ACOUSTIC SENSOR AND CAPACITIVE TRANSDUCER

Abstract

An acoustic sensor has a semiconductor substrate having an opening, a back plate that is disposed facing the opening of the semiconductor substrate, that is configured to function as a fixed electrode, and that has sound holes that allow passage of air, a vibration electrode film disposed facing the back plate through a void, and a casing configured to house the substrate, the back plate, and the vibration electrode film, and having a pressure hole that allows inflow of air. The acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure.

Claims

1. An acoustic sensor comprising: a semiconductor substrate comprising an opening; a back plate that is disposed facing the opening of the semiconductor substrate, that is configured to function as a fixed electrode, and that comprises sound holes that allow passage of air; a vibration electrode film disposed facing the back plate through a void; and a casing configured to house the substrate, the back plate, and the vibration electrode film, and comprising a pressure hole that allows inflow of air, wherein the acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure, wherein a flow path is formed, which includes any of the sound hole of the back plate, a gap between the back plate and the vibration electrode film, a gap between the vibration electrode film and the semiconductor substrate, and the opening of the semiconductor substrate, and in which a fluid flowing into the casing from the pressure hole moves to a space opposite the pressure hole across the vibration electrode film in the casing, and wherein a flow path cutoff part is further provided, being configured to cut off at least a part of the flow path when the vibration electrode film is transformed to come close to the semiconductor substrate or the back plate due to the fluid flowing into the casing from the pressure hole.

2. The acoustic sensor according to claim 1, wherein the flow path cutoff part is a projection provided in one of the vibration electrode film and the back plate, and configured to block each of at least some of the sound holes in the back plate by abutting with the other of the vibration electrode film and the back plate when the vibration electrode film is transformed to come close to the back plate.

3. The acoustic sensor according to claim 2, wherein the projection blocks each of the sound holes all over the back plate.

4. The acoustic sensor according to claim 2, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the projection blocks the sound hole disposed in a portion in the back plate, the portion facing an outer periphery of the vibration part of the vibration electrode film.

5. The acoustic sensor according to claim 2, wherein the projection has a cylindrical shape enclosing the sound hole in the back plate in a plan view.

6. The acoustic sensor according to claim 1, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the flow path cutoff part is a wall provided in one of the vibration electrode film and the back plate, and formed surrounding at least a part of the vibration part in the vibration electrode film or to surround at least a portion in the back plate, the portion facing a part of the vibration part of the vibration electrode film, and abuts with the other of the vibration electrode film and the back plate to cut off at least a part of a flow path for air that passes through the gap between the vibration electrode film and the back plate and/or the sound hole of the back plate when the vibration electrode film is transformed to come close to the back plate.

7. The acoustic sensor according to claim 2, wherein the back plate is provided with a fixed electrode film and the flow path cutoff part, and wherein the fixed electrode film is provided only in a portion other than a tip of the flow path cutoff part in the back plate.

8. The acoustic sensor according to claim 2, wherein a stopper is further provided in one of the vibration electrode film and the back plate, the stopper being configured to abut with the other of the vibration electrode film and the back plate when the vibration electrode film and the back plate come close to each other, and wherein the flow path cutoff part is as high as or higher than the stopper.

9. The acoustic sensor according to claim 1, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the flow path cutoff part is a wall provided in one of the vibration electrode film and the semiconductor substrate, and formed surrounding at least the opening in the semiconductor substrate, or to surround at least a portion in the vibration electrode film, the portion facing the opening of the semiconductor substrate, and abuts with the other of the vibration electrode film and the semiconductor substrate to cut off at least a part of a flow path for air that passes through the gap between the vibration electrode film and the semiconductor substrate and/or the opening of the semiconductor substrate when the vibration electrode film is transformed to come close to the semiconductor substrate.

10. The acoustic sensor according to claim 9, wherein a stopper is further provided in one of the vibration electrode film and the semiconductor substrate, the stopper being configured to abut with the other of the vibration electrode film and the semiconductor substrate when the vibration electrode film and the semiconductor substrate come close to each other, and wherein the wall is as high as or higher than the stopper.

11. An acoustic sensor comprising: a semiconductor substrate comprising an opening; a back plate disposed facing the opening of the semiconductor substrate, and comprising sound holes that allow passage of air; a vibration electrode film disposed facing the back plate through a void; and a casing configured to house the substrate, the back plate, and the vibration electrode film, and comprising a pressure hole that allows inflow of air, wherein the acoustic sensor converts transformation of the vibration electrode film into a change in capacitance between the vibration electrode film and the back plate to detect sound pressure, and wherein a flow path inhibition part is further provided, being configured to inhibit a flow of a fluid that passes through the opening of the semiconductor substrate or the sound hole of the back plate when the vibration electrode film is transformed to come close to the semiconductor substrate or the back plate.

12. A capacitive transducer configured to be housed in a casing having a pressure hole that allows inflow of air, comprising: a semiconductor substrate comprising an opening; a back plate disposed facing the opening of the semiconductor substrate, configured to function as a fixed electrode, and comprising sound holes that allow passage of air; and a vibration electrode film disposed facing the back plate through a void, wherein transformation of the vibration electrode film is converted into a change in capacitance between the vibration electrode film and the back plate, and wherein a flow path cutoff part is further provided, being configured to cut off at least a part of a flow path for a fluid that passes through a gap between the vibration electrode film and the semiconductor substrate or the back plate and/or a flow path for a fluid that passes through the opening of the semiconductor substrate or the sound hole of the back plate when the vibration electrode film is transformed to come close to the semiconductor substrate or the back plate.

13. The capacitive transducer according to claim 12, wherein the flow path cutoff part is a projection provided in one of the vibration electrode film and the back plate, and configured to block each of at least some of the sound holes in the back plate by abutting with the other of the vibration electrode film and the back plate when the vibration electrode film is transformed to come close to the back plate.

14. The capacitive transducer according to claim 13, wherein the projection blocks each of the sound holes all over the back plate.

15. The capacitive transducer according to claim 13, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the projection blocks the sound hole disposed in a portion in the back plate, the portion facing an outer periphery of the vibration part of the vibration electrode film.

16. The capacitive transducer according to claim 13, wherein the projection has a cylindrical shape enclosing the sound hole in the back plate in a plan view.

17. The capacitive transducer according to claim 12, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the flow path cutoff part is a wall provided in one of the vibration electrode film and the back plate, and formed surrounding at least a part of the vibration part in the vibration electrode film or to surround at least a portion in the back plate, the portion facing a part of the vibration part of the vibration electrode film, and abuts with the other of the vibration electrode film and the back plate to cut off at least a part of a flow path for air that passes through the gap between the vibration electrode film and the back plate and/or the sound hole of the back plate when the vibration electrode film is transformed to come close to the back plate.

18. The capacitive transducer according to claim 13, wherein the back plate is provided with a fixed electrode film and the flow path cutoff part, and wherein the fixed electrode film is provided only in a portion other than a tip of the flow path cutoff part in the back plate.

19. The capacitive transducer according to claim 13, wherein a stopper is further provided in one of the vibration electrode film and the back plate, the stopper being configured to abut with the other of the vibration electrode film and the back plate when the vibration electrode film and the back plate come close to each other, and wherein the flow path cutoff part is as high as or higher than the stopper.

20. The capacitive transducer according to claim 12, wherein the vibration electrode film is formed including a platy vibration part on which pressure acts, and a fixed part configured to fix the vibration part to the semiconductor substrate or the back plate, and wherein the flow path cutoff part is a wall provided in one of the vibration electrode film and the semiconductor substrate, and formed surrounding at least the opening in the semiconductor substrate, or to surround at least a portion in the vibration electrode film, the portion facing the opening of the semiconductor substrate, and abuts with the other of the vibration electrode film and the semiconductor substrate to cut off at least a part of a flow path for air that passes through the gap between the vibration electrode film and the semiconductor substrate and/or the opening of the semiconductor substrate when the vibration electrode film is transformed to come close to the semiconductor substrate.

21. The capacitive transducer according to claim 20, wherein a stopper is further provided in one of the vibration electrode film and the semiconductor substrate, the stopper being configured to abut with the other of the vibration electrode film and the semiconductor substrate when the vibration electrode film and the semiconductor substrate come close to each other, and wherein the wall is as high as or higher than the stopper.

22. A capacitive transducer configured to be housed in a casing having a pressure hole that allows inflow of air, comprising: a semiconductor substrate comprising an opening on a surface; a back plate disposed facing the opening of the semiconductor substrate, and comprising sound holes that allow passage of air; and a vibration electrode film disposed facing the back plate through a void, wherein transformation of the vibration electrode film is converted into a change in capacitance between the vibration electrode film and the back plate, and wherein a flow path inhibition part is further provided, being configured to inhibit a flow of a fluid that passes through the opening of the semiconductor substrate or the sound hole of the back plate when the vibration electrode film is transformed to come close to the semiconductor substrate or the back plate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG. 1 is a perspective view illustrating an example of a conventional acoustic sensor manufactured by the MEMS technique;

[0042] FIG. 2 is an exploded perspective view illustrating an example of an internal structure of the conventional acoustic sensor;

[0043] FIGS. 3A to 3C are views for describing a case of excessive pressure abruptly acting on the acoustic sensor;

[0044] FIGS. 4A and 4B are views for describing a conventional measure against the case of excessive pressure abruptly acting on the acoustic sensor;

[0045] FIGS. 5A to 5C are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a first embodiment of the present invention;

[0046] FIGS. 6A to 6C are views illustrating a configuration of a projection in the first embodiment of the present invention;

[0047] FIGS. 7A to 7C are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a second embodiment of the present invention;

[0048] FIGS. 8A to 8C are views illustrating another configuration of the vicinity of the vibration electrode film and the back plate in the second embodiment of the present invention.

[0049] FIGS. 9A to 9C are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a third embodiment of the present invention;

[0050] FIGS. 10A to 10C are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a fourth embodiment of the present invention;

[0051] FIGS. 11A to 11D are views for describing states of tips of the projection/wall and the relation between the stopper and heights of the projection/wall in one or more embodiments of the present invention.

[0052] FIGS. 12A to 12C are second views for describing a case of excessive pressure abruptly acting on the acoustic sensor.

[0053] FIGS. 13A to 13C are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a fifth embodiment of the present invention;

[0054] FIGS. 14A and 14B are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in the case of provision of a pressure hole on the ceiling surface of the package.

[0055] FIGS. 15A and 15B are views illustrating a configuration of the vicinity of the vibration electrode film and the back plate in a modified example of the present invention; and

[0056] FIGS. 16A and 16B are views illustrating another example of the vibration electrode film according to one or more embodiments of the present invention.

DETAILED DESCRIPTION

[0057] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments shown below is an aspect of the present invention, and is not intended to restrict the technical scope of the present invention. In the following, the case of using a capacitive transducer as an acoustic sensor will be described. However, the capacitive transducer according to the present invention is configured to detect displacement of a vibration electrode film, and can thus be used as a sensor other than the acoustic sensor. For example, it may be used as a pressure sensor, or may be used as an acceleration sensor, an inertia sensor, or some other sensor. It may also be used as an element other than the sensor, such as a speaker for converting an electrical signal into displacement. Further, the placement of a back plate, a vibration electrode film, a back chamber, a semiconductor substrate, and the like in the following description is an example. This placement is not restrictive so long as an equivalent function is exerted. For example, the placement of the back plate and the vibration electrode film may be reversed. In embodiments of the invention, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to one of ordinary skill in the art that the invention may be practiced without these specific details. In other instances, well-known features have not been described in detail to avoid obscuring the invention.

[0058] FIG. 1 is a perspective view illustrating an example of a conventional acoustic sensor 1 manufactured by the MEMS technique. FIG. 2 is an exploded perspective view illustrating an example of an internal structure of the acoustic sensor 1. The acoustic sensor 1 is a laminated body formed by laminating an insulating film 4, a vibration electrode film (diaphragm) 5, and a back plate 7 on the top surface of a silicon substrate (hereinafter also referred to simply as a substrate) 3 provided with a back chamber 2. The back plate 7 has a structure where a fixed electrode film 8 is formed on a fixed plate 6, and is formed by disposing the fixed electrode film 8 on the fixed plate 6 on the silicon substrate 3 side. Sound holes are provided all over the fixed plate 6 of the back plate 7 as a large number of punched holes (each of meshed points on the fixed plate 6 illustrated in FIG. 2 corresponds to each of the sound holes). Further, a fixed electrode pad 10 for acquiring an output signal is provided at one of four corners of the fixed electrode film 8.

[0059] The silicon substrate 3 can be formed by a single crystal silicon, for example. The vibration electrode film 5 can be formed by conductive polycrystal silicon, for example. The vibration electrode film 5 is a substantially rectangular thin film, in which fixed parts 12 are provided at four corners of a vibration part 11, having a substantially quadrilateral shape, that vibrates. The vibration electrode film 5 is disposed on the top surface of the silicon substrate 3 so as to cover the back chamber 2, and is fixed to the silicon substrate 3 at the four fixed parts 12 as anchor parts. The vibration part 11 of the vibration electrode film 5 reacts sensitively to sound pressure to vibrate vertically.

[0060] The vibration electrode film 5 is not in contact with the silicon substrate 3 or the back plate 7 in a place other than the four fixed parts 12. This allows smoother vertical vibration of the vibration electrode film 5 after sensitive reaction to sound pressure. Further, a vibrating membrane electrode pad 9 is provided in one of the fixed parts 12 at the four corners of the vibration part 11. The fixed electrode film 8 provided in the back plate 7 is provided so as to correspond to the vibrating portion of the vibration electrode film 5 except for the fixed parts 12 at the four corners. This is because the fixed parts 12 at the four corners of the vibration electrode film 5 do not react sensitively to sound pressure to vibrate and hence capacitance between the vibration electrode film 5 and the fixed electrode film 8 remains unchanged.

[0061] When sound reaches the acoustic sensor 1, the sound passes through the sound hole to apply sound pressure to the vibration electrode film 5. That is, sound pressure is applied to the vibration electrode film 5 through this sound hole. Further, providing the sound hole can facilitate air in an air gap between the back plate 7 and the vibration electrode film 5 to escape to the outside, to reduce thermal noise, leading to noise reduction.

[0062] In the acoustic sensor 1, with the structure described above, the vibration electrode film 5 vibrates upon receipt of sound, and the distance between the vibration electrode film 5 and the fixed electrode film 8 changes. When the distance between the vibration electrode film 5 and the fixed electrode film 8 changes, capacitance between the vibration electrode film 5 and the fixed electrode film 8 changes. Hence it is possible to detect sound pressure as an electrical signal by previously applying a direct-current voltage between the vibrating membrane electrode pad 9 electrically connected with the vibration electrode film 5 and the fixed electrode pad 10 electrically connected with the fixed electrode film 8, and taking out the above-mentioned change in capacitance as an electrical signal.

[0063] Next, a description will be given of an operation of the above conventional acoustic sensor 1. FIGS. 3A to 3C are schematic views describing the case of excessive pressure acting on the acoustic sensor 1. As illustrated in FIGS. 3A to 3C, when excessive pressure acts on the acoustic sensor 1, the pressure acts on a vibration electrode film 105 from a pressure hole 106a provided at the bottom surface of a package 106 as the casing. Then, the vibration electrode film 105 is greatly transformed to the back plate 107 side (opposite the pressure hole 106a), and the vibration electrode film 105 comes into contact with the back plate 107. The vibration electrode film 105 may be damaged at that time.

[0064] Further, the air flowing in from the pressure hole 106a in the above process passes through the gap between the vibration electrode film 105 and the back plate 107, further passes through a sound hole 107a of the back plate 107, and gets more deeply into the casing, to be compressed. Since this increases the pressure in the package 106, when the inflow of the air is ended, the increase in the pressure in the package 106 may then cause large transformation of the vibration electrode film 105 to the side opposite the back plate 107 (to the pressure hole 106a side), causing damage on the vibration electrode film 105. This may occur, for example, in a case where the acoustic sensor 1 falls or some other case in addition to the case where excessive air pressure acts on the acoustic sensor 1.

[0065] In view of the increase in the pressure in the package 106, measures as illustrated in FIGS. 4A and 4B are considered. That is, as illustrated in FIG. 4A, by eliminating the sound hole 107a in a portion in the back plate 107, the portion facing the vicinity of the end of the vibration electrode film 105, it is possible to make it difficult for the air to pass through the back plate 107 via the sound hole 107a when excessive pressure acts from the pressure hole 106a.

[0066] However, in this case, since the air is accumulated between the vibration electrode film 105 and the back plate 107 in the vicinity of the end of the vibration electrode film 105, noise tends to occur due to Brownian motion of the air. Further, as illustrated in FIG. 4B, by eliminating a stopper 107b of the back plate 107, when the vibration electrode film 105 is transformed to the back plate 107 side, it is possible to bring the whole surfaces of the vibration electrode film 105 and the back plate 107 into intimate contact with each other and make it difficult for the air to pass through the back plate 107 via the sound hole 107a. However, in this case, the vibration electrode film 105 and the back plate 107 are liable to stay in intimate contact and become unable to be separated, thus causing occurrence of sticking.

[0067] Accordingly, in a first embodiment of the present invention, a projection is provided in the back plate, the projection cylindrically projecting to the vibration electrode film side so as to enclose the sound hole. Namely, it is configured such that, when the vibration electrode film is transformed to the back plate side, the vibration electrode film abuts with the tip of the projection to block the sound hole and prevent passage of the air through the sound hole and through the back plate, and thereby prevent an increase in the pressure in the package.

[0068] FIGS. 5A to 5C are views for describing a structure of the vicinity of a back plate 27 and a vibration electrode film 25 in the first embodiment. FIG. 5A is a sectional view illustrating a state before excessive pressure acts, FIG. 5B is a sectional view illustrating a state where the excessive pressure has acted, and FIG. 5C is a plan view. Note that FIGS. 5A and 5B are sectional views along an X-X cross section indicated in FIG. 5C. In FIG. 5A, numeral 23 denotes a substrate, numeral 29 denotes a vibrating membrane electrode pad, numeral 30 denotes a fixed electrode pad, numeral 31 denotes a vibration part in the vibration electrode film 25, and numeral 32 denotes a fixed part in the vibration electrode film 25. As illustrated in FIG. 5A, a projection 27c having a cylindrical shape is provided in the back plate 27 so as to enclose a sound hole 27a close to the end of the vibration electrode film 25 among sound holes 27a in the back plate 27.

[0069] Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the vibration electrode film 25 abuts with the projection 27c to block the sound hole 27a, and can thus prevent the air from passing through the sound hole 27a to suppress the increase in the internal pressure of the package in terms of a region close to the end of the vibration electrode film 25. Further, the presence of the projection 27c makes it difficult for the air to get into the gap between the back plate 27 and the vibration electrode film 25, and to reach the sound hole 27a disposed in a region close to the center of the vibration electrode film 25. It is thereby possible to prevent the air from passing through the sound hole 27a in the region to suppress the increase in the internal pressure of the package.

[0070] Note that the projection 27c may be provided at the sound hole 27a in a region A enclosing the vibration part 31 of the vibration electrode film 25, indicated by a dotted line in FIG. 5C, or may be provided at the sound hole 17a in a region extended in the center of the vibration part 31. The projection 27c may also be provided at the sound holes 27a in the whole region of the vibration part 31. Further, among the sound holes 27a in the above region, the projection 27c may be provided at each of all the sound holes 27a, or may be provided at each of some of the sound holes 27a. The size of the region provided with the projection 27c and the number of sound holes 27a provided with the projection 27c may be appropriately decided based on the degree of increase in the pressure in the package, the degree of occurrence of sticking, and the like, when excessive pressure acts on the acoustic sensor 1.

[0071] FIGS. 6A to 6C illustrate enlarged views of the sound hole 27a and the projection 27c. FIG. 6A is a plan view, and FIG. 6B is a Y-Y sectional view. As illustrated in FIG. 6A, the projection 27c is provided so as to enclose the sound hole 27a in a plan view, and has a cylindrical shape when the sound hole 27a has a circular shape. Note that in the first embodiment, wall-shaped walls 27e link the projections 27c having a cylindrical shape as illustrated in the plan view of FIG. 6C. It is thereby possible to more reliably prevent the air from passing through the gap between the back plate 27 and the vibration electrode film 25 and through the sound hole 27a to suppress the increase in the pressure in the package. Note that the projection 27c and the wall 27e correspond to the flow path cutoff part and the flow path inhibition part in the present invention.

[0072] Next, as a second embodiment, a description will be given of an example where a wall is provided so as to surround a portion in the back plate 27, the portion facing the vibration part 31 of the vibration electrode film 25, so as to make it difficult for the air to pass through the sound hole 27a when excessive pressure acts on the acoustic sensor 1 and the vibration electrode film 25 is transformed to the back plate 27 side.

[0073] FIGS. 7A to 7C are views for describing a structure of the vicinity of the back plate 27 and the vibration electrode film 25 in the second embodiment. FIG. 7A is a sectional view illustrating a state before excessive pressure acts, FIG. 7B is a sectional view illustrating a state where the excessive pressure has acted, and FIG. 7C is a plan view. Note that FIGS. 7A and 7B are sectional views along an X-X cross section indicated in FIG. 7C. In the second embodiment, as illustrated in FIG. 7A, a wall 27d is provided so as to surround a region, which is a portion facing the vibration part 31 of the vibration electrode film 25 and in which the sound holes 27a are distributed, in the back plate 27.

[0074] Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the vibration part 31 of the vibration electrode film 25 abuts with the tip of the wall 27d to cut off a flow path for the air (inhibit the flow of the air) toward the region where the sound holes 27a are distributed in the back plate 27. It is thereby possible to prevent the air from passing through the sound hole 27a to suppress the increase in the pressure in the package. Note that the wall 27d may be provided so as to surround a region B including all the sound holes 27a in FIG. 7C, or some of the sound holes 27a may be distributed outside the region surrounded by the wall 27d. The wall 27d may be provided so as to surround the whole of the vibration electrode film 25 including the fixed portion 32, as illustrated in FIG. 8C.

[0075] Next, a description will be given of an example where a projection is provided in the vibration electrode film. FIGS. 9A to 9C are views for describing a structure of the vicinity of the back plate 27 and the vibration electrode film 25 in a third embodiment. FIG. 9A is a sectional view illustrating a state before excessive pressure acts, FIG. 9B is a sectional view illustrating a state where the excessive pressure has acted, and FIG. 9C is a plan view. Note that FIGS. 9A and 9B are sectional views along an X-X cross section indicated in FIG. 9C. In the third embodiment, as illustrated in FIG. 9A, a projection 25a is provided in a position where each of the sound holes 27a disposed in the facing back plate 27 can be blocked in the vicinity of the end of the vibration part 31 of the vibration electrode film 25. That is, in a plan view, there has been provided the projection 25a having such a cross section in a columnar shape as to include each of the sound holes 27a.

[0076] Accordingly, as illustrated in FIG. 9B, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, among the sound holes 27a in the back plate 27, the projection 25a provided in the vibration electrode film 25 can block particularly the sound hole 27a disposed in a portion facing the vicinity of the end of the vibration part 31 of the vibration electrode film 25, which tends to be a flow path for the air. It is thereby possible to block the sound hole 27a disposed in the portion facing the vicinity of the end of the vibration part 31 of the vibration electrode film 25, and also possible to cut off a flow path for the air (inhibit the flow of the air) flowing into the gap between the vibration electrode film 25 and back plate 27 on the center side of the vibration electrode film 25. It is thereby possible to more efficiently prevent the air from passing through the sound hole 27a to suppress the increase in the pressure in the package.

[0077] Note that in the vibration electrode film 25, the projection 25a may be provided at the sound hole 27a in a region A enclosing the vibration part 31 of the vibration electrode film 25, indicated by a dotted line in FIG. 9C, or may be provided at the sound hole 27a in a region extended in the center of the vibration part 31. The projection 25a may be provided at each of the sound holes 27a facing the whole region of the vibration part 31 (i.e., at each of all the sound holes 27a disposed in the back plate 27). Further, among the sound holes 27a in the above region, the projection 25a may be provided at each of all the sound holes 27a, or may be provided at each of some of the extracted sound holes 27a. The size of the region provided with the projection 25a and the number of sound holes 27a provided with the projection 25a may be appropriately decided based on the degree of increase in the pressure in the package, the degree of occurrence of sticking, and the like, when excessive pressure acts on the acoustic sensor 1.

[0078] In the third embodiment, the projection 25a having a columnar shape is provided in the vibration electrode film 25, the projection 25a being able to block each of the sound holes 27a in the facing back plate 27. However, the projection 25a may have a columnar shape being able to block a plurality of sound holes 27a. Alternatively, for example, a wall is provided so as to surround at least a part of the vibration part 31 of the vibration electrode film 25, and when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the sound hole 27a facing the region surrounded by this wall may be blocked.

[0079] Next, a case will be described where the present invention is applied to a structure where a hole 25b is provided in the vibration electrode film 25. Such a structure may be employed for the purpose of decreasing the sensitivity of a low-frequency region of the acoustic sensor 1. FIGS. 10A to 10C illustrate a structure of a projection 25c in the structure where the hole 25b is provided in the vibration electrode film 25. In such a case, as illustrated in FIG. 10A, the projection 25c having a cylindrical shape may be provided in the vibration electrode film 25 so as to enclose the hole 25b. Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the projection 25c of the vibration electrode film 25 abuts with the back plate 27 to cut off a flow path for the air (inhibit the flow of the air) by the hole 25b in the vibration electrode film 25, so as to make it possible to prevent the air from passing through the hole 25b to suppress the increase in the pressure in the package.

[0080] Further, as illustrated in FIG. 10B, a projection 27e may be provided in the back plate 27, the projection 27e having a cross section that includes the hole 25b in a plan view. Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the projection 27e of the back plate 27 abuts with the vibration electrode film 25 to cut off a flow path for the air (inhibit the flow of the air) by the hole 25b in the vibration electrode film 25, so as to make it possible to prevent the air from passing through the hole 25b to suppress the increase in the pressure in the package.

[0081] Alternatively, as illustrated in FIG. 10C, a projection 27f may be provided in the back plate 27, the projection 27f having a cross section slightly smaller than the hole 25b in a plan view. Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the projection 27f of the back plate 27 gets into the hole 25b in the vibration electrode film 25 to cut off a flow path for the air (inhibit the flow of the air), so as to make it possible to prevent the air from passing through the hole 25b to suppress the increase in the pressure in the package. Further, in this case, the risk of occurrence of sticking can be reduced by the projection abutting with the vibration electrode film 25. In the fourth embodiment illustrated in FIGS. 10A to 10C, the flow path for the air passing through the hole 25b in the vibration electrode film 25 is cut off (the flow of the air is inhibited) directly. In the meantime, this indirectly cuts off at least a part of a flow path for a fluid passing through the gap between the vibration electrode film 25 and the back plate 27 and/or a flow path for a fluid passing through the sound hole of the back plate 27.

[0082] In one or more of the above embodiments, the fixed electrode film is not provided in a portion in contact with the vibration electrode film, such as the tips of the projection and the wall provided on the back plate side (see FIG. 11A).

[0083] Accordingly, for example, even when the wall 27d illustrated in FIG. 11A comes into contact with the vibration electrode film 25 at the time of excessive pressure acting on the acoustic sensor 1, it is possible to prevent occurrence of an electrical short circuit between the vibration electrode film 25 and the back plate 27.

[0084] Further, FIGS. 11B to 11D illustrate the relation of height between the wall 27d provided in the back plate 27 and a stopper 27b. In FIG. 11B, the wall 27d is higher than the stopper 27b. In FIG. 110, the wall 27d is as high as the stopper 27b. In these cases, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the wall 27d reaches the vibration electrode film 25 earlier than or simultaneously with the stopper 27b. This allows the wall 27d and the vibration electrode film 25 to more reliably abut with each other. As a result, when excessive pressure acts on the acoustic sensor 1, it is possible to more reliably prevent the air from passing through the sound hole 27a to suppress the increase in the pressure in the package.

[0085] On the other hand, as illustrated in FIG. 11D, in a case where the wall 27d is lower than the stopper 27b, when excessive pressure acts and the vibration electrode film 25 is transformed to the back plate 27 side, the stopper 27b reaches the vibration electrode film 25 earlier than the wall 27d, thus making it difficult for the wall 27d and the vibration electrode film 25 to reliably abut with each other. As a result, when excessive pressure acts on the acoustic sensor 1, it is difficult to reliably prevent an increase in the pressure in the package due to passage of the air through the sound hole 27a.

[0086] According to one or more embodiments of the present invention, the wall 27d is made higher than the stopper 27b as illustrated in FIG. 11B, or make the wall 27d as high as the stopper 27b as illustrated in FIG. 11C. This also applies to the case where the projection is provided in the back plate 27.

[0087] Next, a case will be described where the present invention is applied to a configuration where a pressure hole 108b is present not on the bottom surface side (the substrate side with respect to the vibration electrode film) but on the ceiling surface side (opposite the substrate across the vibration electrode film) in a package 108. With reference to FIG. 12, a description will be given of a case of the excessive pressure acting on an acoustic sensor 101 in this configuration. When excessive pressure acts on the acoustic sensor 1 in this configuration, the pressure acts on the vibration electrode film 105 from the pressure hole 108b provided on the ceiling surface of the package 108 via the sound hole 107a of the back plate 107. Then, the vibration electrode film 105 is greatly transformed to the side opposite the back plate 107 (to the substrate 103 side), and the vibration electrode film 105 comes into contact with the substrate 103. The vibration electrode film 105 may be damaged at this point.

[0088] Further, the air flowing in from the pressure hole 108b in the above process passes through the gap between the vibration electrode film 105 and the substrate 103, further passes through the opening of the substrate 103, and gets more deeply into the casing, to be compressed. Since the pressure in the package 108 thereby increases, when the inflow of the air is ended, the vibration electrode film 105 is greatly transformed to the back plate 107 side this time, to come into contact with the back plate 107. The vibration electrode film 105 may be damaged at that time.

[0089] In view of the above, in a fifth embodiment, when the pressure hole is present not on the substrate side but on the opposite side of the substrate across the vibration electrode film in the package, the wall is provided in the vibration electrode film on the substrate side, so as to make it difficult for the air to pass through an opening of the back chamber in the substrate to increase the pressure in the package.

[0090] FIGS. 13A to 13C are views for describing a structure of the vicinity of the back plate 27 and the vibration electrode film 25 in the fifth embodiment. FIG. 13A is a sectional view illustrating a state before excessive pressure acts, FIG. 13B is a sectional view illustrating a state where the excessive pressure has acted, and FIG. 13C is a plan view. Note that FIGS. 13A and 13B are sectional views along an X-X cross section indicated in FIG. 13C. In the fifth embodiment, as illustrated in FIG. 13A, a wall 25d is provided in a portion, which faces a substrate 23, in the vibration electrode film 25 so as to surround a back chamber 22.

[0091] Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the substrate 23 side, as illustrated in FIG. 13B, the wall 25d of the vibration electrode film 25 abuts with the top surface of the substrate 23 to cut off a flow path for the air (inhibit the flow of the air) toward the back chamber 22, thereby enabling prevention of an increase in the pressure in the package. Note that the wall 25d is provided so as to surround the opening of the back chamber 22 that is substantially square in a plan view, as indicated by a chain double-dashed line in FIG. 13C. Although the wall 25d is formed in a closed curve in a plan view in this case, the wall 25d may have a gap in a part thereof. Further, in the fifth embodiment, a stopper (not illustrated) may be provided on the surface of the vibration electrode film 25 on the substrate 23 side in order to prevent occurrence of sticking between the vibration electrode film 25 and the substrate 23. In this case, according to one or more embodiments of the present invention, the wall 25d is made as high as or higher than the stopper. Accordingly, when excessive pressure acts and the vibration electrode film 25 is transformed to the substrate 23 side, it is possible to more reliably cause the wall 25d of the vibration electrode film 25 to abut with the top surface of the substrate 23, and to prevent an increase in the pressure in the package.

[0092] When the pressure hole is provided on the ceiling surface of the package, there is considered a configuration where the back plate 27 is disposed in the vibration electrode film 25 on the ceiling surface side (i.e., on the pressure hole side) as illustrated in FIGS. 13A to 13C and FIG. 14A, or a configuration where a vibration electrode film 35 is disposed in a back plate 37 on the ceiling surface side (i.e., on the pressure hole side) as illustrated in FIG. 14B. In such a case as illustrated in FIG. 14B, a wall 37d may be provided so as to surround a region where a sound hole 37a is disposed in the back plate 37. Although not illustrated, a cylindrical projection may be provided in the back plate 37 so as to surround the sound hole 37a. Further, such a projection as to block the sound hole 37a may be provided in the vibration electrode film 35.

MODIFIED EXAMPLE

[0093] In one or more of the above embodiments, the description has been given assuming that the projection or the wall is formed by adding a projected shape to the surface of the back plate or the vibration electrode film. However, the projection or the wall may be formed by adding a curved shape to the back plate or the vibration electrode film.

[0094] Each of FIG. 15A and 15B illustrates a sectional view of the vicinity of the back plate and the vibration electrode film in such a modified example. FIG. 15A is an example where a curved shape is added to the obliquely formed side surface of the back plate 27 to form a wall 27f. In this example, when excessive pressure acts on the acoustic sensor 1 and the vibration electrode film 25 is transformed to the back plate 27 side, the end surface of the vibration part 31 comes close to the wall 27f, to cut off a flow path (inhibit the flow) at the time of the air flowing into the gap between the back plate 27 and the vibration electrode film 25 and prevent passage of the air through the sound hole 27a. It is thereby possible to prevent an increase in the pressure in the package.

[0095] In this modified example, when the curved shape is added to the vibration electrode film 25 on the back plate 27 side, the end surface of the vibration part 31 comes close to the wall 27f, to cut off a flow path (inhibit the flow) at the time of the air flowing into the gap between the back plate 27 and the vibration electrode film 25. In contrast, when the curved shape is extended in the wall 27f to the more central side of the vibration electrode film 25 and the vibration electrode film 25 is transformed to the back plate 27 side, the surface of the vibration electrode film 25 on the back plate 27 side may abut with the wall 27f, to cut off the flow path (inhibit the flow) at the time of the air flowing into the gap between the back plate 27 and the vibration electrode film 25.

[0096] Next, FIG. 15B is an example where a projection 25e of the vibration electrode film 25 is formed by adding a curved shape to a part of the end of the vibration part 31 in the vibration electrode film 25. Also in this example, when excessive pressure acts on the acoustic sensor 1 and the vibration electrode film 25 is transformed to the back plate 27 side, the projection 25e blocks the sound hole 27a of the back plate 27, to cut off a flow path (inhibit the flow) at the time of the air flowing into the gap between the back plate 27 and the vibration electrode film 25 and prevent passage of the air through the sound hole 27a. It is thereby possible to prevent an increase in the pressure in the package.

[0097] In one or more of the above embodiments, the example has been described where excessive pressure acts on the acoustic sensor 1 and the air flows in from the pressure hole. However, the present invention is also applicable to a case where the acoustic sensor 1 is used in an atmosphere other than the air. That is, the flow path cutoff part and the flow path inhibition part in the present invention may cut off a flow path for a fluid other than the air or inhibit the flow of the fluid.

[0098] In one or more of the above embodiments, the example has been described where the vibration part of the vibration electrode film has been in a substantially square shape and the fixed parts have been formed on its periphery. However, the vibration part of the vibration electrode film may be in a circular shape as illustrated in FIGS. 16A and 16B or other shapes. For example, one or more fixed parts 52 may be provided on the periphery of the circular vibration part 51 in a vibration electrode film 45 so as to radially extend as illustrated in FIG. 16A, or an outer peripheral portion of the circular vibration part 51 in the vibration electrode film 45 may directly function as the fixed part 52 that is fixed to the substrate 43 (or a back plate, not illustrated) as illustrated in FIG. 16B. When the whole outer peripheral portion of the circular vibration part 51 in the vibration electrode film 45 functions as the fixed part 52, the air does not flow in from the gap between the circular vibration part 51 and the substrate 43. Hence, previously forming a hole in the circular vibration part 51 is a precondition of the present invention.

[0099] While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.