Circuit board and manufacturing method thereof

Abstract

A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.

Claims

1. A circuit board, comprising: a substrate, having a first surface and a second surface opposite to each other; a patterned circuit layer, embedded in the first surface, and a line width of the patterned circuit layer gradually reducing from the first surface towards the second surface; a patterned photo-imaginable dielectric layer, embedded in the substrate corresponding to the patterned circuit layer; and a first surface finish layer, exposed on the second surface and only covering a bottom surface of a part of the patterned circuit layer.

2. The circuit board according to claim 1, wherein a cross section outline of the patterned circuit layer is an inverted-trapezoid.

3. The circuit board according to claim 1, wherein the substrate has a plurality of through holes respectively connecting the first surface and the second surface.

4. The circuit board according to claim 1, wherein the patterned photo-imaginable dielectric layer correspondingly contacts the patterned circuit layer.

5. The circuit board according to claim 1, wherein a composite material of the first surface finish layer comprises Ni, Au or an alloy thereof.

6. The circuit board according to claim 1, further comprising: a carrier, disposed on the second surface of the substrate.

7. The circuit board according to claim 1, wherein a composite material of the substrate comprises a solder resist material.

8. The circuit board according to claim 1, further comprising: a second surface finish layer, exposed on the first surface and covering a top surface of the patterned circuit layer.

9. The circuit board according to claim 8, wherein a chip is adapted to be disposed on the first surface to electrically contact the second surface finish layer and the patterned circuit layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

(2) FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the invention.

(3) FIG. 2 is a schematic diagram of a circuit board according to another embodiment of the invention.

(4) FIG. 3A to FIG. 3I are schematic diagrams of a manufacturing process of the circuit board depicted in FIG. 1.

DESCRIPTION OF THE EMBODIMENTS

(5) Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.

(6) FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the invention. In the present embodiment, a circuit board 100 includes a substrate 110, a patterned circuit layer 120 and a photo-imaginable dielectric layer 130. As shown in FIG. 1, the substrate 110 has a first surface 112 and a second surface 114 opposite to each other. The patterned circuit layer 120 is embedded in the first surface 112 of the substrate, and a line width of the patterned circuit layer 120 gradually reduces from the first surface 112 towards the second surface 114. In the present embodiment, a cross section outline of the patterned circuit layer 120 is, for example, an inverted-trapezoid which is wider at the top and narrower at the bottom.

(7) In the present embodiment, the photo-imaginable dielectric layer 130 is disposed in the substrate 110 corresponding to the patterned circuit layer 120, and the photo-imaginable dielectric layer 130 and the patterned circuit layer 120 correspondingly contact each other. Further, the circuit board 100 includes a first surface finish layer 142 and a second surface finish layer 144, respectively serving as bonding pads for solder bumps, traces or chips. As shown in FIG. 1, the first surface finish layer 142 is disposed on a bottom surface of a part of the patterned circuit layer 120. The second surface finish layer 144 is disposed on a top surface of the patterned circuit layer 120 and exposed on the first surface 112. Furthermore, as shown in FIG. 1, the circuit board 100 further includes a carrier 260, which is disposed on the second surface 114 of the substrate 110, and a release film 270 is provided between the substrate 110 and the carrier 260.

(8) In the present embodiment, the substrate 110 is mainly composed of a solder resist material 113, and the solder resist material 113 is, for example, a solder mask or other similar dielectric materials. In addition, composite materials of the first surface finish layer 142 and the second surface finish layer 144 are, for example, Ni, Au or an alloy material of aforesaid metals. As shown in FIG. 1, the solder resist material 113 may expose the second surface finish layer 144 disposed on the patterned circuit layer 120. In the present embodiment, the solder resist material 113 may be used as a solder resist layer on the surface of the substrate 110 and a dielectric insulation layer between the circuits at the same time. Furthermore, the first surface 112 of the substrate 110 has a plurality of openings 110a, and the openings 110a may be filled with the circuit layer and the solder resist material by electroplating or electroless plating.

(9) In the present embodiment, electrical insulation of the solder resist material 113 composing the substrate 110 and matching of thermal expansion coefficient of the material thereof are not as good as those of the traditional dielectric material. Therefore, the photo-imaginable dielectric layer 130 is further disposed in the substrate 110 in the present embodiment to effectively improve the electrical insulation of the substrate 110 and solve the matching issue of the thermal expansion coefficients of the materials.

(10) Specifically, in the present embodiment, an overall thickness of the circuit board 100 may be effectively reduced by directly using the solder resist material 113 as the dielectric insulation material of the substrate 110 for the circuit board 100 without additionally disposing other dielectric layers in the circuit board 100. Nonetheless, when the chip (not illustrated) is subsequently disposed on the substrate 110, stress and strain generated in relative to a difference between the thermal expansion coefficients of the chip and the substrate 110 can easily cause damages on the chip. Accordingly, in the present embodiment, because the matching issue of the thermal expansion coefficients between the substrate 110 and the chip may be solved by disposing the photo-imaginable dielectric layer 130 in the substrate 110 to slow down the stress and strain generated by the difference between the thermal expansion coefficients of the chip and the substrate 110, the damages on the chip may be reduced.

(11) Referring back to FIG. 1, in the present embodiment, the cross section outline of the patterned circuit layer 120 is the inverted-trapezoid wider at the top and narrower at the bottom in the first surface 112 and the openings 110a of the substrate 110. Therefore, the chip or the wire bonding pads with larger area may be formed on the patterned circuit layer 120 of the first surface 112 of the substrate 110.

(12) FIG. 2 is a schematic diagram of a circuit board according to another embodiment of the invention. A difference between the present embodiment and the embodiment of FIG. 1 is that, a chip 50 may be disposed on the first surface 112 of the substrate 110, and the chip is electrically connected to the second surface finish layer 144 exposed on the first surface 112 and the patterned circuit layer 120. Further, after the chip 50 is disposed, the carrier 260 disposed on the second surface 114 of the substrate 110 may be removed from the second surface 114 through the release film 270. Furthermore, a bumping process may be performed on the first surface finish layer 142 exposed on the second surface 114 of the substrate 110 in order to form a solder bump 160. Accordingly, the chip 50 may be electrically connected to other chips or the circuit board via the solder bump 160. In the present embodiment, a molding compound 170 may be disposed on the first surface 112 of the substrate 110 to cover the chip 50 and the patterned circuit layer 120 and provide protection thereto.

(13) FIG. 3A to FIG. 3I are schematic diagrams illustrating a flow in a manufacturing method of the circuit board depicted in FIG. 1. Referring to FIG. 3A to FIG. 3I, a step of the manufacturing method of the circuit board 100 includes: providing a first carrier 210 (as shown in FIG. 3A). In the present embodiment, the first carrier 210 has a third surface 212 and a fourth surface 214 opposite to each other, and a release film 220 and a first metal layer 230 are respectively disposed on the third surface 212 and the fourth surface 214 in sequence. The first metal layer 230 of the present embodiment is, for example, a copper layer. As shown in FIG. 3A, the first carrier 210 of the present embodiment may be a multi-layer carrier commonly composed of an upper carrier 215 and a lower carrier 217, and the upper carrier 215 and the lower carrier 217 are adhered and attached to each other by an adhesive layer 216.

(14) Next, as shown in FIG. 3B, the photo-imaginable dielectric layer 130 being patterned may be bonded on the first metal layer 230 of the third surface 212 and the fourth surface 214. In the present embodiment, the photo-imaginable dielectric layer 130 bonded on the first metal layer 230 is first patterned through a lithography process, and a plurality of through holes 130a are formed therein to facilitate in exposing a part of the first metal layer 230 in the subsequent manufacturing process. In the present embodiment, the upper carrier 215 and the lower carrier 217 and the release film 220 and the first metal layer 230 on the respective surfaces of the upper carrier 215 and the lower carrier 217 are manufactured subsequently by the same manufacturing process. Therefore, the following drawings and descriptions take only the manufacturing process performed on the upper carrier 215 and the third surface 212 as an example for the description, whereas the related manufacturing process performed on the lower carrier 217 and the fourth surface 214 are not repeatedly described and illustrated.

(15) As shown in FIG. 3C, a patterned dry film layer 250 may be formed on the photo-imaginable dielectric layer 130, and the patterned dry film layer 250 exposes a part of the photo-imaginable dielectric layer 130, the through holes 130a therein and a part of the first metal layer 230. Next, as shown in FIG. 3D, the patterned dry film layer 205 and said part of the photo-imaginable dielectric layer 130 may serve as an electroplating mask for electroplating a second metal layer 240 on a surface of the part of the first metal layer 230 in the through holes 130a. In the present embodiment, the second metal layer 240 is, for example, an electroplated copper layer.

(16) As shown in FIG. 3E, the first surface finish layer 142 may then be formed on the second metal layer 240. In the present embodiment, the area of first surface finish layer 142 may serve as a solder pad of the solder bump 160 in a subsequent bumping process of the circuit board 100. Then, as shown in FIG. 3F, the patterned dry film layer 250 is removed to expose the rest of the photo-imaginable dielectric layer 130 and the first metal layer 230 sheltered by the patterned dry film layer 250.

(17) Next, as shown in FIG. 3G, the photo-imaginable dielectric layer 130 may serve as an etching mask for etching the rest of the first metal layer 230, so as to form the patterned circuit layer 120 on the release film 220 of the third surface 212.

(18) Next, as shown in FIG. 3H, the solder resist material 113 is coated on the patterned circuit layer 120 and the photo-imaginable dielectric layer 130 to form the substrate 110, and the first surface finish layer 142 is exposed by the solder resist material 113. Aforesaid substrate 110 has the first surface 112 and the second surface 114 opposite to each other. In addition, the release film 220 on the third surface 212 of the first carrier 210 and the first surface 112 of the substrate 110 contact each other. As shown in FIG. 3H, the cross section outline of the patterned circuit layer 120 gradually reduces from the first surface 112 towards the second surface 114.

(19) As shown in FIG. 3I, the second carrier 260 is attached on the second surface 114 of the substrate 110, and the release film 270 is provided between the second carrier 260 and the substrate 110. Next, the first carrier 210 on the first surface 112 of the substrate 110 is removed through the release film 220. Then, the second surface finish layer 144 is formed on the patterned circuit layer 120 exposed on the first surface 112 of the substrate 110 by, for example, an electroless plating manufacturing method. At this point, the circuit board 100 is substantially manufactured.

(20) In the manufacturing process of the circuit board 100 according to the invention, because the photo-imaginable dielectric layer 130 may be directly used as electroplating mask and etching mask, it is not required to additionally dispose other dry films or photo resist layers when electroplating the second metal layer 240 and the first surface finish layer 142 thereon as well as when etching the first metal layer 230. In addition, during the manufacturing process of the circuit board 100, when the second metal layer 240 is electroplated, the first surface finish layer 142 may be directly electroplated on the second metal layer 240 to serve as the solder pad for the bumping process so the solder bump 160 may be formed on the first surface finish layer 142 in the subsequent manufacturing process. In other words, in the manufacturing method of the present embodiment, the solder pad for the bumping process is manufactured together while manufacturing the circuit board 100. Therefore, in the subsequent manufacturing process, the solder bump 160 may be soldered on the surface of the circuit board 100 so the chip 50 disposed on the circuit board 100 may be electrically connected to other chips or the carrier via the solder bump 160.

(21) In summary, in the circuit board and the manufacturing method thereof according to the embodiments of the invention, the photo-imaginable dielectric layer may serve as the electroplating mask or the etching mask for electroplating the second metal layer and the first surface finish layer or etching the first metal layer in order to form the patterned circuit layer. Further, after the circuit board is manufactured, the photo-imaginable dielectric layer may be embedded in the substrate of the circuit board to improve the electrical insulation of the substrate and solve the matching issue of the thermal expansion coefficients between materials of the substrate with the chip and the patterned circuit layer. Furthermore, in the manufacturing method of the circuit board according to the invention, the solder pad for the bumping process may be electroplated during the manufacturing process of the circuit board to further simplify the steps in the manufacturing process of the circuit board.

(22) In addition, in the embodiments of the invention, the cross section outline of the patterned circuit layer of the circuit board may be the inverted-trapezoid wider at the top and narrower at the bottom, so as to increase the areas of the chips or the wire bonding pads of the patterned circuit layer on the surface of the circuit board.

(23) It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.