METHOD AND MACHINE FOR EXAMINING WAFERS

Abstract

Method and machine utilizes the real-time recipe to perform weak point inspection on a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same lot. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

Claims

1-10. (canceled)

11. A method of inspecting a wafer, comprising: determining an inspecting plan according to a critical area to define an inspection area on the wafer; examining the wafer with a high resolution imaging tool; identifying defects in the inspection area according to at least one image taken by said high resolution imaging tool; and updating a defect wafer map for storing in a database.

12. The method of claim 11, wherein the inspecting plan is constructed by a smart review sampling filter.

13. The method of claim 11, wherein the high resolution imaging tool contains a SORIL objective lens.

14. The method of claim 11, wherein the defect is identified by a universal detect identification unit.

15. The method of claim 11, wherein the defect wafer map comprises at least one of the following: a possible defect location within a die or a device provided by a prediction of a numerical simulation; a verified result of a previous inspection output of other defect scanning tool; and a historical wafer map result collected from a previous wafer that experienced all fabrication processes.

16. The method of claim 11, wherein the critical area comprises a possible defect location.

17. The method of claim 16, wherein the possible defect location comprises a forerunner to defects.

18. The method of claim 11, further comprising determining the critical area based on a prediction of a numerical simulation.

19. The method of claim 11, further comprising determining the critical area based on a result of image processing.

20. The method of claim 11, further comprising determining the critical area based on analysis of signatures of the wafer.

21. The method of claim 20, wherein the analysis uses a GDS file.

22. The method of claim 11, wherein the inspecting plan is determined based on at least one of the following: product information identifying a feature based on a semiconductor fabrication process; and detecting parameters that instruct the high resolution imaging tool what to do in the inspection area.

23. The method of claim 11, wherein the inspecting plan comprises instructions configured to cause the high resolution imaging tool to examine the wafer only in the critical area instead of the whole wafer.

24. The method of claim 11, further comprising determining a similarity between a wafer map representing the wafer and another wafer map stored in the database; in response to the similarity exceeding a threshold, setting a wafer map flag value to a first value, otherwise setting the wafer map flag value to a second value; and constructing the inspecting plan when the wafer map flag is the first value, otherwise constructing the inspecting plan according to full wafer inspection, wherein the inspecting plan covers only a defect inspection area indicated by the other wafer map from the database.

25. An apparatus comprising: a load/unload assembly configured to receive a lot including a wafer; a memory storing a set of instructions; and a processor configured to execute the set of instructions to cause the apparatus to: construct an inspecting plan for inspecting the wafer according to a critical area to define an inspection area on the wafer; acquire at least one image of the wafer with a high resolution imaging tool; identify defects in said inspection area according to the at least one image; and classify the defects and update a defect wafer map for storing in a database.

26. The apparatus of claim 25, wherein the inspecting plan is constructed by a smart review sampling filter.

27. The apparatus of claim 25, wherein said high resolution imaging tool contains a SORIL objective lens.

28. The apparatus of claim 25, wherein the defects are identified by a universal defect identification unit.

29. The apparatus of claim 25, wherein the defect wafer map comprises at least one of the following: a possible defect location within a die or a device provided by a prediction of a numerical simulation; a verified result of a previous inspection output of other defect scanning tool; and a historical wafer map result collected from a previous wafer that experienced all fabrication processes.

30. A non-transitory computer readable medium that stores a set of instructions that is executable by at least one processor of an apparatus to cause the apparatus to perform a method for inspecting a wafer, the method comprising: determining an inspecting plan according to a critical area to define an inspection area on the wafer; examining the wafer with a high resolution imaging tool; identifying defects in the inspection area according to at least one image taken by said high resolution imaging tool; and updating a defect wafer map for storing in a database.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a schematic diagram illustration of a prior art imaging unit.

[0029] FIG. 2 is a schematic diagram illustration of a prior art defect finding algorism.

[0030] FIG. 3 is schematic diagram illustration of an inspection tool structure for examining wafers in accordance with an embodiment of present invention.

[0031] FIG. 4 is a schematic diagram illustration of a flowchart to perform weak point inspection in accordance with an embodiment of present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0032] Reference will now be made in detail to specific embodiments of the invention. Examples of these embodiments are illustrated in accompanying drawings. While the invention will be described in conjunction with these specific embodiments, it will be understood that it is not intended to limit the invention to these embodiments. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims. In the following description, numerous specific details are set forth in order to provide a through understanding of the present invention. The present invention may be practiced without some or all of these specific details. In other instances, well known process operations are not described in detail in order not to unnecessarily obscure the present invention.

[0033] Terminology definition: [0034] in the present invention examine a wafer implies the wafer is inspected by a charged particle beam system after the wafer experienced a semiconductor fabrication process in a process tool. [0035] In the present invention a lot of wafer implies a group of semiconductor wafers that will experience a semiconductor fabrication process with a same process tool as a batch or one wafer at a time. The number of wafers within a lot maybe one or several wafers in a wafer cassette, or more than one cassette. Typically, one cassette may contain at most 25 200-mm wafers or 13 300-mm wafers. [0036] In the present invention hot spot of a wafer of a semiconductor process implies a possible defect location within a die or a device provided by a prediction of a numerical simulation, a verified result of a previous inspection output of other defect scanning tool (e.g., a klarf file), and a historical wafer map result collected from previous wafers which experienced all fabrication processes. [0037] In the present invention weak point of a wafer implies a defect clustering area which is illustrated through wafer map analysis. [0038] In the present invention a scanning electron microscope (SEM) will be use as an example to express a charged particle beam system.

[0039] Wafer inspection tools help semiconductor manufacturer increase and maintain ICs yield. The IC industry employs inspection tools to detect defects that occur during the fabrication process. The important characteristics of an inspection tool are defect detection sensitivity and wafer throughput. Sensitivity to detect a defect and wafer throughput are coupled such that greater sensitivity usually means lower throughput.

[0040] An scanning electron microscope (SEM) based inspection tool, for example, has an inspection probe spot diameter of 100 nm and a pixel rate of 12.5 million pixels per sec (Mpps), has a throughput of 0.05 300-mm wafers per hour (wph). A throughput at this level can not bear to do a full wafer inspection after a fabrication process. In order to perform valuable tool time to inspect critical position, a hot spot inspection and or a weak point inspection with a high resolution charged particle beam inspection tool is developed. FIG. 1 illustrates a SEM-based high resolution defect inspection/review tool with a swing objective retarding immersion lens (SORIL) developed by Chen et al. (U.S. Pat. No. 7,960,697), all of which is incorporated herein by reference. The beam tube 150 and the immersion magnetic field objective lens 182 provide high image resolution imaging unit for the present invention. The EDS detector 172 added to the modified SORIL 180 also provides an ability of identifying composition of defects.

[0041] U.S. patent application Ser. No. 13/303,953 in titled of Smart Defect Review for Semiconductor Integrated Circuit by Wang el al., filed in Nov. 23, 2011, all of which is incorporated herein by reference. As shown in FIG. 200, the present invention adopted the smart sampling review filter 240 algorism developed by Wang et al. to set up a defect inspection or defect review plan, which instruct the inspection/review tool to locate defects from a confined area instead of the whole wafer based on previous loaded information. The present invention also adopted the universal defect identification unit 250 algorism to identify defects through image comparison developed by Wang, et al.

[0042] Hot spot information of a specific semiconductor fabrication process with a specific processing tool maybe come from numerical simulation, wafer map analysis, and output file from other defect scanning tool. A recipe is constructed for a SEM-base defect inspection/review tool to instruct tire tool perform defect inspection/review on those hot spot positions, to examine the possible defect positions with high resolution, to classify the real defect according to the defect shape, size, physical characteristics, and fabrication process. A wafer weak point map illustrates real defect distribution can be constructed after perform wafer map analysis according to the output of SEM-based defect review. Base on the result of the defect inspection/review tool, a fab manager can recommend corrective actions to the corresponding process or processing tool thereafter improve the yield of the fabrication process.

[0043] For a semiconductor fabrication process or processing tool that without previous experience to determine wafer hot spot, one embodiment of the present invention to set up the inspection/review tool's own weak point map according to the inspection/review result of previous wafers. FIG. 3 illustrates a block diagram describing the key composition of the tool that performs weak point inspection in the present invention. Block 301 the wafer load/unload assembly which consists with the loading unit 220 of FIG. 2: block 302 the recipe assembly which consists with the smart review sampling filter 240 of FIG. 2; block 303 the examining assembly which consists with the imaging unit 100 of FIG. 2; block 304 the defect-finding algorism which consists with the universal defect identification unit 250 of FIG. 2; block 305 the data management algorism which consists with the combination of two function block data classification 260 and data export 270 of FIG. 2. A wafer map regarding defect distribution is constructed at the block 305.

[0044] FIG. 4 illustrates a flowchart to perform the self weak point inspection according to one embodiment of the present invention. A lot of wafers is sent to the defect inspection/review tool 100 (will be refer as tool 100 here since) and a wafer is loaded. The recipe will check if a wafer map already exists in database regarding the loaded wafer, if the answer is no, the wafer is undergoing a full wafer inspection, a full wafer inspection plan is setup accordingly as the step 430 and 434 illustrated in FIG. 4. If the answer is yes, the wafer map is loaded from database and a weak point inspection plan is setup to cover the defect located area according to the wafer map indicates (step 420, and step 424). The step 422 is for checking if the information of wafer map can represent the incoming wafer or not. If the answer is no, the recipe will back to step 430 and perform a full inspection for the loaded wafer, if the answer is yes then the recipe will perform step 424 to set up an inspection plan only to cover the critical area that indicates by the wafer map.

[0045] The tool 100 will identify defects in step 440 using algorithm of the universal defect locating unit 250. There are several methods can be chosen for defect identification. Three points comparison method, the method identify defects by comparing images acquired from three different positions and mark error (defect) on the one deviate from the other two images. Die to golden die, the method identify defects by comparing images acquired from one die of the loaded wafer and a golden die to distinguish if a defect exists, where the golden die is refer to a perfect die without any defects. Die to design database or die to database, the method identify defects by comparing images acquired from a layout for a die or device of the loaded wafer and the original layout for a else or device on the design database.

[0046] The following step 450 is wafer mapping, this step records defects and its die/wafer location to database. The defect classification information such as defect type, size of the defect, composition of the defect if applied, process history of the wafer, coordinates on the wafer, location of the die (local coordinates), and etc., are recorded. After wafer mapping, the tool 100 compares found defects position on the current wafer map and the previous wafer map. If the defects' position consistency is over 99% then set flag=1. Flag=1 indicates that the wafer map can pretty much represent the defect clustering area of a wafer in this lot and a weak point inspection plan setup according to this wafer map may cover most of the defect clustering area. If the defects' position consistency is less than 90% then set flag=0. Flag=0 indicates next wafer will perform full wafer inspection again to accumulate defect distribution information. The tool 100 utilizes the smart review sampling algorithm 240 to construct the weak point inspection plan to save inspection time when Flag is set to 1.

[0047] Step 460 releases the wafer after inspection and in step 470 the recipe will request next wafer within the lot if there is any, the recipe will end the batch job in step 480 if no more wafer need to be inspected within the lot.

[0048] It is because the information of the new discovered defect within the specified area will be updated to the wafer map database, therefore the weak point algorism of the present invention has self-learning ability. Since the inspecting area of the next wafer loaded is varied according to the previous inspection results, in another words, the recipe of the inspection is varied in each inspection process.

[0049] The first advantage of the present invention is increasing throughput by focusing inspection area on critical or weak point area on the wafer. The second advantage of the present invention is that knowledge learned will accumulate automatically onto the database.

[0050] Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that other modifications and variation can be made without departing the spirit and scope of the invention as hereafter claimed.