DISTRIBUTED POWER MANAGEMENT APPARATUS

Abstract

A distributed power management apparatus is provided. The distributed power management apparatus includes an envelope tracking (ET) integrated circuit (ETIC) and a distributed ETIC separated from the ETIC. The ETIC is configured to generate a number of ET voltages for a number of power amplifier circuits and the distributed ETIC is configured to generate a distributed ET voltage(s) for a distributed power amplifier circuit(s). In a non-limiting example, the number of power amplifier circuits and the distributed power amplifier circuit(s) can be disposed on opposite sides (e.g., top and bottom) of a wireless device. As such, in embodiments disclosed herein, the ETIC is provided closer to the power amplifier circuits and the distributed ETIC is provided closer to the distributed power amplifier circuit(s). By providing the ETIC and the distributed ETIC closer to the respective power amplifier circuits, it is possible to reduce trace inductance and unwanted signal distortion.

Claims

1. A method for operating a distributed power management apparatus comprising: generating, from a distributed envelope tracking (ET) integrated circuit (ETIC), a distributed ET voltage based on a distributed ET target voltage; generating, from each of a plurality of voltage circuits in an ETIC separated from the distributed ETIC, a respective one of a plurality of ET voltages and a respective one of a plurality of low-frequency currents based on a respective one of a plurality of ET target voltages; coupling a selected one of the plurality of voltage circuits to the distributed ETIC to provide the respective one of the plurality of low-frequency currents to the distributed ETIC; and providing a selected one of the plurality of ET target voltages to the distributed ETIC as the distributed ET target voltage.

2. The method of claim 1, wherein generating the distributed ET voltage comprises: generating a distributed initial ET voltage based on the distributed ET target voltage; and raising the distributed initial ET voltage by a distributed offset voltage to generate the distributed ET voltage.

3. The method of claim 1, wherein generating the respective one of the plurality of ET voltages and the respective one of the plurality of low-frequency currents comprises: generating a low-frequency voltage based on a battery voltage; inducing the respective one of the plurality of low-frequency currents based on the low-frequency voltage; generating an initial ET voltage based on the respective one of the plurality of ET target voltages; and raising the initial ET voltage by an offset voltage to generate the respective one of the plurality of ET voltages.

4. The method of claim 3, further comprising generating the low-frequency voltage in the selected one of the plurality of voltage circuits based on the selected one of the plurality of ET target voltages.

5. The method of claim 4, further comprising causing the selected one of the plurality of voltage circuits not to generate the initial ET voltage.

6. The method of claim 1, further comprising: receiving, via an input switch circuit in the ETIC, the plurality of ET target voltages from a transceiver circuit; and controlling the input switch circuit to couple any of the plurality of ET target voltages to any of the plurality of voltage circuits.

7. The method of claim 6, further comprising controlling the input switch circuit to cause the selected one of the plurality of ET target voltages to be provided to the distributed ETIC and the selected one of the plurality of voltage circuits.

8. The method of claim 1, further comprising controlling an output switch circuit in the ETIC to couple any of the plurality of voltage circuits to any of a plurality of voltage outputs in the ETIC.

9. The method of claim 8, further comprising: coupling the distributed ETIC to the ETIC via a selected one of the plurality of voltage outputs; and controlling the output switch circuit to couple the selected one of the plurality of voltage circuits to the selected one of the plurality of voltage outputs to provide the respective one of the plurality of low-frequency currents to the distributed ETIC.

10. The method of claim 9, further comprising: coupling each of one or more power amplifier circuits to a respective one of the plurality of voltage outputs that is different from the selected one of the plurality of voltage outputs coupled to the distributed ETIC; and coupling at least one distributed power amplifier circuit to the distributed ETIC.

11. A method for operating a distributed power management apparatus in a wireless device comprising: generating, from a distributed envelope tracking (ET) integrated circuit (ETIC) in the distributed power management apparatus, a distributed ET voltage based on a distributed ET target voltage; generating, from each of a plurality of voltage circuits in an ETIC separated from the distributed ETIC in the distributed power management apparatus, a respective one of a plurality of ET voltages and a respective one of a plurality of low-frequency currents based on a respective one of a plurality of ET target voltages; coupling a selected one of the plurality of voltage circuits to the distributed ETIC to provide the respective one of the plurality of low-frequency currents to the distributed ETIC; providing a selected one of the plurality of ET target voltages to the distributed ETIC as the distributed ET target voltage; coupling the ETIC to one or more power amplifier circuits in the wireless device; and coupling at least one distributed power amplifier circuit to the distributed ETIC.

12. The method of claim 11, further comprising: providing one or more antennas along one side of the wireless device and coupling each of the one or more antennas to a respective one of the one or more power amplifier circuits; and providing at least one distributed antenna along an opposite side of the wireless device and coupling the at least one distributed antenna to the at least one distributed power amplifier circuit.

13. The method of claim 11, further comprising: disposing the ETIC closer to any of the one or more power amplifier circuits than to the at least one distributed power amplifier circuit; and disposing the distributed ETIC closer to the at least one distributed power amplifier circuit than to any of the one or more power amplifier circuits.

14. The method of claim 11, wherein generating the distributed ET voltage comprises: generating a distributed initial ET voltage based on the distributed ET target voltage; and raising the distributed initial ET voltage by a distributed offset voltage to generate the distributed ET voltage.

15. The method of claim 11, wherein generating the respective one of the plurality of ET voltages and the respective one of the plurality of low-frequency currents comprises: generating a low-frequency voltage based on a battery voltage; inducing the respective one of the plurality of low-frequency currents based on the low-frequency voltage; generating an initial ET voltage based on the respective one of the plurality of ET target voltages; and raising the initial ET voltage by an offset voltage to generate the respective one of the plurality of ET voltages.

16. The method of claim 15, further comprising: generating the low-frequency voltage in the selected one of the plurality of voltage circuits based on the selected one of the plurality of ET target voltages; and causing the selected one of the plurality of voltage circuits not to generate the initial ET voltage.

17. The method of claim 11, further comprising receiving, via an input switch circuit in the ETIC, the plurality of ET target voltages from a transceiver circuit; and controlling the input switch circuit to couple any of the plurality of ET target voltages to any of the plurality of voltage circuits.

18. The method of claim 17, further comprising controlling the input switch circuit to cause the selected one of the plurality of ET target voltages to be provided to the distributed ETIC and the selected one of the plurality of voltage circuits.

19. The method of claim 11, further comprising controlling an output switch circuit in the ETIC to couple any of the plurality of voltage circuits to any of a plurality of voltage outputs in the ETIC.

20. The method of claim 19, further comprising: coupling each of one or more power amplifier circuits to a respective one of the plurality of voltage outputs that is different from the selected one of the plurality of voltage outputs coupled to the distributed ETIC; and coupling the at least one distributed power amplifier circuit to the distributed ETIC.

Description

BRIEF DESCRIPTION OF THE DRAWING FIGURES

[0011] The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.

[0012] FIG. 1 is a schematic diagram of an exemplary distributed power management apparatus configured according to an embodiment of the present disclosure;

[0013] FIG. 2A is a schematic diagram providing an exemplary illustration of an output switch circuit in an envelope tracking (ET) integrated circuit (ETIC) of the distributed power management apparatus of FIG. 1;

[0014] FIG. 2B is a schematic diagram providing an exemplary illustration of an input switch circuit in the ETIC of the distributed power management apparatus of FIG. 1;

[0015] FIG. 3A is a schematic diagram providing an exemplary illustration of a voltage circuit in the ETIC of the distributed power management apparatus of FIG. 1;

[0016] FIG. 3B is a schematic diagram providing an exemplary illustration of a distributed voltage circuit in a distributed ETIC of the distributed power management apparatus of FIG. 1; and

[0017] FIG. 4 is a schematic diagram of a wireless device incorporating the distributed power management apparatus of FIG. 1.

DETAILED DESCRIPTION

[0018] The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.

[0019] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items.

[0020] It will be understood that when an element such as a layer, region, or substrate is referred to as being on or extending onto another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being directly on or extending directly onto another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being over or extending over another element, it can be directly over or extend directly over the other element or intervening elements may also be present. In contrast, when an element is referred to as being directly over or extending directly over another element, there are no intervening elements present. It will also be understood that when an element is referred to as being connected or coupled to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being directly connected or directly coupled to another element, there are no intervening elements present.

[0021] Relative terms such as below or above or upper or lower or horizontal or vertical may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0022] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms comprises, comprising, includes, and/or including when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0023] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0024] Embodiments of the disclosure relate to a distributed power management apparatus. The distributed power management apparatus includes an envelope tracking (ET) integrated circuit (ETIC) and a distributed ETIC separated from the ETIC. The ETIC is configured to generate a number of ET voltages for a number of power amplifier circuits and the distributed ETIC is configured to generate a distributed ET voltage(s) for a distributed power amplifier circuit(s). In a non-limiting example, the number of power amplifier circuits and the distributed power amplifier circuit(s) can be disposed on opposite sides (e.g., top and bottom) of a wireless device. As such, in embodiments disclosed herein, the ETIC is provided closer to the power amplifier circuits and the distributed ETIC is provided closer to the distributed power amplifier circuit(s). By providing the ETIC and the distributed ETIC closer to the respective power amplifier circuits, it is possible to reduce trace inductance and unwanted signal distortion.

[0025] FIG. 1 is a schematic diagram of an exemplary distributed power management apparatus 10 configured according to an embodiment of the present disclosure. The distributed power management apparatus 10 includes an ETIC 12 and a distributed ETIC 14 (denoted as DETIC). Notably, the ETIC 12 and the distributed ETIC 14 are separate circuits that are coupled by a conductive trace 16.

[0026] The ETIC 12 includes a number of voltage circuits 18(1)-18(M). Each of the voltage circuits 18(1)-18(M) can be configured to generate a respective one of a number of ET voltages V.sub.CCA-V.sub.CCM and a respective one of a number of low-frequency currents I.sub.DCA-I.sub.DCM (e.g., direct currents) based on a respective one of a number of ET target voltages V.sub.TGT-1-V.sub.TGT-L.

[0027] The distributed ETIC 14 includes at least one distributed voltage circuit 20, which is configured to generate at least one distributed ET voltage D.sub.VCC based on at least one distributed ET target voltage D.sub.VTGT. Notably, the distributed voltage circuit 20 does not generate its own low-frequency current. Instead, the distributed ETIC 14 is configured to receive a respective one of the low-frequency currents I.sub.DCA-I.sub.DCM generated by a selected one of the voltage circuits 18(1)-18(M) (also referred to as a selected low-frequency current DI.sub.DC hereinafter) via the conductive trace 16. Further, the distributed ETIC 14 also receives a respective one of the ET target voltages V.sub.TGT-1-V.sub.TGT-L of the selected one of the voltage circuits 18(1)-18(M) as the distributed ET target voltage D.sub.VTGT. As discussed later in FIGS. 3A and 3B, the distributed ETIC 14 can have a smaller footprint than the ETIC 12 by receiving the distributed ET target voltage D.sub.VTGT and the selected low-frequency current DI.sub.DC from the ETIC 12.

[0028] The ETIC 12 can include a number of voltage outputs 22(1)-22(N). In embodiments disclosed herein, N may be smaller than, equal to, or larger than M. One of the voltage outputs 22(1)-22(N) (referred to as a dedicated voltage output 24 hereinafter) is dedicated to providing the selected low-frequency current DI.sub.DC to a distributed voltage output 26 in the distributed ETIC 14. As a non-limiting example, the voltage output 22(N) is discussed hereinafter as the dedicated voltage output 24. However, it should be appreciated that any of the voltage outputs 22(1)-22(N) can be configured to function as the dedicated voltage output 24.

[0029] The ETIC 12 further includes an output switch circuit 28 configured to couple any of the voltage circuits 18(1)-18(M) to any of the voltage outputs 22(1)-22(N). The ETIC 12 further includes a control circuit 30, which can be a field-programmable gate array (FPGA), as an example. The control circuit 30 may control the output switch circuit 28 to couple any of the voltage circuits 18(1)-18(M) to the dedicated voltage output 24 to provide the respective one of the low-frequency currents I.sub.DCA-I.sub.DCM to the distributed voltage output 26 as the selected low-frequency current DI.sub.DC.

[0030] FIG. 2A is a schematic diagram providing an exemplary illustration of the output switch circuit 28 in the ETIC 12 of the distributed power management apparatus 10 of FIG. 2. Common elements between FIGS. 1 and 2A are shown therein with common element numbers and will not be re-described herein.

[0031] Notably, the output switch circuit 28 can include one or more output switches SW.sub.OUT, which can be any types of switches. For example, the output switches SW.sub.OUT can be a multi-pole multi-throw (MPMT) switch or a number of single-pole multi-throw (SPMT) switches. Accordingly, the control circuit 30 can control the output switches SW.sub.OUT to selectively couple any of the voltage circuits 18(1)-18(M) to any of the voltage outputs 22(1)-22(N).

[0032] With reference back to FIG. 1, the distributed power management apparatus 10 can include one or more power amplifier circuits 32(1)-32(K)(K<N), each configured to amplify a respective one of one or more radio frequency (RF) signals 34(1)-34(K). The control circuit 30 can control the output switch circuit 38 to provide any of the ET voltages V.sub.CCA-V.sub.CCM and any of the low-frequency currents I.sub.DCA-I.sub.DCM to any of the power amplifier circuits 32(1)-32(K). The distributed power management apparatus 10 also includes at least one distributed power amplifier circuit 36 configured to amplify at least one distributed RF signal 38. The distributed power amplifier circuit 36 is coupled to the distributed voltage output 26 to receive the distributed ET voltage DV.sub.CC.

[0033] Since the distributed ETIC 14 is coupled to the ETIC 12 via the conductive trace 16, the distributed ETIC 14 will see a trace inductance L.sub.T and a capacitance C.sub.VO. Herein, the trace inductance LT represents an equivalent inductance of the conductive trace 16 and the capacitance C.sub.VO represents an equivalent capacitance of all active and passive circuits that are coupled to the dedicated voltage output 24. For example, the capacitance C.sub.VO can include an equivalent capacitance of a switch (not shown) in the output switch circuit 38 that couples the selected one of the voltage circuits 18(1)-18(M) to the dedicated voltage output 24. In addition, if any of the power amplifier circuits 32(1)-32(K) is coupled to the dedicated voltage output 24, the capacitance C.sub.VO would also include an equivalent capacitance of the power amplifier circuit. Given that the equivalent capacitances of the switch and the power amplifier circuit are all parallel capacitances with respect to the dedicated voltage output 24, the capacitance C.sub.VO at the dedicated voltage output 24 will equal a sum of the equivalent capacitances of any switch and any power amplifier circuit coupled to the dedicated voltage output 24.

[0034] The trace inductance L.sub.T and the capacitance C.sub.VO can cause an equivalent series resonance frequency f.sub.RESONANCE as shown in the equation (Eq. 1) below.

[00001]$\begin{array}{cc}{f}_{\mathrm{RESONANCE}}=1/\left(2\sqrt{L_T*\mathrm{Cov}}\right)& \left(\mathrm{Eq}.1\right)\end{array}$

[0035] The equivalent series resonance frequency f.sub.RESONANCE can cause linearity degradation in the distributed power amplifier circuit 36 if the equivalent series resonance frequency f.sub.RESONANCE is close enough to a modulation bandwidth of the distributed RF signal 38. In this regard, it is necessary to separate the equivalent series resonance frequency f.sub.RESONANCE from the modulation bandwidth as much as possible.

[0036] In an embodiment, it is possible to separate the equivalent series resonance frequency f.sub.RESONANCE from the modulation bandwidth of the distributed RF signal 38 by increasing the equivalent series resonance frequency f.sub.RESONANCE. According to the equation (Eq. 1), one way to increase the equivalent series resonance frequency f.sub.RESONANCE is to reduce the capacitance C.sub.VO. As mentioned above, the capacitance C.sub.VO is equal to the sum of equivalent capacitance of any switch and any power amplifier circuit coupled to the dedicated voltage output 24. In a non-limiting example, it is possible to reduce the capacitance C.sub.VO by eliminating the equivalent capacitance of any power amplifier circuit coupled to the dedicated voltage output 24. In this regard, the distributed power management apparatus 10 can be configured not to couple any of the power amplifier circuit 32(1)-32(K) to the dedicated voltage output 24. In other words, the power amplifier circuit 32(1)-32(K) can be couped to any of the voltage outputs 22(1)-22(N), except for the dedicated voltage output 24.

[0037] The ETIC 12 also includes an input switch circuit 40. The input switch circuit 40 is coupled to a transceiver circuit (not shown) to receive the ET target voltages V.sub.TGT-1-V.sub.TGT-L. The input switch circuit 40 is also coupled to the voltage circuits 18(1)-18(M) in the ETIC 12 and the distributed voltage circuit 20 in the distributed ETIC 14.

[0038] FIG. 2B is a schematic diagram providing an exemplary illustration of the input switch circuit 40 in the ETIC 12 of the distributed power management apparatus 10 of FIG. 2. Common elements between FIGS. 1 and 2B are shown therein with common element numbers and will not be re-described herein.

[0039] Notably, the input switch circuit 40 can include one or more input switches SW.sub.IN, which can be any type of switches. For example, the input switches SW.sub.IN can be an MPMT switch or a number of SPMT switches. Accordingly, the control circuit 30 can control the input switches SW.sub.IN to provide any of the ET target voltages V.sub.TGT-1-V.sub.IGT-L to any of the voltage circuits 18(1)-19(M). The input switch circuit 40 also includes at least one distribution switch SW.sub.DIST, which can be a multi-pole single throw (MPST) or a SPMT switch, as an example. The control circuit 30 can control the distribution switch SW.sub.DIST to provide any of the ET target voltages V.sub.TGT-1-V.sub.IGT-L to the distributed voltage circuit 20 as the distributed ET target voltage DV.sub.TGT.

[0040] With reference back to FIG. 1, as discussed earlier, each of the voltage circuits 18(1)-18(M) in the ETIC 12 can generate the respective one of the ET voltages V.sub.CCA-V.sub.CCM and the respective one of the low-frequency currents I.sub.DCA-I.sub.DCM. In this regard, FIG. 3A is a schematic diagram providing an exemplary illustration of a voltage circuit 42, which can be provided in the distributed power management apparatus 10 of FIG. 1 as any of the voltage circuits 18(1)-18(N). Common elements between FIGS. 1 and 3A are shown therein with common element numbers and will not be re-described herein.

[0041] The voltage circuit 42 includes a voltage amplifier 44 (denoted as VA) coupled in series to an offset capacitor 46. The voltage amplifier 44 is configured to generate an initial ET voltage V.sub.AMP based on an ET target voltage V.sub.TGT, which can be any of the ET target voltages V.sub.TGT-1-V.sub.TGT-L. The offset capacitor 46 can be charged by a low-frequency current I.sub.DC, which can be any of the low-frequency currents I.sub.DCA-I.sub.DCM, to an offset voltage VOFF to thereby raise the initial ET voltage V.sub.AMP by the offset voltage VOFF. Accordingly, the voltage circuit 42 can generate an ET voltage V.sub.CC, which can be any of the ET voltages V.sub.CCA-V.sub.CCM, that equals a sum of the initial ET voltage V.sub.AMP and the offset voltage V.sub.OFF (V.sub.CC=V.sub.AMP+V.sub.OFF).

[0042] The voltage circuit 42 also includes a bypass switch S.sub.BYP having one end coupled in between the voltage amplifier 44 and the offset capacitor 46, and another end to a ground (GND). The bypass switch S.sub.BYP is closed while the offset capacitor 46 is being charged toward the offset voltage V.sub.OFF and opened when the offset capacitor 46 is charged to the offset voltage V.sub.OFF. The voltage circuit 42 also includes a feedback loop 48 that feeds a copy of the ET voltage V.sub.CC back to the voltage amplifier 44. The voltage amplifier 44 operates based on a supply voltage V.sub.SUP, which may be provided by, for example, the control circuit in the ETIC 12. Notably, the supply voltage V.sub.SUP may also be provided by a dedicated supply voltage circuit (not shown) in the ETIC 12.

[0043] The voltage circuit 42 also includes a multi-level charge pump (MCP) 50 coupled in series to a power inductor 52. The MCP 50 is configured to generate the low-frequency voltage V.sub.DC at multiple levels based on a battery voltage V.sub.BAT. In a non-limiting example, the MCP 50 can generate the low-frequency voltage at different levels (e.g., 0 V, V.sub.BAT, or 2*V.sub.BAT) in accordance with the ET target voltage V.sub.TGT. The power inductor 52 induces the low-frequency current I.sub.DC based on the low-frequency voltage VDC.

[0044] With reference back to FIG. 1, as discussed earlier, the distributed voltage circuit 20 in the distributed ETIC 14 can generate the distributed ET voltage DV.sub.CC based on the distributed ET target voltage DV.sub.TGT. In this regard, FIG. 3B is a schematic diagram providing an exemplary illustration of the distributed voltage circuit 20 in the distributed power management apparatus 10 of FIG. 1. Common elements between FIGS. 1 and 3B are shown therein with common element numbers and will not be re-described herein.

[0045] The distributed voltage circuit 20 includes a distributed voltage amplifier 54 (denoted as DVA) coupled in series to a distributed offset capacitor 56. The distributed voltage amplifier 54 is configured to generate a distributed initial ET voltage DV.sub.AMP based on the distributed ET target voltage DV.sub.TGT, which can be any of the ET target voltages V.sub.TGT-1-V.sub.TGT-L. The distributed offset capacitor 56 can be charged by the selected low-frequency current DI.sub.DC, which can be any of the low-frequency currents I.sub.DCA-I.sub.DCM, to a distributed offset voltage DV.sub.OFF to thereby raise the distributed initial ET voltage DV.sub.AMP by the distributed offset voltage DV.sub.OFF. Accordingly, the distributed voltage circuit 20 can generate the distributed ET voltage DV.sub.CC that equals a sum of the distributed initial ET voltage DV.sub.AMP and the distributed offset voltage DV.sub.OFF (DV.sub.CC=DV.sub.AMP+DV.sub.OFF).

[0046] The distributed voltage circuit 20 also includes a distributed bypass switch DS.sub.BYP having one end coupled in between the distributed voltage amplifier 54 and the distributed offset capacitor 56, and another end to the GND. The distributed bypass switch DS.sub.BYP is closed while the distributed offset capacitor 56 is being charged toward the distributed offset voltage DV.sub.OFF and opened when the distributed offset capacitor 56 is charged to the distributed offset voltage DV.sub.OFF. The voltage circuit 42 also includes a distributed feedback loop 58 that feeds a copy of the distributed ET voltage DV.sub.CC back to the distributed voltage amplifier 54. The distributed voltage amplifier 54 operates based on a distributed supply voltage DV.sub.SUP, which may be provided by, for example, the control circuit in the ETIC 12. Notably, the distributed supply voltage DV.sub.SUP may also be provided by a dedicated supply voltage circuit (not shown) in the ETIC 12 or in the distributed ETIC 14.

[0047] In contrast to the voltage circuit 42 in FIG. 3A, the distributed voltage circuit 20 does not include the MCP 50 and the power inductor 52. Instead, the distributed voltage circuit 20 relies on the MCP 50 and the power inductor 52 in the voltage circuit 42 of FIG. 3A to supply the selected low-frequency current DI.sub.DC. By eliminating the MCP 50 and the power inductor 52 from the distributed voltage circuit 20, it is thus possible to reduce footprint of the distributed voltage circuit 20.

[0048] With reference back to FIG. 1, when the selected one of the voltage circuits 18(1)-18(M) is coupled to the dedicated voltage output 24 to provide the selected low-frequency current DI.sub.DC to the distributed voltage circuit 20, the control circuit 30 can deactivate the voltage amplifier 44 in the selected one of the voltage circuits 18(1)-18(M). The control circuit 30 can further control the distribution switch SW.sub.DIST in the input switch circuit 40 to provide the respective one of the ET target voltages V.sub.TGT-1-V.sub.IGT-L received by the selected one of the voltage circuits 18(1)-18(M) to the distributed voltage circuit 20 in the distributed ETIC 14. For example, if the voltage circuit 18(1) has been coupled to the dedicated voltage output 24 and is configured to receive the ET target voltage V.sub.TGT-1, the control circuit 30 would deactivate the voltage amplifier 44 in the voltage circuit 18(1) and control the distribution switch SW DIST to provide the ET target voltage V.sub.TGT-1 to the distributed voltage circuit 20 as the distributed ET target voltage DV.sub.TGT.

[0049] The distributed power management apparatus 10 can be provided in a wireless device to enable a flexible antenna configuration. In this regard, FIG. 4 is a schematic diagram of a wireless device 60 incorporating the distributed power management apparatus 10 of FIG. 1. Common elements between FIGS. 1 and 4 are shown therein with common element numbers and will not be re-described herein.

[0050] The wireless device 60 can include one or more antennas 62(1)-62(K) disposed on a first side 64 (e.g., top side) of the wireless device 60. As such, the power amplifier circuits 32(1)-32(K) can each be coupled to a respective one of the antennas 62(1)-62(K).

[0051] The wireless device 60 also includes at least one distributed antenna 66 disposed on a second side 68 (e.g., bottom side) of the wireless device 60. As shown in FIG. 4, the second side 68 is an opposite side relative to the first side 64. By disposing the antennas 64 and the distributed antenna 66 on the opposite sides, it is possible to mitigate a so-called hand-blocking effect. Accordingly, the distributed power amplifier circuit 36 can be coupled to the distributed antenna 66.

[0052] In embodiments disclosed herein, the ETIC 12 is disposed closer to any of the power amplifier circuits 32(1)-32(K) than to the distributed power amplifier circuit 36. Similarly, the distributed ETIC 14 is disposed closer to the distributed power amplifier circuit 36 than to any of the power amplifier circuits 32(1)-32(K). As a result, it is possible to reduce potential trace inductance distortion in the ET voltages V.sub.CCA-V.sub.CCM and the distributed ET voltage DV.sub.CC.

[0053] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.