Physically non-stick structure and cooking utensil

Abstract

The present application discloses a physically non-stick structure and a cooking utensil applied on a surface of a metal substrate, the physically non-stick structure includes a concave structure and a convex structure on at least a part of an area of the concave structure, at least a part of a surface of the concave structure and/or at least a part of a surface of the convex structure are provided with a physical vapor deposition layer, and a morphology of a surface of the physical vapor deposition layer is similar to a morphology of the surface of the concave structure and/or the surface of the convex structure covered by the physical vapor deposition layer.

Claims

1. A physically non-stick structure configured for being applied to a surface of a metal substrate, comprising a concave structure and a convex structure in at least a part of an area of the concave structure, wherein at least one of at least a part of a surface of the concave structure or at least part of a surface of the convex structure is provided with a physical vapor deposition layer, and a morphology of a surface of the physical vapor deposition layer is the same as at least one of a morphology of the surface of the concave structure or a morphology of the surface of the convex structure covered by the physical vapor deposition layer, wherein the convex structure comprises a plurality of protrusions at least on the part of the surface of the concave structure, and a height of each of the plurality of protrusions is 0.1-0.3 micrometers.

2. The physically non-stick structure according to claim 1, wherein the concave structure and the convex structure are integrated with the metal substrate, and the physical vapor deposition layer directly contacts at least one of the concave structure or the convex structure.

3. The physically non-stick structure according to claim 1, wherein the concave structure comprises a plurality of recesses, and each of the plurality of recesses has a depth of 45-85 micrometers.

4. The physically non-stick structure according to claim 3, wherein the concave structure is formed by the plurality of recesses arranged in an orthogonal array, and each of the plurality of recesses has a diameter of 0.3-0.55 millimeters, a depth of 55-75 micrometers, and a hole center distance of 0.6-0.8 millimeters.

5. The physically non-stick structure according to claim 1, wherein a thickness of the physical vapor deposition layer is 0.8-1.45 micrometers.

6. A cooking utensil, comprising the physically non-stick structure according to claim 1, wherein the physically non-stick structure is at least provided on a part of an area at a bottom of an inner surface of the cooking utensil.

7. The cooking utensil according to claim 6, wherein the physically non-stick structure is provided in a defined area of the inner surface of the cooking utensil, and the concave structure and the convex structure are provided outside of the defined area of the inner surface of the cooking utensil.

8. The cooking utensil according to claim 6, wherein the physically non-stick structure is at least provided in a part of an area of an outer surface of the cooking utensil.

9. The cooking utensil according to claim 8, wherein the physically non-stick structure is provided in the area of the outer surface of the cooking utensil away from a bottom of the cooking utensil, or the convex structure and the convex structure are integrally provided in the area of the outer surface of the cooking utensil away from the bottom of the cooking utensil.

10. A physically non-stick structure configured for being applied to a surface of a metal substrate, comprising a concave structure and a convex structure in at least a part of an area of the concave structure, wherein at least one of at least a part of a surface of the concave structure or at least part of a surface of the convex structure is provided with a physical vapor deposition layer, and a morphology of a surface of the physical vapor deposition layer is the same as at least one of a morphology of the surface of the concave structure or a morphology of the surface of the convex structure covered by the physical vapor deposition layer, wherein the concave structure comprises a plurality of recesses, and each of the plurality of recesses has a depth of 45-85 micrometers, wherein the concave structure is formed by the plurality of recesses arranged in an orthogonal array, and each of the plurality of recesses has a diameter of 0.3-0.55 millimeters, a depth of 55-75 micrometers, and a hole center distance of 0.6-0.8 millimeters.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic view of a metal substrate with the physically non-stick structure according to Embodiment 1 of the present application;

(2) FIG. 2 is an enlarged diagram of portion A in FIG. 1;

(3) FIG. 3 is a cross sectional view of B-B in FIG. 2;

(4) FIG. 4 is an enlarged diagram of portion C in FIG. 3;

(5) FIG. 5 is an enlarged diagram of portion D in FIG. 4;

(6) FIG. 6 is an enlarged diagram of portion E in FIG. 5 after rotation;

(7) FIG. 7 is a schematic view of the physically non-stick structure according to Embodiment 2 of the present application;

(8) FIG. 8 is a schematic view of a cooking utensil according to Embodiment 1 of the present application;

(9) FIG. 9 is a schematic view of the cooking utensil according to Embodiment 2 of the present application.

DETAILED DESCRIPTION

(10) In order to make the purpose, the solutions and the advantages of the Embodiments in the present application clearer, the present application is further described in detail below in combination with the drawings. The component of the Embodiments in the present application generally described and illustrated in the figures herein can be arranged or designed in various different configurations. Based on the Embodiments in the present application, all other embodiments obtained from the skilled in the art without creative work all fall in the protection scope of the present application.

(11) It should be noted that, similar signals and similar letters are represented as similar items in the figures, therefore, once one item is defined in a figure, which is not required to be further defined or explained in the following figures.

(12) In the description of the present application, it should be understood that, the terms of installation, coupling and connection should be broadly understood unless there are other concrete specifications and limitations, for example, which can be a fixed connection, a detachable connection or an integrated connection; can be a mechanical connection, can be an electric connection; and can be a direct connection, can be connected by an intermediate means, and can be an inner connection between two elements. For the skilled in the art, the specific meaning of the above terms in the present application can be understood based on the actual situation.

(13) In the present description, it should be understood that, the terms of up, down, left, right and so on related to the orientation or location relationship are illustrated based on the orientation or location relationship illustrated in the figures, which is only for convenient describing of the present application and for simplifying the description, rather than to indicate or hint that the devices or the elements must have the specific location and are configured or operated in a specific location, which shall not be understood as a limitation of the present application.

(14) Some embodiments of the present application is further described in detail below in combination with the drawings. The features in the following Embodiments can be combined with each other without conflict.

(15) The cooking utensils of the present application include catering utensils and utensils for preparing dishes.

Embodiment 1

(16) A schematic structure of a physically non-stick structure 2 of an embodiment is shown in FIGS. 1-6. The physically non-stick structure 2 is provided on a surface of a metal substrate 1, and the physically non-stick structure 2 includes a concave structure and a convex structure 3 in at least a part of the area of the concave structure, wherein at least a part of the surface of the concave structure and/or at least a part of the surface of the convex structure 3 is provided with a physical vapor deposition layer 4, and a morphology of a surface of the physical vapor deposition layer 4 is similar to a morphology of the surface of the concave structure and/or of the convex structure 3 covered by the physical vapor deposition layer.

(17) Referring to FIG. 1, the physically non-stick structure 2 of the present embodiment is integrally processed on the defined area of the surface of the metal substrate 1 by processes such as etching and so on, wherein the physically non-stick structure 2 of the present embodiment is processed on the surface of the metal substrate 1 by chemical etching and physical etching.

(18) Referring to FIG. 2, the physically non-stick structure 2 includes a concave structure, in which the concave structure is formed by a plurality of recesses 21 arranged in an orthogonal array. The cross section of the recess 21 of the present embodiment is a circle, which can be a polygon such as a hexagon or a quadrilateral according to production requirements. The diameter of the recess 21 is 0.3-0.55 millimeters, and preferably 0.4-0.45 millimeters. The hole-center distance a of the adjacent recesses 21 is between 0.6 to 0.8 millimeters, and preferably 0.6 millimeters. If the recess 21 is shaped as a polygon, the polygons are evenly distributed, and the diameter of the inscribed circle of the polygon is 0.3-0.55 millimeters, and preferably 0.4-0.45 millimeters.

(19) Referring to FIG. 3, the recesses 21 are processed by chemical etching on the surface of the metal substrate 1, the hole depth b of the recess 21 is 45-85 micrometers, and preferably is 55-75 micrometers.

(20) Referring to FIG. 4, the convex structure 3 is processed on the surface of the concave structure by etching, the etching for the convex structure 3 of the present embodiment is physical etching.

(21) Referring to FIG. 5, the convex structure 3 includes a plurality of protrusions 31 at least on at least a part of the surface of the concave structure, in which the height of the protrusion 31 is 0.1-0.3 micrometers. This figure only illustrates the structure of the protrusion 31. When the surface of the concave structure is etched with a plasma source, the shape of the protrusion 31 is irregular, but the height range of each of the protrusions 31 should be controlled in 0.1-0.3 micrometers.

(22) Referring to FIG. 6, the surface of at least a part of the concave structure and/or the convex structure 3 is provided with the physical vapor deposition layer 4. It can be realized by setting and controlling the parameters of the PVD coating process that the morphology of the surface of the physical vapor deposition layer 4 is similar to the morphology of the surface of the concave structure and/or of the convex structure 3 covered by the physical vapor deposition layer, so as to realize the non-stick effect of the surface of the metal substrate 1. The physical vapor deposition layer 4 directly contacts the concave structure and/or the convex structure 3, in which the thickness of the physical vapor deposition layer 4 is 0.8-1.45 micrometers. The conventional PVD layer cannot directly contact the metal substrate 1 for bonding, by which a transition layer must be provided between the PVD layer and the metal substrate 1, such as in the patent application serial no. CN202121169683.5 and CN202222426611.5 the solution with a transition layer is adopted to realize the bonding. The transition layer can not only have better adhesion to the layer, but also have better adhesion to the metal substrate 1, thereby ensuring good adhesion between the PVD layer and the metal substrate 1, such that it is difficult to fall off. The physically non-stick structure 2 in the present application possesses a new structure through theory analysis and a long-term experience and test, wherein the related structure is directly processed on the surface of the metal substrate 1, which can realize a good adhesion between the PVD layer and the metal substrate 1, improve the non-stick performance of the surface of the metal substrate 1, and have a wear-resistant performance, thereby ensuring the wear-resistant and non-stick performance of the surface of the metal substrate 1 for a long time. The present metal substrate 1 is a metal material such as a carbon steel, an alloy steel, a stainless steel, a titanium alloy and so on.

(23) A part of the concave structure is provided with the convex structure 3, and the surface of a part of the convex structure 3, or the surface of a part of the concave structure, or the surface of a part of the concave structure and of a part of the convex structure 3 is coated with the physical vapor deposition layer 4, by which a plurality of combined structures can be realized on surface of the metal substrate 1, thereby realizing different surface effects according to different using demands, or realizing different surface effects on the surface of the metal substrate in different areas.

(24) Performance Comparison Test of Different Parameters:

(25) TABLE-US-00001 Serial Parameter/ Surface Non-stick effect Number Performance adhesion hardness by frying egg 1 The thickness of level 3 600-800HV level III the physical vapor deposition layer is less than 0.8 m, and the depth of PVD etching is less than 0.1 m 2 The thickness of above level 2 300-800HV level III the physical vapor deposition layer is less than 0.8 m, and the depth of PVD etching is greater than 0.3 m 3 The thickness of level 3 1500- level III the physical 2000HV vapor deposition layer is greater than 1.45 m, and the depth of PVD etching is less than 0.1 m 4 The thickness of above level 2 1500- level III the physical 2000HV vapor deposition layer is greater than 1.45 m, and the depth of PVD etching is greater than 0.3 m 5 The thickness of above level 2 1500- level II the physical 2000HV vapor deposition layer is 0.8 m, and the depth of PVD etching is 0.1-0.3 m 6 The thickness of above level 2 1500- level II the physical 2000HV vapor deposition layer is 0.95 m, and the depth of PVD etching is 0.1-0.3 m 7 The thickness of above level 2 1500- level II the physical 2000HV vapor deposition layer is 1.1 m, and the depth of PVD etching is 0.1-0.3 m 8 The thickness of above level 2 1500- level II the physical 2000HV vapor deposition layer is 1.45 m, and the depth of PVD etching is 0.1-0.3 m

(26) It can be seen from the performance comparison test that the comprehensive performance is optimal by the thickness of the physical vapor deposition layer in the range of 0.8-1.45 m and the depth of PVD etching in the range of 0.1-0.3 m of items 5-8, and the cost of these parameter ranges is also the most reasonable.

(27) When the thickness of the physical vapor deposition layer is less than 0.8 m and the depth of PVD etching is less than 0.1 m, the layer adhesion is poor and only reaches level 3, therefore, it is easy to fall off; the hardness of 600-800 HV is insufficient, therefore, the wear-resistant performance is poor; and the non-stick effect by frying egg is at level III and is poor.

(28) When the thickness of the physical vapor deposition layer is less than 0.8 m, and the depth of PVD etching is greater than 0.3 m, the hardness of the layer is 300-800 HV, and is insufficient, the wear-resistant performance is poor; and the non-stick effect by frying egg is at level III and is poor.

(29) When the thickness of the physical vapor deposition layer is greater than 1.45 m, and the depth of PVD etching is less than 0.1 m, the layer adhesion is very poor and only reaches level 3, it is easy to fall off; although the hardness of 1500-200 HV can meet the requirement, but this way wastes raw material and increases costs, and the non-stick effect by frying egg is at level III and is poor.

(30) When the thickness of the physical vapor deposition layer is greater than 1.45 m, and the depth of PVD etching is greater than 0.3 m, the adhesion can be above level 2 and the hardness of 1500-200 HV can meet the requirements, but this way wastes raw material and increases costs, and the non-stick effect by frying egg is at level III grade and is poor.

(31) When the thickness of the physical vapor deposition layer is in the range of 0.8-1.45 m, and the depth of PVD etching is in the range of 0.1-0.3 m, the adhesion can reach level 2, the hardness in 1500-2000 HV, the non-stick effect by frying egg is at level II, which is the most cost-effective.

Embodiment 2

(32) FIG. 7 schematically shows the structure of the physically non-stick structure 2 of the second embodiment. The physically non-stick structure 2 includes a shot-peened layer 22 on a surface of the metal substrate 1, a physical vapor deposition layer 4 is provided on the surface of the shot-peened layer 22, the recesses 21 on the surface of the metal substrate 1 are processed by shot peening process, and the morphology of the surface of the physical vapor deposition layer 4 is similar to the morphology of the surface of the shot-peened layer 22 covered by the physical vapor deposition layer.

(33) The physically non-stick structure 2 of the present embodiment is integrally formed on the defined area of the surface of the metal substrate 1 through the processes such as shot peening process, or rolling and so on, and then is plated with PVD layer.

(34) The shot-peened layer 22 is a concave-convex structure processed on the surface of the metal substrate 1 through the shot peening process, the shot-peened layer 22 is formed by a plurality of recesses 21 arranged in a regular or irregular manner, wherein the cross section of the recess 21 in the present embodiment is a circle. The diameter of the recess 21 is 0.3-0.95 millimeters, and preferably is 0.4-0.65 millimeters. The recess 21 is a spherical recess 21 by spraying the steel shots of 0.6-1 millimeters to the surface of the metal substrate 1 under the pressure of 2 Mpa-8 Mpa, and the above-mentioned diameter of the recess 21 is a spherical diameter. The recess can be processed into a circle, an ellipse or a polygon, such as a hexagon or a quadrilateral according to the design requirements via the processes such as rolling and so on. The range of the hole center distance a of adjacent recesses 21 lies in 0.3-0.8 millimeters, and preferably is 0.6 millimeters, wherein the range of the hole center distance a herein is the distance between the spherical centers of adjacent recesses 21. If the recess 21 is shaped as a polygon, the polygon can be evenly distributed by rolling or distributed in an irregular manner according to the design requirements, the diameter of the inscribed circle of the polygon is 0.3-0.95 millimeters, and preferably is 0.4-0.65 millimeters.

(35) The shot-peened layer 22 is a surface, which is formed by connecting the protrusions 31 between a recess 21 and other recesses 21, the recesses are formed by shot peening processing the inner surface of the body after the body is formed. The depth b of the recess is 45-85 micrometers, and preferably is 55-75 micrometers. The shot-peened layer 22 is integrally formed with the metal substrate 1, and the physical vapor deposition layer 4 directly contacts the shot-peened layer 22.

(36) The surface of at least a part of the shot-peened layer 22 is provided with the physical vapor deposition layer 4, the thickness of the layer can be controlled by setting the parameters of the PVD coating technology, such that the morphology of the surface of the physical vapor deposition layer 4 is similar to the morphology of the surface of the shot-peened layer 22 covered by it, so as to reach the non-stick effect of the surface of the metal substrate 1. The physical vapor deposition layer 4 directly contacts the shot-peened layer 22, wherein the thickness of the physical vapor deposition layer 4 is 0.8-1.45 micrometers. The conventional PVD layer cannot directly contact the metal substrate 1 for bonding, by which a transition layer must be provided between the PVD layer and the metal substrate 1, such as in the patent application serial no. CN202121169683.5 and CN202222426611.5 the solution with a transition layer is adopted to realize a bonding. The transition layer can not only have better adhesion to the layer, but also have better adhesion to the metal substrate 1, thereby ensuring good adhesion between the PVD layer and the metal substrate 1, such that it is difficult to fall off. The physically non-stick structure in the present application possesses a new structure through theory analysis and the long-term experience and test, wherein the corresponding convex-concave structure is directly processed on the surface of the metal substrate 1 through a shot peening process, which can realize a good adhesion between the PVD layer and the metal substrate 1, improve the non-stick performance of the surface of the metal substrate 1, and have a wear-resistant performance, thereby ensuring the wear-resistant and non-stick performance of the surface of the metal substrate 1 for a long time. The metal substrate 1 is made of a metal material such as a carbon steel, an alloy steel, a stainless steel, a titanium alloy and so on.

Embodiment 3

(37) Referring to FIG. 7, this embodiment differs from Embodiment 2 in that an electrolytic layer or a plasma-polished layer is additionally provided between the shot-peened layer 22 and the physical vapor deposition layer 4. The surface of a part of the shot-peened layer 22 is provided with the electrolytic layer or the plasma-polished layer, and the surface of a part of the electrolytic layer or the plasma-polished layer, or the surface of a part of the shot-peened layer 22, or the surface of a part of the shot-peened layer 22 and a part of the electrolytic layer or the plasma-polished layer is plated with the physical vapor deposition layer 4, wherein a plurality of combined structures can be formed on the surface of the metal substrate 1, realizing different surface effects according to different using demands, or realizing different surface effects on the surface of the metal substrate 1 in different areas.

(38) Referring to FIG. 6, this embodiment differs from Embodiment 1 in that the convex structure 3 is processed on the surface of the shot-peened layer 22 by electrolytic process or plasma polishing process, wherein the convex structure 3 is formed by the electrolytic process in the present embodiment.

(39) Referring to FIG. 5, this embodiment differs from Embodiment 1 in that the convex structure 3 includes a plurality of protrusions 31 at least provided on at least a part of the surface of the shot-peened layer 22, wherein the height of the protrusion 31 is 45-85 micrometers, and the electrolytic layer is a surface formed by connecting a protrusion 31 and other protrusions 31. This figure only illustrates the structure of the protrusions 31. When the surface of the shot-peened layer 22 is processed via an electrolytic process or a plasma polishing process, the shape of the protrusion 31 is irregular, but the height range of each of the protrusions 31 must be controlled in 45-85 micrometers.

Embodiment 4

(40) Referring to FIG. 8, the present Embodiment discloses a cooking utensil, and particularly a frying pan. The frying pan includes a pan body 5 and a handle 6, and a bottom area 511 of the inner surface 51 of the pan body 5 is provided with the physically non-stick structure 2 of any one of the above Embodiments. In practice, in order to realize a better non-stick performance, all area of the inner surface 51 of the pan body 5 can be provided with the physically non-stick structure 2. The frying pan is taken as an example to illustrate the present embodiment, in practice, the present physically non-stick structure 2 can be applied to any surface of all cooking utensils including catering utensils and utensils for preparing dishes and including but not limited to the containers of cooking utensils (the cup body of a soybean milk machine; or the inner container of an electric cooker, of a pressure cooker, of an electric chafing dish; or an oven body), the body of a juicer, a scoop and so on.

Embodiment 5

(41) Referring to FIG. 9, this embodiment differs from Embodiment 4 in that the outer surface 52 of the pan body 5 of the present embodiment is also provided with the physically non-stick structure 2, and the physically non-stick structure 2 is provided at the pan mouth away from the pan bottom. In practice, in order to realize a good non-stick performance of the outer surface 52, all area of the outer surface 52 can be provided with the physically non-stick structure 2. Or the concave structure and the convex structure 3 can be integrally formed in the area of the pan mouth 521 of the outer surface 52 of the pan body 5 away from the pan bottom.

Embodiment 6

(42) Referring to FIGS. 1-7, the present embodiment further discloses a processing method for physically non-stick structure, which is configured for processing the physically non-stick structure 2 in Embodiment 1, Embodiment 2 or Embodiment 3 on the surface of a metal substrate 1. The processing method includes: Shaping: processing the metal substrate 1 into a predetermined shape with a predetermined size; Shot peening: shot peening the metal substrate 1 after cutting or the shaped product; spraying the steel shots of 0.6-1 millimeters under the pressure of 2 Mpa-8 Mpa for 3 second-5 minutes onto the surface of the metal substrate 1 or the surface of the shaped product, to form a shot-peened layer 22 with spherical recesses 21; and Coating: heating the metal substrate 1 after shot peening or the shaped product up to 200 C.-500 C., positioning it in a vacuum environment, and carrying out PVD coating on the inner surface.

Embodiment 7

(43) Referring to FIGS. 8-9, the present embodiment discloses a processing method for cooking utensil, which is adaptive for the cooking utensils in Embodiment 4 or Embodiment 5, and the processing method includes: shaping: processing the metal substrate 1 into a frying pan body 5; Shot peening: shot peening the inner surface 51 of the frying pan body 5; spraying the steel shots of 0.6-1 millimeter under the pressure of 2 Mpa-8 Mpa for 3 seconds-5 minutes onto the inner surface 51 of the frying pan body 5, to form a shot-peened layer 22 with spherical recesses 21; Electrolyzing: electrolyzing the surface of the shot-peened layer 22, to form an electrolytic layer; and Coating: heating the electrolyzed frying pan body 5 up to 200 C.-500 C., positioning it in the vacuum environment, and carrying out PVD coating on the inner surface 51 of frying pan body.

(44) The above are the basic principle, the main features and advantages of the present application. It should be understood by those skilled in the art that the present application is not limited by the above-mentioned embodiments, what is described in the above-mentioned embodiments and specifications only illustrates the principles of the present application. Without departing from the spirit and scope of the present application, there will be many changes, modifications, substitutions and variants of the present application, which fall within the scope of the claimed invention.

LIST OF REFERENCE SIGNS

(45) 1 metal substrate 2 physically non-stick structure 21 recess 22 shot-peened layer 3 convex structure 31 protrusion 4 physical vapor deposition layer 5 pan body 51 inner surface 511 bottom area 52 outer surface 521 area of pan mouth 6 handle a hole center distance b hole depth c height of protrusion