DEVICE AND METHOD FOR LASER PROCESSING OF DIAMONDS

Abstract

A method is described or processing diamonds, either natural or artificially produced, by using a laser beam with minimal power output. The laser wavelength is fitted to the peak absorption wavelength of diamond, such as a helium-silver laser with a wavelength of 224 nm.

Claims

1. A method comprising: using a laser beam of a wavelength equal, within 10%, to one of absorption wavelengths of a diamond, to saw, cut, shape or polish said diamond.

2. The method according to claim 1, wherein the wavelength is less than one of said absorption wavelengths.

3. The method according to claim 1, wherein the laser beam is at a wavelength of 224 nm.

4. The method according to claim 1, wherein the laser beam is produced by a helium-silver laser.

5. A system for processing diamonds, comprising: a helium-silver ion laser configured to emit a beam at a wavelength of 224 nm; and a gem holder configured to hold a diamond in a path of said beam.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The present invention will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawing in which:

[0011] FIG. 1 is a simplified illustration of a laser system for diamond processing, in accordance with a non-limiting embodiment of the invention.

DETAILED DESCRIPTION OF EMBODIMENTS

[0012] Non-limiting features of the invention include:

[0013] Use of a laser beam of wavelength equivalent to the one of the absorption wavelengths of diamond, to saw, cut, shape and polish the processed specimen.

[0014] Use of a laser beam of wavelength shorter than above stated wavelength of the processed material, by as small an amount as available (such as but not limited to, 1% less, or alternatively 2% less, or alternatively 5% less, or alternatively 10% less), to saw, cut, shape and polish processed specimen.

[0015] Use of a laser beam of wavelength 224 nm, produced by a helium-silver laser to saw, cut, shape and polish diamonds, either natural or artificially produced, both gem stones and those used for in industrial processes.

[0016] Use of a laser beam of wavelength 224 nm, produced by a helium-silver laser operating at that wavelength to saw, cut, shape and polish diamonds, either natural or artificially produced, both gem stones and those used for in industrial processes

[0017] Reference is now made to FIG. 1, which illustrates a laser system for diamond processing, in accordance with a non-limiting embodiment of the invention.

[0018] The system may include, without limitation, a helium-silver ion laser 10, emitting a wavelength of 224 nm, an optical beam expander 12, including at least two lenses of a material highly transparent at the wavelength of 224 nm, and a beam modulator 14, such as a focusing lens or a lens combination, also transparent at the above wavelength, or a curved mirror, highly reflective at that wavelength.

[0019] The optical beam expander 12 and/or the beam modulator 14 may be mounted together or separately on a holder 16. The holder 16 may be adjustable, either manually or by a controller 18, in order to the place the optical components in the appropriate location along the optical path of the laser beam 19.

[0020] A gem holder 20 is provided for holding the diamond 22 being processed by the laser beam 19. A multi-dimensional translation and/or rotational platform 24 may be coupled to gem holder 20 to enable placement of the processed diamond 22 at the appropriate positions and angles for the desired shaping. Platform 24 may be in controlled by controller 18.