Apparatus and method for developing freeze drying protocols using small batches of product

Abstract

A method of monitoring and controlling a freeze drying process in a freeze drying apparatus having walls, shelves and a number of vials or trays positioned on different areas of the shelves and containing product to be freeze dried. One or more vials or trays are selected that are representative of the positions of all of the vials or trays in different areas of the shelves. One or more heat flux sensors are positioned between the selected vials or trays and adjacent portions of the walls and/or shelves. The heat transfer between the selected vials or trays and the adjacent wall or shelf portions is measured during the freezing and drying stages of the freeze drying process.

Claims

1. A method of monitoring and controlling a freeze drying process in a freeze drying apparatus having walls, one or more shelves and one or more vials or trays positioned on different areas of the shelves and containing a product to be freeze dried, comprising: selecting one or more vials or trays that are representative of the positions of all of the vials or trays in different areas of the shelves, positioning one or more heat flux sensors between the selected vials or trays and adjacent portions of the walls and/or the shelves, taking measurements of heat flow between the selected vials or trays and the adjacent portions of the walls and/or the shelves during at least a part of the freeze drying process, and using information provided by the measurements of heat flow to determine one or more critical parameters, the one or more critical parameters consisting of a Vial Heat Transfer Coefficient (Kv), Mass Flow (dm/dt), and/or Product Resistance (Rp), wherein the method further comprises adjusting the Vial Heat Transfer Coefficient (Kv) of the freeze drying apparatus to stimulate a Vial Heat Transfer Coefficient (Kv) of a large freeze dryer by adjusting the temperature of a thermal conductor connected to the walls and/or the shelves.

2. The method of claim 1, wherein the one or more heat flux sensors are mounted on or embedded inside the adjacent portions of the walls and/or the shelves.

3. The method of claim 1, wherein the Vial Heat Transfer Coefficient (Kv) is determined by the following formula: $\frac{\mathrm{dq}}{\mathrm{dt}}=K_v{A}_v\left(T_s-T_b\right)\text{=>}{K}_v=\frac{\frac{\mathrm{dq}}{\mathrm{dt}}}{A_v\left(T_s-T_b\right)}$ $\mathrm{Where}:\frac{\mathrm{dq}}{\mathrm{dt}}=\mathrm{Heat}\mathrm{transfer}\mathrm{measured}\mathrm{from}\mathrm{heat}\mathrm{flux}\mathrm{sensor}{K}_v=\mathrm{Vial}\mathrm{heat}\mathrm{transfer}\mathrm{coefficient}\mathrm{to}\mathrm{be}\mathrm{calculated}{A}_v=\mathrm{Outer}\mathrm{cross}\mathrm{section}\mathrm{area}\mathrm{of}\mathrm{vial}{T}_s=\mathrm{Shelf}\mathrm{surface}\mathrm{temperature}\mathrm{from}\mathrm{measurement}{T}_b=\mathrm{Product}\mathrm{temperature}\mathrm{at}\mathrm{the}\mathrm{bottom}\mathrm{center}\mathrm{of}a\mathrm{vial}.$

4. The method of claim 1, further comprising calculating a product temperature at the bottom of the vials or trays based on the determined Vial Heat Transfer Coefficient (Kv).

5. The method of claim 1, wherein the Mass Flow (dm/dt) is determined by the following formula: $\frac{\mathrm{dq}}{\mathrm{dt}}=\Delta H_s\frac{\mathrm{dm}}{\mathrm{dt}}\text{=>}\frac{\mathrm{dm}}{\mathrm{dt}}=\frac{\frac{\mathrm{dq}}{\mathrm{dt}}}{\Delta H_s}\mathrm{Where}:\frac{\mathrm{dq}}{\mathrm{dt}}=\mathrm{Heat}\mathrm{transfer}\mathrm{measured}\mathrm{from}\mathrm{heat}\mathrm{flux}\mathrm{sensor},\Delta H_s=\mathrm{Heat}\mathrm{of}\mathrm{sublimination}\mathrm{of}\mathrm{ice},\mathrm{and}\frac{\mathrm{dm}}{\mathrm{dt}}=\mathrm{Mass}\mathrm{transfer}\mathrm{rate}\mathrm{to}\mathrm{be}\mathrm{calculated}.$

6. The method of claim 1, wherein the Product Resistance (Rp) is determined by the following formula: $\frac{\mathrm{dm}}{\mathrm{dt}}=\frac{A_p\left(P_i-P_c\right)}{R_p}\text{=>}{R}_p=\frac{A_p\left(P_i-P_c\right)}{\frac{\mathrm{dm}}{\mathrm{dt}}}$ Wherein a vapor pressure of ice Pi is calculated by a vapor Pressure over ice equation: $P_i=6.112e^{\left(\frac{22.46T_b}{272.62+T_b}\right)}$ $\mathrm{Where}:$ $\frac{\mathrm{dm}}{\mathrm{dt}}=a\mathrm{mass}\mathrm{transfer}\mathrm{rate}\mathrm{to}\mathrm{be}\mathrm{calculated}$ $A_p=\mathrm{an}\mathrm{inner}\mathrm{cross}\mathrm{section}\mathrm{area}\mathrm{of}\mathrm{vial}$ $P_i=\mathrm{the}\mathrm{vapor}\mathrm{pressure}\mathrm{of}\mathrm{ice}\mathrm{calculated}\mathrm{from}\mathrm{ice}\mathrm{temperature}{T}_b{P}_c=a\mathrm{chamber}\mathrm{pressure}{R}_p=a\mathrm{resistance}\mathrm{of}a\mathrm{dried}\mathrm{product}\mathrm{layer}\mathrm{to}\mathrm{be}\mathrm{calculated}{T}_b=a\mathrm{product}\mathrm{temperature}\mathrm{at}\mathrm{the}\mathrm{bottom}\mathrm{center}\mathrm{of}a\mathrm{vial}.$

7. The method of claim 1, further comprising: using data provided by the measurements of heat flow and/or the determined one or more critical parameters to develop a freezing and/or drying protocol transferrable from the freeze drying apparatus to another freeze drying apparatus.

8. The method of claim 7, wherein the freeze drying apparatus is a lab freeze dryer, and said another freeze drying apparatus is a production freeze dryer.

9. The method of claim 1, further comprising simulating an operation of a production freeze dryer based on data provided by the measurements of heat flow and/or the determined one or more critical parameters, wherein the freeze drying apparatus is a lab freeze dryer.

10. The method of claim 1, further comprising adjusting the Vial Heat Transfer Coefficient (Kv) of the freeze drying apparatus to simulate the Vial Heat Transfer Coefficient (Kv) of the large freeze dryer by adjusting a shelf temperature of the freeze drying apparatus.

11. The method of claim 1, wherein the measurements of heat flow are taken between the selected vials or trays and the adjacent portions of the walls and/or the shelves during the entire freeze drying process.

12. The method of claim 1, wherein the measurements of heat flow are taken between the selected vials or trays and the adjacent portions of the walls and/or the shelves during a freezing stage of the freeze drying process.

13. The method of claim 12, further comprising using information provided by the measurements of heat flow to determine the end of the freezing stage.

14. The method of claim 12, further comprising controlling nucleation by controlling the heat flow between the selected vials or trays and the adjacent portions of the walls and/or the shelves during the freezing stage to produce a consistent crystal structure across an entire batch of vials or trays and/or inside each of the vials or trays.

15. The method of claim 12, further comprising controlling the heat flow between the selected vials or trays and the adjacent portions of the walls and/or the shelves during the freezing stage.

16. The method of claim 1, wherein the measurements of heat flow are taken between the selected vials or trays and the adjacent portions of the walls and/or the shelves during a primary drying stage of the freeze drying process.

17. The method of claim 16, further comprising using information provided by the measurements of heat flow to determine the end of the primary drying stage.

18. The method of claim 16, further comprising monitoring the primary drying stage based on information provided by the measurements of heat flow to ensure a primary drying process to be completed properly and consistently.

19. The method of claim 16, further comprising using information provided by the measurements of heat flow to control a shelf temperature to maintain a product temperature to a predetermined level or as close as possible to its critical temperature during the primary drying stage.

20. The method of claim 16, further comprising using information provided by the measurements of heat flow to define and plot a cycle optimization design space, wherein, based on the cycle optimization design space, an optimum shelf temperature and/or an optimum chamber pressure is selected for use in a laboratory or production freeze drying apparatus.

21. The method of claim 1, wherein the measurements of heat flow are taken between the selected vials or trays and the adjacent portions of the walls and/or the shelves during a secondary drying stage of the freeze drying process.

22. The method of claim 21, further comprising using information provided by the measurements of heat flow to determine the end of the secondary drying stage.

23. The method of claim 21, further comprising using information provided by the measurements of heat flow to monitor and/or control the secondary drying stage.

24. A method of monitoring and controlling a freeze process in a freeze drying apparatus having walls, one or more shelves and one or more vials or trays positioned on different areas of the shelves and containing a product to be freeze dried, comprising: selecting one or more vials or trays that are representative of the positions of all of the vials or trays in different areas of the shelves, positioning one or more heat flux sensors between the selected vials or trays and adjacent positions of the walls and/or the shelves, and taking measurements of heat flow between the selected vials or trays and the adjacent positions of the walls and/or the shelves during at least a part of the freeze drying process, wherein the one or more heat flux sensors are mounted on top or bottom surfaces of the adjacent portions of the shelves, and one or more stainless foils are positioned between the one or more heat flux sensors and the vials or trays.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Further features and advantages of the present device, as well as the structure and operation of various embodiments of the present device, will become apparent and more readily appreciated from the following description of the preferred embodiments, taken in conjunction with the accompanying drawings of which:

(2) FIG. 1 is a schematic top plan view of a number of vials in a tray indicating those that are “edge vials” and those that are “center vials”;

(3) FIG. 2 is a top plan view of a 19 vial nest of vials with indications of center and edge vials;

(4) FIG. 3 is a side elevational view representative of the temperature profile inside a vial undergoing sublimation;

(5) FIG. 4 is a graph showing the temperature profile comparison between a development freeze dryer and a larger batch target or laboratory freeze dryer to demonstrate the ability to simulate the target freeze dryer;

(6) FIG. 5 is side elevational view showing the concept of the apparatus in a Development Freeze Dryer (“DFD”) according to one embodiment;

(7) FIG. 6 is a top plan view of a vial nest in a Development Freeze Dryer (“DFD”) according to one embodiment;

(8) FIG. 7 is a model of one possible configuration inside a freeze dryer where thermal conductors are located in slots in a thermal emulator ring;

(9) FIG. 8 is an example thermal emulator mounted inside a development freeze dryer chamber;

(10) FIG. 9 is a schematic diagram of a small freeze dryer that includes a thermal emulator assembly placed in a small chamber, an isolation valve or proportional valve between the product chamber and condenser for simulating pressure drops between the chambers, an external condenser that can be used for controlled nucleation seed generation including a valve and filter, a capacitance manometer is located on both the product chamber and condenser and a pirani is located on the product chamber for performing end of drying determination and other process control situations;

(11) FIG. 10 is a schematic side elevational view of a thermal emulator assembly placed inside a freeze dryer;

(12) FIG. 11 is a schematic top plan view of a thermal emulator assembly placed on a shelf in a larger freeze dryer;

(13) FIG. 12 is a schematic top plan view of a portion of a thermal emulator with flexible membranes for improving thermal contact with adjacent vials;

(14) FIGS. 13 and 14 are examples of thermal emulators that may be placed in any freeze dryer to eliminate the edge vial effect;

(15) FIG. 15 is a perspective view of a circular fluid filled vessel around a 19 vial nest;

(16) FIG. 16 is a perspective view of a hexagonal fluid filled vessel around a 19 vial nest;

(17) FIG. 17 is a block diagram describing how various parameters can be calculated, using the present inventive concept;

(18) FIG. 18 is an elevational view of a portion of a shelf in a first embodiment of a freeze drying apparatus having one or more product vials mounted thereon with a heat flux sensor mounted on the top surface of the shelf beneath the vials;

(19) FIG. 19 is an elevational view of a portion of a shelf in a second embodiment of a freeze drying apparatus having a heat flux sensor embedded in the shelf beneath one or more product vials mounted on the shelf; and

(20) FIG. 20 is an elevational view of a portion of a third embodiment of a freeze drying apparatus wherein one or more heat flux sensors are mounted on walls or shelves that are in contact with or adjacent to bulk product to be freeze dried in the apparatus.

DETAILED DESCRIPTION OF THE TECHNOLOGY

(21) This description of the exemplary embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description. In the description, relative terms such as “lower,” “upper,” “horizontal,” “vertical,” “above,” “below,” “up,” “down,” “top,” and “bottom,” as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description and do not require that the apparatus be constructed or operated in a particular orientation. Terms concerning attachments, coupling and the like, such as “connected,” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or flexible or rigid attachments or relationships, unless expressly described otherwise. ‘Vial’ will refer to any container type, such as vial, syringe, tray, well plate, or any other container used to hold the product. ‘Development’ (or DFD) or ‘Source’ or (SFD) shall refer to the freeze dryer that is being used to analyze, create, simulate a larger batch target freeze dryer for the purpose of producing a protocol that can be transferred. ‘Target’ (or TFD) shall refer to the freeze dryer that will be receiving the transferable protocol. ‘Protocol’ will refer to the recipe, profile, process, or steps that defines the shelf temperature and product chamber pressure or other critical process parameters for a specific order of operations for a freeze drying application. ‘Adjacent vial’ or ‘surrounding vial’ refers to a vial that is close proximity or in contact with another vial. A single vial can have a maximum of 6 adjacent vials or be surrounded by 6 vials. ‘Center vials’ refers to vials that are surrounded by at least two outside rows of vials, 6 in the first outside ring and 12 in the second outside ring. ‘Edge vial’ refers to a vial that is surrounded by less than two outside rows of vials. ‘Edge vial effect’ refers to the difference in freezing and drying conditions for edge vials versus center vials. The ‘Thermal Emulator’ consists of a temperature controlled surface that is in close proximity to the vials, and may or may not include a ‘thermal conductor’ or other heat transfer device, material, or method to aid in conduction from the thermal emulator to the vials. The ‘thermal conductor’ or heat transfer device, material, or method may or may not be integral with the ‘thermal emulator’ and may be in contact or close proximity to the vial. A ‘batch’ refers to the product placed in the freeze dryer and can be one or many vials or containers. A ‘nest’ is a small batch of product, such as a group of 19 vials packed together.

(22) The present technology relates to a design, apparatus, and method to use a small sample of a product, for example 1 to 37 vials, in small Development Freeze Dryers (“DFDs”) to develop freeze drying protocols that enables an optimized protocol to be developed and easy transfer to larger systems. The method and apparatus simulate different heat transfer conditions, such as those of larger freeze dryers or larger batches, also referred to as “Target Freeze Dryers” or “TFDs” while using a minimal amount of product, as few as 1 to 37 vials or product containers in some instances, with the intent to develop transferrable protocols to any sized system or batch. The key to creating these protocols for larger batches when using a small sample of product is simulating the center vial conditions and eliminating the edge vial effect by simulating the heat from different sources that would be expected in the larger batch, such as conduction from the shelf, radiation from the walls and door, and inter-vial or inter-container dynamics.

(23) Most freeze drying experimentation and protocol development is done in 6 to 10 square foot freeze dryers which requires a significant amount of product and time. With new drug costs increasing, a method to reduce the amount of product used and reduce the time of development is needed. As mentioned above, simulating a freeze drying protocol includes three major steps, each having their unique heat transfer characteristics, including; freezing, primary drying (sublimation), and secondary drying (desorption). Each of these steps need to be controllable. Initial attempts at developing a freeze dryer for small batches, for example 1 to 37 vials, included experimentation with temperature controlled walls to reduce the radiation and other heat input, however, testing has shown that the method of a fully decoupled temperature controlled wall does not produce sufficient results to simulate large batches of vials.

(24) While the current concept could be applied to a wide variety of conditions and circumstances, there are two areas of interest for process simulation, which will be discussed in further detail here, namely “center vials” and “edge vials”. (See FIGS. 1, 2). Typically, center vials freeze slower and dry (sublimate and desorb) slower than edge vials. Center vials are each surrounded by at least two outside rows of vials with 6 of those vials being adjacent. Edge vials are typically the outer 2-3 rows of vials on a shelf. An edge vial may have as few as 2 or 3 adjacent vials. Note that the more vials placed on a shelf the smaller the % of edge vials and the larger the % of center vials.

(25) The purpose of the present concept is to enable the development of a robust or optimized protocol using a minimal amount of product by eliminating the edge vial effect and mimicking the performance of the target batch as closely as possible to enable an improved or optimized freeze drying profile to be produced, while collecting critical process information that can be used to aid in the development of the target protocol. A method and apparatus is required that can effectively simulate the heat transfer dynamics of larger batches and collect the critical process information. In an embodiment, a method and apparatus can use a thermal emulator closely coupled to edge vials under test to produce conditions similar to those experienced by center vials in a larger batch or TFD. (See FIGS. 5 and 6)

(26) To produce the center vial conditions, a thermal emulator can be placed in close proximity or against the vials or a thermal conduction contact block can be used to conduct between the vials and the thermal emulator. (See FIGS. 5 and 6) This produces a heat flow path that can be adjusted to simulate the local heat flow of the center vials.

(27) Edge vial conditions can also be simulated by controlling the temperature of the thermal emulator with or without the conduction blocks to simulate the radiation and convection that an edge vial may be exposed to. In addition, a corral or other containment may be added to the vial nest to more accurately simulate local conditions of the edge vials.

(28) In an alternative embodiment, a thermal conductor could be integrated with the thermal emulator as a single entity. The conducting surface can then be made adjustable to make contact with vials located at varying distances from the thermal emulator.

(29) The thermal emulator can be of any design such as coiled tubes, an annular shell or any other design or shape. It may be temperature controlled using a circulating fluid, thermoelectric devices, refrigerant direct expansion or any other cooling/heating method. Similarly, it may be heated using circulating fluid, circulating gas, heat pads, or any other heating method known in the relevant art. Additionally, the surface may be designed to have different radiant properties from fully reflective to a black body.

(30) The thermal conductor can be made from any suitable material, such as borosilicate glass, conductive paste, fluid filled container, metal, ceramic or plastic. It may be designed to provide a snug fit or to have a spring loaded function or other method to ensure good contact or close proximity to the vials. The conductor may be designed to have a close proximity, a single point of contact, multiple points of contact, or intimate contact with the vials and the thermal emulator. Additionally, the surface may be designed to have different radiant properties from fully reflective to a black body.

(31) In addition to controlling the shelf temperature, chamber pressure, and a method to control the wall temperature of the outside vials the DFD can also be supplied with:

(32) Controlled Nucleation—Millrock U.S. Pat. No. 8,875,413

(33) Heat Flux Monitoring and Control—Millrock U.S. Pat. No. 9,121,637

(34) Implementation of the present heat flux measurement method in a freeze drying process control opens a new door to optimization and enables a validation trail of the freeze drying cycle. It is based on continuous real time measurement, as opposed to other techniques which only take occasional batch based average estimates or calculations after the cycle is finished. It works throughout the cycle from freezing to the end of drying. It can be easily transferred from lab scale to production as a true Process Analytical Technology (PAT).

(35) Using heat flux to verify the process in-situ can confirm, for the first time, that the process has performed within acceptable parameters. In addition, feedback can be used to prevent damage to the product in process before it happens, in events such as equipment malfunction.

(36) Heat flux sensing provides information that can identify process changes that could accidently occur, such as a change in vial, formulation changes, freeze drying machine performance and other critical parameters that previously have not been measureable.

(37) During a power loss, the cake structure could be affected. Heat flux sensing could be used to confirm that no negative effects in cake structure have occurred, thus saving a batch product.

(38) Using a surface heat flux sensor has major advantages over all other methods for monitoring and controlling a freeze drying process including:

(39) 1. Can be used for both the freezing and drying portions of the freeze drying process;

(40) 2. Minimally invasive-does not change the heat transfer mechanism;

(41) 3. Real-time, continuous measurement;

(42) 4. Can be installed on all freeze drying equipment from lab to production scale;

(43) 5. Works with both internal and external condenser configurations;

(44) 6. Can be used to determine end of primary drying;

(45) 7. Eliminates the need for multiple product runs at different pressures to determine an acceptable performance envelope;

(46) 8. Acts as a PAT tool and enables real-time monitoring and control of the process, from laboratory to production;

(47) 9. Provides in-situ information for Quality by Design with minimum cycle runs;

(48) 10. It is equipment and container independent allowing seamless cycle transfer;

(49) 11. Is batch size independent, works from a small lot to a full load (MTM and TDLAS require a large batch);

(50) 12. Performs direct measurement and does not rely on estimates in calculations (MTM requires that the volume of the chamber be estimated);

(51) 13. Can identify changes in critical process parameters, i.e., vial construction, formulation, equipment performance, etc.;

(52) 14. Can be used to verify cake integrity post power failure or other equipment or process failure;

(53) 15. Low cost; and/or

(54) 16. Can be easily implemented.

(55) The heat flux sensor can be implemented in various ways. For example, on most laboratory scaled systems the sensor can be mounted on the top surface of the shelf, while on production scale systems it may be embedded inside the shelf. The mounting location is not limited to the shelf for monitoring and control. It may also be mounted on the walls or other surfaces of the freeze drying apparatus that are near the vials or bulk product and may have a significant heat transfer effect on the process.

(56) Any suitable type of heat flux sensor may be used. As an illustrative example, a low thermal capacitance and low thermal impedance heat flux sensor is suitable for this type of application.

(57) As shown in FIG. 18, one or more product vials 10 are mounted on the center or other portions of one or more shelves 12 in a freeze drying apparatus so as to be representative of the product vials (not shown) in other positions on the shelves 12. One or more heat flux sensors 14 are mounted on the upper surface of the shelves 12 and/or adjacent walls (not shown). A stainless metal foil or other layer 16 expediting heat transfer may be positioned between each heat flux sensor 14 and the product vials 10 to insure accurate measurement of the heat loss or gain between the product vials 10 and the shelves 12.

(58) A modified embodiment is shown in FIG. 19 wherein one or more product vials 110 are mounted on the center or other portions of one or more shelves 112 in a freeze drying apparatus and one or more heat flux sensors 114 are embedded inside the shelves 112 and/or adjacent walls (not shown) beneath or adjacent to the product vials 110.

(59) As illustrative examples, the embodiment of FIG. 18 may be used in laboratory scaled systems and the embodiment of FIG. 19 may be used in production scale systems.

(60) A third embodiment is shown in FIG. 20 wherein bulk product P to be freeze dried is placed in a tray or trays 210 mounted on one or more shelves 212 of a freeze drying apparatus having walls or other surfaces 216. One or more heat flux sensors 214 may be mounted on the shelves 212 adjacent to and above or below the bulk product P. One or more heat flux sensors 214 may also be mounted on the walls or other surfaces 216 of the freeze drying apparatus adjacent to bulk product P on the shelves 212. The heat flux sensors 214 are mounted in selected positions on the shelves 212 or walls 216 adjacent to selected bulk product P so as to be representative of all of the bulk product in the freeze drying apparatus. The heat flux sensors 214 may be mounted on or embedded into the shelves 212, walls 216 or other surfaces adjacent to the bulk product P.

(61) In order to create the most consistent crystal structure in the vial and across the batch a common starting point and a method for controlling the rate of crystal growth is required. Controlled nucleation provides a common starting point by nucleating all the vials at the same temperature, rate, and time. Once the vials are nucleated crystal growth begins in the unsaturated solution. By measuring the heat flow during crystal growth the freezing rate can be determined. Combining this information with the latent heat of ice, it is possible to predict the end of latent heat removal and the end of unsaturated solution crystallization if the heat flow can be controlled.

(62) In most freezing profiles the shelf temperature is ramped to a low temperature at a controlled rate, for example to −40° C. at 0.5° C./min. When the heat flow is monitored it is very apparent that the crystal growth changes dramatically during the crystallization process. With feedback from the heat flux sensors the shelf temperature can be controlled to keep the heat flow at a predetermined level throughout the crystal growth phase of freezing. The result is a homogeneous ice crystal structure throughout the vial and throughout the batch. The crystal growth can be controlled at different rates to develop different crystal sizes.

(63) The heat flux sensor provides in-process information for Heat Flow (dq/dt). With this information a series of calculations can be performed to provide critical information for control of the freeze drying process. Three critical parameters can be determined, including the Vial Heat Transfer Coefficient (K.sub.v), Mass Flow (dm/dt), and Product Resistance (R.sub.p). The calculations enable the process parameters to be predicted instead of using the typical ‘after-the-fact’ open-loop control feedback of thermocouples. This makes heat flux based control a true process analytical tool. Once Kv has been determined the product temperature at the bottom of the vial (T.sub.b) can be calculated, thus eliminating the need for a thermocouple for monitoring product temperature

(64) K.sub.v-Vial Heat Transfer Coefficient

(65) Vial heat transfer coefficient K.sub.v, is an important process variable which has a direct impact on product temperature during the drying step. Its value depends on vial physical properties, chamber vacuum level, and shelf surface finish.

(66) One known method to calculate K.sub.v involves multiple sublimation tests which require the operator to perform a short run and then remove the product from the freeze dryer to measure the actual weight loss in a period of time after each test cycle. This process is performed for each different vacuum level to produce a performance curve. This approach is time consuming and error-prone.

(67) Using the present heat flux measurement method, K.sub.v can be determined (calculated) in real time during the cycle without the time and labor intensive sublimation tests. Having in-process knowledge of K.sub.v totally eliminates the process uncertainty caused by heat transfer efficiency differences. One can calculate the product ice temperature based on shelf surface temperature of K.sub.v.

(68) Vial heat transfer coefficient (K.sub.v) and Product Temperature (T.sub.b) are very useful for Quality by Design (QbD). Any changes in vial characteristics and formulation can be identified.

(69) $\frac{\mathrm{dq}}{\mathrm{dt}}=K_v{A}_v\left(T_s-T_b\right)\text{=>}{K}_v=\frac{\frac{\mathrm{dq}}{\mathrm{dt}}}{A_v\left(T_s-T_b\right)}\mathrm{Where}:\frac{\mathrm{dq}}{\mathrm{dt}}=\mathrm{Heat}\mathrm{transfer}\mathrm{measured}\mathrm{from}\mathrm{heat}\mathrm{flux}\mathrm{sensor}{K}_v=\mathrm{Vial}\mathrm{heat}\mathrm{transfer}\mathrm{coefficient}\mathrm{to}\mathrm{be}\mathrm{calculated}{A}_v=\mathrm{Outer}\mathrm{cross}\mathrm{section}\mathrm{area}\mathrm{of}\mathrm{vial}{T}_s=\mathrm{Shelf}\mathrm{surface}\mathrm{temperature}\mathrm{from}\mathrm{measurement}{T}_b=\mathrm{Product}\mathrm{temperature}\mathrm{at}\mathrm{the}\mathrm{bottom}\mathrm{center}\mathrm{of}a\mathrm{vial}$

(70) To calculate the K.sub.v a thermocouple is required to measure T.sub.b. This is required one time only. Once K.sub.v has been determined, the T.sub.b can be calculated and the thermocouple eliminated.

(71) Dm/dt—Mass Flow

(72) Heat Flow measurement enables the control to be load sensitive. Traditional control on fluid inlet temperature has no real measurement of cooling or heating load on the shelf. A change in load results in a different thermal treatment profile on the product. This is a major obstacle for transferring a process to a different piece of equipment or different batch size. Control based on heat flow makes the process fully transferable and scalable to any size of machine and load.

(73) Mass Flow information gives a real time estimate of when the primary drying cycle can be finished. Previously, end of cycle could only be detected when it happened. With heat flow measurement, it is possible to predict the end of a cycle right from the beginning. During the cycle any process parameter change causes a change in mass flow which can be monitored.

(74) Heat Flow and Mass Transfer Equation:

(75) $\frac{\mathrm{dq}}{\mathrm{dt}}=\Delta H_s\frac{\mathrm{dm}}{\mathrm{dt}}\text{=>}\frac{\mathrm{dm}}{\mathrm{dt}}=\frac{\frac{\mathrm{dq}}{\mathrm{dt}}}{\Delta H_s}\mathrm{Where}:\frac{\mathrm{dq}}{\mathrm{dt}}=\mathrm{Heat}\mathrm{transfer}\mathrm{measured}\mathrm{from}\mathrm{heat}\mathrm{flux}\mathrm{sensor}\Delta H_s=\mathrm{Heat}\mathrm{of}\mathrm{sublimination}\mathrm{of}\mathrm{ice}\frac{\mathrm{dm}}{\mathrm{dt}}=\mathrm{Mass}\mathrm{transfer}\mathrm{rate}\mathrm{to}\mathrm{be}\mathrm{calculated}$
Rp=Product Resistance

(76) Product resistance R.sub.p is the resistance to sublimation caused by a dry layer of the product. Its value depends on the ice crystal size, orientation and distribution which is a product of freezing. Most current equipment has no direct measurement of R.sub.p. This means that there is no way to verify that the product was frozen the same way from batch to batch. With a real time reading of R.sub.p the ice matrix property can be verified from the moment drying process starts. During the drying process, if the process product temperature causes the dry layer to collapse or crack, a change of product resistance can be monitored in real time. This measurement offers a complete trace of product structure during the drying process, allowing process verification.

(77) Mass Transfer and Product Resistance Equation:

(78) $\frac{\mathrm{dm}}{\mathrm{dt}}=\frac{A_p\left(P_i-P_c\right)}{R_p}\text{=>}{R}_p=\frac{A_p\left(P_i-P_c\right)}{\frac{\mathrm{dm}}{\mathrm{dt}}}$

(79) Vapor Pressure Over Ice Equation:

(80) $P_i=6.112e^{\left(\frac{22.46T_b}{272.62+T_b}\right)}$

(81) (Guide to Meteorological Instruments and Methods of Observation 2008) Where:

(82) $\frac{\mathrm{dm}}{\mathrm{dt}}=\mathrm{Mass}\mathrm{transfer}\mathrm{rate}\mathrm{to}\mathrm{be}\mathrm{calculated}\text{}{A}_p=\mathrm{Inner}\mathrm{cross}\mathrm{section}\mathrm{area}\mathrm{of}\mathrm{vial}{P}_i=\mathrm{Vapor}\mathrm{pressure}\mathrm{of}\mathrm{ice}\mathrm{calculated}\mathrm{from}\mathrm{ice}\mathrm{temperature}{T}_b{P}_c=\mathrm{Chamber}\mathrm{pressure}{R}_p=\mathrm{Resistance}\mathrm{of}\mathrm{the}\mathrm{dried}\mathrm{product}\mathrm{layer}\mathrm{to}\mathrm{be}\mathrm{calculated}{T}_b=\mathrm{Product}\mathrm{temperature}\mathrm{at}\mathrm{the}\mathrm{bottom}\mathrm{center}\mathrm{of}a\mathrm{vial}$

(83) The heat flow information can be used to determine:

(84) Heat Flow Freezing: determine that the product is ready for controlled nucleation; control the shelf temperature for controlled crystal growth; determine that the product has reached the end of freezing and is ready for primary drying; Primary drying: Calculate the product temperature during the entire primary drying process; Determine the end of primary drying (when the heat flow approaches zero)

(85) Product Temperature Determine the product temperature through calculation to eliminating the need for invasive temperature measurement methods, such as thermocouples; Verify the product did not rise above the critical temperature; Feed back to the control system to adjust the shelf temperature to constantly keep the product below its critical temperature while maximizing the shelf temperature, thus reducing primary drying times.

(86) Mass Flow Calculate the end of primary drying time: Calculate the mass flow and remaining material to determine the amount of time that is left in primary drying; Define a design space for equipment (QbD—Quality by Design): Adjust the vacuum level and shelf temperature to develop design space in a single run.

(87) Process Analytical Technology (PAT) To determine if any changes to the process have occurred, the heat flow will change. Process changes could be the result of, but not limited to: Vial characteristics Fill levels Equipment performance Other factors
Features: True Process Analytical Technology for monitoring and control of the entire freezing and drying process; QbD Tool for developing design space; Identify changes in process: Change in vials; Change in fill amount. Determine if collapse or melt-back is taking place.

(88) From the foregoing description, it will be readily seen that the present heat flux method is simple, inexpensive, easily implemented and is a minimally invasive, reliable, efficient and accurate method for monitoring and controlling both the freezing and drying portions of the freeze drying process of different types of freeze drying apparatus.

(89) The thermal emulator can be controlled via programmed steps or enabled to track the product temperature dynamically, thus mimicking the changing temperatures or changing heat flow of any measured vial, center or edge, or any other target temperature such as the vial wall.

(90) A further improvement to the apparatus is the ability to control the pressure differential between the product chamber and condenser, to simulate larger batch production freeze dryer conditions. As shown in FIG. 9, a proportional valve is placed in the vapor port between the product chamber and condenser. The proportional valve can be adjusted to develop a restriction and therefore a pressure differential between the two chambers.

(91) The apparatus can include any method of controlled nucleation or other freezing methodology to aid in optimizing the freezing process; any method for measuring, monitoring, and controlling the critical process parameters, such as ‘manometric temperature measurement’, heat flux measurement and control, tunable laser diode mass flow measurement, or near infrared dryness measurement.

(92) The combination of these technologies provides the tools needed to analyze and control the process, to determine the critical process parameters such as thermal conductivity of the vial, as well as develop improved protocols using a very small batch of vials. These advantages include, but are limited to: Ability to simulate either center vials or edge vials, or any other condition experienced by a vial in a larger batch or TFD. Minimal sample size to minimize the cost of product required for protocol development Simplifies and speeds development of protocols Can be used to troubleshoot processing problems experienced with larger batches, such as those in pilot and production sized freeze drying systems Works in all phases of freeze drying including; freezing, primary drying, and secondary drying enabling the production of a completely optimized freeze drying protocol. Can be used to not only develop robust protocols, but can also be used optimize protocols by determining the conditions for proper freezing and reduced drying time Can be used to determine the critical process parameters enabling transfer of the improved protocol to larger batches or the TFD. Reduced cost of operation Space savings

(93) Previous Experiments—Appendix A—Previous experiments using a temperature controlled chamber wall, fully decoupled from the vials, in a small freeze dryer resulted in reduced heat transfer from radiation sources, but the proportion of heat flow from different sources was not balanced like larger systems and the drying times continued to be shorter than expected and therefore did not fully simulate the larger systems. Experiments with reducing the wall temperature and changing the wall surface for lower emissivity had marginal effect on the process.

(94) Appendix: a. Experiment 1—shows the sublimation uniformity in a small freeze dryer with the wall temperature at −40C; b. Experiment 2—shows the sublimation uniformity in a small freeze dryer with the wall temperature at −40C and examples of thermal insulation to eliminate radiation; c. Table 1—Shows the primary drying times of the same freeze drying protocol performed with different size batches and different edge conditions, without a thermal emulator; d. Experiment 3—shows the improved sublimation uniformity when conducting the temperature of the temperature controlled wall to the outside row of vials in the nest; e. Experiment 4—shows the further improved sublimation uniformity with a thermal emulator and thermal conductors contacting or in close proximity to the outside row of vials in the nest;

(95) After analysis of these failed experiments, the inventor came to the conclusion that there must be another effect based on the size of the batch. Duplicate freeze drying processes were performed in a small freeze dryer and in a laboratory freeze dryer and the results indicated that there was either a major source of radiation in the small system or a cooling factor with larger batches. Experiments were performed in the small freeze dryer that reduced the wall temperature and shielded the vials from the walls preventing radiation, again the results were not satisfactory.

(96) Conclusion: The faster drying times when processing small batches, for example 1 to 37 vials, is often referred to as the edge vial effect, which is more a result of loss of cooling from adjacent vials sublimating than radiation from warm surfaces. Sublimation, changing the state of ice to vapor, absorbs a significant amount of energy and reduces the temperature of the sublimating vial. Since sublimation is endothermic it is a cooling process and the center vials are surrounded by two or more rows which have a cooling effect on each other. Therefore a center vial experiences lower wall temperatures than edge vials. The sublimation of the adjacent vials dramatically reduces the energy available for the center vial, lowers the wall temperature of the center vial, and results in a reduced sublimation rate and therefore longer primary drying times of the center vial.

(97) Sublimation rate experiment—To test the theory that the difference in sublimation rates is a result of adjacent vials having a cooling effect, the wall of the chamber in the small freeze dryer was closely coupled with the outer vials and the wall was cooled to simulate a temperature that a sublimating vial would produce.

(98) The sublimation rate of each vial in the 19 vial stack was measured before and after adding the thermal conductors. The result of adding the thermal conductor was a significant reduction in drying rate (longer drying time) and an improvement in the uniformity of sublimation across the 19 vial batch.

(99) Experiment 1 shows the uniformity of sublimation with a cooled wall that is fully decoupled.

(100) Experiment 2 shows the results of attempts to eliminate radiation by insulating the 19 vial stack.

(101) Experiment 3 shows the results of coupling the wall.

(102) Experiment 4 shows a coil added to the chamber which is temperature controlled and thermal conductors between the coil and the vials to enable close coupling and temperature control of the outer or edge vials. The result is a significant improvement in sublimation rate uniformity. In addition, the primary drying time was very similar to that of a full tray in a laboratory (Revo®) freeze dryer.

(103) Developing Protocols—Developing protocols can be performed by simulating the conditions for either center or edge vials in each mode of the freeze drying process; freezing, primary drying, and secondary drying. Below are examples of different processes that may be used. The freezing method produces the ice crystal structure that can impede or encourage primary drying, so multiple methods for freezing can allow the operator to compare and optimize the freezing method. Some methods of operation are described below, these are meant to describe different modes of operation and are not intended to define a limited scope. 1) Freezing—each of these methods can be performed with simulation of center vials or edge vials by controlling the wall temperature of the outside vials in the nest. a) Shelf temperature controlled as a sequence of ramps and holds i) Temperature of Thermal emulator adjusted via programmed steps ii) Temperature of Thermal emulator adjusted by tracking a measured product temperature of one vial or an average of several vials iii) Temperature of shelf adjusted by tracking the wall temperature of one vial or an average of vials. b) Same as ‘a)’ with an annealing step c) Same as ‘a)’ with a controlled nucleation event d) Same as “c)’ with the shelf temperature controlled based on heat flow post-nucleation e) Reduce shelf temperature based on heat flow i) Temperature of Thermal emulator adjusted via programmed steps ii) Temperature of Thermal emulator adjusted by tracking a measured product temperature of one vial or an average of several vials iii) Temperature of shelf adjusted by tracking the wall temperature of one vial or an average of vials. f) Same as ‘e)’ with a controlled nucleation event 2) Primary Drying and Secondary Drying—each of the following methods can be performed while simulating either center or edge vials or any other vial condition by controlling the wall temperature of the outside vials in the nest using the thermal emulator in close proximity or contact a) Using #2 above, either simulating center or edge vials or other vial condition, and adjusting the temperature of the thermal emulator to a user entered program sequence b) If thermocouples or other temperature measuring devices are placed in the vials, they can be used as feedback to control the product temperature by adjusting the shelf temperature. c) Using ‘b.’ above to keep the product temperature just below the critical temperature. d) Using ‘b’ or ‘c’ above and automatically adjusting the temperature of the thermal emulator based on the changing temperature of the product e) Using #2 above, simulating either center or edge vial or other vial condition, and using heat flux monitoring and control to produce results similar to the TFD system. f) Using ‘e’ above and adding product temperature control to keep the product temperature just below the critical temperature. i) Method ‘f’ using a thermocouple or other temperature measurement device or method. ii) Method ‘f’ where heat flux sensors are used to calculate the product temperature:

(104) $\begin{array}{cc}\mathrm{Tb}=\mathrm{Tshelf}-\left(\left(\frac{\mathrm{dQ}}{\mathrm{dt}}\right)/\mathrm{Av}\right)/\mathrm{Kv})\mathrm{or}\mathrm{Tb}=\mathrm{Ts}-\left(\mathrm{HF}/\mathrm{KV}\right)& \left(1\right)\end{array}$ (a) Where Tshelf and dQ/dt are measured and Kv is a constant specific to the application. (i) Tb=product temperature—C (ii) Tshelf—shelf surface temperature—C (iii) Kv—thermal conductivity of the vial—W/sq M C (iv) dQ/dt—Watts (v) Av—area of the vial—sq M (vi) HF—heat flux—W/SQM

(105) The following methods are examples of the different configurations that may be used. It is not meant to limit the scope of operations and is intended solely to provide examples of use.

(106) Method 1—Center Vial Simulation Basic—Applying a thermal emulator to the outside vials and controlling the temperature of the thermal emulator, either manually or automatically, to eliminate the edge vial effect and therefore simulate center vials. During freezing the thermal emulator can simulate the conditions the outside vials may be exposed to. During primary drying lower edge vial wall temperatures will be achieved which decreases the rate of sublimation and mimics larger batches of product.

(107) Method 2—Center Vial Simulation with Product Temperature Control—Improving upon Method 1 by additionally controlling the shelf surface temperature based on the product temperature to maintain a specified product temperature.

(108) Method 3—Center Vial Simulation Improved—Improving upon Method 2 by measuring heat flow and other critical process parameters provides insight into the freezing and drying heat transfer dynamics. Data is used to determine the critical process parameters to develop, improve, and transfer the protocol or can be compared to similar data collected from a larger batch or larger freeze dryer. Critical process information such as; vial thermal conductivity (Kv), product temperature (Tb), and heat flow (dQ/dt) and mass flow (dM/dt) can be collected and other critical process parameters can be calculated, such as; product cake resistance (Rp).

(109) Method 4—Center Vial Simulation Closed Loop Control—Improving upon Method 3, measuring and controlling heat flow and other critical process parameters provides closed loop control of the process for optimized process results, such as controlling the freezing process at a predetermined, programmed, or calculated heat flow rate for improved ice crystal formation. Drying, both primary and secondary, may also be controlled using heat flow that is controlled at a predetermined, programmed, or calculated heat flow.

(110) Method 5—Center Vial Simulation Closed Loop Control with Product Temperature Control—Improving upon Method 4, additionally measuring or calculating the product temperature and controlling the shelf temperature to maintain a product temperature to a predetermined level or as close as possible to its critical temperature. This can be used to optimize the primary drying process to reduce total process times.

(111) Method 6—Edge Vial Simulation without Thermal Contact—Simulating the edge vials can be achieved by removing the thermal conductors, which allows the user to get a better understanding of the impact of the freeze drying process under the extreme edge conditions. As an example, a 19 vial stack with a thermal emulator temperature above the shelf temperature without thermal contact will result in higher radiation and shorter drying times. The outer two rows of vials will be very similar to the edge vials in a large batch.

(112) Method 7—Edge Vial Simulation with Thermal Contact—Simulating the edge vials with the thermal conductors in place and controlling the temperature of the conductors at higher temperatures allows the user to get a better understanding of the impact of the freeze drying process under the extreme edge conditions. As an example, a 19 vial stack with contact to a thermal emulator above the shelf temperature will result in higher vial wall temperatures and shorter drying times. The outer two rows of vials will be very similar to the edge vials in a large batch.

(113) Traditional freeze drying process control is inefficient open loop control of the shelf temperature without feedback from product temperature and only being able to control the heat transfer fluid temperature from the point at which it flows into the shelf stack. Depending on the different product loads (i.e.: quantity, size and fill of product or vials) as well as the equipment construction (i.e.: shelf construction, fluid pump size and flow rate, etc.) the actual shelf surface temperature varies, although the inlet fluid temperature remains constant, and therefore the product temperatures across a batch can vary. In addition, the heat transfer coefficient changes with vacuum level and vial. This means that the same inlet shelf temperature may result in different product temperatures and therefore different freezing and drying results.

(114) If thermocouples or other temperature measuring devices are placed in the vials, they can be used as feedback to control the product temperature by adjusting the shelf temperature. Typically, the product temperature would be controlled below it's critical or collapse temperature, but there are cases where the product temperature is controlled above the collapse temperature.

(115) The thermal emulator enables different freeze drying batch conditions to be simulated, which enables a small batch of product to be used for studies and process optimization. To further improve the process, the thermal emulator can be controlled via user entered steps or the temperature can be dynamically adjusted via closed loop control based on the product temperature. The unique advantage of tracking the product temperature is that it simulates the conditions that adjacent vials would normally produce. The tracking temperature could be the same as the product temperature, vial wall temperature, or an offset can be used to simulate different operating conditions.

(116) The thermal emulator apparatus can be configured to fit into any existing freeze dryer enabling protocols to be developed with small batches. The apparatus is simply placed on the shelf. This apparatus will have the same thermal control capabilities where it can control the thermal conditions of the outer vials in a nest. (FIGS. 10, 11)

(117) The thermal emulator concept may also be used to control the edge vial thermal conditions in any freeze dryer, where a thermal emulator, such as a fluid filled tube or other heating or cooling concept, is placed in contact or close proximity to the edge vials (FIGS. 5, 6) and temperature controlled to simulate the product temperature of the center vials or any other condition.

(118) Thermal Emulator Apparatus and Method for Process Development Using a Small Batch of Product in a Small Development Freeze Dryer

(119) An apparatus that consists of a small dedicated freeze dryer that simulates the heat transfer dynamics of larger systems using a thermal emulator on a small batch of vials. The key to an effective thermal emulation apparatus is developing a sufficient heat transfer path and a method of temperature or heat flow control to simulate the dynamics of a vial in a freeze drying process. The thermal emulator apparatus must be able to control temperature over a wide range, such as −80° C. to +105° C., while being able to change temperature rapidly to mimic the process dynamics.

(120) Several example methods for the thermal emulation include, but are not limited to: Temperature controlling the freeze drying chamber walls which are in intimate or close proximity to the vials which use independent conductors to transfer heat to the vials A thermal emulator surface, such as a coil, plate, or other apparatus that is independent of the chamber wall and provides temperature or heat flow control to the vials by Being in direct contact or close proximity to the vials Or uses independent thermal conductors to transfer heat to vials

(121) The method for developing the necessary temperatures and heat flow can be varied and may include, but is not limited to, any combination of the following cooling and heating methods inside the temperature controlled surface: Cooling using Flowing Liquid in a coil, plate or other configuration Direct expansion of refrigerant in a coil, plate or other configuration Thermoelectric device LN2 or Cold Nitrogen Cooled forced air CO2 Or other cooling method Heating using a Flowing liquid in a coil, plate, wall or other configuration Resistive heating element of high or low voltage Thermoelectric device(s) Hot gas Forced hot air Or any other appropriate method

(122) The temperature controlled surface (thermal emulator) may have a single point of contact, multiple points of contact, may have intimate surface contact, or may be in close proximity to the vials.

(123) The thermal conductors may be made out of a multitude of materials or may be made from a combination of materials, including but not limited to copper, stainless steel, ceramic, glass, conductive rubber, or any other appropriate material.

(124) The thermal conducting surface can be made from a flexible membrane that can expand and contract to provide intimate contact with the temperature controlled surface and the vials. The flexible membrane can be filled with a thermally conductive fluid that is temperature controlled.

(125) A method of spring loading may be used to ensure the best thermal contact between the thermal emulator, the thermal conductor and the vials.

(126) The thermal emulator and thermal conductor can be any shape to meet the application needs. The height of the thermal emulator and thermal conductor may be varied to simulate the height of the product in the vial or any other height that is deemed appropriate for the application.

(127) The contact between the thermal emulator and the temperature source can be enhanced using any appropriate thermally conductive material including, but not limited to, thermal paste, Chomeric rubber, encapsulated paste, encapsulated fluid, glue, epoxy, solder, or any other appropriate material. Another method of contact is the use of a flexible membrane between the temperature controlled surface and the thermal conductor block.

(128) The temperature controlled surface may have a fixed or changeable surface that can be varied to a select emissivity from fully reflective to a black body.

(129) The thermal emulator may also have the ability to produce temperature gradient between the top and bottom surface to simulate the temperature variation of the material being freeze dried. One example of this apparatus is adding a heater to the top surface to create a higher temperature on the top surface, simulating a temperature gradient similar to the dry product vs frozen product.

(130) The temperature of the thermal emulator can be controlled using, but not limited to any of the following: A preprogrammed recipe or protocol Feedback of the product temperature from one or more of the vials in process Thermocouple Wireless temperature sensor Or other temperature sensing device Feedback from a heat flux sensor beneath or near the vials Feedback of the product temperature as determined by the heat flux measurement Feedback of the product temperature calculated from a mass flow sensor, such as TDLAS Feedback from product temperature based on manometric temperature measurement Feedback from any other method that determines product temperature

(131) The apparatus may be further improved and enhanced by adding apparatus and methods of process monitoring and control to capture critical data and control the process. Examples of the types of instrumentation that may be added include: Heat flux sensors (U.S. Pat. No. 9,121,637) to determine the heat flow, product temperature and other critical process parameters. Some concepts include, but are not limited to: Product temperature determination Heat flow control for ice crystal growth End of super-cooling End of freezing End of primary drying End of secondary drying Process analysis

(132) Heat Flux Sensor—One method of measuring heat flux is to use surface heat flux sensors that are designed to obtain a precise direct reading of thermal transfer through a surface or interface in terms of energy per unit time per unit area. A heat flux monitoring system provides data on the freeze dryer that has previously been unavailable. Either a single sensor between the shelf and vial or multiple heat flux sensors can be used. For example, the sensors can be placed between the shelf and the vial, on the radiant surface above the product, on the vial, on the walls surrounding the product, in the condensing path, etc. Multiple sensors provide more information about the overall process.

(133) Measuring the heat flow enables monitoring and control of the ice crystal growth process. This method enables control of the shelf temperature during phase transition events when there is no product temperature change. Any suitable type of heat flux sensor may be used. As an illustrative example, a low thermal capacitance and low thermal impedance heat flux sensor is suitable for this type of application.

(134) For the purposes of this patent application, standard freezing profiles can be used while the heat flow is monitored for use in determining any differences between the DFD and the TFD. The heat flux sensor can be implemented in various ways. For example: on the shelf surface, in the shelf surface, on the vial, and any other surface. The mounting location is not limited to the shelf for monitoring and control. It may also be mounted on the walls or other surfaces of the freeze drying apparatus that are near the vials or bulk product and may have a significant heat transfer effect on the process.

(135) The heat flux monitoring system can operate in a stand-alone mode to compare any two freeze dryers or can be interfaced with the freeze dryer control system for further automation and data acquisition.

(136) The intent of the DFD is to simulate the heat flow characteristics of larger freeze dryers. Therefore, a method to measure the target system and to control the DFD is needed. A heat flux sensor can be used to identify the proportion of heat flow to the vial, via shelf and other sources, allowing the TFD to be characterized and then simulated in the DFD. In addition, the use of heat flux sensors enables the measurement and calculations of other critical process parameters, such as: Kv, mass flow, cake resistance, etc.

(137) The use of a heat flux monitoring system provides a method to overcome the short-comings of traditional process measurement via temperature. A heat flux monitoring system based on the heat flux measurement between shelf and product and other heat sources is the missing link for producing optimized and improved profiles.

(138) Traditional freeze drying process control is inefficient open loop control due to limited feedback from product temperature and only being able to control the heat transfer fluid temperature from the point at which it flows into the shelf stack. Depending on the different product loads (i.e.: quantity, size and fill of product or vials) as well as the equipment construction (i.e.: shelf construction, fluid pump size and flow rate, etc.) the actual shelf surface temperature varies, although the inlet fluid temperature remains constant. In addition, the heat transfer coefficient changes with vacuum level and vial. This means that the same inlet shelf temperature may result in different product temperatures and therefore different freezing and drying results.

(139) If thermocouples or other temperature measuring devices are placed in the vials, they can be used as feedback to control the product temperature by adjusting the shelf temperature.

(140) Critical Process Parameters (FIG. 18)—Critical Process Parameters (“CPP” include, but are not limited to:

(141) Shelf temperature profile—Ts

(142) Heat flow, dQ/dt

(143) Vial Heat Transfer Coefficient—Kv

(144) Mass-flow, dM/dt

(145) Sublimation front temperature

(146) Product temperature, Tp

(147) Product Cake Resistance, Rp

(148) The heat flux sensor provides in-process information for Heat Flow per unit area. With this information a series of calculations can be performed to provide critical information for control of the freeze drying process. Three critical parameters can be determined, including the Vial Heat Transfer Coefficient (K.sub.v), Mass Flow (dM/dt), and Product Resistance (R.sub.p). The calculations enable the process parameters to be predicted instead of using the typical ‘after-the-fact’ open-loop control feedback of thermocouples. This makes heat flux based control a true process analytical tool. Once Kv has been determined the product temperature at the bottom of the vial (T.sub.b) can be calculated, thus eliminating the need for an invasive thermocouple for monitoring product temperature

(149) Development scenarios using heat flux technology, the following methods relating to the following scenarios can be created: a freezing profile; primary drying profile; and secondary drying profile. One can also develop a baseline optimized freeze dry process profile that is robust and efficient for a DFD. The process data can be collected and stored along with the heat transfer characteristics used. To transfer the profile, the target system critical heat transfer characteristics are first identified. A conversion program can then be used to translate the baseline development cycle to a target system shelf temperature profile or heat flow profile.

(150) The TFD can then execute the profile based on the significant process parameter, which may be either without feedback from sensors or with feedback from a heat flow monitoring system to verify proper operation.

(151) An acceptance dead-band can be created during transfer or translation for quality control purposes. For target systems with the ability to measure heat flow in-process, adjustments can be made to compensate for changes in equipment performance or other process changes.

(152) The Target System Heat Transfer Characteristics can be used as critical process parameters for a development system that has the heat flow measurement system integrated with the control system in a way to simulate the operation of different freeze dryers.

(153) Another benefit from the heat flux method is limited product samples are required to finish the test run as long as they can cover the area of the sensor. Other methods like Tunable Diode Laser Absorption Spectroscopy (TDLAS) require many more samples to generate enough vapor flow for accuracy of measurement. The use of heat flux monitoring enables Quality by Design (QbD) characterization of processes and acts as a Process Analytical Technology (PAT).

(154) Tunable laser diode system to measure mass flow

(155) The temperature controlled conductor concept may also be used to eliminate the edge vial effect in a freeze dryer where a temperature controlled surface, such as a fluid filled tube or other heating or cooling concept, is placed in contact with or close to the edge vials.

(156) Manometric temperature measurement may be implemented to determine the product temperature without the use of thermocouples. Product temperature determination End of Primary Drying

(157) The apparatus and method of controlled nucleation can be added to the system to enable the user to test different freezing profiles and their effect on primary drying. Controlled nucleation with the ability to control freezing post-nucleation using thermal emulator enables full control of the freezing process. Any method of controlled nucleation can be used, including but not limited to the following: Millrock Technology's controlled nucleation of ice fog and forced ice crystals using pressurization (U.S. Pat. Nos. 8,839,528, 8,875,413) Other Ice fog techniques Other Forced ice crystals techniques Depressurization Vibration Any other method

(158) Process optimization can be performed by testing and improving the freezing process, primary drying process, and secondary drying process. Some, but not all of the possible methods, include:

(159) Control of freezing process for optimum ice crystal formation and structure. Normally a simple ramp and hold are used for freezing, but this method does not produce the optimum ice crystal structure for primary and secondary drying. Using a method of controlled nucleation combined with heat flow control post-nucleation produces the most consistent and primary drying friendly structure, thus providing the foundation for efficient and robust primary drying.

(160) During primary drying, keeping the product temperature slightly below the product critical temperature produces the shortest and most effective process. A method to dynamically adjust the shelf temperature or chamber pressure throughout the cycle can be implemented. Techniques such as the following, but not limited to these methods, may be used: Millrock Technology's AutoDry (U.S. Pat. No. 8,434,240) may be used to determine and control the product temperature; Millrock Technology's AccuFlux® and LyoPAT® technology (U.S. Pat. No. 9,121,637) may be used to determine the product temperature and provide critical process parameter information for use in improving and transferring the process to another freeze dryer; Manometric temperature measurement may be implemented to determine product temperature;

(161) To improve upon the apparatus a method to control the pressure differential between the product chamber and condenser allows the user to simulate the dynamics of production sized freeze dryers. Methods for adjusting the pressure differential include but are not limited to: Proportional butterfly valve between product chamber and condenser Adjustable ball valve between the product chamber and condenser Iris style aperture between the product chamber and condenser And other methods of vacuum control that may restrict the flow between the product chamber and condenser

(162) Thermal Emulator for Process Development Using a Small Batch of Product in Any Freeze Dryer (FIGS. 10 and 11)

(163) An apparatus and method may also be applied to laboratory and production sized freeze dryers to enable simulation of larger batches using a small amount of product, such as 1 to 37 vials.

(164) The apparatus includes a thermal emulator assembly that is in direct contact or close proximity to the vials or uses thermal conductors that are in direct contact or close proximity to both the vial and the thermal emulator. The thermal emulator may be placed on the shelf of the freeze dryer or may be added to the system in a manner that enables proper operation.

(165) The apparatus is added to any freeze dryer with connections either through an available port or through the front door. It may be implemented as a stand-alone system or integrated with the freeze dryer control system and mechanical systems.

(166) The apparatus will have all the same features and capabilities of the small development freeze dryer as described previously.

(167) Edge Vial Elimination Apparatus for Use in Any Freeze Dryer (FIGS. 13 and 14)

(168) An apparatus that consists of a thermal emulator that surrounds a batch of vials in a laboratory, pilot, or production freeze dryer. The thermal emulator is used to eliminate the ‘edge vial’ effect, where the outer 2 rows of vials typically dry faster than the center vials and therefore are processed differently. The key to an effective thermal emulation apparatus is developing a sufficient heat transfer path and a method of temperature or heat flow control to simulate the dynamics of a vial in a freeze drying process. The apparatus must be able to control temperature over a wide range, for example −80° C. to +105° C., while being able to change temperature rapidly to mimic the process.

(169) Several example methods for the thermal emulation include, but are not limited to a thermal emulator surface, such as a chamber wall, coil, plate, or other apparatus that is independent of the chamber wall and provides temperature or heat flow control to the vials by being in direct contact or close proximity to the vials or uses independent thermal conductors to transfer heat to vials

(170) The method for developing the necessary temperatures and heat flow can be varied and may include, but is not limited to, any combination of the following cooling and heating methods inside the temperature controlled surface:

(171) Cooling Using Flowing liquid in a coil, plate, wall or other configuration Direct expansion of refrigerant in a coil, plate or other configuration Thermoelectric device LN2 or Cold Nitrogen Cooled forced air CO2 Or other cooling method

(172) Heating using a Flowing liquid in a coil, plate, wall or other configuration Resistive heating element of high or low voltage Thermoelectric device(s) Hot gas Forced hot air Or any other appropriate method

(173) The temperature controlled surface (thermal emulator) or thermal conductor may have a single point of contact, multiple points of contact, may have intimate surface contact, or may be in close proximity to the vials.

(174) The thermal emulator may be in direct contact to a corral or tray within which the vials or material being freeze dried are placed.

(175) The thermal conducting surfaces may be made out of a multitude of materials or may be made from a combination of materials, including but not limited to copper, stainless steel, ceramic, glass, conductive rubber, or any other appropriate material.

(176) The thermal emulator and thermal conductor can be any shape to meet the application needs. The height of the thermal emulator and thermal conductor may be varied to simulate the height of the product in the vial or any other height that is deemed appropriate for the application.

(177) The contact between the thermal emulator and the temperature source can be enhanced using any appropriate thermally conductive material including, but not limited to, thermal paste, heat transfer capable rubber, encapsulated paste, encapsulated fluid, glue, epoxy, solder, or any other appropriate material.

(178) The temperature controlled surface may have a fixed or changeable surface that can be varied to a select emissivity from fully reflective to a black body.

(179) The thermal emulator may also have the ability to produce temperature gradient between the top and bottom surface to simulate the temperature variation of the material being freeze dried. One example of this apparatus is adding a heater to the top surface to create a higher temperature on the top surface, simulating a temperature gradient similar to the dry product vs frozen product.

(180) The thermal emulator may be placed on the shelf of the freeze dryer or may be added to the system in a manner that enables proper operation.

(181) The apparatus is added to any freeze dryer with connections either through an available port or through the front door. It may be implemented as a stand-alone system or integrated with the freeze dryer control system and mechanical systems.

(182) The temperature of the thermal emulator can be controlled using, but not limited to any of the following: A preprogrammed recipe or protocol Feedback of the product temperature from one or more of the vials in process Thermocouple Wireless temperature sensor Or any other temperature sensing device Feedback from a heat flux sensor beneath or near the vials Feedback of the product temperature determined from the heat flux measurement Feedback of the product temperature calculated from a mass flow sensor, such as TDLAS Feedback from product temperature based on manometric temperature measurement Feedback from any other method that determines product temperature

(183) Using a Fluid Filled Vessel to Minimize or Eliminate the Edge Vial Effect. (FIGS. 15 and 16)

(184) A unique concept, which may be used in a limited manner, is a fluid filled vessel that surrounds the vial nest, for example 1 to 37, this is in intimate contact or close proximity to the vials. Where the vessel is filled with a fluid with similar properties to the material in the vials, so that the vessel fluid will freeze and dry in a similar fashion to the material in the vials and will simulate the heat transfer dynamics of the process and can be used in any freeze dryer.

(185) The vessel can be made from any appropriate material such as stainless steel, aluminum, copper, plastic, glass, other metal, or other material. The vessel can be designed and built to fit the vial nest and may take any convenient external shape such as circular, hexagonal, square, or any other shape.

(186) The vessel is placed around the vials on any freeze dryer shelf at the beginning of the process and filled with an appropriate fluid. The vessel fluid should freeze in a similar fashion and dry in a similar fashion to the vials and thus minimizes the edge vial effect. Examples of fluids including but are not limited to water, the same product that is in the vials, or a placebo.