Eutectic Alloy Bonding for Foreign Parts or Items During the Additive Manufacturing Process

Abstract

A method for eutectic alloy bonding of foreign parts during the additive manufacturing process includes the following steps: designing a component for additive manufacturing printing which will include a foreign part such that the foreign part is bonded to the component via an eutectic alloy solder and disposed within a recess; starting to print the component using an additive manufacturing printer; stopping the additive manufacturing printer at the point where the foreign part and the eutectic alloy solder will be placed; placing the foreign part and solder into the recess; restarting the additive manufacturing printer such that the component is completed; and, heat treating the component such that the eutectic alloy solder forms a secure bond between the foreign part and the completed component.

Claims

1. A method for eutectic alloy bonding of a foreign part during an additive manufacturing process, the method comprising: designing a component for additive manufacturing printing which will include a foreign part such that the foreign part is bonded to the component via an eutectic alloy solder and disposed within a recess; starting to print the component using an additive manufacturing printer; stopping the additive manufacturing printer at a point where the foreign part and the eutectic alloy solder will be placed; placing the foreign part and the eutectic alloy solder into the recess; restarting the additive manufacturing printer such that the component is completed; and, heat treating the completed component such that the eutectic alloy solder forms a secure bond between the foreign part and the printed component.

2. The method of claim 2, wherein the additive manufacturing printer utilizes a component material with a stress relief temperature, and the eutectic alloy solder has a melting temperature below the stress relief temperature of the component material.

3. The method of claim 2, wherein the additive manufacturing printer utilizes a component material with a melting point, and the eutectic alloy solder has a melting temperature lower than the melting point of component material.

4. The method of claim 1, wherein the eutectic alloy solder permits rigid bonding of the foreign part during ambient conditions but is designed in such a way to melt in certain use conditions so as to act as a mechanical indicator of sorts.

5. The method of claim 1, wherein the eutectic alloy solder is oriented in such a way as to solidify in a specific manner during the heat treating and remain solid during ambient conditions.

Description

DESCRIPTION

[0015] The preferred embodiments of the present invention are illustrated by way of example below and in FIGS. 1-4. The method for eutectic alloy bonding of foreign items, parts, or bodies during the additive manufacturing process includes the following steps: designing a component 100 (or work piece) for additive manufacturing printing which will include a foreign part 400 such that the foreign part 400 is bonded to the component 100 via an eutectic alloy solder 300 and disposed within a recess 115; starting to print the component 100 using an additive manufacturing printer; stopping the additive manufacturing printer at the point where the foreign part 400 and the eutectic alloy solder 300 will be placed; placing the foreign part 400 and eutectic alloy solder 300 into the recess 115; restarting the additive manufacturing printer such that the component 100 is completed; and, heat treating the component 100 such that the eutectic alloy solder 300 forms a secure bond between the foreign part 400 and the completed component 100.

[0016] In the description of the present invention, the invention will be discussed in a powder bed fusion printing environment; however, this invention can be utilized for any type of application that requires use of a bond in the additive manufacturing process.

[0017] The method described herein utilizes additive manufacturing in order to produce a final component 100. The preferred additive manufacturing printer is a Direction Metal Laser Sintering (DMSL) Printer; however, any additive manufacturing printer or the equivalent may be utilized.

[0018] The preferred component material (the additive manufacture material) used to print the component 100 and act as a substrate material is 4340 steel powder, though any material that is suitable for additive manufacturing can be used.

[0019] The preferred solder material is eutectic 63%/37% Pb-Sn. However, any alloy or solder material may be utilized, so long as the alloy is eutectic and has a melting temperature below the stress relief temperature of the substrate material or component material, and/or lower than the melting point of the substrate material or component material.

[0020] The foreign part 400 is installed in-situ during the additive manufacturing process. In operation, the additive manufacturing printer is stopped at the point where the foreign part 400 will be placed. FIG. 1 shows a cross section of where the printer will be stopped in order to install the eutectic alloy solder 300 and foreign part 400. In one of the embodiments, the work piece 100 (the component being printed by AM), positioned on a build plate 200, is made from additive manufacture material 105. As shown in FIG. 3, the work piece 100 includes a recess 115 that includes a groove 110 or trough for the eutectic alloy solder 300 and a ledge 130 to position the foreign part 400, and a cavity 120 disposed within the work piece 100. In the preferred embodiment, as shown in FIGS. 1-3, the ledge 130 is designed into the work piece 100 or component. The foreign part 400 is positioned and placed onto the ledge 130 when the printing is paused. The groove 110 may have the same radius as the eutectic alloy solder 300 used, so that the eutectic alloy solder 300 completely fills the groove 110 and fits snugly within. The foreign part 400 is then placed in the recess 115, specifically on the ledge 130, and then the printing process is restarted. As shown in FIGS. 2 and 4, the printing is continued until the work piece 100 is completed and the foreign part 400 is disposed within the work piece 100. In the preferred embodiment, as shown in FIGS. 3 and 4, there may be two ledges, each disposed on opposite sides of the groove 110.

[0021] In one of the preferred embodiments, the eutectic alloy solder 300 permits rigid bonding of the foreign part 400 during ambient conditions but is designed in such a way to melt in certain use conditions so as to act as a mechanical indicator of sorts. (e.g.: fuse/recalibration or repair of internal sensors/thermal switch). Additionally, the eutectic alloy solder 300 may be oriented in such a way as to solidify in a specific manner during the heat treat process (which may be different than the orientation during the additive manufacturing process) and remain solid during ambient conditions.

[0022] When introducing elements of the present invention or the preferred embodiment(s) thereof; the articles a, an, the, and said are intended to mean there are one or more of the elements. The terms comprising, including, and having are intended to be inclusive and mean that there may be additional elements other than the listed elements.

[0023] Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the preferred embodiment(s) contained herein.