. It involves providing channels on the external face of the reaction chamber plates such as by machining; when in use, the thermal fluid used in the thermal fluid layer(s) fills in these channels, desirably flows in these channels also, suppressing thermal cross-talk both by its presence and by its flow.
[0043] As an additional benefit, the heat exchange area between the plates (30,40) that surround the process fluid layer (35) and the thermal fluid layer(s) is increased by use of the anti-cross-talk channels. The absence and/or significant reduction of thermal cross-talk and the increase of the heat exchange surface can provide one or more of the following benefits 1) minimize the risk for autocatalytic, explosive reactions; 2) prevent or minimizes the boiling of the solvents, which would diminish the utile volume and therefore unfavorably affects the performance of the reactor or would increase the concentration in the liquid phase, which would potentially lead to explosive, so unsafe conditions; 3) conserve the proper conditions in monophase and/or multiphase systems; 4) avoids unwanted precipitation in the endothermic reactions; 5) allows working with higher concentrations which decreases waste and diminishes the cost of downstream processes; 6) decreases the operating costs on the thermal fluid side.
[0044] The methods and/or devices disclosed herein are generally useful in performing any process that involves mixing, separation, absorption, distillation, extraction, crystallization, precipitation, or otherwise processing fluids or mixtures of fluids, including multiphase mixtures of fluidsand including fluids or mixtures of fluids including multiphase mixtures of fluids that also contain solidswithin a microstructure. The processing may include a physical process, a chemical reaction defined as a process that results in the interconversion of organic, inorganic, or both organic and inorganic species, a biochemical process, or any other form of processing. The following non-limiting list of reactions may be performed with the disclosed methods and/or devices: oxidation; reduction; substitution; elimination; addition; ligand exchange; metal exchange; and ion exchange. More specifically, reactions of any of the following non-limiting list may be performed with the disclosed methods and/or devices: polymerisation; alkylation; dealkylation; nitration; peroxidation; sulfoxidation; epoxidation; ammoxidation; hydrogenation; dehydrogenation; organometallic reactions; precious metal chemistry/homogeneous catalyst reactions; carbonylation; thiocarbonylation; alkoxylation; halogenation; dehydrohalogenation; dehalogenation; hydroformylation; carboxylation; decarboxylation; amination; arylation; peptide coupling; aldol condensation; cyclocondensation; dehydrocyclization; esterification; amidation; heterocyclic synthesis; dehydration; alcoholysis; hydrolysis; ammonolysis; etherification; enzymatic synthesis; ketalization; saponification; isomerisation; quaternization; formylation; phase transfer reactions; silylations; nitrile synthesis; phosphorylation; ozonolysis; azide chemistry; metathesis; hydrosilylation; coupling reactions; and enzymatic reactions.