LED-based light bulb
09944519 ยท 2018-04-17
Assignee
Inventors
- Christopher L. Bohler (North Royalton, OH, US)
- Boris Kolodin (Beachwood, OH, US)
- Emil Radkov (Euclid, OH, US)
- Srinath K. Aanegola (Broadview Heights, OH, US)
- Stanton E. Weaver, Jr. (Northville, NY, US)
- James T. Petroski (Parma, OH, US)
- Zena Brown (Beachwood, OH, US)
Cpc classification
F21V29/58
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/23
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2115/10
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V3/02
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21Y2105/18
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/773
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/63
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B82Y10/00
PERFORMING OPERATIONS; TRANSPORTING
F21V3/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/61
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/67
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F21V3/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/232
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21K9/64
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B82Y10/00
PERFORMING OPERATIONS; TRANSPORTING
F21V29/70
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F21V29/58
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
Abstract
A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
Claims
1. A light source comprising: a light engine comprising a printed circuit board and including at least one LED; a light transparent or translucent enclosure fitted over at least a portion of the light engine; an index matching and thermal spreading material in the enclosure and in direct physical contact with the at least one LED, said material consisting of a liquid; a base for supporting the light engine, enclosure and a heat sink in operative arrangement; and a conversion circuit housed in at least a portion of the base for supplying electric power to the light engine.
2. The light source of claim 1, wherein the liquid material comprises a lens.
3. The light source of claim 1, wherein the enclosure is one of a bulb, spherical, elliptical, cylindrical, domed, squared, and n-sided shaped.
4. The light source of claim 1, wherein the base is one of a screw base and wedge base.
5. The light source of claim 1, wherein the heat sink is in thermal communication with the light engine and comprises i) a slug portion and ii) a plurality of radially extending fins disposed about the outer periphery of the slug portion and external to the light source to transfer heat from the light engine into ambient air external to the light source.
6. The light source of claim 1, wherein the base comprises an active cooling unit for dissipating thermal energy away from the at least one LED.
7. The light source of claim 6, wherein the active cooling unit includes at least one of thermoelectric cooling, piezo synthetic jets, piezo fans and electric fans.
8. The light source of claim 1 wherein said light engine comprises a plurality of LEDs and all LEDs of the light engine reside in a common plane.
9. The light source of claim 1 wherein said conversion circuit is in electrical communication with a voltage source.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) The invention may take form in various components and arrangements of components, and in various steps and arrangements of steps. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention.
(2)
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DETAILED DESCRIPTION
(8) With reference to
(9) Preferably, the platform 14 is a substrate on which a semiconductor may be grown. The platform 14 can be one of sapphire, gallium arsenide, silicon carbide, gallium phosphorous, gallium arsenide, gallium nitride, or other suitable material. It is also contemplated that the platform 14 can be a printed circuit board, heatsink, or any other suitable means for mounting the LEDs 12. The LEDs 12 are attached to the platform 14 by one of solder, wirebonding, thermosonic, thermocompression, electrical conductive adhesives, thermal conductive adhesives, other suitable means, or a combination of the above. It is also contemplated that the LEDs 12 can be adjacent to or manufactured as an integral part of the cover 22.
(10) The platform 14 is adapted to be directly mounted into a base or socket 24. In one embodiment, the base 24 has a receptacle into which the light engine 16 is plugged in. Preferably, the base 24 is one of the commercially available light bulb sockets for easy field exchange and retrofitting of the light bulb with the LED light engine 16 such that the enclosure 22 can be fitted over the light engine 16. E.g., in one embodiment, the base 24 is one of commercially available incandescent light sockets such as 6S6 screw base, 194 wedge base, or other. Such design allows the conventional lamp to be replaced with a variety of different LED light engines without modification to the lamp socket or to the lamp enclosure. Optionally, the base 24 is custom manufactured. At least one heatsink 26 is integrally disposed in thermal communication with the light engine 16 and the base 24 to take the heat away from the LEDs 12. The heatsink 26 is constructed from the material capable of conducting the heat away from the LEDs 12. Examples of suitable materials include copper, aluminum, silicon carbide, boron nitride and others known to have a high coefficient of thermal conductivity.
(11) Preferably, an index matching material 28 is applied to encompass the light engine 16 to improve the light extraction. The index matching material is selected from silicones, acrylics, epoxies, thermoplastics, glasses and any other appropriate materials. Optionally, an index matching fluid, which preferably serves as a thermal spreading medium, is present between the light engine 16 and the cover 22. The fluid is selected from solids, gels, liquids, fluorocarbon coolants, luminescent materials and others to create a desired visual effect. Additionally, reflective or translucent particles may added to the fluid for further visual effects. The cover 22 works together with the internal fluid to optimize light extraction and/or provide visual effects. In one embodiment, the index matching material 28 is structured to provide lensing.
(12) In order to provide suitable electrical power to the LEDs 12, the lighting system 10 includes one or more of an electric power conversion circuit, or control electronics, or power electronics circuits 30, which are preferably integrated with the light engine 16. Alternatively, the electric power conversion circuit 30 can be adjacent the light engine 16, located within the base 24, or disposed remotely from the lighting system 10. In one embodiment, the electric power conversion circuit includes an AC/DC converter which permits the LED-based lighting system 10 to be powered by a standard domestic 120 VAC or international 220 VAC user voltage. Such circuitry makes the LED lamp a true replacement for a bulb light. Preferably, the power electronics circuits 30 are two- or three-dimensional structures to provide minimal dimensions. In one embodiment, the electric power conversion circuits 30 are flexible circuits. Optionally, the electric power conversion circuits 30 are non-planar circuit boards.
(13) With reference to
(14) With reference to
(15) Optionally, the base 24 includes at least one of thermoelectric cooling, piezo synthetic jets, qu-pipes, heat-pipes, piezo fans and electric fans, or other forms of active cooling.
(16) With reference to
(17) In one embodiment, the enclosure 22 includes transparent organic phosphors 23 which are preferably coated on an inside, or outside surface of the enclosure 22, or a combination thereof. It is also contemplated that the phosphors can be dissolved, melted, coextruded, or dispersed by any other means within the walls forming the enclosure 22. Preferably, the phosphor distribution is uniform. In one embodiment, the phosphor distribution is non uniform to create preselected patterns, figures, special visual effects of different colors, and other effects. It is also contemplated that both transparent and conventional non-transparent phosphors can be used to create special effects, patterns, or figures. In one embodiment, the enclosure 22 is frosted or otherwise treated to provide special visual effects. Examples of the organic transparent phosphors are the BASF Lumogen F dyes such as Lumogen F Yellow 083, Lumogen F Orange 240, Lumogen F Red 300, and Lumogen F Violet 570. Of course, it is also contemplated that other phosphors such as the rare earth complexes with organic component described in the U.S. Pat. No. 6,366,033; quantum dot phosphors described in the U.S. Pat. No. 6,207,229; nanophosphors described in the U.S. Pat. No. 6,048,616, or other suitable phosphors can be used.
(18) With continuing reference to
(19) With reference again to
(20) The invention has been described with reference to the preferred embodiments. Modifications and alterations will occur to others upon a reading and understanding of the preceding detailed description. It is intended that the invention be construed as including all such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.