METHODS AND SYSTEMS FOR BONDING
20180111332 ยท 2018-04-26
Inventors
Cpc classification
F01D5/147
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F16B11/006
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C66/1122
PERFORMING OPERATIONS; TRANSPORTING
B29C66/301
PERFORMING OPERATIONS; TRANSPORTING
F01D5/282
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C65/48
PERFORMING OPERATIONS; TRANSPORTING
F01D17/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/31
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2260/407
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Y02T50/60
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
B29C66/92211
PERFORMING OPERATIONS; TRANSPORTING
G01B7/287
PHYSICS
B29C65/52
PERFORMING OPERATIONS; TRANSPORTING
F05D2220/36
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C66/73112
PERFORMING OPERATIONS; TRANSPORTING
B29C66/532
PERFORMING OPERATIONS; TRANSPORTING
F05D2230/23
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29C65/782
PERFORMING OPERATIONS; TRANSPORTING
B29C66/346
PERFORMING OPERATIONS; TRANSPORTING
F05D2260/83
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B29L2031/082
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C65/00
PERFORMING OPERATIONS; TRANSPORTING
G01B7/16
PHYSICS
F16B11/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
G01L1/20
PHYSICS
G01B7/287
PHYSICS
B29C65/48
PERFORMING OPERATIONS; TRANSPORTING
B29C65/78
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Methods and apparatus are described for improving fit checking at the bonding interface of a first component, such as a fan blade (1), and a second component, such as an edge guard (2) for the fan blade (1), to be bonded by adhesive. A bondline thickness profile over the area of the bonding interface is determined by interposing a compressible, flexible sensor layer between the components before they are bonded. The sensor layer contains an array of piezoelectric elements which indicate local bondline thickness by signalling pressure due to compression of the layer. The bondline thickness profile can be processed by a programmed control processor to produce an adhesive application schedule prescribing the shapes of pieces of adhesive film which, when applied over the bonding interface, will build up an adhesive layer corresponding in thickness to the bondline thickness. The sensor layer can be prepared as a kit of shaped panels or as a contoured preform (55) matching the form of the bonding interface.
Claims
1. A bonding method for joining first and second components by adhesive bonding at a bonding interface defined by respective complementary bonding faces of the first and second components, the method comprising a pre-bonding fit check in which the components are arranged in an intended bonding position to check the closeness of fit between them over the bonding interface, and wherein the fit check comprises: bringing the components together in the intended bonding position with a flexible, compressible spacing sensor layer between their bonding faces, thereby compressing the sensor layer to varying degrees according to the spacing between the faces at different regions of the bonding interface, and sensing the degree of compression of the sensor layer at the different regions to obtain a bondline thickness profile for the bonding interface.
2. Bonding method according to claim 1 in which the sensor layer comprises an array of piezoelectric sensors.
3. Bonding method according to claim 1 in which the sensor layer is susceptible of resilient compression at least down to 20% of its rest condition thickness.
4. Bonding method according to claim 1 in which the thickness of the sensor layer is at least 0.5 mm and not more than 2 mm.
5. Bonding method according to claim 1 in which the sensor layer is recoverably compressible at least down to 0.2 mm thickness.
6. Bonding method according to claim 1 in which the sensor layer comprises a sensor sheet incorporating an array of pressure sensors and an extender layer laminated on one or both faces of the sensor sheet, the extender layer material being softer than that of the sensor sheet; and optionally wherein the extender layer material constitutes at least 70% of the total sensor layer thickness.
7. (canceled)
8. Bonding method according to claim 1 in which the bonding interface is three-dimensionally shaped and the sensor layer is a sensor layer preform having a corresponding three-dimensional shape or a sensor layer preform kit comprising a set of shaped panels corresponding to respective correspondingly-shaped regions of the bonding interface.
9. Bonding method according to claim 1 comprising using a programmed control processor to determine an adhesive application schedule, representing the quantities of adhesive to be applied to the respective regions of the bonding interface, from the bondline thickness profile.
10. Bonding method according to claim 9 comprising using the control processor to control the amounts of adhesive applied at various regions of the bonding interface in dependence on the adhesive application schedule.
11. Bonding method according to claim 9 in which the adhesive is applied as a solid film of predetermined uniform thickness, and the adhesive application schedule determines an arrangement of pieces of the adhesive film for building up an adhesive layer corresponding in thickness to the bondline thickness profile.
12. Bonding method according to claim 11 in which the adhesive application schedule controls a cutter to cut a set of adhesive film pieces suitable to build up said adhesive layer.
13. Bonding method according to claim 11 comprising controlling an automated adhesive application guide in dependence on the adhesive application schedule to indicate on a said component the positions of application of adhesive film pieces to build up said adhesive layer.
14. Bonding method according to claim 1 in which the bonding interface is progressively curved in more than one plane.
15. Bonding method according to claim 1 in which the second component has a recess comprised in or constituting its bonding face and receiving a correspondingly projecting bonding face or bonding face portion of the first component.
16. Bonding method according to claim 1 in which the second component is a channel, cover or sheath having an interior recessed bonding face fitting onto a complementary outer edge bonding face of the first component.
17. Bonding method according to claim 1 in which one or both components is of fibre-reinforced composite,
18. Bonding method according to claim 1 in which the first component is a blade, vane or other aerofoil element and the second component is an edge cover or edge guard for it.
19. A fit check system for implementing a bonding method according to claim 8 and comprising: the sensor layer preform or preform kit, and a control processor programmed to determine a bondline thickness profile based on pressure data from the sensors of the sensor layer preform.
20. A fit check system according to claim 19 in which the control processor is programmed to determine an adhesive application schedule in dependence on the bondline thickness profile and optionally control any of a cutter to cut adhesive pieces, a positioning guide to indicate predetermined positions for adhesive pieces on a said component, or an automated adhesive applicator.
21. A fit check system according to claim 19 in which the sensor layer preform or preform kit is shaped to fit a blade edge.
22. (canceled)
Description
[0030] The invention will now be described by way of example with reference to the accompanying drawings in which
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[0039]
[0040] Refer first to
[0041] The opposed bonding surfaces 13,23 of the blade body 1 and edge guard 2 define a bonding interface of the assembly, occupied by the adhesive 9. The shortest distance across this interface from one component face to the other is the bondline thickness. The preferred adhesive is an epoxy-based adhesive, used as a solid film provided on a release backing. A maximum bondline thickness for such an assembly away from the void region 26, that is a bondline thickness above which the adhesive becomes less effective in holding the components together, is usually about 1 mm. However, the bondline thickness may permissibly be much less, down to near-contact, without disadvantage. Accordingly it is preferred to use an adhesive film of thickness only a fraction of the maximum bondline thickness, so that the adhesive can be built up in multiple layers to approximate closely the variations in the bondline gap. Adhesive film thickness is usually between 1/10 and of the maximum bondline thickness. In this example 0.25 mm thick thermosetting epoxy adhesive film is used.
[0042] The edge guard 2 has location points 211,212 at its tip and root ends respectively, indicated but not specifically shown in
[0043]
[0044] The sensor layer 5 is a thin polymeric sheet or film 52 incorporating an array 51 of minute piezoelectric sensors 53. The layer 5 is flexible and the connectors for the sensors 53 run within the sheet 52 to a single master connector 59 to the control processor 6. Rectangular piezoelectric array sensor sheets of this general type are known and commercially available, e.g. from Tiedemann & Betz as mentioned above. They are available at sheet thicknesses in a wide range below 1 mm and in a variety of polymer materials. The total number and density of individual sensors can also be chosen over a wide range, with the distance between individual sensors being as high as 12 mm and as small as 1 mm according to the design needs. The total number of the sensors, usually arranged in crossing lines, may be in the hundreds or thousands so a detailed pressure profile can be determined. Each sensor 53 gives out an electric signal proportional to the applied pressure at that point of the layer 5 and these pressure data are communicated to the control processor 6 for storage and use. A visual representation or map of the pressure variation over the layer may be presented on a display 63.
[0045] According to the present proposals a sensor layer 5 of the type shown schematically in
[0046]
[0047] To implement the invention, a sensor layer preform kit 55 e.g. as seen in
[0048] (
[0049] Further software of the control processor (it may of course be a separate operation and a separate processor in actuality) then converts the bondline thickness profile data 61 to a set of instructions corresponding to the amount or number of layers of film adhesive required to fill the bondline at each region. This calculated adhesive application schedule 62 is then used to assist the preparation of an adhesive kit for bonding the edge guard 2 onto the blade body 1.
[0050] Firstly, a programmable automated cutter 65 (indicated schematically in
[0051] For solid film adhesive of predetermined thickness, the software interprets the graduated pressure/thickness values from the sensor layer with reference to a set of threshold values corresponding to multiples of the adhesive film thickness, thereby determining the number of layers of film adhesive required to fill the bond line at each region. The result is an adhesive application schedule in the form of program instructions for a predetermined set of adhesive film shapes calculated in dependence on the bondline thickness profile, and which can be cut from a supply of adhesive film 7 by the automatic cutter 65. Some corresponding adhesive shapes are indicated schematically at 71 in
[0052] Because the adhesive application schedule is in the form of stored data directly calculated from the bondline thickness profile, it is also available to assist a user to position the pieces of adhesive film 71 correctly on the blade body 1.
[0053] In this way, the process of adhesive kit preparation for assembly of the blade edge guard is completely automated. The skilled person will also understand that the use of the sensor layer preform and the associated system can be used before the actual bonding stage as a means of shape checking and quality control for components to be bonded.
[0054] With reference to
[0055] During operation, air entering the intake 511 is accelerated by the fan 512 to produce two air flows: a first air flow A into the intermediate-pressure compressor 513 and a second air flow B which passes through the bypass duct 522 to provide propulsive thrust. The intermediate-pressure compressor 513 compresses the air flow A directed into it before delivering that air to the high-pressure compressor 514 where further compression takes place.
[0056] The compressed air exhausted from the high-pressure compressor 514 is directed into the combustion equipment 515 where it is mixed with fuel and the mixture combusted. The resultant hot combustion products then expand through, and thereby drive the high, intermediate and low-pressure turbines 516,517,518 before being exhausted through the nozzle 519 to provide additional propulsive thrust. The high, intermediate and low-pressure turbines respectively drive the high and intermediate-pressure compressors 514, 513 and the fan 512 by suitable interconnecting shafts.