PROTECTION CIRCUIT IN BLASTING SYSTEMS

Abstract

There is provided an electronic detonator with electronic delayer, comprising: a conductive shell comprising an open end for receiving elements such as an explosive charge, and a closed end, and a printed circuit board (PCB) comprising the electronic circuit of the delayer, the printed circuit board being placed inside the conductive shell, characterized in that the electronic detonator further comprises at least a resilient, compressible and conductive gasket positioned by the open end in a space defined by the PCB and an inner surface of the conductive shell, filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and contacting the ground connection of the PCB and the inner surface of the conductive shell such that acts as connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

Claims

1. An electronic detonator with electronic delayer, comprising: a conductive shell comprising: an open end or inlet for receiving elements such as an explosive charge, and a closed end (67), and a printed circuit board (PCB) comprising the electronic circuit of the delayer, the PCB being placed inside the conductive shell, wherein the electronic detonator further comprises at least a resilient, compressible and conductive gasket in a position such that the gasket is: positioned by the open end in a space defined by the PCB and an inner surface of the conductive shell, filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and contacting the ground connection of the PCB and the inner surface of the conductive shell such that the contact acts as connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

2. The electronic detonator with electronic delayer according to claim 1 wherein the conductive shell is made of metal, preferably copper or aluminium.

3. The electronic detonator with electronic delayer according to claim wherein the gasket is adapted to cover the complete opening between the PCB and the detonator shell.

4. The electronic detonator with electronic delayer according to claim 1 comprising two conductive gaskets.

5. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is positioned on a shield connection point of the PCB.

6. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is made of a low resistance material.

7. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is positioned on a plane coinciding with the plane of the edge of the open end of the conductive shell.

8. The electronic detonator with electronic delayer according to claim 1 wherein the gasket comprises an inner hole by which the gasket is connected to the shield of the PCB, preferably by means of melted tin.

9. The electronic detonator with electronic delayer according to claim 1 wherein the gasket is semi-circle shaped.

10. A blasting system comprising an electronic detonator with electronic delayer according to claim 1.

11. A method for manufacturing an electronic detonator according to claim 1 comprising assembling at least one resilient, compressible and conductive gasket in a position such that the gasket is: positioned by the open end in a space defined by the PCB and an inner surface of the conductive shell, filling at least part of the space between the PCB and the inner surface of the conductive shell, such that protection against electromagnetic interferences (EMI) is allowed and contacting the ground connection of the PCB and the inner surface of the conductive shell such that it acts as connection path for grounding the PCB, allowing protection against electro-static interference (ESD).

12. The method for manufacturing an electronic detonator according to claim 9 wherein the gasket is positioned on a shield connection point of the PCB.

Description

DESCRIPTION OF THE DRAWINGS

[0035] These and other characteristics and advantages of the invention will become clearly understood in view of the detailed description of the invention which becomes apparent from preferred embodiments of the invention, given just as an example and not being limited thereto, with reference to the drawings.

[0036] FIG. 1A This figure represents a detonator (11) according to the state of the art.

[0037] FIG. 1B This figure represents a detonator (13) according to the state of the art.

[0038] FIG. 2 This figure represents a solution according to the present invention wherein a detonator (2) is represented.

[0039] FIG. 3 This figure represents a detonator (3) according to the invention. A shield connection point (31) may be the specific part of the PCB (32) where a compressive conductive gasket (33) is positioned establishing a connection to the ground of the PCB.

[0040] FIG. 4 This figure represents a front view of the detonator (4) comprising a shell (41), a PCB (42) and a gasket (43) which has been inserted between the shell (41) and the PCB (42).

[0041] FIG. 5 This figure represents a front view of the detonator (5) comprising a shell (51), a PCB (52) and two gaskets (53, 54) which have been inserted between the shell (51) and the PCB covering the whole area between them.

[0042] FIG. 6A This figure represents a PCB (61), lead wires (64), rubber bushing (65), gasket (63) and fuse head (66).

[0043] FIG. 6B This figure represents a metallic shell (62) in which the rest of the elements of figure A are being inserted.

[0044] FIG. 60 This figure represents a metallic shell covering the elements until the gasket (63).

[0045] FIG. 6D This figure represents complete detonator (6) covered and completely assembled.

DETAILED DESCRIPTION OF THE INVENTION

[0046] Once the object of the invention has been outlined, specific non-limitative embodiments are described hereinafter.

[0047] FIGS. 1A and 1B represent detonators (11, 13) according to the state of the art for which hand soldered wire pieces (12, 14) are used and which cannot be included in an automatic SMT process; they do not protect against EMI.

[0048] Said solutions in the state of the art use normally 2 ways of protection, the first is to solder a piece of metal from the PCB to the shell, and the other solution is to have copper pads in the edge of the PCB to ease the spark between the shell and the pad in case of electrostatic discharge. None of these solutions provides with EMI protection in the way the invention does; besides, solutions in the state of the art require manual assembly process.

[0049] FIG. 2 shows a solution according to the present invention wherein a detonator (2) is represented. The detonator (2) comprises a shell (21) having the electronic circuit for a delayer in the PCB (22) and a resilient, compressible and conductive gasket (23) which is represented before being inserted into the shell (21).

[0050] The PCB (22) grounded to the outer part of the shell (23) provides protection against ESD via a physical connection. ESD protection is therefore provided against voltage transients and other transient events.

[0051] FIG. 3 shows a detonator (3) according to the invention. A shield connection point (31) may be the specific part of the PCB (32) where a compressive conductive gasket (33) is positioned establishing a connection to the ground of the PCB. In the state of the art a piece of wire is used for achieving ESD protection but said solution requires manual soldering, whereas the solution according to the invention advantageously uses an automated surface mount process. In this embodiment the gasket (33) is positioned on a shield connection point of the PCB. Advantageously this positioning provides proper grounding to the PCB and the detonator so that the circuit is completely protected against ESD.

[0052] Besides, the gasket (33) is positioned on a plane (34) coinciding with the plane of the edge of the open end of the conductive shell (35). Advantageously, the gasket (33) positioned on (34) the edge allows the complete length of the PCB (32), from the open end until the closed end where the explosive may be inserted, to be protected against any external EMI.

[0053] There is also shown an inner hole (36) by which the gasket (33) is connected to the shield connection point (31) of the PCB (32), preferably by means of melted tin (37). Advantageously the position of the gasket (33) on the PCB (32) is securely fastened by said inner hole (37) in the gasket.

[0054] FIG. 4 shows a front view of the detonator (4) comprising a shell (41), a PCB (42) and a gasket (43) which has been inserted between the shell (41) and the PCB (42). In this embodiment the gasket presents a shape different from a semi-circle and therefore the space between the inner part of the shell (41) and the PCB (42) is not completely covered, giving however a good EMI protection.

[0055] FIG. 5 shows a front view of the detonator (5) comprising a shell (51), a PCB (52) and a gasket (53) which has been inserted between the shell (51) and the PCB (52). In this embodiment the gasket (53, 54) presents a semi-circle shape and therefore the space between the inner part of the shell (51) and the PCB (52) is completely covered. Besides in the embodiment of FIG. 5 there are represented two gaskets (53, 54), achieving an optimal protection against EMI.

[0056] In an embodiment, the gasket is a highly compressible and resilient electrically conductive pad which is compatible with standard surface mount technology (SMT) installation processes. Besides it is comprised in a conductive silver-coated hollow silicone extrusion bonded to a silver-plated metal support layer adapted to be welded. By piecing a series of parts of identical or varying lengths on a PCB ground trace, an efficient EMI seal can be formed between the PCB and corresponding shield housing. This enables users to create a low cost, custom EMI gasket at the board level without special tooling or custom installation equipment.

Manufacturing Method:

[0057] FIGS. 6A, 6B, 6C and 6D show an example of steps of an embodiment of a method for manufacturing a detonator (6) according to the invention. The PCB (61) may be inserted into a metallic shell (62); subsequently the compressive gasket (63) is positioned to fill the space between the shell (62) and the PCB (61) protecting the circuit and making contact from the circuit to the shell. The gasket is positioned on a shield connection point (67) of the PCB (61).

[0058] In FIGS. 6A, 6B, 6C and 6D the following elements are shown: [0059] lead wires (64) for conducting a detonation signal, [0060] rubber bushing (65) for protecting the detonator (6) from external conditions like humidity and dust, [0061] gasket (63), [0062] fuse head (66) for detonating.

[0063] Different positions of the different parts of the detonator (6) and the sequence of assembling them are shown:

[0064] FIG. 6A: shows the PCB (61), lead wires (64), rubber bushing (65), gasket (63), a shell (62) comprising an open end and a closed end, and fuse head (66);

[0065] FIG. 6B: shows the metallic shell (62) in which the rest of the elements of FIG. 6A are being inserted;

[0066] FIG. 6C: shows the metallic shell covering the elements until the gasket (63);

[0067] FIG. 6D: shows the complete detonator (6) covered and completely assembled.