Heating tile

Abstract

A heating tile designed to be easily installed using standard construction methods and materials while providing a radiant heating method that is compatible with both computer controlled systems as well as simple thermostat controls, can be repaired without major floor rework, does not produce a significant magnetic field, is protected against overheating due to excessive exposed surface insulation, and is water and contaminant resistant even if there is minor cracking of the tile.

Claims

1. A heating tile, comprising: an inflammable tile of rigid design with an electrical conductivity value greater than or equal to 110.sup.6 m; and recessed channels in the tile holding a resistive heating element, an over temperature sensor, and two cold leads, wherein a flexible water tight insulation is installed over the resistive heating element.

2. The heating tile of claim 1, wherein the resistive heating element is placed such that it has the ability to slide within the recessed channels.

3. The heating tile of claim 1, wherein the over temperature sensor is wired in series with the resistive heating element to shut current flow off if the temperature of the tile exceeds a preset value.

4. The heating tile of claim 1, wherein the two cold leads are placed in their appropriate channels and not permanently adhered to the tile.

5. The heating tile of claim 1, wherein the resistive heating element is attached to the two cold leads.

6. The heating tile of claim 1, wherein the two cold leads are terminated with those on one end being of exposed electrically conductive material and the other end being of either a hard and fast connector or a slide connector, both of which shall have a water tight seal against exposing the bare electrically conductive material to liquids or fine contaminants after installation.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Many aspects of the embodiment's can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiment's. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

(2) FIG. 1 is a schematic view of one embodiment of a heated tiled floor. Although this embodiment shows squares, the invention applies to any shape or arrangement of tiles.

(3) FIG. 2 is a schematic of a heating tile used in the heating floor in FIG. 1. The layout of one embodiment is shown. The exact placement of the components is dependent on the design of the tile but all components that are required are presented.

DETAILED DESCRIPTION OF THE INVENTION

(4) The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to an or one embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

(5) Referring to FIG. 1, a heating floor according to one embodiment is shown. The heating floor includes a plurality of heating tiles (1) disposed side by side and may be of any shape the design requires. The plurality of heating tiles (1) are arranged to form a plurality of lines and rows between which there may be a gap filled with some form of grout or equivalent (9) in another embodiment the heating tiles (1) may be placed next to each other with no deliberate gap (9). The plurality of heating tiles (1) can be fixed with the floor using the standard tile securing material methods and materials.

(6) The plurality of heating tiles (1) can be electrically interconnected in any fashion as appropriate for the installation. The embodiments include but are not limited to being connected by number of tiles, or grouped according to the designers plans, or the control system limitations, but in no case to exceed the current rating of the cold leads (6) of the tiles (1).

(7) For safety and assembly reasons the tile (1) must be of rigid design and its electrical conductivity greater than or equal to 110.sup.6 m. This ohmic value will act as a second insulator in case of failure of either the cold lead insulation or the heating element insulation, similar to a double insulated drill.

(8) Referring to FIG. 2, each heating tile (1) includes channels (2) inlaid with the resistive heating element (3) such that it has the ability to slide within the channels (2) and have a flexible water tight insulation (4) to allow minor cracking of the tile and shifting caused by normal floor deformations without exposing the resistive heating elements (3) to contact with liquids or the encroachment of fine contaminants. In one embodiment this inlaying of the resistive heating elements (3) could be done with tape holding the wire into the channel with the tape also stuck to the outside of the bottom of the tile itself. In this embodiment the tape must not be water proof in order to ensure liquids do not fill the channel. Other equally effective embodiments are also applicable. The wattage of the resistive heating elements will be dependent upon their usage environment.

(9) In line with the resistive heating element (3) there is an automatic reset over temperature sensor (5) to prevent the tile from getting to hot. The over temperature sensor (5) would be activated by such things as storing large flat objects on the tile while the heat is on, or being covered by items placed on the floor such as pillows, blankets, throw rugs, etc. The over temperature sensor (5) may be located in different spots based on design and layout criteria and tile (1) shape and characteristics. The over temperature sensor (5) in one embodiment would be set for around 40 C. (104 F.) for a human occupancy and in other embodiments may require higher or lower temperatures depending on their application.

(10) In one embodiment the channels (2) for the resistive heating elements (3) and the two cold leads (6) are no more than 5 mm apart and laid out so the currents in the wires in the two adjacent channels are flowing in opposite directions. In other embodiments there may be only one channel (2) for the resistive heating elements (3) and one channel (2) for the two cold leads (6) or other combinations of single and dual channels (2) in which case the wires in single channels (2) will be laid such that the currents in the adjacent wires are opposing. This arrangement will severely reduce if not totally eliminate any magnetic fields associated with the flow of electric current.

(11) The two cold leads (6) are shown going straight through the tile (1), but can be designed to enter/leave any side, or even multiple sides if the design requires it. This allows the tiles (1) to be designed so some may act as corner pieces or straight through pieces, or even multiple branch pieces as would best fit the application. The two cold leads are shown in channels, but must not be permanently attached to the tile (1) or cracking of the tile may damage the insulation of one or more of the two cold leads (6). In one embodiment the method of holding the two colds leads 16) in place can mimic the method for the resistive heating elements (3) or can be a different method.

(12) First end cold lead (6a) is the end which mates up to the second end (6b) cold lead and consists of enough bare electrically conductive material to make up with the connector on the second end (6b). The cold lead second end (6b) can be either a slip in connector or a mechanical connector using mechanical compression or soldering as the attachment method. The method used will depend on Electrical codes in the areas the tile (1) is designed to be used in. When attached together the first end cold lead (6a) and the second end cold lead (6b) must form a water tight connection to prevent any water or fine contaminates from forming an electrical bridge to the environment.

(13) The slack take up chamber (8) will only be required in the embodiment where either types mechanical connections or solder sleeve connectors are used. This allows the connection to be made up and then any slack pushed back into the tile (1). On very thin tiles (1), this chamber may not be used and the leads may be countersunk into the flooring as determined by the installer. The exact size and shape of the take up chamber (8) will depend on the characteristics of the cold leads (6,6a & 6b). The illustration is generic and not to scale.

(14) Each cold lead (6) to resistive heating element (7) connection is done at some point along the cold leads (6). The chamber may actually be the channel (2) the cold leads (6) are running in or in another embodiment where both cold leads (6) are within one channel (2) depending on the tile (1) material and construction. It's exact placement will depend on the layout of the resistive heating element (3) and were the most economical attachment point is.

(15) Heating tile (1) provides a method of installation which requires minimum expertise outside of the normal expertise which would be required to install the tile without heat. It allows an installation in existing houses with little more effort than what would be required for a new floor overlay.

(16) It is to be understood that the above-described embodiment's are intended to illustrate rather than limit the present disclosure. Variations may be made to the embodiment's without departing from the spirit of the disclosure as claimed. It is understood that any element of any one embodiment is considered to be disclosed to be incorporated with any other embodiment. The above-described embodiment's illustrate the scope of the disclosure but do not restrict the scope of the disclosure.