ARRAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY PANEL
20180164634 ยท 2018-06-14
Assignee
Inventors
Cpc classification
G02F1/136227
PHYSICS
G02F1/136222
PHYSICS
International classification
Abstract
An array substrate and a liquid crystal display (LCD) panel thereof are described. The array substrate includes a bottom substrate; a thin film transistor disposed on the bottom substrate; a first passivation layer disposed on the thin film transistor and comprising a first opening which exposes the drain electrode region of the thin film transistor; a color resist layer disposed on the first passivation layer and configured to form a color filter, wherein the color resist layer comprises a second opening corresponding to the first opening to expose the drain electrode region of the thin film transistor; a pixel electrode layer disposed on the color resist layer and formed by electrically connecting the first opening and the second opening to the drain electrode region of the thin film transistor; and a second passivation layer disposed on the pixel electrode layer.
Claims
1. An array substrate, comprising: a bottom substrate; a thin film transistor disposed on the bottom substrate, the thin film transistor comprising: a first metal layer disposed on the bottom substrate and configured to form a plurality of scan lines and a gate electrode region of a thin film field-effect transistor; a first insulation layer disposed on the first metal layer; a semiconductor layer disposed on the first insulation layer and configured to form a channel region of the thin film field-effect transistor; and a second metal layer disposed on the semiconductor layer and configured to form a source electrode region and a drain electrode region of the thin film field-effect transistor and form a plurality of data lines; a first passivation layer disposed on the thin film transistor and comprising a first opening which exposes the drain electrode region of the thin film transistor; a color resist layer disposed on the first passivation layer and configured to form a color filter, wherein the color resist layer comprises a second opening corresponding to the first opening to expose the drain electrode region of the thin film transistor, a hole diameter of the second opening is greater than a hole diameter of the first opening, and the color resist layer comprises a plurality of color resists wherein two adjacent color resists therebetween form the second opening; a pixel electrode layer disposed on the color resist layer and formed by electrically connecting the first opening and the second opening to the drain electrode region of the thin film transistor; and a second passivation layer disposed on the pixel electrode layer.
2. The array substrate of claim 1, wherein the color resists comprises a color R resist, a color G resist and a color B resist.
3. An array substrate, comprising: a bottom substrate; a thin film transistor disposed on the bottom substrate; a first passivation layer disposed on the thin film transistor and comprising a first opening which exposes the drain electrode region of the thin film transistor; a color resist layer disposed on the first passivation layer and configured to form a color filter, wherein the color resist layer comprises a second opening corresponding to the first opening to expose the drain electrode region of the thin film transistor; a pixel electrode layer disposed on the color resist layer and formed by electrically connecting the first opening and the second opening to the drain electrode region of the thin film transistor; and a second passivation layer disposed on the pixel electrode layer.
4. The array substrate of claim 3, wherein the thin film transistor comprises: a first metal layer disposed on the bottom substrate and configured to form a plurality of scan lines and a gate electrode region of a thin film field-effect transistor; a first insulation layer disposed on the first metal layer; a semiconductor layer disposed on the first insulation layer and configured to form a channel region of the thin film field-effect transistor; and a second metal layer disposed on the semiconductor layer and configured to form a source electrode region and a drain electrode region of the thin film field-effect transistor and form a plurality of data lines.
5. The array substrate of claim 3, wherein a hole diameter of the second opening is greater than a hole diameter of the first opening.
6. The array substrate of claim 3, wherein the color resist layer comprises a plurality of color resists and two adjacent color resists therebetween form the second opening.
7. The array substrate of claim 3, wherein the color resists comprises a color R resist, a color G resist and a color B resist.
8. A liquid crystal display panel comprising an array substrate and a glass substrate opposite the array substrate wherein a liquid crystal is filled into the array substrate and glass substrate therebetween, the array substrate comprising: a bottom substrate; a thin film transistor disposed on the bottom substrate; a first passivation layer disposed on the thin film transistor and comprising a first opening which exposes the drain electrode region of the thin film transistor; a color resist layer disposed on the first passivation layer and configured to form a color filter, wherein the color resist layer comprises a second opening corresponding to the first opening to expose the drain electrode region of the thin film transistor; a pixel electrode layer disposed on the color resist layer and formed by electrically connecting the first opening and the second opening to the drain electrode region of the thin film transistor; and a second passivation layer disposed on the pixel electrode layer.
9. The liquid crystal display panel of claim 8, wherein the thin film transistor comprises: a first metal layer disposed on the bottom substrate and configured to form a plurality of scan lines and a gate electrode region of a thin film field-effect transistor; a first insulation layer disposed on the first metal layer; a semiconductor layer disposed on the first insulation layer and configured to form a channel region of the thin film field-effect transistor; and a second metal layer disposed on the semiconductor layer and configured to form a source electrode region and a drain electrode region of the thin film field-effect transistor and form a plurality of data lines.
10. The liquid crystal display panel of claim 8, wherein a hole diameter of the second opening is greater than a hole diameter of the first opening.
11. The liquid crystal display panel of claim 8, wherein the color resist layer comprises a plurality of color resists and two adjacent color resists therebetween form the second opening.
12. The liquid crystal display panel of claim 8, wherein the color resists comprises a color R resist, a color G resist and a color B resist.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0018]
[0019]
[0020]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] The following embodiments refer to the accompanying drawings for exemplifying specific implementable embodiments of an array substrate and an LCD panel of the present invention. Furthermore, directional terms described by the present invention, such as upper, lower, front, back, left, right, inner, outer, side, etc., are only directions by referring to the accompanying drawings, and thus the used directional terms are used to describe and understand the present invention, but the present invention is not limited thereto. In the drawings, the same reference symbol represents the same or a similar component.
[0022]
[0023] In one embodiment, the material of bottom substrate 201 is made of glass, which is configured to be a substrate of the thin film transistor 202 disposed on the bottom substrate 201.
[0024] The thin film transistor 202 includes a first metal layer 301, a first insulation layer 302, a semiconductor layer 303 and a second metal layer 304.
[0025] The first metal layer 301 disposed on the bottom substrate 201 is configured to form scan lines (not shown) and a gate electrode region of thin film transistor 202 where the material of first metal layer 301 is selected from chromium, molybdenum, aluminum and copper. The first insulation layer 302 disposed on the first metal layer 301 is configured to be a gate insulation layer where the first insulation layer 302 is composed of silicon nitride layer. The semiconductor layer 303 disposed on the first insulation layer 302 is configured to form a channel region of thin film transistor 202 where the semiconductor layer 303 is composed of amorphous silicon layer. The second metal layer 304 disposed on the semiconductor layer 303 is configured to form a source electrode region 401 and drain electrode region 402 of thin film transistor, and data lines (not shown), where the material of second metal layer 304 is selected from chromium, molybdenum, aluminum and copper.
[0026] The first passivation layer 203 disposed on the thin film transistor and includes a first opening 501 which exposes the drain electrode region 402 of thin film transistor 202.
[0027] The color resist layer 204 disposed on the first passivation layer 203 is configured to form a color filter. For example, the color filter may be RGB color resist and black matrix. The color resist layer 204 includes a second opening 601 which corresponds to the first opening 501 to expose the drain electrode region 402 of thin film transistor 202. Preferably, a hole diameter of the second opening 601 is greater than a hole diameter of the first opening 501 so that the drain electrode region 402 exposed from the first opening 501 can be completely exposed from the second opening 601. Meanwhile, the alignment between the second opening 601 and first opening 501 during the manufacturing procedures is able to prevent the offset between the second opening 601 and first opening 501.
[0028] Furthermore, the color resist layer 204 includes a plurality of color resists where two adjacent color resists therebetween form the second opening 601. In one embodiment, the color resists includes a color R resist, a color G resist, a color B resist and a color W resist. For example, the second opening 601 is disposed between the color R resist and color G resist.
[0029] The pixel electrode layer 205 is disposed on the color resist layer 204 and formed by electrically connecting the first opening 501 and second opening 601 to the drain electrode region 402 of thin film transistor 202 where the pixel electrode layer 205 is composed of indium-tin oxide. The pixel electrode layer 205 covers the color resist layer 204 and covers the first passivation layer 203, which is exposed from the second opening 601, and the drain electrode region 402, which is exposed from the first opening 501.
[0030] The second passivation layer 206 is disposed on the pixel electrode layer 205 and covers the pixel electrode layer 205 in the second opening 601. Therefore, if the second passivation layer 206 is disposed on the pixel electrode layer 205 for electrically connecting the pixel electrode layer 205 to the drain electrode region 402, there is no need to form openings in the second passivation layer 206 to maintain the integrity of the second passivation layer 206. The integrity of the second passivation layer 206 is capable of protecting the color resist layer to avoid the bubble in the second opening 601.
[0031]
[0032] As is understood by a person skilled in the art, the foregoing preferred embodiments of the present invention are illustrative rather than limiting of the present invention. It is intended that they cover various modifications and similar arrangements be included within the spirit and scope of the present invention, the scope of which should be accorded the broadest interpretation so as to encompass all such modifications and similar structure.