Method to fuse silicone and thermoplastic resin

Abstract

This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps: Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.

Claims

1. A method to fuse silicone and thermoplastic resin, comprising the following steps: A: conducting plasma treatment twice on a thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin cover ranges from 500 to 800 W, the time of treatment ranges 5 to 60 seconds; B: applying a glue on the place for laying a silicone gasket on the thermoplastic resin lid, and baking in the oven for 15-20 minutes; C: putting the treated thermoplastic resin lid and the silicone gasket in step B into an over mold for encapsulation, the time of which ranges from 2 to 3 minutes; conducting post vulcanization for 2 hours after completing the encapsulation.

2. The method according to claim 1, wherein the thermoplastic resin is selected from a group consisting of polypropylene and polyethylene.

3. The method according to claim 1, wherein a temperature for encapsulation ranges from 100 C. to 130 C.

4. The method according to claim 1, wherein a temperature for the post vulcanization ranges from 80 C. to 130 C.

5. The method according to claim 3, wherein the temperature for encapsulation is 125 C.

6. The method according to claim 4, wherein the temperature for post vulcanization is 120 C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is the process flow chart of this invention.

DETAILED DESCRIPTION OF THE INVENTION

(2) The invention has been described with respect to the following embodiments. However, those skilled in this field will readily understand that contents described in these embodiments are only for explaining this invention, which shall not and will not restrict this invention elaborated in the claims.

(3) Embodiment 1: a method to fuse silicone and thermoplastic resin comprises the following steps:

(4) Conducting treatment twice on polypropylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polypropylene. The power for treating the polypropylene lid is 500 W, and the time of treatment is 60 seconds; applying the glue on the place for laying silicone gasket on polypropylene lid, and baking it in the oven for 20 minutes; putting the treated polypropylene lid and silicone gasket into the over mold for encapsulation, the temperature of which is 125 C. and the time of which is 2 minutes. Then conducting post vulcanization at 120 C. for 2 hours after completing the encapsulation.

(5) Embodiment 2: a method to fuse silicone and thermoplastic resin comprises the following steps:

(6) Conducting treatment twice on polyethylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polyethylene. The power for treating the polyethylene lid is 800 W, the time of treatment is 5 s; applying the glue on the place for laying silicone gasket on polyethylene lid, baking it in the oven for 15 minutes; putting the treated polyethylene lid and silicone into the over mold for encapsulation, the temperature of which is 100 C. and the time of which is 3 minutes. Then conducting post vulcanization at 80 C. for 2 hours after completing the encapsulation.

(7) Embodiment 3: a method to fuse silicone and thermoplastic resin comprises the following steps:

(8) Conducting treatment twice on polypropylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polypropylene. The power for treating the polypropylene lid is 600 W, the time of treatment is 30 seconds; applying the glue on the place for laying silicone gasket on polypropylene lid, baking it in the oven for 20 minutes; putting the treated polypropylene lid and silicone gasket into the over mold for encapsulation, the temperature of which is 130 C. and the time of which is 2 minutes. Then conducting post vulcanization at 80 C. for 2 hours after completing the encapsulation.

(9) Embodiment 4: a method to fuse silicone and thermoplastic resin comprises the following steps:

(10) Conducting treatment twice on polyethylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polyethylene. The power for treating the polyethylene lid is 700 W, the time of treatment is 15 s; applying the glue on the place for laying silicone gasket on polyethylene lid, bake it in the oven for 15 minutes; putting the treated polyethylene lid and silicone gasket into the over mold for encapsulation, the temperature of which is 100 C. and the time of which is 3 minutes. Then conducting post vulcanization at 100 C. for 2 hours after completing the encapsulation.

(11) Embodiment 5: a method to fuse silicone and thermoplastic resin comprises the following steps:

(12) Conducting treatment twice on polypropylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polypropylene. The power for treating the polypropylene lid is 500 W, the time of treatment is 60 seconds; applying the glue on the place for laying silicone gasket on polypropylene lid and baking it in the oven for 20 minutes; putting the treated polypropylene lid and silicone gasket into the over mold for encapsulation, the temperature of which is 125 C. and the time of which is 3 minutes. Then conducting post vulcanization at 130 C. for 2 hours after completing the encapsulation.

(13) Embodiment 6: a method to fuse silicone and thermoplastic resin comprises the following steps:

(14) Conducting treatment twice on polyethylene lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of polyethylene. The power for treating the polyethylene lid is 800 W, the time of treatment is 10 seconds; apply the glue on the place for laying silicone gasket on polyethylene lid, baking it in the oven for 15 minutes; putting the treated polyethylene lid and silicone gasket into the over mold for encapsulation, the temperature of which is 125 C. and the time of which is 2 minutes. Then conducting post vulcanization at 100 C. for 2 hours after completing the encapsulation.

(15) Apparent to those skilled in this field that this invention patent is not limited to details of the above-mentioned exemplary embodiments. It can be realized in other specific forms without departing from the spirit or basic features of this invention patent. The scope of protection of this invention patent is limited by claims, therefore it aims at embracing all changes fallen within the definition and scope of equivalent components of claims into this invention patent, and any mark in drawings attached to claims shall not be regarded as the restriction of claims involved.