Solar cell and method of fabricating the same

Abstract

A solar cell according to the disclosure includes a back electrode layer; and a light absorbing layer on the back electrode layer, wherein the light absorbing layer includes an undoped region and a doping region on the undoped region, and the doping region includes zinc. A method of fabricating a solar cell according to the disclosure includes forming a back electrode layer on a substrate; forming a preliminary light absorbing layer on the back electrode layer; forming a dopant supply layer on the preliminary light absorbing layer; and diffusing the dopant supply layer.

Claims

1. A solar cell comprising: a support substrate; a back electrode layer on the support substrate; a light absorbing layer on the back electrode layer; a buffer layer on the light absorbing layer; a high resistance buffer layer comprising ZnO, without impurities, and disposed on the buffer layer; and a front electrode layer on the high resistance buffer, wherein the light absorbing includes a Cu(Ga,In)Se.sub.2 (CIGS) crystal structure, wherein the front electrode layer has a thickness in a range of from 500 nm to 1.5 m, wherein the front electrode layer is doped with 1.5 wt % to 3.5 wt % aluminum (Al), wherein the buffer layer comprises magnesium zinc oxide (MgZnO) and a mass ratio of the Mg to Zn in the magnesium zinc oxide is less than or equal to 0.7, wherein the light absorbing layer includes an undoped region and a doping region on the undoped region, wherein the undoped region is disposed on and in direct contact with the back electrode layer, wherein the doping region is disposed on the undoped region, wherein the doping region is in direct contact with the buffer layer, wherein a thickness of the undoped region is less than 50% of a thickness of the doping region, wherein the doping region comprises zinc, wherein an amount of the zinc in the doping region is in a range of 0.1 wt % to 3 wt %; and wherein the doping region of the light absorbing layer forms a homogenous PN junction together with the undoped region of the light absorbing layer, and wherein the doping region has an energy bandgap similar to that of the undoped region.

2. The solar cell of claim 1, wherein the magnesium zinc oxide (MgZnO) is expressed by a chemical formula (Mg.sub.xZn.sub.1-x)O.

3. The solar cell of claim 2, wherein the x satisfies an equation 0.3x0.7.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) FIG. 1 is a sectional view showing one section of a solar cell according to the embodiment;

(2) FIG. 2 is a graph comparing an open-circuit voltage Voc of the embodiment with an open-circuit voltage of a comparative example; and

(3) FIGS. 3 to 6 are sectional views showing a method of fabricating a solar cell according to the embodiment.

MODE FOR THE INVENTION

(4) In the description of the embodiments, it will be understood that, when a layer (film), a region, a pattern or a structure is referred to as being on or under another layer (film), another region, another pattern, or another structure, it can be directly or indirectly on the other layer (film), region, pattern, or structure, or one or more intervening layers may also be present. Such a position of the layer has been described with reference to the drawings.

(5) The size or the thickness of the layer (film), the region, the pattern or the structure may be modified exaggerated for the purpose of explanation and clarity. The size may not utterly reflect the actual size.

(6) Hereinafter, an exemplary embodiment of the disclosure will be described with reference to the accompanying drawings.

(7) The solar cell according to the embodiment will now be described in detail with reference to FIG. 1. FIG. 1 is a sectional view showing one section of a solar cell according to the embodiment.

(8) Referring to FIG. 1, the solar cell according to the embodiment includes a support substrate 100, a back electrode layer 200, a light absorbing layer 300, a buffer layer 400, and a front electrode layer 500.

(9) The support substrate 100 has a plate shape, and supports the back electrode layer 200, the light absorbing layer 300, the buffer layer 400, and the front electrode layer 500.

(10) The support substrate 100 may include an insulator. The support substrate 100 may be a glass substrate, a plastic substrate such as polymer or a metal substrate. Meanwhile, the support substrate 100 may include soda lime glass. The support substrate 100 may be transparent, flexible or rigid.

(11) The back electrode layer 200 is provided on a top surface of the support substrate 100. The back electrode layer 200 is a conductive layer. For example, a material used for the back electrode layer 200 may include metal such as molybdenum (Mo).

(12) The back electrode layer 200 may include at least two layers. In this case, at least two layers may be formed by using the same metal or different metals.

(13) The light absorbing layer 300 is provided on the back electrode layer 200. The light absorbing layer 300 may include group I-III-VI compounds. For instance, the light absorbing layer 300 may include the Cu(In,Ga)Se2 (CIGS) crystal structure, the Cu(In)Se2 crystal structure, or the Cu(Ga)Se2 crystal structure.

(14) At least a part of the light absorbing layer 300 is doped with zinc (Zn). In detail, the light absorbing layer 300 includes an undoped region 310 and a doping region 320, and the doping region 320 includes zinc (Zn). In this case, the zinc (Zn) may be contained in the amount of 0.1 wt % to 3 wt %.

(15) A thickness of the undoped region 310 may be less than 50% based on a thickness of the doping region 320.

(16) The energy bandgap of the light absorbing layer 300 is in the range of about 1 eV to 1.8 eV.

(17) In the embodiment, because the undoped region 310 of the light absorbing layer 300 forms a homogeneous PN junction together with the doping region 320 of the light absorbing layer 300, the recombination at the interfacial surface can be reduced so that the open-circuit voltage can be improved. The energy bandgap of the undoped region 310 of the light absorbing layer 300 is similar to the energy bandgap of the doping region 320 of the light absorbing layer 300 so that a yield rate of electrons can be increased.

(18) The buffer layer 400 is provided on the light absorbing layer 300. The buffer layer 400 directly makes contact with the light absorbing layer 300.

(19) The buffer layer 400 may include magnesium zinc oxide (MgZnO).

(20) The magnesium zinc oxide (MgZnO) is expressed as following chemical formula,
(MgxZn1x)OChemical formula

(21) wherein the x satisfies a following equation 1.
0.3x0.7Equation 1

(22) Meanwhile, a mass ratio of the magnesium zinc oxide (MgZnO) may satisfy a following equation 2.
Mg/Zn0.7Equation 2

(23) Referring to FIG. 2, the solar cell according to the embodiment has an improved open-circuit voltage Voc as compared with the solar cell according to the related art having the buffer layer including only cadmium sulfide, which will be described later.

(24) The solar cell according the embodiment is Cd-free, so the solar cell can be fabricated through an environmental-friendly scheme without being restricted by environmental regulations.

(25) The front electrode layer 500 is provided on the light absorbing layer 300. In detail, the front electrode layer 500 is provided on the buffer layer 400.

(26) The front electrode layer 500 is provided on the buffer layer 400 and is transparent.

(27) For example, a material used for the front electrode layer 500 may include an Al doped zinc oxide (AZO), an indium zinc oxide (IZO), or an indium tin oxide (ITO).

(28) A thickness of the front electrode layer 500 may be in the range of about 500 nm to about 1.5 m. The front electrode layer 500 includes the AZO, the aluminum (Al) may be doped at the amount of about 1.5 wt % to about 3.5 wt %. The front electrode layer 500 is a conductive layer.

(29) Hereinafter, a method of fabricating the solar cell according to the embodiment will be described with reference to FIGS. 3 to 6. In the following description, the details of structures and components similar to or the same as those described above will be omitted for the purpose of clarity and simple explanation.

(30) FIGS. 3 to 6 are sectional views showing a method of fabricating a solar cell according to the embodiment.

(31) The method of fabricating a solar cell according to the embodiment may include a step of forming a back electrode layer 200, a step of forming a preliminary light absorbing layer 351, a step of forming a dopant supply layer 352, and a step of forming a light absorbing layer.

(32) First, referring to FIG. 3, metal such as molybdenum (Mo) is deposited on a support substrate 100 and a back electrode layer 200 is formed. The back electrode layer 200 may be formed by two processes having different process conditions.

(33) An additional layer such as a diffusion prevention layer may be interposed between the support substrate 100 and the back electrode layer 200.

(34) Then, a preliminary light absorbing layer 351 is formed on the back electrode layer 200. The preliminary light absorbing layer 351 may have a CuInGaSe-based structure. For instance, Cu, In, Ga and Se are simultaneously or independently evaporated to form the CIGS-based preliminary light absorbing layer 351, or the preliminary light absorbing layer 351 can be formed through the selenization process after forming a metal precursor layer.

(35) In detail, the metal precursor layer is formed on the back electrode layer 200 by performing the sputtering process using a Cu target, an In target, and a Ga target.

(36) Then, the selenization process is performed to form the CIGS-based preliminary light absorbing layer 351.

(37) In addition, the sputtering process using the Cu target, the In target, and the Ga target and the selenization process can be simultaneously performed.

(38) After that, referring to FIG. 4, a dopant supply layer 352 may be formed on the preliminary light absorbing layer 351. The dopant supply layer 352 includes zinc compound. In detail, the dopant supply layer 352 may include dimethylzinc ((CH3)2Zn). The dopant supply layer 352 may be deposited through inert carrier gas.

(39) Next, referring to FIG. 5, a step of forming the light absorbing layer 300 is performed. In the step of forming the light absorbing layer 300, the light absorbing layer 300 may be formed by diffusing the dopant supply layer 352. In detail, the dopant supply layer 352 may be diffused into the preliminary light absorbing layer 351.

(40) The step of forming the light absorbing layer 300 may be performed at the temperature equal to or lower than 350 C.

(41) The step of forming the light absorbing layer 300 may be performed for a time equal to or less than 600 minutes. Accordingly, the above doping region 320 may be ensured by preventing zinc (Zn) contained in the dopant supply layer 352 from reaching a bottom surface of the preliminary light absorbing layer 351.

(42) Referring to FIG. 6, after forming the light absorbing layer 300, a step of forming the buffer layer 400 may be performed. The buffer layer 400 may be formed by depositing the magnesium zinc oxide through Physical Vapor Deposition (PVD).

(43) The front electrode layer 500 is deposited on the buffer layer 400.

(44) For example, the front electrode layer 500 may be formed by depositing a transparent conductive material such as AZO on a top surface of the buffer layer 400 through a sputtering process.

(45) Any reference in this specification to one embodiment, an embodiment, example embodiment, etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to affect such feature, structure, or characteristic in connection with other ones of the embodiments.

(46) Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various variations and modifications are possible in the component parts and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. In addition to variations and modifications in the component parts and/or arrangements, alternative uses will also be apparent to those skilled in the art.

EXPERIMENTAL EXAMPLE

(47) A sputtering process was performed to deposit molybdenum (Mo) on a soda lime glass substrate at a thickness of about 1 m. Next, CuIn0.3Ga0.7Se2 was deposited on the back electrode layer at a thickness of about 1 m through an evaporation so that a light absorbing layer was formed. After that, the sputtering process was performed to deposit MgZnO on the light absorbing layer at a thickness of about 50 nm so that a buffer layer was formed. Subsequently, zinc oxide (ZnO) without impurities was deposited on the buffer layer at a thickness of about 70 nm so that a high resistance buffer layer was formed. After that, the sputtering process was performed to form a front electrode layer on the high resistance buffer layer using a zinc oxide target which is doped with about 3 wt % of aluminum.

COMPARATIVE EXAMPLE

(48) Similar to the experimental example, after a light absorbing layer was formed, CdS was deposited on the light absorbing layer at a thickness of about 70 nm through chemical bath deposition (CBD). After that, similar to the experimental example, a high resistance buffer layer and a front electrode layer were formed.

(49) Referring to FIG. 2, an open-circuit voltage Voc according to a solar cell of the experimental example can be improved as compared with a solar cell of the comparative example.