Exchange coupling film, and magnetoresistive sensor and magnetic detector including the same

Abstract

In an exchange coupling film that has a large magnetic field (Hex) in which the direction of magnetization of a fixed magnetic layer is reversed, high stability under high temperature conditions, and excellent strong-magnetic field resistance, an antiferromagnetic layer, a fixed magnetic layer, and a free magnetic layer are stacked, the antiferromagnetic layer is composed of a PtCr layer and an XMn layer (where X is Pt or Ir), the XMn layer is in contact with the fixed magnetic layer, and the fixed magnetic layer is made of iron, cobalt, an iron-cobalt alloy, or an iron-nickel alloy.

Claims

1. An exchange coupling film comprising: a laminate of an antiferromagnetic layer and a fixed magnetic layer, wherein: the antiferromagnetic layer is composed of a PtCr layer consisting of Pt and Cr and an XMn layer (where X is Pt or Ir); the XMn layer is in contact with the fixed magnetic layer; and the fixed magnetic layer comprises one of iron, cobalt, a cobalt-iron alloy, or a nickel-iron alloy.

2. The exchange coupling film according to claim 1, wherein: the PtCr layer has a thickness larger than that of the XMn layer.

3. The exchange coupling film according to claim 2, wherein a ratio of the thickness of the PtCr layer and the thickness of the XMn layer is 5:1 to 100:1.

4. A magnetoresistive sensor comprising: a laminate of the exchange coupling film according to claim 1 and a free magnetic layer.

5. A magnetic detector comprising: a plurality of the magnetoresistive sensors according to claim 4.

6. The magnetic detector according to claim 5, wherein a plurality of the magnetoresistive sensors according to claim 4 are provided on a single substrate; and the plurality of the magnetoresistive sensors include those having different fixed magnetization directions.

7. The exchange coupling film according to claim 1, wherein X in the XMn layer is Pt.

8. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of more than 70 at % and 100 at % or less of Fe and the balance of Co.

9. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of 80 at % or more and 100 at % or less of Fe and the balance of Co.

10. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of 0 at % or more and less than 20 at % of Fe and the balance of Co.

11. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of 0 at % or more and 10 at % or less of Fe and the balance of Co.

12. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of 10 at % or more and 90 at % or less of Fe and the balance of Co.

13. The exchange coupling film according to claim 1, wherein the fixed magnetic layer comprises a metal consisting of 10 at % or more and 20 at % or less of Fe and the balance of Co or a metal consisting of more than 70 at % and 100 at % or less of Fe and the balance of Co.

14. The exchange coupling film according to claim 1, wherein the PtCr layer comprises a metal consisting of 45 at % or more and 62 at % or less of Pt and the balance of Cr.

15. An exchange coupling film comprising: a laminate of an antiferromagnetic layer and a fixed magnetic layer, wherein: the antiferromagnetic layer is composed of a PtCr layer consisting of Pt and Cr and an XMn layer (where X is Pt or Ir); the XMn layer is in contact with the fixed magnetic layer; the fixed magnetic layer has a self-pinned structure composed of a laminate of a first magnetic layer, an intermediate layer, and a second magnetic layer; and the first magnetic layer and the second magnetic layer are comprised of one of iron, cobalt, a cobalt-iron alloy, or a nickel-iron alloy.

16. The exchange coupling film according to claim 15, wherein X in the XMn layer is Pt.

17. The exchange coupling film according to claim 15, wherein the fixed magnetic layer comprises a metal consisting of more than 70 at % and 100 at % or less of Fe and the balance of Co.

18. The exchange coupling film according to claim 15, wherein the fixed magnetic layer comprises a metal consisting of 0 at % or more and less than 20 at % of Fe and the balance of Co.

19. The exchange coupling film according to claim 15, wherein the fixed magnetic layer comprises a metal consisting of 10 at % or more and 20 at % or less of Fe and the balance of Co or a metal consisting of more than 70 at % and 100 at % or less of Fe and the balance of Co.

20. The exchange coupling film according to claim 15, wherein the PtCr layer comprises a metal consisting of 45 at % or more and 62 at % or less of Pt and the balance of Cr.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is an explanatory drawing illustrating the film configuration of an exchange coupling film 10 of a first embodiment of the present invention;

(2) FIG. 2 is an explanatory drawing illustrating the film configuration of an exchange coupling film 20 of a second embodiment of the present invention;

(3) FIG. 3 is the circuit block diagram of a magnetic sensor 30 of an embodiment of the present invention;

(4) FIG. 4 is a planar view illustrating a magnetic detection device 11 used in a magnetic sensor 30;

(5) FIG. 5 is an explanatory drawing of the hysteresis loop of the magnetization curve of an exchange coupling film according to the present invention;

(6) FIG. 6 is an explanatory drawing explaining the film configuration of the exchange coupling films 40 of Examples 1 to 4 and Comparative Examples 1 to 3;

(7) FIG. 7 is a graph showing a relationship between the temperature and the Hex of each of the exchange coupling films of Examples 1 to 4 and Comparative Examples 1 to 3;

(8) FIG. 8 is a graph showing the normalized Hex obtained by dividing the Hex at each temperature of the exchange coupling film of FIG. 7 by the Hex at room temperature;

(9) FIG. 9 is a graph showing the normalized Hex obtained by dividing the Hex at each temperature of each of the exchange coupling films of Examples 1 to 6 by the Hex at room temperature;

(10) FIG. 10 is a graph showing the Hex of each of the exchange coupling films of Examples 7 and 8 and Comparative Example 4;

(11) FIG. 11 is a graph showing the exchange coupling energy of Examples 7 and 8 and Comparative Example 4; and

(12) FIG. 12 is a graph showing a relationship between the Fe amount (at %) in a CoFe alloy and the saturation magnetostriction constant.

DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

First Embodiment

(13) FIG. 1 shows the film configuration of a magnetic detection device 11 using an exchange coupling film 10 according to a first embodiment of the present invention.

(14) The magnetic detection device 11 is formed by stacking a base layer 1, an antiferromagnetic layer 2, a fixed magnetic layer 3, a non-magnetic material layer 4, a free magnetic layer 5, and a protective layer 6 in this order on a surface of a substrate. The antiferromagnetic layer 2 is composed of a PtCr layer 2A and an XMn layer (where X is Pt or Ir) 2B, and the XMn layer 2B is in contact with the fixed magnetic layer 3. Each of these layers is formed by, for example, a sputtering process or a CVD process. The antiferromagnetic layer 2 and the fixed magnetic layer 3 constitute the exchange coupling film 10 of the first embodiment of the present invention.

(15) The magnetic detection device 11 is a laminated device utilizing a so-called giant magnetoresistance effect (GMR effect) of a single spin valve, and the electric resistance changes based on the relative relationship between the fixed magnetization vector of the fixed magnetic layer 3 and the magnetization vector that changes by the external magnetic field of the free magnetic layer 5.

(16) The base layer 1 is formed of, for example, a NiFeCr alloy (nickel-iron-chromium alloy), Cr, or Ta. In the exchange coupling film 10 of the present embodiment, in order to increase the magnetic field (hereinafter, appropriately also referred to as “Hex”) in which the direction of magnetization of the fixed magnetic layer 3 is reversed, a NiFeCr alloy is preferred.

(17) The antiferromagnetic layer 2 has a layered structure composed of a PtCr layer 2A and an XMn layer 2B (where X is Pt or Ir). In order to increase the Hex, the thickness D1 of the PtCr layer 2A in the antiferromagnetic layer 2 is preferably larger than the thickness D2 of the XMn layer 2B. The ratio of the thickness D1 and the thickness D2, D1:D2, is more preferably 5:1 to 100:1 and further preferably 10:1 to 50:1.

(18) From the viewpoint of increasing the Hex, the PtCr layer 2A is preferably made of PtxCr.sub.100-X (X is 45 at % or more and 62 at % or less) and more preferably PtxCr.sub.100-X (X is 50 at % or more and 57 at % or less). From the same viewpoint, XMn layer 2B is preferably a PtMn layer.

(19) In the present embodiment, the antiferromagnetic layer 2 is ordered by annealing treatment to generate exchange coupling with the fixed magnetic layer 3 (at the interface). The Hex of the exchange coupling film 10 is increased by the magnetic field (exchange coupling field) based on the exchange coupling, and the strong-magnetic field resistance is also improved.

(20) The fixed magnetic layer 3 is formed of Fe (iron), Co (cobalt), a CoFe alloy (cobalt-iron alloy), or a NiFe alloy (nickel-iron alloy). The CoFe alloy and the NiFe alloy each increase the coercive force with an increase in the content of Fe. The fixed magnetic layer 3 is a layer contributing to the giant magnetoresistance effect of a spin valve, and the direction in which the fixed magnetization direction P of the fixed magnetic layer 3 extends is the sensitivity axial direction of the magnetic detection device 11.

(21) The exchange coupling film 10 can have a high Hex regardless of the Fe content in the fixed magnetic layer 3. This is because that the antiferromagnetic layer 2 having the above-described layered structure can be exchange coupled with a variety of types of ferromagnetic materials.

(22) FIG. 12 is a graph showing a relationship between the Fe amount (at %) in CoFe alloys and the saturation magnetostriction constant (cited from O. V. Auwers and H. Neumann, Wiss. Veroffentlich, Siemens, 14, 93 (1935)). As shown in this graph, the magnetostriction of CoFe alloys varies depending on the difference in the composition. In the case of a positive saturation magnetostriction constant, when a tensile stress is applied to a magnetic film having a positive magnetostriction constant, the magnetization of the magnetic film tends to be oriented in the direction of the tensile stress by the amount of (magnetostriction constant)×(stress), because the energy decreases by the amount of (magnetostriction constant)×(stress). Since a magnetic film having zero magnetostriction does not cause a difference in energy even if any stress is applied thereto, the stress resistance is high. Since various stresses are applied to the elements of a magnetic sensor, low magnetostriction is preferred in many cases so that the magnetization direction does not change due to the stress.

(23) As described above, from the viewpoint of magnetostriction, the exchange coupling film 10 may be restricted in design. However, when the exchange coupling film 10 uses, for example, a CoFe alloy as the fixed magnetic layer 3, a high Hex is obtained regardless of the composition thereof in a broad Fe content of 0 to 100 at %. Thus, since the exchange coupling film 10 can use a variety of types of metals (specifically, for example, pure iron (Fe) and pure cobalt (Co)) and alloys as the fixed magnetic layer 3, the selection range of the materials that can be used is wide, and it is excellent in that the degree of freedom in design is higher than before.

(24) The non-magnetic material layer 4 can be formed using, for example, Cu (copper) or Ru (ruthenium).

(25) Although the material and structure of the free magnetic layer 5 are not limited, for example, the free magnetic layer 5 can be formed of a CoFe alloy (cobalt-iron alloy) or a NiFe alloy (nickel-iron alloy) and can be formed as a monolayer structure, a layered structure, or a layered ferri structure.

(26) The protective layer 6 can be formed of, for example, Ta (tantalum).

(27) Incidentally, when an alloy layer, such as the PtCr layer 2A of the exchange coupling film 10, is formed, a plurality of metals forming the alloy (Pt and Cr in the case of the PtCr layer 2A) may be simultaneously supplied, or a plurality of metals forming the alloy may be alternately supplied. Examples of the former include co-sputtering of a plurality of metals forming an alloy, and examples of the later include layer-by-layer deposition of different metal layers. In some cases, simultaneous supply of a plurality of metals forming an alloy is preferable than alternate supply for increasing the Hex.

Second Embodiment

(28) FIG. 2 shows an explanatory drawing illustrating the film configuration of a magnetic detection device (magnetoresistive sensor) 21 using an exchange coupling film 20 of a second embodiment of the present invention. In the present embodiment, the layers having the same functions as those of the magnetic detection device 11 shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

(29) The magnetic detection device 21 of the second embodiment shown in FIG. 2 differs from the magnetic detection device 11 of FIG. 1 in that the exchange coupling film 20 is composed of a fixed magnetic layer 3 having a self-pinned structure and an antiferromagnetic layer 2 joined to each other and that a non-magnetic material layer 4 and a free magnetic layer 5 are formed on the base layer 1 side than the fixed magnetic layer 3.

(30) The magnetic detection device 21 is also a laminated device utilizing a so-called giant magnetoresistance effect of a single spin valve. The electric resistance changes based on the relative relationship between the fixed magnetization vector of a first magnetic layer 3A of the fixed magnetic layer 3 and the magnetization vector that changes by the external magnetic field of the free magnetic layer 5.

(31) The fixed magnetic layer 3 has a self-pinned structure composed of the first magnetic layer 3A, a second magnetic layer 3C, and a non-magnetic intermediate layer 3B positioned between these two layers. The fixed magnetization direction P1 of the first magnetic layer 3A and the fixed magnetization direction P2 of the second magnetic layer 3C are antiparallel due to the interaction. The fixed magnetization direction P1 of the first magnetic layer 3A adjacent to the non-magnetic material layer 4 is the fixed magnetization direction of the fixed magnetic layer 3. The direction in which the fixed magnetization direction P1 extends is the sensitivity axial direction of the magnetic detection device 11.

(32) The first magnetic layer 3A and the second magnetic layer 3C are each formed of Fe (iron), Co (cobalt), a CoFe alloy (iron-cobalt alloy) or a NiFe alloy (nickel-iron alloy). The CoFe alloy and the NiFe alloy each increase the coercive force with an increase in the content of Fe. The first magnetic layer 3A adjacent to the non-magnetic material layer 4 is a layer contributing to the giant magnetoresistance effect of a spin valve.

(33) The non-magnetic intermediate layer 3B is formed of, for example, Ru (ruthenium). The non-magnetic intermediate layer 3B made of Ru preferably has a thickness of 3 to 5 angstrom or 8 to 10 angstrom.

(34) The selection range of the materials that can be used as the first magnetic layer 3A and the second magnetic layer 3C in the fixed magnetic layer 3 having a self-pinned structure of the present embodiment is wide, and the degree of freedom in design is higher than before as in the first embodiment. Structure of magnetic sensor

(35) FIG. 3 shows a magnetic sensor (magnetic detector) 30 including the magnetic detection device 11 shown in FIG. 1. In FIG. 3, magnetic detection devices 11 having different fixed magnetization directions P (see FIG. 1) are denoted by 11Xa, 11Xb, 11Ya, and 11Yb, respectively, for distinguishing them. In the magnetic sensor 30, the magnetic detection devices 11Xa, 11Xb, 11Ya, and 11Yb are disposed on a single substrate.

(36) The magnetic sensor 30 shown in FIG. 3 includes a full bridge circuit 32X and a full bridge circuit 32Y, and a plurality of magnetic detection devices 11 (see FIG. 1) are provided on a single substrate. The full bridge circuit 32X includes two magnetic detection devices 11Xa and two magnetic detection devices 11Xb, and the full bridge circuit 32Y includes two magnetic detection devices 11Ya and two magnetic detection devices 11Yb. All of the magnetic detection devices 11Xa, 11Xb, 11Ya, and 11Yb have the same film structure as that of the exchange coupling film 10 of the magnetic detection device 11 shown in FIG. 1. When they are not particularly distinguished, hereinafter, the magnetic detection devices are appropriately referred to as magnetic detection devices 11.

(37) The full bridge circuit 32X and the full bridge circuit 32Y differ from each other in that the magnetic detection devices 11 having different fixed magnetization directions, which are indicated by arrows in FIG. 3, for making the detection magnetic field directions different from each other, but the mechanisms for detecting the magnetic field are the same. Accordingly, a mechanism for detecting a magnetic field using the full bridge circuit 32X will now be described.

(38) The full bridge circuit 32X is configured by connecting a first serial portion 32Xa and a second serial portion 32Xb in parallel. The first serial portion 32Xa is configured by connecting the magnetic detection device 11Xa and the magnetic detection device 11Xb in series, and the second serial portion 32Xb is configured by connecting the magnetic detection device 11Xb and the magnetic detection device 11Xa in series.

(39) A source voltage Vdd is supplied to a power terminal 33 common to the magnetic detection devices 11Xa constituting the first serial portion 32Xa and the magnetic detection devices 11Xb constituting the second serial portion 32Xb. The ground terminal 34 common to the magnetic detection devices 11Xb constituting the first serial portion 32Xa and the magnetic detection devices 11Xa constituting the second serial portion 32Xb is set to the ground potential GND.

(40) The differential output, (OutX1)−(OutX2), between the output potential (OutX1) in the middle point 35Xa of the first serial portion 32Xa constituting the full bridge circuit 32X and the output potential (OutX2) in the middle point 35Xb of the second serial portion 32Xb is obtained as a detection output (detection output voltage) VXs in the X direction.

(41) When the full bridge circuit 32Y also acts similarly as in the full bridge circuit 32X, the differential output, (OutY1)−(OutY2), between the output potential (OutY1) in the middle point 35Ya of the first serial portion 32Ya and the output potential (OutY2) in the middle point 35Yb of the second serial portion 32Yb is obtained as a detection output (detection output voltage) VYs in the Y direction.

(42) As indicated by arrows in FIG. 3, the sensitivity axial directions of each magnetic detection device 11Xa and each magnetic detection device 11Xb constituting the full bridge circuit 32X and the sensitivity axial directions of each magnetic detection device 11Ya and each magnetic detection device 11Yb constituting the full bridge circuit 32Y are orthogonal to each other.

(43) In the magnetic sensor 30 shown in FIG. 3, the direction of the free magnetic layer 5 of each magnetic detection device 11 changes so as to follow the direction of the external magnetic field H. On this occasion, the resistance value changes based on the relationship between the vectors of the fixed magnetization direction P of the fixed magnetic layer 3 and the magnetization direction of the free magnetic layer 5.

(44) For example, when the external magnetic field H acts on the direction shown in FIG. 3, in the magnetic detection device 11Xa constituting the full bridge circuit 32X, since the sensitivity axial direction and the direction of the external magnetic field H are the same, the electric resistance value is reduced. In contrast, in the magnetic detection device 11Xb, since the sensitivity axial direction and the direction of the external magnetic field H are opposite, the electric resistance value is increased. The change in the electric resistance value maximizes the detection output voltage VXs=(OutX1)−(OutX2). As the external magnetic field H changes rightward with respect to the plane of the paper, the detection output voltage VXs decreases. When the external magnetic field H is directed upward or downward with respect to the plane of the paper FIG. 3, the detection output voltage VXs becomes zero.

(45) In contrast, in the full bridge circuit 32Y, when the external magnetic field H is directed leftward with respect to the plane of the paler as shown in FIG. 3, since the direction of magnetization of the free magnetic layer 5 in all of the magnetic detection devices 11 is orthogonal to the sensitivity axial direction (fixed magnetization direction P), the electric resistance values of the magnetic detection device 11Ya and the magnetic detection device 11Xb are the same. Accordingly, the detection output voltage VYs is zero. In FIG. 3, when the external magnetic field H acts downward with respect to the plane of the paper, the detection output voltage VYs=(OutY1)−(OutY2) of the full bridge circuit 32Y is maximized, and as the external magnetic field H changes upward with respect to the plane of the paper, the detection output voltage VYs decreases.

(46) Thus, the change in the direction of the external magnetic field H causes changes in the respective detection output voltages VXs and VYs of the full bridge circuit 32X and the full bridge circuit 32Y. Accordingly, based on the detection output voltages VXs and VYs obtained from the full bridge circuit 32X and the full bridge circuit 32Y, respectively, the direction of movement and the amount of movement (relative position) of a detection object can be detected.

(47) FIG. 3 shows a magnetic sensor 30 that can detect magnetic fields in the X direction and the Y direction orthogonal to the X direction. However, the magnetic sensor 30 may include only the full bridge circuit 32X or the full bridge circuit 32Y that detects a magnetic field in the X direction or the Y direction only.

(48) FIG. 4 shows planar structures of the magnetic detection device 11Xa and the magnetic detection device 11Xb. In FIGS. 3 and 4, the BXa-BXb direction is the X direction. In (A) and (B) of FIG. 4, the fixed magnetization directions P of the magnetic detection devices 11Xa and 11Xb are indicated by the arrows. The fixed magnetization directions P in the magnetic detection device 11Xa and the magnetic detection device 11Xb are the respective X directions and are opposite to each other.

(49) As shown in FIG. 4, the magnetic detection device 11Xa and the magnetic detection device 11Xb include stripe-shaped element portions 12. The element portions 12 each have the longitudinal direction in the BYa-BYb direction. The multiple element portions 12 are arrayed in parallel to each other. The illustrated right edges of adjacent element portions 12 are connected to each other via a conductive portion 13a, and the illustrated left edges of adjacent element portions 12 are connected to each other via a conductive portion 13b. The illustrated right ends and the illustrated left ends of the element portions 12 are alternately connected to the conductive portions 13a and 13b, and the element portions 12 are connected in a so-called meander shape. In the magnetic detection devices 11Xa and 11Xb, the conductive portion 13a illustrated at the lower right portion is united with a joining terminal 14a, and the conductive portion 13b illustrated at the upper left portion is united with a joining terminal 14b.

(50) Each element portion 12 is composed of stacked multiple metal layers (alloy layers). FIG. 1 shows the layered structure of the element portions 12. Incidentally, each element portion 12 may have a layered structure shown in FIG. 2.

(51) In the magnetic sensors 30 shown in FIGS. 3 and 4, it is possible to replace the magnetic detection device 11 with the magnetic detection device 21 of the second embodiment shown in FIG. 2.

(52) FIG. 5 is a graph explaining the hysteresis loop of the magnetization curve of an exchange coupling film according to the present invention. Generally, the hysteresis loop formed by the M-H curve (magnetization curve) of a soft magnetic material has a symmetrical shape around the intersection of the H-axis and the M-axis (external magnetic field H=0 A/m, magnetization M=0 A/m) as the center, as indicated by a dotted line in FIG. 5. However, the hysteresis loop of an exchange coupling film according to the present invention has a shape shifted along the H-axis depending on the size of an exchange coupling field Hex indicated by a solid line in FIG. 5 because the Hex acts on the fixed magnetic layer. The fixed magnetic layer of this exchange coupling film less likely reverses the direction of magnetization with an increase in the Hex, even if an external magnetic field is applied thereto, to improve the strong-magnetic field resistance.

(53) In addition, the exchange coupling film according to the present invention has a large Hex, in particular, in a high-temperature environment by including the antiferromagnetic layer having a structure composed of a PtCr layer and an XMn layer (where X is Pt or Ir). Accordingly, the exchange coupling film according to the present invention has excellent strong-magnetic field resistance in a high-temperature environment.

(54) Furthermore, a large Hex can be obtained between metal materials of a variety of compositions. The exchange coupling field Hex is generated by interaction between an antiferromagnetic layer and a fixed magnetic layer. Under such a circumstance, in the antiferromagnetic layer according to the present invention, the composition of the fixed magnetic layer that can suitably generate an exchange coupling field Hex is diverse and has a wide range. Specifically, not only a cobalt-iron alloy (CoFe alloy) or a nickel-iron alloy (NiFe alloy) but also until iron (Fe) or cobalt (Co) can be used as the material constituting the fixed magnetic layer. Accordingly, the degree of freedom in design of the fixed magnetic layer can be increased. In particular, iron (Fe), cobalt (Co), and alloys (e.g., 90CoFe alloy or 10CoFe alloy) having compositions similar to those of these metals have a low magnetostriction constant compared to alloys (e.g., 40CoFe) having other compositions. Accordingly, when the fixed magnetic layer is made of such a material, a defect in which the direction of magnetization of the exchange coupling field Hex changes due to the stress based on such magnetostriction less likely occurs.

EXAMPLES

(55) FIG. 6 is an explanatory drawing explaining the film configuration of the exchange coupling film 40 of Examples 1 to 4 and Comparative Examples 1 to 3. Exchange coupling films having the configuration shown in the drawing were formed, and the relationship between temperature and Hex was measured.

Example 1

(56) An exchange coupling film 40 having the following configuration was formed and annealed at 350° C. under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2. The numerical values in parentheses in the following Examples and Comparative Examples show the thicknesses (angstrom).

(57) Substrate/base layer 1: NiFeCr (42)/antiferromagnetic layer 2: Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20)/fixed magnetic layer 3: Co.sup.90 at %Fe.sub.10 at % (100)/protective layer 6: Ta (90)

Example 2

(58) An exchange coupling film 40 having the same configuration as that in Example 1 was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Example 3

(59) An exchange coupling film 40 was formed as in Example 1 except that the antiferromagnetic layer 2 was changed to Pt.sub.54 at %Cr.sub.46 at% (280)/Pt.sub.50 at %Mn.sub.50 at % (10) from Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20) and was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Example 4

(60) An exchange coupling film 40 was formed as in Example 1 except that the antiferromagnetic layer 2 was changed to Pt.sub.54 at %Cr.sub.46 at% (280)/Pt.sub.50 at %Mn.sub.50 at % (20) from Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20) and was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Comparative Example 1

(61) An exchange coupling film 40 was formed as in Example 1 except that the antiferromagnetic layer 2 was changed to Pt.sub.50 at %Mn.sub.50 at % (300) from Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20) and was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Comparative Example 2

(62) An exchange coupling film 40 was formed as in Example 1 except that the antiferromagnetic layer 2 was changed to Ir.sub.20 at %/Mn.sub.80 at % (80) from Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20) and was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Comparative Example 3

(63) An exchange coupling film 40 was formed as in Example 1 except that the antiferromagnetic layer 2 was changed to Pt.sub.51 at% Cr.sub.49 at% (300) from Pt.sub.51 at %Cr.sub.49 at % (280)/Pt.sub.50 at %Mn.sub.50 at % (20) and was annealed at 400° C. instead of 350° C. in Example 1 under a magnetic field strength of 1 kOe for 5 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

(64) Regarding the exchange coupling films 40 of Examples 1 to 4 and Comparative Examples 1 to 3, the results of measurement of a change in Hex due to a change in temperature are shown in Tables 1 to 3. Tables 1 to 3 show the exchange coupling field Hex (unit: Oe) determined from a hysteresis loop obtained by measuring the magnetization curve at each temperature of the exchange coupling film according to each of Examples and Comparative Examples with a VSM (vibrating sample magnetometer) and the normalized Hex obtained by dividing the Hex at each temperature by the Hex at room temperature.

(65) TABLE-US-00001 TABLE 1 Example 1 Example 2 Temperature Hex Normalized Temperature Hex Normalized (° C.) (0e) Hex (° C.) (0e) Hex 24 335 1.00 22 400 1.00 40 330 0.99 44 400 1.00 64 330 0.99 63 385 0.96 84 320 0.96 84 385 0.96 104 325 0.97 104 375 0.94 125 310 0.93 124 380 0.95 143 305 0.91 146 360 0.90 163 305 0.91 164 350 0.88 183 295 0.88 185 355 0.89 203 295 0.88 204 345 0.86 223 295 0.88 224 340 0.85 266 285 0.85 266 340 0.85 305 250 0.75 307 305 0.76 344 245 0.73 345 265 0.66 384 205 0.61 385 220 0.55 423 180 0.54 424 165 0.41 462 130 0.39 463 110 0.28 500 50 0.15 500 25 0.06

(66) TABLE-US-00002 TABLE 2 Example 3 Example 4 Temperature Hex Normalized Temperature Hex Normalized (° C.) (0e) Hex (° C.) (0e) Hex 25 485 1.00 22 530 1.00 42 485 1.00 42 540 1.02 66 485 1.00 63 525 0.99 85 483 0.99 84 540 1.02 104 480 0.99 104 525 0.99 124 480 0.99 125 510 0.96 145 478 0.98 144 510 0.96 165 478 0.98 165 500 0.94 185 470 0.97 184 480 0.91 205 475 0.98 204 480 0.91 224 470 0.97 224 475 0.90 268 453 0.93 268 465 0.88 283 435 0.90 — — — 302 415 0.86 305 425 0.80 345 350 0.72 345 395 0.75 385 280 0.58 385 365 0.69 423 198 0.41 424 275 0.52 462 110 0.23 463 165 0.31 500 20 0.04 500  50 0.09

(67) TABLE-US-00003 TABLE 3 Comparative Example 1 Comparative Example 2 Comparative Example 3 Temperature Hex Normalized Temperature Hex Normalized Temperature Hex Normalized (° C.) (0e) Hex (° C.) (0e) Hex (° C.) (0e) Hex 22 278 1.00 22 83 1.00 24 118 1.00 42 278 1.00 42 79 0.95 48 116 0.99 64 270 0.97 64 76 0.92 64 116 0.99 84 273 0.98 84 73 0.88 83 119 1.01 104 265 0.95 104 65 0.79 104 120 1.02 124 258 0.93 124 63 0.76 125 119 1.01 145 250 0.90 144 55 0.67 145 118 1.00 163 240 0.86 165 50 0.61 164 118 1.00 185 233 0.84 181 46 0.56 184 115 0.98 204 228 0.82 201 38 0.45 204 113 0.96 224 213 0.77 220 34 0.41 240 108 0.91 255 165 0.59 259 14 0.17 286 96 0.82 304 98 0.35 304 0 0.00 326 60 0.51 344 45 0.16 — — — — — — 362 40 0.14 — — — 363 34 0.29 403 5 0.02 — — — 403 18 0.15 422 0 0.00 — — — 422 10 0.09 — — — — — — 460 3.5 0.03 — — — — — — 500 2.5 0.02

(68) FIG. 7 is a graph showing a relationship between the temperature and the Hex of each of the exchange coupling films 40 of Examples 1 to 4 and Comparative Examples 1 to 3. As shown in the graph of FIG. 7 summarizing Tables 1 to 3, in the exchange coupling films 40 of Examples 1 to 4, the Hex value under high-temperature conditions was high.

(69) FIG. 8 is a graph showing the normalized Hex obtained by dividing the Hex at each temperature of the exchange coupling film of FIG. 7 by the Hex at room temperature. As shown by the graph, in the exchange coupling films 40 of Examples 1 to 4, the Hex in a high-temperature environment of 300° C. was about 75% to 85% of the Hex at room temperature. Thus, the reduction rate of the Hex from that at room temperature was small.

(70) As shown by the graphs of FIGS. 7 and 8, the exchange coupling films 40 of Examples 1 to 4 including a PtCr layer and a PtMn layer as the antiferromagnetic layer 2 had high Hex values under room temperature and high-temperature conditions, and the reduction rate of the Hex due to an increase in temperature was small, compared to the exchange coupling films 40 of Comparative Examples 1 to 3 including an antiferromagnetic layer 2 made of a PtMn, IrMn, or PtCr layer only.

Example 5

(71) An exchange coupling film having the following configuration was formed and annealed at 350° C. under a magnetic field strength of 1 kOe for 20 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

(72) Substrate/base layer 1: NiFeCr (42)/non-magnetic material layer 4: [Cu (40)/Ru (10)]/fixed magnetic layer 3: Co.sub.60 at %Fe.sub.40 at % (100)/antiferromagnetic layer 2: Pt.sub.50 at %Mn.sub.50 at % (12)/Pt.sub.51 at %Cr.sub.49 at % (280)/protective layer 6: Ta(90)

Example 6

(73) An exchange coupling film was formed as in Example 5 except that the antiferromagnetic layer 2 was changed to Pt.sub.50 at %Mn.sub.50 at % (18)/Pt.sub.51 at %Cr.sub.49 at % (280) from Pt.sub.50 at %Mn.sub.50 at % (12)/Pt.sub.51 at %Cr.sub.49 at % (280) and was annealed at 350° C. under a magnetic field strength of 1 kOe for 20 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2 as in Example 5.

(74) Regarding the exchange coupling films of Examples 5 and 6, Table 4 shows the normalized Hex obtained by measuring the exchange coupling field Hex (unit: Oe) with a VSM (vibrating sample magnetometer) and dividing it by the Hex at room temperature.

(75) TABLE-US-00004 TABLE 4 Example 5 Example 6 Temperature Normalized Temperature Normalized (° C.) Hex (° C.) Hex 22 1.00 22 1.00 63 1.00 68 0.97 106 0.97 108 0.93 123 0.97 125 0.90 145 0.95 145 0.89 165 0.93 166 0.88 183 0.89 184 0.83 202 0.87 204 0.82 220 0.85 224 0.79 262 0.80 265 0.74 306 0.75 305 0.66 341 0.68 344 0.60 382 0.61 382 0.51 421 0.52 422 0.38 462 0.37 462 0.19 — — 481 0.08 500 0.15 500 0.03

(76) FIG. 9 is a graph showing the normalized Hex obtained by dividing the Hex at each temperature of each of the exchange coupling films of Examples 1 to 6 by the Hex at room temperature. As shown by the graph summarizing the results of Table 4, in Examples 5 and 6 using Co.sub.60 at %Fe.sub.40 at % as the fixed magnetic layer 3, the high-temperature stability was good as in Examples 1 to 4 using Co.sub.90 at %Fe.sub.10 at % as the fixed magnetic layer 3.

Example 7

(77) Exchange coupling films having the following configuration were formed by changing the Fe amount X (at %) in the fixed magnetic layer 3 to 0, 10, 20, 30, 40, 50, 60, 70, 80, 90, and 100 and were annealed at 350° C. under magnetic field strength of 1 kOe for 20 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

(78) Substrate/base layer 1: NiFeCr (40)/non-magnetic intermediate layer 4: [Cu (40)/Ru (10)]/fixed magnetic layer 3: Co.sub.(100-X at %)Fe.sub.X at % (50)/antiferromagnetic layer 2: Pt.sub.48 at %Mn.sub.52 at %(20)/Pt.sub.51 at %Cr.sub.49 at % (280)/protective layer 6: Ta (50)

Example 8

(79) An exchange coupling film was formed as in Example 7 and was annealed at 400° C. instead of 350° C. in Example 7 under a magnetic field strength of 1 kOe for 20 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

Comparative Example 4

(80) Exchange coupling films having the following configuration were formed by changing the Fe amount X (at %) in the fixed magnetic layer 3 to 0, 10, 20, 30, 40, 50, 60, 70, 80, 90, and 100 and were annealed at 350° C. under magnetic field strength of 1 kOe for 20 hours to fix the magnetization of the fixed magnetic layer 3 and the antiferromagnetic layer 2.

(81) Substrate/base layer 1: NiFeCr (40)/non-magnetic intermediate layer 4: [Cu (40)/Ru (10)]/fixed magnetic layer 3: Co.sub.(100-X at %)Fe.sub.X at % (50)/antiferromagnetic layer 2: Ir.sub.22 at %Mn.sub.78 at % (80)/protective layer 6: Ta (50)

(82) Regarding the exchange coupling films of Examples 7 and 8 and Comparative Example 4, Table 5 shows the results of measurement of the exchange coupling field Hex (unit: Oe) with a VSM (vibrating sample magnetometer), and Table 6 shows the exchange coupling energy per unit area (erg/cm.sup.2).

(83) TABLE-US-00005 TABLE 5 Hex (exchange coupling field, Oe) Comparative Example 7 Example 8 Example 4 Annealing Annealing Annealing Fe amount in layer temperature temperature temperature (at %) 350° C. 400° C. 350° C. 0 325 725 41 10 413 825 63 20 388 838 82 30 538 875 182 40 488 870 174 50 513 850 155 60 475 875 150 70 425 863 135 80 413 838 90 90 425 813 75 100 338 400 68

(84) TABLE-US-00006 TABLE 6 Exchange coupling energy (erg/cm.sup.2) Comparative Example 7 Example 8 Example 4 Annealing Annealing Annealing Fe amount in layer temperature temperature temperature (at %) 350° C. 400° C. 350° C. 0 0.26 0.55 0.03 10 0.34 0.60 0.04 20 0.34 0.65 0.06 30 0.54 0.74 0.16 40 0.52 0.76 0.17 50 0.55 0.82 0.16 60 0.51 0.82 0.15 70 0.48 0.85 0.13 80 0.43 0.74 0.09 90 0.42 0.69 0.07 100 0.32 0.32 0.07

(85) FIGS. 10 and 11 are graphs showing the exchange coupling field Hex (Oe) and the exchange coupling energy (erg/cm.sup.2) of the exchange coupling films of Examples 7 and 8 and Comparative Example 4. As shown by the graphs summarizing Tables 5 and 6, it was demonstrated that the exchange coupling film using Pt.sub.48 at %Mn.sub.52 at % (20)/Pt.sub.51 at %Cr.sub.49 at % (280) as the antiferromagnetic layer 2 had high exchange coupling field Hex and exchange coupling energy even if Co.sub.(100-X at %)Fe.sub.X at % (50) (X=0 to 100) was used as the fixed magnetic layer 3. Thus, when an antiferromagnetic layer 2 composed of a PtCr layer and an XMn layer (where X is Pt or Ir) is used, an exchange coupling film 10 having a high exchange coupling field Hex can be obtained using a variety of metals as the fixed magnetic layer 3. Accordingly, since a CoFe alloy that is used as the fixed magnetic layer 3 can be determined by giving priority to, for example, properties such as magnetostriction, the exchange coupling film 10 has a high degree of freedom in design.