Mechanochemical synthesis of hexagonal OsB2
09926204 ยท 2018-03-27
Assignee
Inventors
Cpc classification
C04B2235/666
CHEMISTRY; METALLURGY
C04B2235/76
CHEMISTRY; METALLURGY
C04B2235/767
CHEMISTRY; METALLURGY
C04B2235/761
CHEMISTRY; METALLURGY
C04B2235/5445
CHEMISTRY; METALLURGY
C04B2235/5436
CHEMISTRY; METALLURGY
C30B1/10
CHEMISTRY; METALLURGY
International classification
C30B1/10
CHEMISTRY; METALLURGY
C04B35/626
CHEMISTRY; METALLURGY
C04B35/58
CHEMISTRY; METALLURGY
Abstract
The presently disclosed and/or claimed inventive concept(s) relates generally to hexagonal osmium boride, OsB.sub.2, and methods of producing the same. In one non-limiting embodiment, hexagonal OsB.sub.2 is produced by mechanochemical synthesis of osmium and boron in a high energy ball mill.
Claims
1. A composition, comprising OsB.sub.2 having a hexagonal lattice structure, wherein the OsB.sub.2 comprises a P6.sub.3/mmc space group.
2. The composition of claim 1, wherein the hexagonal OsB.sub.2 comprises unit cell dimensions of: (i) a=b=2.911 and c=7.392 ; and (ii) ==90, =120.
3. The composition of claim 1, wherein the hexagonal OsB.sub.2 is in the form of a powder.
4. The composition of claim 3, wherein the hexagonal OsB.sub.2 is stable after annealing the hexagonal OsB.sub.2 for at least 6 days at a temperature of at least 1050 C.
5. The composition of claim 3, wherein the hexagonal OsB.sub.2 is stable at temperatures in a range of from about 223 C. to about 875 C.
6. The composition of claim 5, wherein the hexagonal OsB.sub.2 undergoes negative thermal expansion at a temperature range of from about 300 C. to about 500 C. in the direction of the a lattice parameter.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
(14) Before explaining at least one embodiment of the presently disclosed and/or claimed inventive concept(s) in detail, it is to be understood that the presently disclosed and/or claimed inventive concept(s) is not limited in its application to the details of construction and the arrangement of the components or steps or methodologies set forth in the following description or illustrated in the drawings. The presently disclosed and/or claimed inventive concept(s) is capable of other embodiments or of being practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein is for the purpose of description and should not be regarded as limiting.
(15) Unless otherwise defined herein, technical terms used in connection with the presently disclosed and/or claimed inventive concept(s) shall have the meanings that are commonly understood by those of ordinary skill in the art. Further, unless otherwise required by context, singular terms shall include pluralities and plural terms shall include the singular.
(16) All patents, published patent applications, and non-patent publications mentioned in the specification are indicative of the level of skill of those skilled in the art to which the presently disclosed and/or claimed inventive concept(s) pertains. All patents, published patent applications, and non-patent publications referenced in any portion of this application are herein expressly incorporated by reference in their entirety to the same extent as if each individual patent or publication was specifically and individually indicated to be incorporated by reference.
(17) All of the articles and/or methods disclosed herein can be made and executed without undue experimentation in light of the present disclosure. While the articles and methods of the presently disclosed and/or claimed inventive concept(s) have been described in terms of preferred embodiments, it will be apparent to those of ordinary skill in the art that variations may be applied to the articles and/or methods and in the steps or in the sequence of steps of the method described herein without departing from the concept, spirit and scope of the presently disclosed and/or claimed inventive concept(s). All such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope and concept of the presently disclosed and/or claimed inventive concept(s).
(18) As utilized in accordance with the present disclosure, the following terms, unless otherwise indicated, shall be understood to have the following meanings.
(19) The use of the word a or an when used in conjunction with the term comprising may mean one, but it is also consistent with the meaning of one or more, at least one, and one or more than one. The use of the term or is used to mean and/or unless explicitly indicated to refer to alternatives only if the alternatives are mutually exclusive, although the disclosure supports a definition that refers to only alternatives and and/or. Throughout this application, the term about is used to indicate that a value includes the inherent variation of error for the quantifying device, the method being employed to determine the value, or the variation that exists among the study subjects. For example, but not by way of limitation, when the term about is utilized, the designated value may vary by plus or minus twelve percent, or eleven percent, or ten percent, or nine percent, or eight percent, or seven percent, or six percent, or five percent, or four percent, or three percent, or two percent, or one percent. The use of the term at least one will be understood to include one as well as any quantity more than one, including but not limited to, 1, 2, 3, 4, 5, 10, 15, 20, 30, 40, 50, 100, etc. The term at least one may extend up to 100 or 1000 or more depending on the term to which it is attached. In addition, the quantities of 100/1000 are not to be considered limiting as lower or higher limits may also produce satisfactory results. In addition, the use of the term at least one of X, Y, and Z will be understood to include X alone, Y alone, and Z alone, as well as any combination of X, Y, and Z. The use of ordinal number terminology (i.e., first, second, third, fourth, etc.) is solely for the purpose of differentiating between two or more items and, unless explicitly stated otherwise, is not meant to imply any sequence or order or importance to one item over another or any order of addition.
(20) As used herein, the words comprising (and any form of comprising, such as comprise and comprises), having (and any form of having, such as have and has), including (and any form of including, such as includes and include) or containing (and any form of containing, such as contains and contain) are inclusive or open-ended and do not exclude additional, un-recited elements or method steps.
(21) The term or combinations thereof as used herein refers to all permutations and combinations of the listed items preceding the term. For example, A, B, C, or combinations thereof is intended to include at least one of: A, B, C, AB, AC, BC, or ABC and, if order is important in a particular context, also BA, CA, CB, CBA, BCA, ACB, BAC, or CAB. Continuing with this example, expressly included are combinations that contain repeats of one or more item or term, such as BB, AAA, AAB, BBC, AAABCCCC, CBBAAA, CABABB, and so forth. The skilled artisan will understand that typically there is no limit on the number of items or terms in any combination, unless otherwise apparent from the context.
(22) The terms mechanochemical synthesis and mechanochemical alloying, as well as derivations of such, are used herein to reference a process of strain-induced synthesis of compounds. For example, in one embodiment, mechanochemical synthesis is done in a high energy ball mill, which utilizes both strong elastic and plastic shear deformations during milling to induce solid state chemical reactions at a lower pressure.
(23) Turning now to the presently disclosed and/or claimed inventive concept(s), a new hexagonal crystal structure for OsB.sub.2 is disclosed and/or claimed herein that was previously thought to only exist in the form of a mathematical calculation. The new hexagonal OsB.sub.2 can be used for a variety of applications, ranging from abrasives and cutting tools to protective coatings.
(24) In one embodiment, the hexagonal OsB.sub.2 has a crystallographic structure similar to the hexagonal structure of ReB.sub.2. In a further non-limiting embodiment, the lattice parameters of the hexagonal structure of OsB.sub.2 comprise: lattice constants comprising a=b, wherein a and b are in a range from about 2.90 to about 2.92 , or from about 2.905 to about 2.92 , and c, wherein c is in a range from about 7.3 to about 7.5 , or from about 7.35 to about 7.5 ; angles between the lattice constants comprising ==90, =120; and/or a P6.sub.3/mmc, No. 194 space group. In another embodiment, the lattice parameters of the hexagonal structure of OsB.sub.2 comprise: lattice constants comprising a=b=2.911 and c=7.392 ; angles between the lattice constants comprising ==90, =120; and a P6.sub.3/mmc, No. 194 space group. In yet another embodiment, the lattice parameters of the hexagonal structure of OsB.sub.2 comprise: lattice constants comprising a=b=2.9047 and c=7.450 ; angles between the lattice constants comprising ==90, =120; and a P6.sub.3/mmc, No. 194 space group. In one embodiment, the hexagonal OsB.sub.2 is in the form of a powder. In another non-limiting embodiment, the hexagonal OsB.sub.2 is in a sintered bulk form of hexagonal OsB.sub.2, wherein the hexagonal OsB.sub.2 in a sintered bulk form has lattice constants comprising a=b=2.916 and c=7.376 . In another non-limiting embodiment, the lattice parameters of the hexagonal structure of OsB.sub.2 in a sintered bulk form comprise: lattice constants comprising a=b, wherein a and b are in a range from about 2.90 to about 2.92 , or from about 2.905 to about 2.92 , and c, wherein c is in a range from about 7.3 to about 7.5 , or from about 7.35 to about 7.5 ; angles between the lattice constants comprising ==90, =120; and/or a P6.sub.3/mmc, No. 194 space group. The powdered hexagonal OsB.sub.2 comprises nanoparticles having a diameter of from about 1 to about 20 nm, or from about 1 to about 15 nm, or from about 1 to about 10 nm. The powdered hexagonal OsB.sub.2, however, has a tendency to agglomerate such that the powdered hexagonal OsB.sub.2 comprises agglomerates of the above-described particles having diameters of less than about 100 m, or less than about 50 m, or less than about 30 m, or less than about 10 m.
(25) In an alternative embodiment, the hexagonal OsB.sub.2 is in the sintered bulk form, wherein the powdered hexagonal OsB.sub.2 undergoes densification by sintering the hexagonal OsB.sub.2 powder. In one embodiment, the hexagonal OsB.sub.2 powder undergoes Spark Plasma Sintering at 1550 C. and 50 MPa of pressure for 5 minutes to form sintered OsB.sub.2, wherein the sintered OsB.sub.2 comprises at least 80% by volume of hexagonal OsB.sub.2 and at most 20 wt % by volume of orthorhombic OsB.sub.2. The bulk form of hexagonal OsB.sub.2 has a diameter in a range of from about 0.5 cm to about 5 cm, or from about 1 cm to about 4 cm, or from about 1 cm to about 3 cm, and a thickness of from about 0.2 to about 1 cm, or from about 0.3 to about 0.8 cm, or from about 0.4 cm to about 0.8 cm after sintering.
(26) Additionally, as further described in the examples below, in one embodiment, the hexagonal OsB.sub.2 has a hardness value of about 524 GPa and a Young's modulus in a range of from about 56138 GPa to about 58542 GPa, as calculated by Oliver and Pharr's method from a load-displacement plot produced by a spherical indentor having a radius of 0.222 m and a nanoindentation loading of 8 mN, and also using a Poisson ratio of either 0.18 or 0.27 to calculate the Young's modulus. In a further non-limiting embodiment, the above-described hardness and Young's modulus measurements have a standard deviation of about 10%.
(27) In another embodiment, and also further described in the examples below, the hexagonal OsB.sub.2 has an estimated hardness value of about 34 GPa when calculated using the standard definition of hardness, i.e., dividing an applied load by its indentation contact area, wherein the applied load is provided by a spherical indentor having a radius of 0.222 m. In a further embodiment, the indentation contact area can be measured from SEM micrographs. In another non-limiting embodiment, the estimated hardness of hexagonal OsB.sub.2 is calculated by applying a force of 8 mN to a sintered form of hexagonal OsB.sub.2, wherein the force is applied by a spherical indentor having a radius of 0.222 m and the indentation contact area, as measured by SEM micrographs, is the area of a circle having a diameter of approximately 543.6 nm.
(28) The above-described powdered hexagonal OsB.sub.2 having a P6.sub.3/mmc, No. 194 space group also retains its hexagonal structure at high temperatures. In one embodiment, the above-described powdered hexagonal OsB.sub.2 having a P6.sub.3/mmc, No. 194 space group retains its structure after annealing the hexagonal OsB.sub.2 powder at a temperature of at least 1050 C. in vacuo for at least 6 days. In another embodiment, above-described powdered hexagonal OsB.sub.2 having a P6.sub.3/mmc, No. 194 space group maintains its structure at a temperature in a range of from about 223 C. to about 875 C. In yet another embodiment, the above-described powdered hexagonal OsB.sub.2 having a P6.sub.3/mmc, No. 194 space group maintains its structure at a temperature in a range from of about 223 C. to about 875 C., wherein the unit cell volume decreases at a temperature in a range of from about 300 to about 500 C., indicating a negative thermal expansion of the hexagonal OsB.sub.2 between the above-described temperature range. More specifically, in one non-limiting embodiment, the a lattice parameter of the above-described powdered hexagonal OsB.sub.2 having a P6.sub.3/mmc, No. 194 space group decreases in value at a temperature in a range of from about 300 to 500 C., resulting in negative thermal expansion within the recited temperature range.
(29) The presently disclosed and/or claimed inventive concept(s) is also directed to a method of making hexagonal OsB.sub.2, where in one non-limiting embodiment, the hexagonal OsB.sub.2 has lattice constants comprising a=b, wherein a and b are in a range from about 2.90 to about 2.92 , or from about 2.905 to about 2.92 , and c, wherein c is in a range from about 7.3 to about 7.5 , or from about 7.35 to about 7.5 ; angles between the lattice constants comprising ==90, =120; and/or a P6.sub.3/mmc, No. 194 space group. In another embodiment, the presently disclosed and/or claimed inventive concept(s) is directed to a method of making hexagonal OsB.sub.2 lattice parameters comprising lattice constants of a=b=2.9047 and c=7.4500 ; angles between the lattice constants comprising ==90, =120; and a P6.sub.3/mmc s pace group. In an alternative embodiment, the presently disclosed and/or claimed inventive concept(s) is directed to a method of making hexagonal OsB.sub.2 having lattice parameters comprising lattice constants of a=b=2.911 and c=7.392 ; angles between the lattice constants comprising ==90, =120, and a P6.sub.3/mmc space group.
(30) The method of making the above-described hexagonal OsB.sub.2 comprises the step of mechanochemically reacting osmium and boron. In one embodiment, the osmium and boron are reacted in a high energy ball mill, wherein the ball mill comprises a container comprised of tungsten carbide and milling media comprised of tungsten carbide. The milling media can comprise at least two balls. In another embodiment, the osmium and boron are reacted in a high energy ball mill, wherein the ball mill comprises a container comprised of tungsten carbide and at least two balls comprised of tungsten carbide having diameters of about 12.7 mm. In another embodiment, the container and milling media can comprise a hard metallic and/or ceramic material capable of milling osmium and boron with minimal damage to the media during the media process. In yet another embodiment, the osmium and boron can be reacted in any milling apparatus or otherwise that provides the requisite forces to mechanochemically react the osmium and boron to produce hexagonal OsB.sub.2.
(31) In one embodiment, the method of forming hexagonal OsB.sub.2 comprises the step of mechanochemically reacting osmium and boron, wherein the osmium and boron are in the form of powders and wherein the osmium powder and boron powder are mechochemically reacted for at least 2 hours, or at least 15 hours, or at least 20 hours. The osmium powder and boron powder can be added, in one non-limiting embodiment, at a molar ratio in a range of from about 1:2 to about 1:3, or from about 1:2.5 to 1:3, or from about 1:2.7 to 1:3 osmium powder to boron powders. In one embodiment, the amount of osmium and boron powders is added at about a 5:1 weight ratio, or about a 4:1 weight ratio, or about a 3:1 weight ratio, or about 2.7:1 weight ratio of the balls in the ball mill to the osmium and boron powders.
(32) The presently disclosed and/or claimed inventive concept(s) is also directed to a method of producing a bulk form of the above-described hexagonal OsB.sub.2 powder comprising the step of sintering the above-described hexagonal OsB.sub.2 powder. In one embodiment, the hexagonal OsB.sub.2 is sintered by high temperature Spark Plasma Sintering at a temperature of at least 1550 C. and at a pressure of at least 50 MPa for about 5 minutes. The process of sintering the hexagonal OsB.sub.2 powder reduces the porosity of the powder, densifying the powder into a bulk, or solid, object comprising the hexagonal OsB.sub.2. In another embodiment, the hexagonal OsB.sub.2 is sintered by high temperature Spark Plasma Sintering at a temperature of 1550 C. and at a pressure of 50 MPa for about 5 minutes. In yet another embodiment, the hexagonal OsB.sub.2 is sintered by high temperature Spark Plasma Sintering at a temperature in a range of from about 1400 to about 1450 C. and at a pressure of at least 70 MPa for about 3 minutes.
EXAMPLES
(33) Examples are provided herein below. However, the presently disclosed and/or claimed inventive concept(s) is to be understood to not be limited in its application to the specific experimentation, results, and laboratory procedures disclosed herein below. Rather, the Examples are simply provided as one of various embodiments and are meant to be exemplary and not exhaustive.
(34) The following examples were carried out by mechanochemical synthesis of elemental powder compounds. Specifically, the examples are directed to the mechanical synthesis of powdered OsB.sub.2 from powdered osmium and boron. During the mechanochemical synthesis process, chemical reactions occur between the reactants by deforming the reactants through cold welding, fracturing, and re-welding the reactant particles in a ball mill apparatus. The mechanochemical synthesis is able to occur at or near room temperature, especially when the reactants are in powder form, as a result of the high diffusivity of the particles, low diffusion distances, and increased density of crystalline defects as a result of, for example, ball milling the reactants in a closed container. Large strain on the reactants brings together the highest occupied molecular orbital and the lowest unoccupied molecular orbital to close the gap there between, after which the bonding electrons delocalize into anti-bonding states causing the activation energy for the reaction to fall close to zero. Additionally, localized frictional heating provides the required thermal energy to lower the activation barrier for the hexagonal form of OsB.sub.2 while avoiding dramatic temperature rises from the localized high pressure/high shear interactions. This is because the only heat present in the reaction is provided by reaction enthalpies, which are favored for the reactions involved in mechanically synthesizing OsB.sub.2 from osmium and boron-rich solids. On average, a ball mill for mechanochemically synthesizing OsB.sub.2 from osmium and boron-rich solids is extremely energy efficient, requiring approximately only 100 W of power to produce ten grams of material.
(35) Osmium metal powder (99.95% pure, Heraeus, South Africa) and boron powder (99% pure, 325 mesh, Alfa Aesar) were used for mechanochemical synthesis of hexagonal OsB.sub.2. Both Os and B powders (molar ratio 1:3) were loaded into a vial for a SPEX 8000D ball mill (
(36) After the first 2.5 hours of grinding, a group of peaks, which do not correspond to the orthorhombic OsB.sub.2 structure, are evident in the XRD patterns, as illustrated in
(37) In a second example, the above-described experimental method was used, changing only the ball to powder weight ratio to a ratio of 2.7:1 so that little to no tungsten carbide contamination was detected by XRD analysis after 20 hours of milling. In order to improve crystallinity and remove strain induced during the mechanochemical synthesis, a small quantity of hexagonal OsB.sub.2 was annealed by loading the hexagonal OsB.sub.2 powder into a fused silica ampule, sealed under vacuum, and heated for 6 days at 1050 C. After annealing, a Rigaku (Tokyo, Japan) D/MAX X-Ray Diffractometer with a copper source (Cu K.sub.l=1.5418 ) was once again used to record the XRD patterns. The XRD pattern (
(38) TABLE-US-00001 TABLE 1 Lattice Parameter Data Source a () c () c/a ratio Mechanochemically synthesized 2.905 7.450 2.565 hexagonal OsB.sub.2 ReB.sub.2 2.900 7.478 2.579 Theoretical Calculation for 2.941 7.338 2.495 hexagonal OsB.sub.2
(39) As illustrated by Table 1, the OsB.sub.2 presently disclosed and/or claimed inventive concept(s) herein have a hexagonal lattice similar, but not the same as the hexagonal lattice structure of ReB.sub.2 or the theoretically calculated hexagonal OsB.sub.2. The structure of the synthesized hexagonal OsB.sub.2 unit cell based on the measured lattice parameters is shown in
(40) Small variations, however, are inherent in the measured values of lattice parameters due to diffractometers, including diffractometers of the same X-ray brand, producing slightly different XRD patterns for the same experimental sample. Expected deviations may therefore result from the fact that lattice parameters cannot be read directly from XRD results and require simulations and refinement of the XRD patterns to obtain the lattice constants. The material itself also could have some variations which may lead to slight deviations in the measured value of the lattice constants. For example, sintered hexagonal OsB.sub.2 has slightly different lattice constants than the hexagonal OsB.sub.2 prior to sintering. There are many other factors too that could impact the measured lattice parameters, including the temperature during the XRD measurement, the particle size of the powder, powder film roughness and height, etc. As such, a second XRD pattern was obtained for the hexagonal OsB.sub.2 sample described above, which was assessed to comprise lattice parameters of a=b=2.911 and c=7.392 . Thus, it was determined that the lattice parameters for hexagonal boron can comprise: a=b, wherein a and b are in a range from about 2.90 to about 2.92 , or from about 2.905 to about 2.92 , and c, wherein c is in a range from about 7.3 to about 7.5 ; angles between the lattice constants comprising ==90, =120; and/or a P6.sub.3/mmc, No. 194 space group.
(41) The morphology and grain size of the powders were examined in a Zeiss (Jena, Germany) ULTRA-55 FEG scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscopy (EDS) detector. The irregular shape and size of the agglomerates can also be seen in an SEM image of the powder after 18 hours of milling, as depicted in
(42) A JEOL (Tokyo, Japan) JEM2200FS aberration-corrected scanning transmission electron microscope (STEM) was also used to obtain high-resolution images of the hexagonal OsB.sub.2 nanoparticles and study the atomic arrangement of the hexagonal OsB.sub.2 powder. Characteristic high-angle annular dark-field (HAADF) images of OsB.sub.2 particles are presented in
(43) Additionally, in order to verify the phase stability of the hexagonal OsB.sub.2 structure, the OsB.sub.2 powder was exposed to temperatures in a range between 223 C. and 25 C. in vacuo and temperatures in a range between 25 C. and 875 C. in an argon atmosphere. An X'PERT-PRO Diffractometer system from PANanlytical (Almelo, Netherlands) was used to collect high and low temperature in situ XRD patterns. A change in a and c lattice parameters and unit cell volume as a function temperature are presented in
(44) The high temperature stability of the hexagonal OsB.sub.2 was also analyzed by in situ TEM, wherein the microstructural features of the hexagonal OsB.sub.2 were investigated. The TEM images of a hexagonal OsB.sub.2 particle after high energy ball milling are shown in
(45) The hexagonal OsB.sub.2 powder was also sintered to decrease the porosity of the powder and create a densified, bulk form of the hexagonal OsB.sub.2 powder. More specifically, the hexagonal OsB.sub.2 powder was subjected to a high temperature Spark Plasma Sintering (SPS) process at 1550 C. for 5 minutes of dwell time at 50 MPa applied pressure. However, XRD analysis of the sintered OsB.sub.2 suggested that, after sintering, the OsB.sub.2 comprised a mixture of 80 wt % hexagonal OsB.sub.2 and 20 wt % orthorhombic porous OsB.sub.2 (
(46) Hardness and Young's modulus measurements were then taken on the sintered hexagonal OsB.sub.2 with Hysitron (Minneapolis, Minn.) nanoindenter equipped by a conical indenter with a tip radius of 0.222 m. The Young's modulus were calculated by Oliver and Pharr's method from the unloading part of load-displacement plot depicted in
(47) From the above description, it is clear that the inventive concept(s) disclosed herein is well adapted to carry out the object and to attain the advantages mentioned herein as well as those inherent in the inventive concept(s) disclosed herein. While exemplary embodiments of the inventive concept(s) disclosed herein have been described for purposes of this disclosure, it will be understood that numerous changes may be made which will readily suggest themselves to those skilled in the art which are accomplished without departing from the scope of the inventive concept(s) disclosed herein and defined by the appended claims.