Method of manufacturing a radio frequency identification device

Abstract

The present invention relates to a method of manufacturing an antenna for a radio frequency (RFID) tag. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide a microchip attachment location and to selectively tune an antenna for a particular end use application. The cutting may be performed by a laser, die cutting, stamping or combinations thereof.

Claims

1. A method of manufacturing an antenna structure for a radio frequency identification (RFID) tag, comprising the steps of: providing a conductive layer, a two part adhesive layer in which one part is tacky and another part is not tacky, and a carrier layer supporting the conductive layer and the adhesive layer; cutting a first antenna pattern through the conductive layer wherein the cutting includes performing a partial die cut with one of a rotary die cutter or a laser cutter up to the carrier layer but not through the carrier layer and through the conductive layer and the adhesive layer; creating a microprocessor attachment portion by further cutting in the first antenna pattern to create a RFID antenna structure; where the microprocessor attachment portion in the first antenna pattern includes ablating the conductive layer using a computer controlled cutting laser; and attaching a microprocessor to the microprocessor attachment portion wherein the RFID antenna structure has multiple contact points allowing for one of a direct attachment point for the microprocessor or a strap attachment point each being different points on the RFID antenna structure without changing a design of the RFID antenna structure.

2. The method of claim 1, wherein the microprocessor attachment portion ablated by the laser cutter is generally t-shaped to define a gap that separates a first antenna contact end from a second antenna contact end.

3. The method of claim 2, including a further step of removing at least a matrix portion from the first antenna pattern after the step of cutting a first antenna pattern.

4. The method of claim 1, where tracing is done by a positioned supplementary second laser cutter on a supplementary laser cutting path while continuously ablating the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure.

5. A method of manufacturing a radio frequency identification (RFID) tag comprising the steps of: providing a carrier layer; placing a conductive material on the carrier layer such that the conductive layer is attached to the carrier layer by an adhesive layer wherein a plurality of patterned registration marks is provided on top of one of the adhesive or carrier layer; cutting portions of the conductive material with a computer controlled laser to form an RFID antenna structure to create an RFID tag such that the plurality of registration marks are provided to assist in the cutting of a pattern for the RFID antenna structure which the laser uses while continuously ablating the conductive material and the adhesive layer; selectively cutting with the laser additional portions of the RFID tag to create a modified RFID tag and forming at least one of a logo, indicia, name or combinations thereof; creating a microprocessor attachment portion by further cutting in the antenna structure; removing the modified RFID tag from the carrier layer; tracing by a second laser cutter on a cutting path the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure; and attaching a microprocessor directly to the RFID antenna structure to create a standard RFID tag.

6. The method of claim 5, wherein the microprocessor is directly attached to the RFID antenna structure at a microprocessor attachment portion of the RFID antenna structure.

7. The method of claim 5, wherein the antenna structure has a microprocessor attachment portion that is generally t-shaped that defines a gap that separates a first antenna contact end from a second antenna contact end.

8. The method of claim 7, wherein the microprocessor is attached directly to the RFID antenna structure at the first antenna contact end and the second antenna contact end.

9. The method of claim 5, wherein the microprocessor is attached directly to the RFID antenna structure through the use of at least one of ultrasonic welding, crimping, adhesive bonding or combinations thereof.

10. The method of claim 5, wherein the step of selectively cutting portions of the antenna is practiced prior to the step of attaching the microprocessor.

11. A method of manufacturing a radio frequency identification (RFID) tag, comprising the steps of: providing a conductive layer having a metal foil layer bonded to a carrier layer in areas where an antenna pattern is to be formed, the metal foil layer is bonded to the carrier layer by an adhesive layer; cutting a first antenna pattern in the conductive layer; cutting a second pattern in the first antenna pattern to create a RFID antenna structure wherein the cutting includes performing a partial die cut up to the carrier layer through the conductive layer and the adhesive layer and the conductive layer and RFID antenna structure are manufactured in a continuous roll to roll process; selectively cutting with portions of one of the first and second patterns in the RFID antenna structure to create a modified RFID tag; creating a microprocessor attachment portion by further cutting in the antenna structure and attaching a microprocessor such that none of the conductive layer is present in the microprocessor attachment portion; where the microprocessor attachment portion in the first antenna pattern includes ablating the conductive layer using a computer controlled cutting laser; tracing by a laser cutter on a laser cutting path the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure; and removing the modified RFID tag from the carrier layer.

12. The method of claim 11, wherein a microprocessor attachment portion is formed in the antenna pattern is generally t-shaped void and defines a gap that separates a first antenna contact end from a second antenna contact end.

13. The method of claim 12, wherein the microprocessor is directly attached the microprocessor attachment portion of the RFID antenna structure at the first antenna contact end and the second antenna contact end.

14. The method of claim 11, wherein the step of selectively cutting portions of the RFID antenna structure to create a modified RFID tag includes ablating the conductive layer using a computer controlled cutting laser.

15. The method of claim 11, wherein the microprocessor is attached directly to the RFID antenna structure through at least one of ultrasonic welds, electrically conductive adhesive, mechanical crimping or combinations thereof.

16. The method of claim 11, wherein the cutting of the basic antenna pattern through the conductive layer includes performing a partial cut with one of a rotary die cutter or cold foil process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) These, as well as other objects and advantages of this invention, will be more completely understood and appreciated by referring to the following more detailed description of the presently preferred exemplary embodiments of the invention in conjunction with the accompanying drawings, of which:

(2) FIG. 1 is a top view of an antenna created by a prior art method;

(3) FIG. 2 is a top view of a complete standard RFID tag created by a method disclosed by the present invention;

(4) FIG. 3 depicts a roll-to-roll process for manufacturing a standard RFID antenna structure in accordance with an aspect of the present invention;

(5) FIG. 4 is a cross sectional view of a web used in the roll-to-roll process disclosed by the present invention;

(6) FIG. 5 is a top view of a die used by a rotary die cutter as disclosed by the present invention;

(7) FIG. 6 is a top view of a basic antenna structure cut by the die shown in FIG. 3;

(8) FIG. 7 is a top view of an exemplary primary laser cutting path utilized by the present invention;

(9) FIG. 8 is a top view showing the placement of the primary laser path shown in FIG. 7 on the basic antenna structure shown in FIG. 6;

(10) FIG. 9 is a top view of a standard antenna structure;

(11) FIG. 10 depicts a roll-to-roll process for manufacturing modified RFID tags in accordance with an aspect of the present invention;

(12) FIG. 11 is a top view of an exemplary secondary cutting path utilized by the present invention;

(13) FIG. 12 is a top view showing the placement of the secondary cutting path shown in FIG. 10 on the standard RFID tag shown in FIG. 2;

(14) FIG. 13 is a top view of a completed modified RFID tag created by a method disclosed by the present invention;

(15) FIG. 14 depicts another roll-to-roll process for manufacturing modified RFID tags in accordance with an aspect of the present invention;

(16) FIG. 15 illustrates a methodology of creating a standard RFID antenna in accordance with an aspect of the present invention;

(17) FIG. 16 illustrates a methodology of creating a modified RFID tag in accordance with an aspect of the present invention; and

(18) FIG. 17 provides a side elevation of a conductive laminate produced in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

(19) The apparatuses and methods disclosed in this document are described in detail by way of examples and with reference to the figures. Unless otherwise specified, like numbers in the figures indicate references to the same, similar, or corresponding elements throughout the figures. It will be appreciated that modifications to disclosed and described examples, arrangements, configurations, components, elements, apparatuses, methods, materials, etc. can be made and may be desired for a specific application. In this disclosure, any identification of specific shapes, materials, techniques, arrangements, etc. are either related to a specific example presented or are merely a general description of such a shape, material, technique, arrangement, etc. Identifications of specific details or examples are not intended to be, and should not be, construed as mandatory or limiting unless specifically designated as such.

(20) Referring now to FIG. 2, a top view of a completed exemplary RFID tag 50 created by a method of the present invention is shown. The RFID tag 50 has an antenna structure 55 formed out of a conductive layer. The antenna structure 55 has a center portion 60 with a generally T-shaped opening 65. It should be understood that any configuration or shape may be produced depending on the requirements of the end user application.

(21) The generally T-shaped opening 65 defines a gap 70 that separates a first antenna contact end 75 from a second antenna contact end 80. A microprocessor 85 can then be directly electrically coupled to the first and second contact antenna ends 75, 80 while extending over the gap 70. It should be noted that the microprocessor 85 is directly electrically coupled to the standard antenna structure 55 without the use of any contact extensions, e.g. strap, as a result of the methodology used to create the standard antenna structure 55, which will be explained in detail below. However, the present invention contemplates that a contact extension may be utilized but is not required.

(22) Having now described the RFID tag 50, a schematic illustration of an apparatus by which the antenna structure 55 is created is set forth in FIG. 3, which shows a roll-to-roll process for manufacturing an RFID antenna structure in accordance with an aspect of the present invention. A web 90 is dispensed via an unwinder 95 from a web roll 100 and fed to a rotary die cutter 110 which has a rotary die 150. The web 90 exits a first cutter 110, and is fed into a laser cutter 175. A laser cutting path 215 (an exemplary embodiment of which is provided in detail in FIG. 7) is programmed into a computer 400 that controls the laser cutter 175.

(23) The programmable laser can also be used to cut other patterns into the material, such as logos, names, trademarks, images or the like such that an RFID device can be created and information about the retailer, customer, manufacturer, marketing or promotional event, theme, etc. can be included with the device.

(24) An exemplary laser suitable for use in the present invention includes a ytterbium laser, which pulses at about 48 kHz in a wavelength of 1024 nm. Ideally, the energy of the laser is not apparent from the surface of the substrate, such that there are no areas of surface roughness, blacking or die strikes such as one may see with a die cutter.

(25) Continuing with reference to FIG. 3, the web 155 exits the laser cutter 175 and is fed into a stripper 180, if necessary. When provided, the stripper 180 separates the matrix web 190 from the antenna structure to create a finished antenna structure web 185. It should be noted that the reinforcement layer 135 (FIG. 4), when provided, may be necessary to bolster the strength of the conductive layer 145 so as to prevent the tearing or ripping of the conductive layer 145 during the processing/cutting of the antenna structure web 185 if the conductive layer isn't sufficiently strong to withstand processing. Alternatively, a foil or other conductive structure such as a web or mesh of wires with sufficient mechanical strength may be used. In the latter instance, the foil matrix, when collected, is 100% recyclable. The antenna structure web 185 has a succession of antenna structures disposed on the carrier layer 130. The antenna structure web 185 is wound into an antenna structure roll 195 by a first rewinder 200, while the matrix web 190 is wound into a matrix roll 210 by a second rewinder 205.

(26) Referring now to FIG. 4, a cross sectional view of the web 115 used in the roll-to-roll process is shown. The web 115 may be selected from paper, fabric (woven and non-woven, synthetic or natural fabrics), plastics or other suitable material. The web 115 may include a conductive layer 120 bonded to a carrier layer 130 by a first adhesive layer 125. In one embodiment of the present invention, the first adhesive layer 125 may have a pattern of optical brighteners (not shown) disposed within the adhesive layer used as registration marks, in order to assist in the cutting process by the laser. The optical brighteners are detectable by the laser and indicate to the laser where to cut the pattern for the antenna structure. The optical brighteners may also be printed on top of the adhesive layer rather than being present within the adhesive layer. Additionally, the optical brighteners may be printed on the carrier layer 130 as opposed to being mixed in the adhesive, that is the optical brighteners can be printed, sprayed or otherwise applied to the carrier layer prior to the application of the adhesive and adjacent the area where the adhesive is applied. In this embodiment, it is preferred that the adhesive layer is clear or transparent so that the optical brighteners may be seen through the adhesive layer.

(27) Alternatively, other triggers or elements can be used by the system to allow the laser to begin cutting, such as printed and unprinted areas of the web, coated and uncoated adhesive areas, punches, cuts, slits in the web and the like.

(28) In a preferred embodiment, the optical brighteners are a fluorescent powder, in an amount that is approximately 1% by weight of the adhesive and more preferably 0.5% by weight of the adhesive.

(29) In one embodiment of the present invention, the web may have a series of printed registration marks 14 along the longitudinally and/or transversely extending sides of the first adhesive layer (depending on the direction of web travel). The registration marks assist in alignment of the antenna patterns in the conductive layer, and are typically provided in a machine direction which is the direction the web or sheet travels through the machine. Optical brighteners may serve as registration marks or the registration marks may be printed using a wide variety of ink on top of individual optical brighteners. In another embodiment, the registration marks may be made out of optical brighteners and the optical brighteners may be incorporated within the adhesive layer, on top of the adhesive layer, or on top of the first face of the substrate as well.

(30) In one embodiment of the present invention, the web or sheet may include only a single layer of foil which may be supported by a carrier or support that is removable prior to the foil being adhered to the carrier and is used only to support foil during the processing. Alternatively, the foil may be of sufficient thickness that it does not require a supporting layer and has sufficient strength to withstand the processing of the roll to roll process and subsequent cutting.

(31) The carrier layer 130 may be made out of any material or combination of materials (paper, fabric, plastics, etc.) that allows the carrier layer 130 to be flexible so as to facilitate the manufacture of the carrier layer 130 as a continuous web that can be wound into a roll form for use in a roll-to-roll process. Webs may also be collected in a fanfold or zigzag configuration. Examples of such materials include, but are not limited to, polyester films, polyethylene terephthalate films, polyimide films, fabric or cloth, or paper materials (card stock paper, bond paper, etc.). The adhesive layer 125 may be applied to the carrier layer 130 by flood coating or roll coating, and may be a pressure activated adhesive or pressure sensitive adhesive.

(32) It should be understood that while the present invention is described as a roll to roll arrangement using a web, the invention may be practiced in a sheet feed configuration. In a sheet feed process, sheets of material (paper, plastic, fabric, etc.) are provided from a hopper or sheet feeder and then the sheets are collected once processing is completed. The sheets of material are usually collected in a stack.

(33) When a reinforcement layer is used to create a reinforced conductive layer 120 a metal foil layer 145 is bonded to a reinforcement layer 135 by a second adhesive layer 140. The metal foil layer 145 may be constructed out of any suitable conductive material, such as aluminum, copper, silver, gold and the like. Combinations of conductive materials may also be used. In addition, the conductive material can be created by printing of conductive ink, coatings of conductive fluids or solutions, flakes or other suitable processes. The second adhesive layer 140 may be a general-purpose permanent pressure sensitive adhesive, pressure activated adhesive, or any other suitable adhesive. The second adhesive layer 140 may be applied to the reinforcement layer 135 by flood coating, roll coating or pattern coating adhesive only in areas where antennas are to be formed. Alternatively, the adhesive may be a two part adhesive, in which one part is coated on the web and is not tacky and then upon the coating of the second part, in selective areas where the antenna is to be formed, the adhesive becomes tacky. A two part adhesive may also be used where a foil is in direct association with the carrier and no reinforcement layer is used.

(34) The present invention contemplates that optical brighteners may also be contained in the second adhesive or on top of the second adhesive layer to serve a similar purpose as they do in the first adhesive layer 125. Optical brighteners 23 may be contained in the second adhesive layer 20 as opposed to or in addition to optical brighteners 23 in the first adhesive layer 125.

(35) When a rotary die cutter or cold foil process is used, the rotary die cutter or cold foil process 110 is equipped with a die 150 (an exemplary embodiment of which is shown in detail in FIG. 3) having a shape generally mirroring the outline of an antenna structure to be formed, but without the opening for the attachment of the chip (e.g. T-shaped opening) or other configuration that will be imparted to the design (an exemplary embodiment of which is shown in detail in FIG. 5). As the web 90 is fed through the rotary die 110, the rotary die 110 causes the die 150 to cyclically cut or press into the web 90 as with a cold foil process, up to the carrier layer 130 through the metal foil layer 120 and the first adhesive layer 125, thereby delineating a succession of antenna structures from an undesired portion referred to as a matrix web 190. An exemplary antenna structure 165 is shown in FIG. 6. The antenna structure 165 has a center portion 170. The antenna structure 165 does not yet have a microprocessor attachment area defined in the center portion 170. It should be understood that other more intricate areas may also not be formed during the first cutting and reference to the attachment feature is intended to be illustrative and not limiting.

(36) Referring back to FIG. 3, the web 90 exits the rotary die cutter 110 and is fed into a laser cutter 175. A laser cutting path 215 (an exemplary embodiment of which is shown in detail in FIG. 7) is programmed into a computer 400 that controls the laser cutter 175. As the web 90 is fed through the laser cutter 175, the laser cutter 175 positions the laser cutting path 215 onto the center portion 170 of the antenna structure 165 that was created by the rotary die 110, as shown in FIG. 8. As the antenna structures advance through the laser cutter 175, the laser cutter 175 traces the position of the laser cutting path 215 while continuously ablating the conductive layer 120 and the adhesive layer 125 to create a microprocessor attachment area in the center portion of the basic antenna structures. The laser may create or refine additional areas of the antenna which are too fine for the die cutter to process. Where a reinforcement layer is present, the laser may also cut through the reinforcement layer and second adhesive layer.

(37) A succession of finished antenna structures is produced in the conductive layer 120 disposed on the carrier layer 35 while the structures are still surrounded by the matrix web 190 which is subsequently stripped off. A finished antenna structure 220 is shown in FIG. 9. The finished antenna structure has a center portion 500 (e.g. microprocessor attachment area) having an opening 230, which in the present example is generally T shaped. The opening 230 defines a gap 245 that separates a first antenna contact end 240 from a second antenna contact end 250.

(38) It should be appreciated that the laser cutter 175 ablates the conductive layer 120 and the adhesive layer 125 to create the opening for attaching the microprocessor. Accordingly, no material exists in the opening for the stripper 180 to remove as the stripper 180 separates the matrix web 190 from the antenna structure created by the first cutting process that was used to create the general antenna structure web 185. The microprocessor attachment area of antenna structure is particularly narrow. Therefore, if the die 150 were shaped to also cut the microprocessor attachment opening, the material being removed from the microprocessor attachment area during the separation of the antenna structure web 185 from the matrix web 190 would likewise be particularly narrow, and therefore weak and especially prone to tearing. This can be problematic, as the tearing could potentially damage the antenna structure which may destroy the functionality of the antenna. Furthermore, tearing of this nature would result in material remaining in the microprocessor attachment that would have to be manually removed, resulting in decreased production rates and increased manufacturing costs.

(39) While the laser cutter 175 creates only the microprocessor attachment that defines the gap and two contact antenna ends in this example, it should be appreciated that the laser cutting path 215 can easily and quickly be altered simply by loading a new laser cutting path program into the computer 400 to create other cutting or patterns to be produced in the antenna structure subsequent to the attachment pattern or simultaneously with or prior to the attachment pattern. Accordingly, the disclosed roll-to-roll process makes the production of small batches of specialized antennas with very unique variations of the exemplary standard antenna structures economically sustainable or makes the production of very intricate designs more feasible for such finite batches of antennas.

(40) Referring now to FIG. 10, a roll-to-roll process for manufacturing a modified RFID tag in accordance with an aspect of the present invention is shown. As used herein, a modified antenna structure refers to the process of taking a previously formed antenna structure especially since it's from a collection of standardized patterns and then further adapting that structure to meet a particular end use application or to complete the manufacture of a specific design.

(41) An antenna structure web 275 is dispensed from an antenna structure roll 270 via an unwinder 260. For the purposes of this exemplary embodiment, it will be assumed that the antenna structure roll 270 shown in FIG. 10 was created by the roll-to-roll process depicted in FIG. 3. However, any other suitable methods may be employed to create the antenna structures such as a sheet feed method. The antenna structure web 275 is fed into a microprocessor attachment apparatus 280. The microprocessor attachment apparatus 280 secures a microprocessor to the antenna structures being advanced through the microprocessor attachment apparatus 280 thereby creating a direct electrical connection between the microprocessor and the antenna structure.

(42) Referring back to FIG. 2 the completed standard RFID tag 50 illustrates where the microprocessor attachment apparatus 280 (FIG. 14) places the microprocessor 85 in relation to the antenna structure 55. The microprocessor attachment apparatus 280 secures one end of the microprocessor 85 to the antenna structure 55 at the first contact end 75, and the other end of the microprocessor 85 to the second contact end 80 such that the microprocessor extends across the gap 70. The microprocessor attachment apparatus 280 can secure the microprocessor 85 to the antenna structure 55 via an electrically conductive adhesive, a weld (e.g., spot weld), ultrasonic bonding, mechanical crimping or by any other suitable means that allow an electrical current to flow through the microprocessor 100 and around the antenna structure 55.

(43) It should be appreciated that the high-resolution cutting capabilities of the laser cutter 175 allows the laser cutter 175 to create a gap that is narrow enough to allow for the direct attachment of a microprocessor to the standard antenna structure without the use of any contact extensions. The absence of contact extensions may simplify the manufacturing process, decreases manufacturing costs, and eliminate a potential failure point (e.g. contact connection point). It should however be understood that contact extensions or a strap or lead frame can also be used in connection with the current process. In some instances, depending on the size of the strap or lead frame, different performance can be obtained by using the same antenna but with a different sized strap.

(44) The present invention may also be used to create unique or adaptable antennas with multiple contact points (or a graduated contact point) that allows for both direct attachment of a microprocessor or with a strap at a different point without changing the design of the antenna

(45) Referring back to FIG. 10, the antenna structure web 275 exits the microprocessor attachment machine 280 as an RFID tag web 605. The RFID tag web 605 has a succession of RFID tags disposed on the carrier layer. The RFID tag web 605 is fed into a second or subsequent laser cutter 285 to make the modifications to the initial antenna structure. A supplementary laser cutting path 310 (an exemplary embodiment of which is shown in detail in FIG. 11) is programmed into a second computer 600 that controls the second laser cutter 285. As the RFID tag web 605 is fed through the second laser cutter 285, the second laser cutter 285 positions the supplementary laser cutting path 310 onto the RFID tags as shown in FIG. 12. As the RFID tags advance through the second laser cutter 285, the second laser 285 cutter traces the positioned supplementary laser cutting path 310 while continuously ablating the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure for use for example with a RFID tag, label, ticket or inlay.

(46) A modified RFID tag 320 is shown in FIG. 13. The modified RFID tag 320 shares the same basic layout and structure as the RFID tag 50 shown in FIG. 2. The modified RFID tag 320 has a modified RFID antenna structure 650. The modified RFID tag 320 differs from the RFID tag 50 only in that the modified RFID tag 320 has a plurality of scallops 330 provided in the periphery portion of the modified RFID antenna structure 650. In addition to scallops, other shapes or other portions of the antenna can be easily created and the material removed from the conductive material.

(47) It should be noted that the supplementary cutting path 310 is designed preferably only to make slight alterations to the shape of the standard antenna structure so as to provide further flexibility of the standard antenna design. Alternatively, the second laser cutter 285 can also be used to radically alter the physical appearance of the standard antenna structure and to make material changes in the standardized structure when needed.

(48) Referring back to FIG. 10, the RFID tag web 605 exits the second laser cutter as a modified RFID tag web 610. The modified RFID tag web 610 has a succession of modified RFID tags disposed on the carrier layer. The modified RFID tag web 610 is fed into a separator 290. The separator 290 removes the completed modified RFID tags from the carrier layer 130 so that the completed modified RFID tags may be further processed, such as with the addition of a microprocessor, additional printing and the like. The carrier layer 615 is then wound into a carrier roll 300 by a third rewinder 305.

(49) It is contemplated that the roll-to-roll process depicted in FIG. 3 and the roll-to-roll-process depicted in FIG. 10 may be combined to create another roll-to-roll process of manufacturing modified RFID tags, which is depicted in FIG. 14.

(50) FIG. 15 illustrates a methodology of forming an RFID antenna structure. The methodology begins at 800, where a conductive layer disposed on a carrier layer is provided. The conductive layer can include a metal foil layer (aluminum, copper, various alloys, etc.) partially bonded to a carrier layer by an adhesive layer or a conductive layer may be presented solely by itself. The conductive layer can be bonded to the carrier by an adhesive layer or may simply lie on the carrier. At 805, a die is used to cut a basic antenna structure, one of the standardized templates, through the conductive layer up to the carrier layer. The cutting can be accomplished by a die cutter, laser cutter or cold foil impression process. The basic antenna structure does not include a microprocessor attachment portion. At 810, a laser modifies the basic antenna structure to create a modified antenna structure by ablating the conductive layer up to the carrier layer in the basic antenna structure cut by the die to create a microprocessor attachment portion. The laser attachment portion can include at least two microprocessor contact ends separated by a gap. The methodology concludes at 815, with the attachment of a microprocessor to the microprocessor attachment portion. Alternatively, at step 817, where matrix removal is required, a stripper removes the matrix portion of the reinforced conductive layer from the antenna structure such that only the antenna structure remains on the carrier layer. It should be understood, that no matrix may be removed, or it may only be removed at select potions of the process such as when a rotary die cutter is used and not in other instances for example when a laser cutting device is used. Alternatively, no matrix may be removed from the structure and ablate the surrounding material.

(51) FIG. 16 illustrates an exemplary embodiment for manufacturing a modified RFID tag. The methodology begins at 819 by providing a carrier layer and then at 820 an antenna structure is disposed on a carrier layer. The antenna structure has a microprocessor attachment portion that includes at least two microprocessor contact ends separated by a gap. The finished antenna structure may be created by the methodology described in detail above illustrated in FIG. 15, or by any suitable method that creates a gap that is narrow enough to allow a microprocessor to bridge the gap without the use of contact extensions. At 825, a microprocessor is secured to the antenna structure to create a direct electrical connection between the antenna structure and the microprocessor, thereby creating an RFID device such as an RFID tag. The microprocessor extends over the gap and while being secured to both of the at least two contact ends. At 830, a laser ablates select portions of the antenna structure to modify the shape of the RFID antenna to create a modified RFID tag. The methodology concludes at 835, where the modified RFID tag is removed from the carrier layer to allow for further processing.

(52) Reference is now directed to FIG. 17 in which a side elevation of a conductive laminate for use in a RFID tag is shown generally by reference to numeral 401. The laminate 401 includes a microprocessor 450, first antenna pattern 410, a second antenna pattern 420 and a third antenna pattern 430 each of which is disposed on a carrier layer 440. The first 410 and second 420 antenna patterns are in cooperative association with one another. The antenna patterns are created for example by laser cutting such that no visible marks may be made on the surface of the carrier layer of substrate. The antenna patterns are generally distinguishable from one another, may cooperate with one another or may be partially coincident with one another. The third antenna pattern is in cooperative association with the first and second antenna patterns, or alternatively, the third pattern can be unrelated to the form and function of the antenna and may instead provide other forms of identification such as a logo, name or the like.

(53) In another embodiment of the present invention, a pattern for a strap attachment mechanism rather than for a chip attachment for an RFID device may be patterned in the conductive layer using one or more of the methods described herein.

(54) It will thus be seen that a novel method for manufacturing radio frequency identification tags in a continuous and efficient manner using a combination of die cutting and laser cutting that allows for the placement of a microprocessor directly onto a radio frequency identification antenna has been disclosed. While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it will be apparent to those of ordinary skill in the art that the invention is not to be limited to the disclosed embodiment, and that many modifications and equivalent arrangements may be made thereof within the scope of the invention, which scope is to be accorded the broadest interpretation of the appended claims so as to encompass all equivalent structures and products.