VIBRATION SENSOR WITH AIR VENTING CHANNELS
20240369402 ยท 2024-11-07
Assignee
Inventors
Cpc classification
H04R1/04
ELECTRICITY
H04R25/48
ELECTRICITY
International classification
Abstract
The present invention relates to a vibration sensor comprising a carrier substrate comprising a first surface and a second surface, a suspension member and a moveable mass secured thereto, wherein the moveable mass and/or at least part of the suspension member is/are adapted to vibrate when the vibration sensor is exposed to external vibrations, a read-out arrangement for detecting vibrations of the moveable mass and/or at least part of the suspension member, and a signal processor for at least processing an electric signal from the read-out arrangement, wherein the read-out arrangement comprises a capacitor formed by a first capacitor electrode and a second capacitor electrode separated by an air gap, and wherein the first capacitor electrode and/or the second capacitor electrode comprises one or more air venting channels in order to reduce squeeze film damping effects between the first and second capacitor electrodes. The present invention further relates to a hearing device comprising such a vibration sensor and use of the vibration sensor for voice recognition in a hearing device.
Claims
1. A vibration sensor comprising a) a carrier substrate comprising a first surface and a second surface, b) a suspension member and a moveable mass secured thereto, wherein the moveable mass and/or at least part of the suspension member is/are adapted to vibrate when the vibration sensor is exposed to external vibrations, c) a read-out arrangement for detecting vibrations of the moveable mass and/or at least part of the suspension member, and d) a signal processor; for at least processing an electric signal from the read-out arrangement, wherein the read-out arrangement comprises a capacitor formed by a first capacitor electrode and a second capacitor electrode separated by an air gap, wherein the first capacitor electrode and/or the second capacitor electrode comprise(s) one or more air venting channels in order to reduce squeeze film damping effects between the first and second capacitor electrodes.
2. A vibration sensor according to claim 1, wherein at least part of the suspension member is electrically conducting, and in that at least the electrically conducting part of the suspension member forms the first capacitor electrode.
3. A vibration sensor according to claim 1, wherein the second capacitor electrode is provided on the first surface of the carrier substrate.
4. A vibration sensor according to claim 3, wherein the second capacitor electrode; comprises one or more air venting channels, and in that the one or more air venting channels of the second capacitor electrode extend into at least part of the carrier substrate.
5. A vibration sensor according to claim 1, wherein the first capacitor electrode is electrically connected to ground, and in that the second capacitor electrode is electrically biased by the signal processor.
6. A vibration sensor according to claim 1, wherein the one or more air venting channels form a three-dimensional pattern in the first capacitor electrode and/or in the second capacitor electrode.
7. A vibration sensor according to claim 6, wherein the one or more air venting channels are adapted to lead air to and/or from the air gap between the first and second capacitor electrodes.
8. A vibration sensor according to claim 1, wherein the moveable mass; and the signal processor are arranged on opposite sides of the carrier substrate.
9. A vibration sensor according to claim 1, wherein the carrier substrate comprises a first PCB comprising first and second opposing surfaces.
10. A vibration sensor according to claim 9, wherein the signal processor is secured to the second surface of the first PCB.
11. A vibration sensor according to claim 9, wherein the vibration sensor further comprises a spacer-secured to the second surface of the first PCB, and in that the spacer comprises one or more vias electrically connected to the second surface of the first PCB.
12. A vibration sensor according to claim 11, wherein the vibration sensor further comprises a second PCB comprising first and second opposing surfaces, and in that the one or more vias of the spacer, are electrically connected to the first surface of the second PCB, and in that one or more contact pads are provided on the second surface of the second PCB for connecting the vibration sensor to external electronic devices.
13. A vibration sensor according to claim 1, wherein the air gap between the first and second capacitor electrodes is at least partly provided by a spacer arranged between at least part of the first and second capacitor electrodes.
14. A vibration sensor according to claim 1, wherein the air gap between the first and second capacitor electrodes is at least partly provided by one or more embossed elements of the suspension member.
15. A vibration sensor according to claim 1, wherein the acoustic resistance of any one of the one or more air venting channels of the first capacitor electrode and/or the second capacitor electrode is/are lower than the acoustic resistance of any part of the air gap between the first and second capacitor electrodes.
16. A hearing device comprising a vibration sensor according to claim 1, wherein the hearing device comprises a hearing aid, a hearable, a headset, an earbud or a similar device.
17. Use of a vibration sensor according to a claim 1 in a hearing device, wherein the vibration sensor is used for detecting voice
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The present invention will now be described with reference to the accompanying drawings where
[0030]
[0031]
[0032]
[0033]
[0034]
DETAILED DESCRIPTION OF THE INVENTION
[0035] In general, the present invention relates to a vibration sensor for a hearing device. The vibration sensor comprises, among other features, a suspension member and a moveable mass adapted to vibrate when the vibration sensor is exposed to external vibrations. The vibration sensor further comprises a capacitive read-out arrangement for detecting vibrations of the moveable mass and/or at least part of the suspension member. The capacitive read-out arrangement comprises first and second capacitor electrodes, wherein one or more air venting channels is/are provided in the first and/or second capacitor electrode in order to reduce squeeze film damping effects.
[0036] Referring now to
[0037] Around or on the outside of the second capacitor electrode portions 10, 10, 10 a rim 13 forming a periphery is provided. Preferably, the rim 13 forms part of the same layer as second capacitor electrode portions 10, 10, 10 so that the second capacitor electrode portions 10, 10, 10 and the rim 13 has exactly the same thickness. A spacer 13 is arranged on top of the rim 13. Preferably, both the rim 13 and the spacer 13 are electrically conductive. Moreover, the rim 13 and the spacer 13 are preferably electrically connected to ground through via 9 in the first PCB 1 and through via 4 in the spacer 3 between the first PCB 1 and the second PCB 2.
[0038] As seen in
[0039] As also depicted in
[0040] In relation to the capacitive detection scheme, the electrically active part of the first capacitor electrode 11 is the centre electrode portion 11 secured to the moveable mass 16. Similarly, the electrically active part of the second capacitor electrode 10 are the three centre electrode portions 10, 10, 10 which are separated by air venting channels 14 in order to reduce squeeze film damping effects between the first capacitor electrode portion 11 and the second capacitor electrode portions 10, 10, 10. Thus, when the distance between the electrically active parts of the first capacitor electrode 11 and the second capacitor electrode portions 10, 10, 10 is reduced air is allowed to escape via the air venting channels 14 whereby squeeze film damping effects are reduced. As seen in
[0041] In order to detect voice induced vibration signals via bone conduction, the bandwidth of the vibration sensor is typically larger than 6 kHz. In addition to this, the resonance frequency of the vibration sensor is typically close to the upper limit of bandwidth, e.g. above 4 kHz, and the resonance peak is typically less than 10 dB higher compared to the sensitivity at 1 KHz. With this approach Q will typically be smaller than 3. Moreover, the noise floor of the vibration sensor should be low, i.e. <98 dB re. 1 g in .sup.rd octave band at the resonance frequency. In order to meet these requirements the mass of the moveable mass 16 needs to be relatively high, such as higher than 1 mg. As the moveable mass 16 typically has a thickness in the range of 100-200 m, the surface areas of the moveable mass 16 can be up to 2.5 mm.sup.2. In terms of manufacturing the moveable mass may be made of a variety of materials including steel, tantalum or tungsten.
[0042] Turning now to
[0043] A surrounding air venting channel 14, which is fluidly connected to the air venting channels 14, surrounds the six centre electrode portions. The two vias 9, 9 arranged through the first PCB 1, cf.
[0044] Referring now to
[0045] Still referring to
[0046] In the embodiment shown in
[0047] Turning now to the embodiment depicted in
[0048] Referring now to the embodiment shown in
[0049] In the embodiments depicted in
[0050] Although the present invention has been discussed in the foregoing with reference to exemplary embodiments of the invention, the invention is not restricted to these particular embodiments which can be varied in many ways without departing from the invention. The discussed exemplary embodiments shall therefore not be used to construe the appended claims strictly in accordance therewith. On the contrary, the embodiments are merely intended to explain the wording of the appended claims, without intent to limit the claims to these exemplary embodiments. The scope of protection of the invention shall therefore be construed in accordance with the appended claims only, wherein a possible ambiguity in the wording of the claims shall be resolved using these exemplary embodiments.