Auxiliary adhesive dispensing apparatus

Abstract

An auxiliary adhesive dispensing apparatus is connected to a printed circuit board (PCB) through an opening on a side surface of a shielding cover above the PCB, and the auxiliary adhesive dispensing apparatus includes a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB. The auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing.

Claims

1. An auxiliary adhesive dispensing apparatus, comprising: a flow guiding groove; an adhesive-injection opening connected to an end of the flow guiding groove; and a fixing part connecting the flow guiding groove and a printed circuit board (PCB), wherein the auxiliary adhesive dispensing apparatus is connected to the PCB through an opening on a side surface of a shielding cover above the PCB.

2. The auxiliary adhesive dispensing apparatus according to claim 1, wherein the fixing part comprises a surface mount element.

3. The auxiliary adhesive dispensing apparatus according to claim 2, wherein the surface mount element is connected to the other end of the flow guiding groove.

4. The auxiliary adhesive dispensing apparatus according to claim 3, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

5. The auxiliary adhesive dispensing apparatus according to claim 3, further comprising a holding part located at the adhesive-injection opening.

6. The auxiliary adhesive dispensing apparatus according to claim, 5, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

7. The auxiliary adhesive dispensing apparatus according to claim 2, further comprising a holding part located at the adhesive-injection opening.

8. The auxiliary adhesive dispensing apparatus according to claim 7, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

9. The auxiliary adhesive dispensing apparatus according to claim 2, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

10. The auxiliary adhesive dispensing apparatus according to claim 1, wherein the fixing part comprises a positioning post that is located at a bottom of the flow guiding groove and that fits a positioning hole located on the PCB board.

11. The auxiliary adhesive dispensing apparatus according to claim 10, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

12. The auxiliary adhesive dispensing apparatus according to claim 1, wherein a cross section of the flow guiding groove is arc-shaped, rectangular, triangular, or rhombic.

13. The auxiliary adhesive dispensing apparatus according to claim 1, wherein a cross section of the flow guiding groove is arc-shaped.

14. The auxiliary adhesive dispensing apparatus according to claim 1, wherein a cross section of the flow guiding groove is rectangular.

15. The auxiliary adhesive dispensing apparatus according to claim 1, wherein a cross section of the flow guiding groove is triangular.

16. The auxiliary adhesive dispensing apparatus according to claim 1, wherein a cross section of the flow guiding groove is rhombic.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) To describe the technical solutions in the embodiments of the present disclosure or in the prior art more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments or the prior art. The accompanying drawings in the following description show some embodiments of the present disclosure, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.

(2) FIG. 1A is a schematic structural diagram of an auxiliary adhesive dispensing apparatus being mounted on a PCB without a shielding cover;

(3) FIG. 1B is a schematic structural diagram of an auxiliary adhesive dispensing apparatus being mounted on a PCB with a shielding cover;

(4) FIG. 2 is a schematic structural diagram of a structure of an auxiliary adhesive dispensing apparatus according to an embodiment of the present disclosure; and

(5) FIG. 3 is a schematic structural diagram of another structure of an auxiliary adhesive dispensing apparatus according to an embodiment of the present disclosure.

DESCRIPTION OF EMBODIMENTS

(6) To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the following clearly and completely describes the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. The described embodiments are some but not all of the embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

(7) A shielding cover is usually a metal casing. In a process of assembling a modular product, a shielding cover needs to be mounted above a PCB, so that the shielding cover and the PCB together form a sealed cavity, so as to protect components packaged on the PCB, and at the same time provide a shield from external interference. In a conventional packaging process, an adhesive dispensing operation needs to be performed before a shielding cover is mounted, and it is after adhesive dispensing that the shielding cover can be further mounted so that the shielding cover and the PCB together form a sealed cavity and subsequent second-reflow soldering processing is performed. To resolve a defect that an adhesive dispensing operation is required to be performed before a shielding cover is mounted in the prior art, an embodiment of the present disclosure provides an auxiliary adhesive dispensing apparatus, where the auxiliary adhesive dispensing apparatus can help an adhesive dispensing machine perform an adhesive dispensing operation after a shielding cover is mounted.

(8) An embodiment of the present disclosure provides an auxiliary adhesive dispensing apparatus, where the auxiliary adhesive dispensing apparatus is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. As shown in FIG. 1A and 1B, for clarity, FIG. 1A shows a schematic structural diagram of an auxiliary adhesive dispensing apparatus being mounted on a PCB without a shielding cover, and FIG. 1B shows a schematic structural diagram of an auxiliary adhesive dispensing apparatus being mounted on a PCB with a shielding cover. The auxiliary adhesive dispensing apparatus includes a flow guiding groove 1, an adhesive-injection opening 2 connected to the flow guiding groove 1, and a fixing part 3, where the fixing part 3 is used to fix the auxiliary adhesive dispensing apparatus on the PCB. Multiple components are usually mounted on the PCB, where adhesive dispensing needs to be performed at a component or some components. The auxiliary adhesive dispensing apparatus provided in this embodiment of the present disclosure can help an adhesive dispensing machine complete adhesive dispensing at a component at which adhesive dispensing needs to be performed on the PCB.

(9) The flow guiding groove 1 is a concave groove having a particular depth. In a process of use, the flow guiding groove 1 is used as a channel for an adhesive to flow in. In FIG. 1A, a black circular area is an adhesive. In a process of adhesive dispensing, an adhesive dispensing machine (not shown in the figure) injects the adhesive to the adhesive-injection opening 2, and the adhesive flows along the flow guiding groove 1 connected to the adhesive-injection opening 2 to reach a component at which adhesive dispensing is needed, and eventually cures to complete adhesive dispensing.

(10) The flow guiding groove 1 may have multiple different structures. For example, a cross section of the flow guiding groove 1 may be arc-shaped, rectangular, triangular, rhombic, or the like, or certainly may be in other shapes, as long as a path for an adhesive to flow in can be provided.

(11) After adhesive dispensing is complete, the auxiliary adhesive dispensing apparatus may be left inside the product and stay as a part of the product, or may be removed, which is not limited herein.

(12) An auxiliary adhesive dispensing apparatus provided in this embodiment of the present disclosure is connected to a PCB through an opening on a side surface of a shielding cover above the PCB. In a process of adhesive dispensing, an adhesive dispensing machine injects an adhesive to an adhesive-injection opening, and the adhesive flows along a flow guiding groove connected to the adhesive-injection opening to reach a position at which adhesive dispensing is needed, and eventually cures to complete adhesive dispensing. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation is completed after second reflow soldering, so that there is no more second reflow soldering after adhesive dispensing is complete, which can reduce risks of tin whisker bridging in a chip at which adhesive dispensing is performed and tin balls at a peripheral chip.

(13) Moreover, in the prior art, during an adhesive dispensing operation before second-reflow soldering processing, a PCB needs to be washed, examined, baked, and processed in other manners before the adhesive dispensing operation, so as to ensure an effect of adhesive filling. By means of the auxiliary adhesive dispensing apparatus provided in the present disclosure, after second-reflow soldering processing, adhesive dispensing is performed on a modular product that passes a functional test, so that before adhesive dispensing on the modular product, operations such as washing, examination, and baking do not need to be performed; therefore, after the auxiliary adhesive dispensing apparatus is used, a production process of a modular product is simplified, a manufacturing period of the product is shortened, and the introduction of the apparatus does not increase production difficulty, so that a manufacturing cost is reduced and at the same time manufacturing quality of the product and reliability of the product can be ensured.

(14) In a structure, the fixing part 3 is a surface mount element located at an end, away from the adhesive-injection opening 2, of the flow guiding groove 1, so that the fixing part 3 can be fixed on the PCB by using a surface mount method, as shown in FIG. 2. When the fixing part 3 is fixed on the PCB in a surface mount manner, the adhesive-injection opening inside the auxiliary adhesive dispensing apparatus can at the same time be used as a suction part. In this way, a vacuum generating device is used to remove air inside the flow guiding groove through the adhesive-injection opening, so that a vacuum is generated inside the flow guiding groove to produce an external force that can used to hold the flow guiding groove. By means of this external force, an operation of picking up or dropping the flow guiding groove is performed, so as to conveniently fix the fixing part 3 on the PCB.

(15) A holding part 4 may be further included. When the fixing part 3 is attached on the PCB in a surface mount manner, the holding part 4 may be used as a supporting part to support the auxiliary adhesive dispensing apparatus. The suction part 4 may be a magnetic metal part or have a structure of another type.

(16) In another structure, the fixing part 3 is fixed on the PCB in a manner of wave soldering, as shown in FIG. 3. In the structure, the fixing part 3 is one or more positioning posts. These positioning posts fix the auxiliary adhesive dispensing apparatus on the PCB in a manner of a through hole reflow and through hole technology. These positioning posts may be evenly distributed or unevenly distributed along a length direction of the flow guiding groove 1, and the present disclosure is not limited thereto.

(17) It should be noted that in any structure of the present disclosure, the fixing part 3 is preferably fixed on the PCB in a soldering manner, so as to enhance the firmness between the auxiliary adhesive dispensing apparatus and the PCB. The soldering manner includes wave soldering, reflow soldering, hand soldering, and the like, and the present disclosure is not limited thereto.

(18) The auxiliary adhesive dispensing apparatus in this embodiment of the present disclosure is not limited to the structures shown in FIG. 1 to FIG. 3, or may have another structure, which is no longer enumerated herein.

(19) It should be noted that the auxiliary adhesive dispensing apparatus in this embodiment of the present disclosure is not only applicable to the foregoing process of adhesive dispensing on a single board, but also applicable to a process of filling a sealed cavity, for example, pouring sealant, and coating.

(20) The foregoing descriptions are merely exemplary implementation manners of the present disclosure. It should be noted that a person of ordinary skill in the art may make several improvements or polishing without departing from the principle of the present disclosure and the improvements or polishing shall fall within the protection scope of the present disclosure.