Plating method for printed layer

Abstract

A plating method includes: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece.

Claims

1. A plating method for a printed layer, comprising: providing a work piece which is metal or non-metal; forming a printed layer on a predetermined region of a surface of the work piece through printing electrical conductive material on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece, the plated layer covering and directly engaging all exposed surfaces of the printed layer and the surface of the work piece.

2. The plating method as claimed in claim 1, wherein the electrical conductive material is electrical conductive paint.

3. The plating method as claimed in claim 2, wherein the electrical conductive material is silver electrical conductive paint.

4. The plating method as claimed in claim 2, wherein the electrical conductive material is copper electrical conductive paint.

5. The plating method as claimed in claim 2, wherein the electrical conductive material is nickel electrical conductive paint.

6. The plating method as claimed in claim 1, wherein the electrical conductive material is fluorescent paint.

7. The plating method as claimed in claim 1 further comprising: forming a metal plating layer on the work piece to serve as a protective layer.

8. The plating method as claimed in claim 1, wherein the protective layer is a semi-bright nickel plating layer.

9. A plating method for a printed layer, comprising: providing a work piece; forming a printed layer on a predetermined region of a surface of the work piece through printing a mixture of electrical conductive material and metal particles on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece, the plated layer covering and directly engaging all exposed surfaces of the mixture of the electrical conductive material and the metal particles of the printed layer and the surface of the work piece.

10. The plating method as claimed in claim 9, wherein the electrically conductive material is electrical conductive paint.

11. The plating method as claimed in claim 10, wherein the electrical conductive paint is conductive carbon.

12. The plating method as claimed in claim 9, further comprising: pre-immersing the printed layer to form a displacement layer on the printed layer, the displacement layer being located between the exposed surfaces of the mixture of the electrical conductive material and the metal particles of the printed layer and the plate layer.

13. The plating method as claimed in claim 9 further comprising: forming a metal plating layer on the work piece to serve as a protective layer.

14. The plating method as claimed in claim 9, wherein the protective layer is a semi-bright nickel plating layer.

15. The plating method as claimed in claim 9, wherein the protective layer is a semi-bright nickel plating layer.

16. A plating method for a printed layer, comprising: providing a work piece; forming a printed layer on a predetermined region of a surface of the work piece through printing a mixture of electrical conductive material and electrical conductive particles on the predetermined region; forming a plated layer through plating the printed layer and the surface of the work piece, the plated layer covering and directly engaging all exposed surfaces of the mixture of the electrical conductive material and the electrical conductive particles of the printed layer and the surface of the work piece.

17. The plating method as claimed in claim 16, wherein the electrically conductive material is electrical conductive paint.

18. The plating method as claimed in claim 16, wherein the electrical conductive paint is conductive carbon.

19. The plating method as claimed in claim 16 further comprising: forming a metal plating layer on the work piece to serve as a protective layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:

(2) FIG. 1 is a flow chart of an embodiment of a plating method of the invention;

(3) FIG. 2 depicts a manufacturing process of a plated product made by the plating method of FIG. 1;

(4) FIG. 3 depicts a printed layer formed on a work piece by the plating method of FIG. 1;

(5) FIG. 4 depicts a plated layer formed on a work piece by the plating method of FIG. 3;

(6) FIG. 5 is a schematic view of a plated product of the invention;

(7) FIG. 6 is a partially enlarged view of the plated product of FIG. 5;

(8) FIG. 7 is a flow chart of another embodiment of a plating method of the invention;

(9) FIG. 8 depicts a manufacturing process of a plated product made by the plating method of FIG. 7;

(10) FIG. 9 a schematic view of a plated product manufactured by the plating method of FIG. 7;

(11) FIG. 10 is an enlarged view of portion A of FIG. 9;

(12) FIG. 11 is a flow chart of another embodiment of a plating method of the invention;

(13) FIG. 12 depicts a manufacturing process of a plated product made by the plating method of FIG. 11; and

(14) FIG. 13 is a flow chart of another embodiment of a plating method of the invention.

DETAILED DESCRIPTION OF THE INVENTION

(15) The following description is of the best-contemplated mode of carrying out the invention. This description is made for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims.

(16) Referring to FIGS. 1 and 2, a plating method of the invention includes the following steps: S1: providing a work piece 10 which is metal or non-metal; S2: forming a printed layer 20 on a predetermined region of a surface of the work piece 10 through printing electrical conductive material on the predetermined region; and S3: forming a plated layer 30 through plating the printed layer 20 and the surface of the work piece 10.

(17) The electrical conductive material is electrical conductive paint or fluorescent paint. The electrical conductive paint is silver electrical conductive paint including silver particles, copper electrical conductive paint including copper particles or nickel electrical conductive paint including nickel particles or electrical conductive carbon. The copper electrical conductive paint has a lower price than the silver electrical conductive paint. The nickel electrical conductive paint has a better electrical conductivity. The electrical conductive material is selected according to the texts or figures printed on the work piece.

(18) Referring to FIGS. 3 and 4, the printed layer 20 is formed on the predetermined region of a surface of the work piece 10 through printing electrical conductive material on the predetermined region. The plated layer 30 is formed through plating the printed layer 20 and the surface of the work piece 10. The plated layer 30 is coated on the surface of the work piece 10 so as to protect the surface of the work piece 10.

(19) Referring to FIGS. 5 and 6, since the printed layer 20 is formed by printing electrical conductive material including metal particles on the work piece 10, when the plated layer 30 is formed on the printed layer 20 and the surface of the work piece 10, the plated surface 31 on the printed layer 20 is embossed and provides a matte effect. A metal plating layer is formed on the work piece 10 to serve as a protective layer 101. Preferably, the protective layer 101 is a semi-bright nickel plating layer so that the work piece 10 has a smooth surface.

(20) Referring to FIG. 7 or 8, another embodiment of a plating method of the invention includes the following steps: S10: providing a work piece 100 which is metal or non-metal; S20: forming a printed layer 200 on a predetermined region of a surface of the work piece 100 through printing a mixture of electrical conductive material 201 and metal particles 202 or other electrical conductive particles on the predetermined region; and S30: forming a plated layer 300 through plating the printed layer 200 and the surface of the work piece 100.

(21) Referring to FIGS. 9 and 10, since the printed layer 200 includes metal particles 202 mixed with the electrical conductive material 201, the plated surface 310 has a decoration effect just like the work piece 100 embedded with diamond pieces. In this embodiment, a metal plating layer is formed on the work piece 10 to serve as a protective layer 101. Preferably, the protective layer 101 is a semi-bright nickel plating layer so that the work piece 10 has a smooth surface.

(22) Referring to FIGS. 11 and 12, another embodiment of a plating method of another embodiment of the invention includes the following steps step: S10: providing a work piece 100 which is metal or non-metal; S20: forming a printed layer 200 on a predetermined region of a surface of the work piece 100 through printing a mixture of electrical conductive material 201 and metal particles 202 on the predetermined region; S25: pre-immersing the printed layer 200 to form a displacement layer 90 on the printed layer 200; and S30: forming a plated layer 300 through plating the printed layer 200 and the surface of the work piece 100. The displacement layer 90 allows the plated layer 300 attached to the printed layer 200 more tightly and prevents the plated layer 300 from falling off.

(23) The plating method of the invention has the following advantages: the printed layer is formed by printing electrically conductive material, which speeds the plating process; the plated layer 30 protects the printed layer 20 and prevents the printed layer 20 from being scratched by hard object; a matte and embossed effect is provided by the printed layer 20; the printed layer and the plated layer are tightly attached to the work piece and has a shining effect like embedded with diamond pieces.

(24) While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.