Method and system for manufacturing a grinding tool
09993909 ยท 2018-06-12
Assignee
Inventors
Cpc classification
B24D11/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/40
PERFORMING OPERATIONS; TRANSPORTING
B24D3/28
PERFORMING OPERATIONS; TRANSPORTING
B24D11/008
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0846
PERFORMING OPERATIONS; TRANSPORTING
B23K2103/42
PERFORMING OPERATIONS; TRANSPORTING
B23K2103/50
PERFORMING OPERATIONS; TRANSPORTING
International classification
B24D11/00
PERFORMING OPERATIONS; TRANSPORTING
B23K26/08
PERFORMING OPERATIONS; TRANSPORTING
B23K26/40
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A method for manufacturing a grinding tool which has a binding agent based on aromatic molecules includes cutting an abrasive material parent web with a laser device to form at least one inner contour of the grinding tool, and punching out an outer contour of the grinding tool from the abrasive material parent web.
Claims
1. A method of manufacturing a grinding tool which includes a binding agent based on aromatic molecules, the method comprising: cutting a region of an abrasive parent web with a laser device to form at least one inner contour of a grinding tool, the region of the abrasive parent web supported only by adjoining regions of the abrasive parent web during cutting; punching out an outer contour of the grinding tool from the abrasive material parent web; and applying a synchronization marking to the abrasive material parent web with the laser device.
2. The method according to claim 1, wherein the inner contour defines a grinding dust extraction opening.
3. A method of manufacturing a grinding tool that includes a binding agent based on aromatic molecules, the method comprising: cutting an abrasive parent web with a laser device to form at least one inner contour and one outer contour of a grinding tool; and extensively evacuating soot particles formed during the cutting of the inner and outer contours of the grinding tool, wherein during the cutting of the inner and outer contours of the grinding tool, the grinding tool is fixed on a cutting board by generating a gas pressure on a side of the grinding tool that is facing toward the cutting board which is less than a gas pressure on a side of the grinding tool that is facing away from the cutting board.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Further advantages emerge from the following drawing description. In the drawing, two illustrative embodiments of the disclosure are represented. The drawing, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also view the features in isolation and put them together into sensible further combinations.
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DETAILED DESCRIPTION
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(10) The unreeling device 46a unreels an abrasive material parent web 18a from a roll. The abrasive material parent web 18a comprises a substrate, abrasive grains and a binding agent based on aromatic molecules. The binding agent binds the substrate and the abrasive grains one to the other. The abrasive material parent web 18a is of flexible configuration.
(11) A roller system 62a transports the abrasive material parent web 18a to the first dancer 50a and onward through said devices in the specified sequence. At the web connection point 48a, if the roll of the abrasive material parent web 18a is used up, a new roll with a new abrasive material parent web 18a is put in place. The first dancer 50a tautens the abrasive material parent web 18a to a predefined tension. To this end, the dancer 50a has at least one movable roller.
(12) With this tension, the abrasive material parent web 18a is guided through the laser device 14a. In a cutting process, a laser 64a of the laser device 14a cuts inner contours 12a of the grinding tools 10a into the abrasive material parent web 18a by means of a laser beam. The inner contours 12a of the grinding tools 10a delimit grinding dust openings 16a of the grinding tools 10a. The laser 64a is configured as a CO.sub.2 laser.
(13) Moreover, by means of the laser device 14a, synchronization markings 20a are applied to the abrasive material parent web 18a. The synchronization markings 20a are configured as slits in the abrasive material parent web 18a.
(14) The cutting process of the laser device 14a is realized on a free-hanging region 22a of the abrasive material parent web 18a. A soot evacuation device 92a extensively evacuates soot particles, formed in the cutting process, on a side of the abrasive material parent web 18a that is facing away from the laser 64a, through the (due to the free-hanging region 22a) free space 66a. To this end, a fan 68a of the soot evacuation device 92a generates a gas volume flow 70a. The gas volume flow 70a is here configured as an airflow.
(15) The second dancer 52a is disposed between the first clamping feed 54a and the laser device 14a. Before the second dancer 52a, an advancement of the abrasive material parent web 18a is realized in a continuous feed. After the second dancer 52a, an advancement of the abrasive material parent web 18a is realized in a discontinuous feed. The discontinuous feed is generated by the first clamping feed 54a. The second dancer 52a equalizes differences in the feeds by means of a movably mounted roller.
(16) After the second dancer 52a, the abrasive material parent web 18a is guided through the punching device 30a. The punching device 30a has punching knives 72a and a punching web 74a. In a punching process, the punching web 74a serves as a support. The punching web is supported in the punching process on a side facing away from the punching knives 72a. The punching web 74a is configured as a continuous web. The punching web 74a has a discontinuous feed, which is synchronous to the discontinuous feed of the abrasive material parent web 18a. To this end, at least one of the clamping feeds 54a, 56a acts on the punching web 74a. Alternatively to the punching web 74a, a punching device could have a punching plate, over which the abrasive material parent web 18a is guided.
(17) The punching device 30a has a luminant 76a and an optical sensing means 78a. The luminant 76a and the optical sensing means 78a are disposed on different sides of the abrasive material parent web 18a. The luminant 76a shines through the synchronization marking 20a and the optical sensing means 78a registers the energy emitted by the luminant 76a. The punching device 30a determines from a signal pattern of an output signal of the optical sensing means 78a a position of the inner contours 12a relative to the punching knives 72a of the punching device 30a. The punching device 30a controls a feed of the abrasive material parent web 18a in dependence on the determined position. Alternatively, an illuminant and an optical sensing means could be disposed on a same side of the abrasive material parent web, wherein the optical sensing means detects changes in a reflected component of an energy emitted by the luminant.
(18) In dependence on the determined position of the inner contours 12a, the punching knives 72a of the punching device 30a punch outer contours 26a of the grinding tools 10a out of the abrasive material parent web 18a. In the punching process, the punching knives 72a round the edges of the outer contours 26a.
(19) The second clamping feed 56a guides the abrasive material parent web 18a out of the punching device 30a. The second clamping feed 56a here controls a tension of the abrasive material parent web 18a such that the outer contour 26a of the grinding tools 10a corresponds to a preset and is not influenced by different tensions and thus elongations of the abrasive material parent web 18a.
(20) The pickup robot 58a separates the grinding tools 10a from a remainder 80a of the abrasive material parent web 18a. To this end, the pickup robot 58a has movable means which appear sensible to the person skilled in the art. The reeling device 60a reels the remainder 80a of the abrasive material parent web 18a onto a roll.
(21) Beneath the representation of the system 44a,
(22) In
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(24) A cutting process of inner contours 12b by means of the first laser device 14b is realized, as described in the first illustrative embodiment, on a free-hanging region 22b of an abrasive material parent web 18b. After this, the abrasive material parent web 18b is guided through the tension reduction rollers 82b, by means of which a tension of the abrasive material parent web 18b is reduced.
(25) In a cutting process of outer contours 26b of the grinding tools 10b with the second laser device 84b, the abrasive material parent web 18b is fixed on a cutting board 24b of the system 44b by means of an underpressure. To this end, the system 44b has a suction device 86b, which, on a side 88b of a cutting board 24b that is facing away from the abrasive material parent web 18b, generates an underpressure by means of a fan 68b of the suction device 86b. The abrasive material parent web 18b is guided through the second laser device 84b with less tension than through the first laser device 14b.
(26) The suction device 86b is configured in one piece with a soot evacuation device 28b of the system 44b. The soot evacuation device 28b is designed to extensively evacuate soot particles formed with the second laser device 84b in a cutting process of the outer contour 26b of the grinding tool 10b.
(27) In the cutting process, the inner contours 12b and outer contours 26b of the grinding tools 10b, which contours delimit the grinding dust openings 16b, are cut by the different laser devices 14b, 84b. Alternatively or additionally, the inner contours 12b and the outer contours 26b are cut with a same laser device, wherein cuttings of the inner contours 12b which remain on or in the cutting board 24b are removed from the cutting board 24b, for instance by means of compressed air.
(28) The cutting board 24b is represented in greater detail in
(29) The supporting structure 36b consists of a thermoplastic plastic, in this case of a polyethylene plastic. The supporting structure 36b delimits cavities 90b, through which the underpressure on a suction surface 34b acts on the abrasive material parent web 18b. The supporting structure 36b is configured as a honeycomb structure. The supporting surface 32b of the cutting board 24b is smaller than the suction surface 34b of the cavities 90b. In this case, a size of the supporting surface 32b of the cutting board 24b measures less than 10% of a size of the suction surface 34b.
(30) The film layer 40b is bonded to the supporting structure 36b. The film layer 40b is formed of a thermoplastic plastic, in this case of a polypropylene plastic. The film layer 40b delimits the cavities 90b on a side facing away from the supporting surface 32b. The film layer 40b delimits suction openings 42b. Through the suction openings 42b, a gas volume flow 70b is sucked out of the cavities 90b by the suction device 86b. The suction openings 42b are configured as recesses defined in a slit shape. The suction openings 42b respectively enable a gas volume flow 70b out of several of the cavities 90b. Alternatively, suction openings can be made in a film layer in some other way which appears sensible to the person skilled in the art, for instance by a perforation and/or punch hole. The stabilizing layer 38b is configured as a nonwoven layer. The stabilizing layer 38b protects the film layer 40b from damage.
(31) In this illustrative embodiment, the cutting board 24b is guided as a continuous band through the laser device 14b. Alternatively, the cutting board 24b can be guided into the laser device 14b in some other way which appears sensible to the person skilled in the art, for instance as tiles guided one behind the other.
(32) The grinding tools 10b are taken down from the cutting board 24b by the pickup robot 58b. The pickup robot 58b is configured as a pick & place robot.