COATING TAPE
20230033984 · 2023-02-02
Inventors
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B05D1/286
PERFORMING OPERATIONS; TRANSPORTING
B32B18/00
PERFORMING OPERATIONS; TRANSPORTING
C04B41/4523
CHEMISTRY; METALLURGY
B05B13/0221
PERFORMING OPERATIONS; TRANSPORTING
B05B9/002
PERFORMING OPERATIONS; TRANSPORTING
C04B35/62218
CHEMISTRY; METALLURGY
International classification
C04B41/45
CHEMISTRY; METALLURGY
B32B18/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A process for manufacturing continuous ceramic tape includes steps of heating a ceramic feedstock to a molten state and spraying molten droplets of the feedstock onto a deposition surface. The method further includes forming a ceramic coating on the deposition surface by accumulating the droplets, which solidify and are directly bonded to one another. The deposition surface is non-stick with respect to the ceramic coating such that the coating may be peeled off of the deposition surface as a continuous ceramic tape, without fracture. Additionally, in embodiments, the deposition surface is removed by running the deposition over a bending edge, chemically stripping or dissolving the deposition surface, or burning the deposition surface.
Claims
1. A tape, comprising: inorganic material having a melting temperature greater than 250° C. at one standard atmosphere; microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae; a length of at least 10 mm, a thickness orthogonal to the length of at least 20 μm and no more than 5 mm, and a width orthogonal to the length and the thickness of at least 2 mm.
2. The tape of claim 1, wherein the tape is thin such that the thickness is no more than 250 μm.
3. The tape of claim 2, wherein the tape has a length of at least 10 m.
4. The tape of claim 3, wherein the elongate tape is wound on a reel.
5. The tape of claim 1, wherein the lamellae are ceramic.
6. The tape of claim 1, wherein the tape has lower thermal conductivity and/or lower electrical conductivity than the inorganic material in bulk.
7. An assembly, comprising: a tape comprising: inorganic material having a melting temperature greater than 250° C. at one standard atmosphere; microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae; a length of at least 10 mm, a thickness orthogonal to the length of at least 20 μm and no more than 5 mm, and a width orthogonal to the length and the thickness of at least 2 mm; and a polymeric carrier comprising a fluoropolymer surface, the tape bonded to the polymeric carrier with the fluoropolymer surface in contact with the tape.
8. A sheet, comprising: layers of inorganic material having a melting temperature greater than 250° C. at one standard atmosphere, wherein each layer has a thickness of at least 20 μm and no more than 5 mm, wherein each layer has microstructure of overlapping lamellae, the lamellae having a thickness less than twice a lateral dimension thereof, wherein the lamellae are directly bonded to one another but include at least some voids between at least some of the lamellae; and interfaces between the layers where each layer is bonded to an adjoining layer.
9. The sheet of claim 8, wherein the layers are of different materials from one another in terms of composition.
Description
BRIEF DESCRIPTION OF THE FIGURES
[0013] The accompanying Figures are included to provide a further understanding and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments, and together with the Detailed Description serve to explain principles and operations of the various embodiments. As such, the disclosure will become more fully understood from the following Detailed Description, taken in conjunction with the accompanying Figures, in which:
[0014]
[0015]
[0016]
[0017]
[0018]
[0019]
DETAILED DESCRIPTION
[0020] Before turning to the following Detailed Description and Figures, which illustrate exemplary embodiments in detail, it should be understood that the present inventive technology is not limited to the details or methodology set forth in the Detailed Description or illustrated in the Figures. For example, as will be understood by those of ordinary skill in the art, features and attributes associated with embodiments shown in one of the Figures or described in the text relating to one of the embodiments may well be applied to other embodiments shown in another of the Figures or described elsewhere in the text.
[0021] Referring to
[0022] In some such embodiments, the deposition surface 116 is non-stick with respect to the coating 118 such that the coating 118 may be peeled off the deposition surface 116 as a sheet and/or a continuous tape, such as a sheet 120 of a length L of at least 10 mm, without fracture (i.e. crack and tear apart widthwise across the sheet 120 or tape) such as at least 10 cm, such as at least 1 m, such as at least 10 m. In some embodiments, the deposition surface 116 specifically includes a polymer, such as a thermoplastic polymer, such as fluoropolymer, such as polytetrafluoroethylene. Polymer may be counterintuitive as a deposition surface material due to high temperatures of the droplets from the heating step. In other embodiments, different materials may be used with the deposition surface 116 to facilitate delamination of the coating 118, such as polysiloxanes or other polymers, or other materials such as anodized aluminum, for example. In contemplated embodiments, the deposition surface 116 may be flexible, such as a thin layer (e.g., less than 1 mm thick, such as less than 0.5 mm) of polymeric material as disclosed above, such as a polymeric carrier having a surface with a non-stick fluoropolymer. Flexibility of the deposition surface 116 may help removal thereof, such as by peeling.
[0023] In some embodiments, the heating step heats the feedstock to a temperature above 250° C., while the deposition surface 116 includes a thermoplastic polymer, which may have a melting temperature actually below that of the heated feedstock. The combination of a high temperature spray of particles or droplets 114 (e.g., at least 300° C., such as at least 450° C., such as at least 600° C.) and a lower-melting temperature deposition substrate 116 (e.g., that being less than 600° C., such as less than 450° C., such as less than 300° C.) may be counterintuitive. However, small particles or droplets 114 may have insufficient thermal mass and/or temperature to melt or melt much the deposition surface 116.
[0024] According to an exemplary embodiment, the feedstock and corresponding particles or droplets 114, is or includes an inorganic material, such as a ceramic in a powder form or suspension. For example, the feedstock may be, include, and/or mostly include (by weight percentage) alumina or zirconia, such as yttria-stabilized zirconia, precursors thereof, and/or other ceramics. Such materials may be cumbersome to manufacture as thin sheets via conventional processes, such as slicing of boules or via tape casting. In other contemplated embodiments, feedstock may be or include other materials, such as glass, metals, ceramic, and/or polymer.
[0025] Applicants believe manufacturing processes disclosed herein to be particularly efficient for forming sheets 120 of material, such as thin ceramic tapes. In some contemplated embodiments, the step of forming the coating 118 is performed at a rate greater than 5 m/min of the length of the coating 118, such as a rate greater than 10 m/min of the length of the coating 118, such as a rate greater than 12 m/min of the length of the coating 118. For example, Applicants estimate that a tape 42 mm wide could be produced at 12-13 m/min with technology disclosed herein.
[0026] According to some exemplary embodiments, the particles or droplets 114 are a different material (i.e., composition) than the deposition surface 116. But in some contemplated embodiments, multiple passes through the manufacturing line 110 or passage past multiple spray heads 120 in series may add and/or at least party overlap layers of the coating material over one another, such as to increase thickness of the coating 118 and corresponding sheet 120. For example, in some such embodiments, the multiple passes or spray heads may be arranged side-by-side so as to increase the width of the sheet 120, as shown in
[0027] Referring to
[0028] In some embodiments, the coating 118 is applied along a swath of the deposition surface, and the coating 118 forms a sheet 120 that is more specifically an elongate tape, having a length L greater than 10 m. In some embodiments, the elongate tape is much longer than wide, such as having a length L to width W aspect ratio of at least 5:1, such as at least 10:1, such as at least 100:1. The manufacturing process may further include winding the elongate tape on a reel (see, e.g.,
[0029] Referring to
[0030] Referring to
[0031] With or without the furnace, the sheet 120 and/or the coating 218 on the deposition surface 216 (e.g. carrier), may be wound on a reel, such as a reel 312 having a diameter of less than 3 m, such as less than 1 m. The ability to wind the sheet 120 on the reel 312 is a function of the composition and/or the thickness of the material. For example, Applicants believe that alumina tape having a thickness of less than 200 μm and microstructure (i.e., small scale structure of the material, as revealed by microscopy) as described herein, may be wound on such reels 312 without fracture.
[0032] Referring to
[0033] While a polymer deposition surface has primarily been discussed herein, other deposition surfaces are also suitable for use in embodiments of the present invention. For example, other suitable materials for use as deposition surfaces 116, 216, 516 include organic or inorganic materials, such as paper, wood, ceramics, glasses, or metals (e.g., stainless steel, copper, platinum, brass, etc.). Additionally, while “no-stick” or “non-stick” embodiments were previously discussed, “low-stick” materials could be used that have just enough adhesion for the droplets 114, 214 to stick to the deposition surface 116, 216, 516. Further, the deposition surface 116, 216, 516 could be roughened (e.g., through sand blasting) to improve adhesion during the initial stages of deposition, while still allowing for relatively easy peeling of the deposition surface 116, 216, 516 from the coating 118, 218 or sheet 520. Notwithstanding, in further embodiments, other techniques besides peeling can be used to remove the deposition surface 116, 216, 516. For example, paper and polymer deposition surfaces 116, 216, 516 can be burned off of the coating 118, 218 or sheet 520. Additionally, for any of the deposition surfaces 116, 216, 516, the coating 118, 218 or sheet 520 can be released from the deposition surface 116, 216, 516 by running the deposition surface 116, 216, 516 over a bend (an embodiment of which is discussed in more detail below). Still further, the deposition surface 116, 216, 516 can be dissolved or chemically stripped away from the coating 118, 218 or sheet 520.
[0034] Using any of the previously described embodiments, the coating 118, 218 or sheet 520 may be up to 300 μm thick in embodiments. In still other embodiments, the coating 118, 218 or sheet 520 may be up to 3 mm thick, and in yet further embodiments, the coating 118, 218 or sheet 520 may be up to 5 mm thick. In certain embodiments, e.g., in which the coating 118, 218 or sheet 520 is greater than 100 μm thick, then the coating 118, 218 or sheet 520 may be singulated instead of winding the over a reel. In embodiments, the singulated coating 118, 218 or sheet 520 is at least 50 mm in length.
[0035] In sheets 520 built up from multiple layers 522, each layer can be a different material and/or have a different density. For example, each layer 522 can be a different material, such as different ceramic materials (e.g., alumina or zirconia). Also, by way of example, each layer 522 can be a different density. In an embodiment, a first porous layer 522 is deposited followed by a denser layer 522, and in such embodiments, the first porous layer 522 has a density that is less than the density of the second layer 522. Such layer structures may be useful in certain technologies, such as for batteries. Additionally, a first porous layer 522 may be deposited to enhance adhesion of the second, denser layer 522. Thereafter, additional dense layers 522 can be further applied, and optionally, the first porous layer 522 can be dissolved.
[0036] As mentioned above, the coatings 118, 218 or sheet 520 may undergo further processing in a furnace, such as furnace 314. In furnace 314, the coatings 118, 218 or sheet 520 may be sintered. In embodiments, one effect of sintering is to increase the density of coatings 118, 218 or sheet 520. Sintering can take place for either the continuous tape or singulated segments.
[0037] With reference now to
[0038] As in the embodiments described above, the deposition surface 616 can be a polymer, such as a thermoplastic polymer, including fluoropolymers (e.g., polytetrafluoroethylene). Additionally, in embodiments, the deposition surface 616 can be paper or a metal strip or foil, such as stainless steel or copper. In embodiments, each of these materials for the deposition surface 616 can be surface roughened to improve adhesion of the droplets 614 on the deposition surface 616.
[0039] Further, as in the embodiments described above, the feedstock is formed into droplets 614 via the spray head 612 at a high temperature (e.g., feedstock can reach temperatures as high as 10,000 K), but the feedstock is “cooled” by the time it reaches the deposition surface 616. As described above, coating may take place at a rate of 10 m/min. However, in some embodiments, the coating may take place at a lower rate, e.g., 7 m/min, 5 m/min, or 3 m/min. As discussed above, coating of the deposition surface 616 can be accomplished by multiple spray heads 614 arranged in parallel to cover a wider swath and/or in series to deposit more layers or materials.
[0040] As discussed above, the deposition surface 616 is separated from the coating 618 at the edge 622. In embodiments, the coating has a thickness of at least 20 μm. In other embodiments, the coating has a thickness of at least 100 μm, and in still other embodiments, the coating has a thickness of at least 200 μm. In embodiments, the thickness is at most 5 mm. In other embodiments, the coating is at most 3 mm, and in still other embodiments, the coating is at most 300 μm. The coating 618 may undergo further processing, such as sintering in furnace 626 to, e.g., increase the density of the coating 618. Additionally, the continuous tape of coating 618 may undergo singulation before, after, or without sintering to forming singulated strips 628. Such singulated strips 628 may have a length of up to about 10 mm, up to about 25 mm, up to about 50 mm, or up to about 100 mm.
[0041] In another embodiment similar to that shown in
[0042] The construction and arrangements of the methods and products, as shown in the various exemplary embodiments, are illustrative only. Although only a few embodiments have been described in detail in this disclosure, many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes, and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations) without materially departing from the novel teachings and advantages of the subject matter described herein. Some elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. The order or sequence of any process, logical algorithm, or method steps may be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes and omissions may also be made in the design, operating conditions and arrangement of the various exemplary embodiments without departing from the scope of the present inventive technology.