Transfer/punching process

Abstract

The invention relates to a method for operating a punching/transferring device (1), in particular for producing RFID antennas. The punching/transfer device (1) has a punching tool (2) with a vacuum connection (3), said vacuum connection (3) interacting with a porous elastomer (9) such that by means of the punching tool (2), a desired contour can be punched out of a multilayer composite, held, and then dispensed by modifying the shape of the porous elastomer (9) and/or by modifying the vacuum.

Claims

1. A method of operating a punching and transferring apparatus for making RFID antennas, wherein the punching and transferring apparatus has a punch with a vacuum connection that works together with a porous elastomer in such a manner that a desired shape is punched out of a multilayer laminate and held by the punch, and then can be released by a modification of the shape of the porous elastomer or of the vacuum.

2. The method according to claim 1, wherein the multilayer laminate comprises a first substrate layer and at least one second substrate layer connected to each other by a separable first adhesive layer, and the at least one second substrate layer is connected to a metal layer via a second adhesive layer, the desired shape being punched out of all the layers by the punch with the exception of the first substrate layer.

3. The method according to claim 1, wherein, prior to the punching of the multilayer laminate, a recess is created by an upstream punching process.

4. The method according to claim 1, wherein, prior to the punching process, the second substrate layer is separated from the first substrate layer and is then reattached.

5. The method according to claim 4, wherein the process of reattaching the two substrate layers is performed with a matched superimposition or with an offset.

6. The method according to claim 1, wherein the punched-out laminated piece comprising the substrate layer, the adhesive layers, and the metal layer is pressed onto a further substrate layer by the adhesive layer.

7. The method according to claim 1 wherein waste around the punched-out laminated piece is disposed of by winding around a roll.

8. The method according to claim 1, wherein waste around the punched-out laminated piece remains on the first substrate layer due to the first adhesive layer, and is disposed of with same by winding into a roll.

9. A method comprising: providing a laminate comprised of a backing substrate, a layer of adhesive thereon, and an inlay layer secured by the adhesive layer to the backing substrate; pressing a punch having a cavity defined within an annular cutting edge and holding a block of a porous elastomer against the laminate to cut with the edge through all of the laminate except the backing substrate and thereby punch out of the laminate a piece shaped like the cavity while simultaneously; drawing air into the cavity through the porous elastomer to compact the elastomer and hold the punched-out piece in the cavity, against a front face of the block, and at or behind a plane defined by the edge; thereafter separating the punched out piece from the backing substrate; thereafter relaxing the block to elastically push at least part of the adhesive layer out of the cavity past the plane defined by the cutting edge; and pressing the adhesive layer on the punched-out piece against a target component to adhere the punched out piece thereto.

10. A punching and transferring apparatus for making an RFID inlay, the punching and transferring apparatus comprising: a punch with a vacuum connection that works together with a porous elastomer in such a manner that a desired shape is punched out of a multilayer laminate and held by the punch and then can be released by a modification of the shape of the porous elastomer.

11. A punching and transferring apparatus for making an RFID inlay, the punching and transferring apparatus comprising: a punch with a vacuum connection that works together with a porous elastomer, the punch having a cutting angle oriented symmetrically or asymmetrically, that is less than 45.

12. The punching and transferring apparatus according to claim 11, wherein a flank of the punch extends parallel to a punching direction.

Description

BRIEF DESCRIPTION OF THE DRAWING

(1) The method according to the invention for operating a punching and transferring apparatus for making RFID inlays, and more precisely antennas of RFID inlays, is explained and described below in greater detail in the context of a punch used therefor according to the invention and with reference to a drawing in which:

(2) FIGS. 1 and 2 show a punching and transferring apparatus 1 at the moment of the punching process (FIG. 1) and at the moment of the transfer of the punched-out piece (FIG. 2) prior to release for further processing;

(3) FIGS. 3 and 4 like FIGS. 1 and 2 show another punching tool and transferring apparatus according to the invention; and

(4) FIG. 5 is a top view of a finished workpiece in accordance with the invention.

SPECIFIC DESCRIPTION OF THE INVENTION

(5) The punching and transferring apparatus 1 comprises a punch 2 that is either as a stand-alone tool or for example one of several such tools on a punching roll. The punch 2 has a vacuum connection 3 that makes it possible to generate a vacuum force applied to the back face of the punch 2 via this vacuum connection 3. This vacuum pressure can be modified in a controlled manner.

(6) The punch 2 can impart to a multilayer laminate given a desired shape by punching.

(7) In the embodiment according to the processing steps illustrated in FIGS. 1 and 2, there is a multilayer laminate with a first substrate layer 4 carrying a first adhesive layer 5 that is connected to a second substrate layer 6. The second substrate layer 6, in turn, is provided with a second adhesive layer 7 over a large surface area, and a metal layer 8 is flush against the latter. The first substrate layer 4 is for example a silicone film, the second substrate layer 6 is for example made of paper, and the metal layer 8 is made of aluminum. This multilayer laminate can be realized in a particularly simple and cost-effective manner if the layers 6, 7, and 8 form the PAL laminate described above. This should be used cost-effectively from a roll.

(8) The multilayer laminate 4-8 described above is fed to the punch 2. The punch is moved toward the first substrate layer 4, proceeding from the metal layer 8. It is specifically moved axially far enough that the shape of the punch 2 that is lowest when viewed as in FIG. 1 projects into the plane in which the first adhesive layer 5 lies, stopping at the upper face of the first substrate layer 4. For this purpose, the first substrate layer 4 can be supported on a counter support (for example, with a flat design, or as a backing roll). So that the punched-out piece formed only by the layers 5 to 8 is guided and held in the punch, the punch 2 has a punch flank 10 that advantageously runs parallel (asymmetrically) to a punching direction 11. The other punch flank of the punch 2 has an angle that is preferably 45, and more preferably in the range from 30 to 35. This design of the punch flank 10 results in a nearly right-angle punching shape with respect to the surface of the multilayer laminate. The two flanks of the punch can also be oriented symmetrically with respect to the punching direction 11.

(9) In order to move the punched-out piece of this multilayer laminate in the punching direction 11 and also hold the piece in the punch 2, a vacuum force is effective through the vacuum connection 3 over a large portion of the surface of the metal layer 8 in this case via a porous elastomer. Because the first substrate layer 4 in particular is supported in a defined manner, and a defined vacuum force is also applied to the multilayer laminate, the porous elastomer 9 is compressed in a defined manner parallel to the punching direction 11. As a result, the multilayer laminate 5 to 8 is punched out in an advantageous manner by the punch flank 10 of the punch 2, and is held in the punch 2. Due to the material properties of the porous elastomer 9 and the applied vacuum force, the system ensures that the end of the punch flank 10 does not engage into the first substrate layer 4. Consequently, a piece of the desired shape is punched out of a multilayer laminate and held by the punch 2 and can then be released by modifying the shape of the porous elastomer 9, particularly its thickness, and/or by modifying the vacuum.

(10) This transfer to a subsequent processing is achieved by pulling off the first substrate layer, for example the silicone film, following the punching process. In the process, the remaining layers 5 to 8 that lie outside of the shape of the punch 2 are also removed. It is important in this case that the adhesion forces of the adhesive layer 7 are significantly greater than those of the adhesive layer 5 in order to prevent the layers 6, 8 arranged on the first substrate layer 4 from also being pulled off with the same. As such, the punch 2 can perform not only the punching process, but also the transfer process for the further processing of the punched-out laminated piece.

(11) While FIGS. 1 and 2 show a first example for the multilayer laminate, the same process (punching and transfer) is likewise shown in FIGS. 3 and 4. However, in the latter case, the additional substrate layer 6 and the metal layer 8 are reversed relative to the adhesive layer 7. This can have significance for the subsequent processing of the punched-out laminated piece.

(12) With respect to FIGS. 2 and/or 4, the actual transfer process is described below. After the multilayer laminate 5 to 8 has been punched out as in FIGS. 1 and 3, the first substrate layer 4 is removed in a subsequent step, along with the layers present around the punched-out piece. This leaves the metal layer 8 that has been given the desired shape and is connected to the further substrate layer 6 via the adhesive layer 7 inside the punch 2. In this case, this is the PAL laminate named above. However, this does not constitute a restriction, because other materials can also be used.

(13) As shown in FIGS. 1 and/or 3, during the punching process this adhesive layer 5 lies approximately in the plane formed by the outer edges (the cutting edges facing downward in FIGS. 1 and/or 3) of the punch flanks 10. As such, at this time (that is, during and immediately following the punching), the adhesive layer 5 was not yet accessible in a defined manner for further processing. After the punching process, the porous elastomer 9 can relax in a defined manner (whereas previously the porous elastomer 9 was compressed in a defined manner during the punching process due to the shape of the punch 2). During the punching process, the vacuum force applied to the multilayer laminate positioned inside the punch 2 hold the punched-out piece in place. After the punching process, the vacuum force applied via the vacuum connection 3 is maintained, is reduced, and/or is eliminated. It is advantageous if it is maintained for the purpose of holding the multilayer laminate positioned inside the punch 2 and is now punched out. However, it can also be reduced or removed if the multilayer laminate is transferred to the target component directly after the punching process. In any case, it is important that the adhesive force of the adhesive layer 5 is greater than the holding force inside the punch so that the punched-out laminated piece can be removed from the punch by this adhesive force, and supplied to the target component and adhered to same.

(14) As such, the porous elastomer 9 can therefore relax again in a defined manner following the punching process (because the counter support has been removed) such that it presses the punched multilayer laminate out of the punch 2 to a desired degree in a release direction 12. The degree of this pressing-out is chosen such that the entire adhesive layer 5, and optionally also a part of the second substrate layer 6, are preferably moved out of the plane defined by the lower edges of the punch flanks 10. This time following the reduction or removal of the vacuum force, and the relaxing of the porous elastomer 9 (that is, an enlargement of the axial extension in the release direction 12) is illustrated in FIGS. 2 and 4. After this has occurred, this punched-out laminated piece 5 to 8 can be transferred for further processing.

(15) Up to this time, most of the layers 5 to 8 of the multilayer laminate are inside the punch 2. However, because it may be necessary, particularly for making an antenna of an RFID inlay, to also give the metal layer 8 a desired shape, in one implementation of the invention it can be contemplated that a desired shape is made prior to the previously described process of punching out the metal layer 8, by a further, particularly upstream, processparticularly also a punching process. The desired shape can, for example, be a cutout 14 in the metal layer, or also a more complex geometry. The further, particularly upstream process need not necessarily be a punching process. Rather, it can be carried out by a laser or the like, for example. The desired overall shape to be given to the metal layer 8 is shown in FIG. 5 in a top view, and the layers 5 to 8 for example have been punched out as a multilayer laminate and transferred to a target component 13 (for example a paper web). Depending on the presence of more or fewer layers, accordingly more or fewer layers (for example only the metal layer with its adhesive layer) are transferred to the target component 13 following the punching process. As such, at least in one design, at least the metal layer 8 can therefore be given a desired shape, particularly a recess 14, before the multilayer laminate 4 to 8 is fed to the punch 2. In this way, the metal layer 8 is advantageously given the desired shape (for example, the antenna structure needed for an RFID inlay), and can undergo the further punching and transferring process. Particularly as regards the multilayer laminate 4 to 8 and the following punching and transferring process, the advantageous result, which is essential for the invention, is that for making an antenna for RFID inlay, an antenna structure is produced such that only the antenna structure, with its adhesive layer, need then be attached to the target component.

(16) Therefore, this is an entirely decisive and substantial advantage of the punching and transferring apparatus according to the invention, and of the method carried out by same.

(17) According to the invention, prior to the punching process, the second substrate layer 6 is furthermore detached from the first substrate layer 4, and then these two layers 4, 6 are brought back together again. In this way, the so-called release value between the two layers 4, 6 that are connected via the adhesive layer 5 is reduced. This means that to separate the two substrate layers 4, 6 from each other, a certain force must first be applied to overcome the adhesive forces of the adhesive layer 5 connecting together the two layers 4, 6. If at this point these two substrate layers 4, 6 are brought together again and then detached once more from each other, the release force then required is lower. This state is exploited to supply the multilayer laminate to the punching process in such a manner that lower forces are needed after punching to remove the first substrate layer 4 from the punched-out laminated piece. This is advantageous because as a result only reduced forces are required to hold the punched-out laminated piece 5 to 8 in the punch 2, particularly only the shape of the punch flanks 10 (and optionally without any vacuum). If the vacuum is present, it can be lower because the release value of the connection between the two substrate layers 4, 6 has been reduced by the previous detaching and re-attaching. This is advantageous most of all for mass production in the punching and transferring of the multilayer laminates.

(18) According to the invention, as a complement to the above, the process of reattaching the two substrate layers 4, 6 can be performed with a matched superimposition or with an offset. If the process of reattaching the two substrate layers 4, 6 is performed with a matched superimposition, the release value is advantageously reduced as described above. If the process of reattaching the two substrate layers 4, 6 is performed with an offset, this has the advantage that the processing, by punching or otherwise, of the metal layer 8, which potentially reached into the direction of the first substrate layer 4, are no longer matched in superimposition following the attachment. As a result, it is advantageously possible to ensure that, if the metal layer 8 particularly has a delicate structure, for example that of an antenna, via the further processing, it can be removed during further processing, following the transfer from the first substrate layer 4, without incidentespecially without damage.

(19) Finally, the punched-out laminated piece comprising the substrate layer 6, the adhesive layers 5, 7, and the metal layer 8 is secured to a further substrate layer by the adhesive layer 5. As a result, the metal layers 8 are transferred to the further substrate layer, with their desired shape, particularly the delicate antenna structure, following the processing and the transfer. If the substrate layer 4 is then removed, the multilayer laminate 5 to 8 can be supplied with its shape to the target component. The unneeded part of the multilayer laminate outside of the punching shape of the punch remains on the first substrate layer 4 and is removed together with itfor example on a rollwithout forming troublesome waste.

(20) The invention therefore offers the very decisive advantage that only the specific part of the multilayer laminate that is also needed for the further process steps is punched out by the punching and transferring apparatus and supplied to the further processing. The remaining part (the scrap) of the multilayer laminate can be disposed of in a very simple manner, and there is no need to capture and dispose of individual layers, as in the prior art.

(21) The multilayer laminate can comprise layers 4 to 8 as described above. However, more layers than this can be contemplated, as well as a multilayer laminate comprising only one substrate layer or adhesive layer and one further layer, in particular a metal layer, connected to each other via an adhesive layer. The metal layer 8 as above is advantageously used to produce an antenna and/or antenna structure, and therefore consists of an electrically conductive material (for example, aluminum foil). Depending on the intended use, the metal layer described above can also consist of a non-conductive material (such as a fabric, paper, plastic film, or the like).