FIBRE OPTIC LASER MACHINING EQUIPMENT FOR ETCHING GROOVES FORMING INCIPIENT CRACKS
20180126488 ยท 2018-05-10
Assignee
Inventors
- Ulrich DUERR (Allmendingen, CH)
- Rudolf Von Niederhaeusern (Tschingel ob Gunten, CH)
- Bruno FREI (Thierachern, CH)
Cpc classification
F16C9/045
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/0676
PERFORMING OPERATIONS; TRANSPORTING
B23K26/0869
PERFORMING OPERATIONS; TRANSPORTING
B23K26/364
PERFORMING OPERATIONS; TRANSPORTING
B41M5/24
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
The laser machining equipment for etching grooves in a wall of a mechanical part, in particular of a connecting rod for a spark ignition engine, is provided with a fibre optic laser device and arranged to supply laser pulses. The fibre optic laser device is controlled so that said laser pulses have a peak power of more than 400 W and at least two times greater than the maximum mean power of said laser device and in that the duration of said laser pulses is below or within the nanosecond range (1 ns to 1000 ns). According to a first embodiment, the fibre optic laser device is controlled in a quasi continuous wave (QCW) mode. According to a second preferred embodiment, the fibre optic laser device is controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at the bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.
Claims
1. A method of etching at least one groove in a lateral wall or surface of a mechanical part by laser pulses supplied by a fiber optic laser device, the groove defining an incipient crack for subsequent fracturing of the mechanical part into at least two pieces, the method comprising: controlling the fiber optic laser device so that the laser pulses have a peak power of more than 400 W and at least two times greater than the mean maximum power of the laser device, and wherein a duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns.
2. The etching method according to claim 1, wherein the fiber optic laser device operates in a quasi continuous wave mode.
3. The etching method according to claim 2, wherein the laser pulses have a peak power of between 400 W and 3000 W.
4. The etching method according to claim 1, wherein the fiber optic laser device is operated in a Q-switch mode.
5. The etching method according to claim 1, wherein the fiber optic laser device includes a seed laser source and at least one fiber optic amplifier medium supplying the laser pulses at an output.
6. The etching method according to claim 4, wherein the laser device is controlled so that the duration of the laser pulses is between 50 ns and 400 ns.
7. The etching method according to claim 4, wherein the fiber optic laser device is controlled so as to supply the laser pulses with a peak power of more than 1000 W.
8. The etching method according to claim 4, wherein the fiber optic laser device is controlled so as to supply the laser pulses with a frequency of between 10 kHz and 200 kHz.
9. The etching method according to claim 1, wherein a low mode optical cable is provided between the laser device and a machining head to which the laser pulses are supplied.
10. The etching method according to claim 1, wherein the mechanical part is a connecting rod in a main aperture of which two diametrically opposite grooves are simultaneously etched.
11. The etching method according to claim 4, wherein the laser device is controlled so that the duration of the laser pulses is between 50 ns and 400 ns.
12. The etching method according to claim 5, wherein the fiber optic laser device is controlled so as to supply the laser pulses with a peak power of more than 1000 W.
13. The etching method according to claim 5, wherein the fiber optic laser device is controlled so as to supply the laser pulses with a frequency of between 10 kHz and 200 kHz.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present invention will be described in more detail in the following description, made with reference to the annexed drawings, given by way of non-limiting example, and in which:
[0016]
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DETAILED DESCRIPTION OF THE INVENTION
[0022]
[0023] The use of a fibre optic laser has several advantages relating to the quality of the laser beam obtained. Further, the beam can be brought to the machining head by a low mode optical cable while still preserving good optical beam quality, which simplifies the equipment. Beam quality is important to allow proper focusing (even with an incident laser beam on the optical focusing system with a relatively small diameter) and thus to reduce the diameter of the beam at the focal point. This must enable narrow grooves to be formed. However, making a narrow and sufficiently deep groove, with walls defining an acute angle and a small radius at the bottom of the groove, involves parameters other than the beam quality. As mentioned above, controlling the supply of energy and in particular controlling luminous intensity, i.e. the power density, are decisive factors in machining this type of groove with an optimal profile. The manner in which material is ablated in the wall of the connecting rod is essential in achieving this optimum profile.
[0024] The use of a fibre optic laser device operating in pulsed mode by modulating the pumping power of the active medium, as proposed in the prior art, results in pulses having a peak power equal to the nominal power of the laser, which is generally less than 200 W for an industrial fibre optic laser, and having a duration of more than 1 s. This relatively low power cannot provide sufficient luminous intensity to prevent a large part of the material receiving the laser pulse from melting and thus changing into a liquid state. The melted liquid material causes a problem of evacuation and tends to remain partly at the bottom of the groove. This results in a relatively large mean radius of curvature R1 at the bottom of the groove, as is shown schematically in
[0025] The findings brought to light in developing the invention result in the selection of a particular control of the fibre optic laser device. According to the invention, the fibre optic laser device is controlled so that the laser pulses have a peak power of more than 400 W and at least two times greater than the maximum mean power of the laser device and so that the duration of the laser pulses is within the nanosecond range (ns), i.e. between 1 ns and 1000 ns or below.
[0026] According to a first operating mode of the fibre optic laser device according to the present invention, this laser device is controlled in a quasi continuous wave (QCW) mode. For a laser with a power of between 50 W and 150 W, it is easy to obtain pulses with a peak power of around 1000 W (1 kW). Depending upon the variant and the application, the laser device is arranged to obtain a peak power or maximum pulse power of between 400 W and around 3000 W (3 kW). Those skilled in the art of fibre optic lasers know how to implement QCW mode and the specific diodes required to obtain such laser pulses.
[0027] To obtain short pulses within the nanosecond range, in particular between 50 ns and 400 ns, with very high power peaks, two main variants described below were envisaged.
[0028] According to a second operating mode, the fibre optic laser device is controlled in a Q-Switch mode. This second operating mode is preferred since it advantageously obtains significant shorter pulse durations than the QCW mode of the first operating mode proposed and also much higher peak powers, for example of around 10 kW. It is therefore possible to obtain very high luminous intensities for sublimating the material of the machined mechanical C part, i.e. to change directly from a solid state to a gaseous state. For example, the fibre optic laser device is controlled so as to supply the laser pulses with a frequency of between 10 kHz and 200 kHz. Since the duration of the pulses is very short, the quantity of energy supplied per pulse is also limited. This quantity of energy may be adjusted to optimise the laser machining method according to the present invention, particularly between 0.1 mJ and 2 mJ. Since the duration of the pulses is very short, the secondary thermal effects and penetration of thermal energy into the material is greatly limited. This allows a very narrow and relative deep groove to be obtained with an optimal profile, as shown schematically in
[0029] According to a third embodiment which is also preferred, the fibre optic laser device includes a seed laser source and at least one fibre optic amplifier medium supplying the laser machining pulses at output. The seed laser pulses form low power pulses that can be produced with a very short duration and at a very high frequency, for example at 10 MHz. These seed pulses are introduced into the input of the fibre optic amplifier medium which substantially maintains the duration and also the frequency of the seed pulses and which greatly amplifies the pulse power. This means of amplification can easily obtain peak powers of more than 1000 W. Those skilled in the art know how to construct this type of fibre optic laser device.
[0030] The machining method according to the invention and the laser machining equipment for implementing said method have further advantages. First of all, the generation of very high power pulses makes it possible to envisage simultaneously machining two diametrically opposite grooves in a connecting rod, in particular by dividing the energy from each primary laser pulse into two secondary pulses, the power of which is half that of said primary laser pulse, while keeping the other benefits of the invention. A particular machining head shown in
[0031] Machining head 32 shown in
[0032] Machining head 60 shown in
[0033]