METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD AND REAR VIEW DEVICE

Abstract

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

Claims

1. A method of manufacturing a printed circuit board, comprising: manufacturing a plurality of plastic substrate parts in an injection molding process to form one or more first substrate parts each comprising at least one coupling means and one or more second substrate parts each comprising at least one receiving means to receive the coupling means; selecting and connecting at least two of the substrate parts through the at least one coupling means and the at least one receiving means; and providing the connected substrate parts with a circuit.

2. The method of claim 1, further comprising forming at least one of the first and second substrate parts with at least one further structural element.

3. The method of claim 2, further comprising: providing a mold complementary to a form of the plurality of plastic substrate parts, the mold comprising at least one of the coupling means, receiving means and further structural element; injecting a polymer mass into the mold; cooling and unmolding a resulting substrate part such that at least one of the coupling means, the receiving means and the further structural element is formed with its respective substrate part in a single step of injection molding.

4. The method of claim 2, further comprising providing a mold complementary to a form of the plurality of plastic substrate parts; inserting at least one element forming at least part of the at least one of the coupling means, receiving means and further structural element into the mold before injecting the polymer mass; and cooling and unmolding a resulting substrate part such that at least one of the coupling means, the receiving means and the further structural element is formed with its respective substrate part.

5. The method of claim 2, wherein the at least one further structure element comprises at least one of a connector or a fastener for affixing the printed circuit board to other components, a positioning element, a guiding element, and a functional element for increasing mechanical stability of the printed circuit board.

6. The method of claim 1, wherein the plurality of plastic substrate parts are not manufactured from FR4 epoxy glass.

7. The method of claim 1, wherein the plurality of plastic substrate parts are manufactured from a resin.

8. The method of claim 5, wherein at least one of the coupling means, the further structural element, and the guiding element is configured to facilitate the connection of two substrate parts.

9. The method of claim 2, wherein at least one of the coupling means and the further structural element is configured to be coupled to or received by a receiving means of another substrate element.

10. The method of claim 1, wherein the coupling means is formed as a clip element, a tongue, or a hook, and the receiving means is formed as a slot, lug, pocket, recess, or undercut.

11. The method of claim 2, wherein the further structural element is formed as a further coupling element or a clip connector.

12. The method of claim 2, wherein the further structural element is formed as a positioning element, a positioning pin, or a groove.

13. The method of claim 2, wherein the further structural element is formed as a bracing element, a ridge, or a ligament.

14. The method of claim 2, wherein the further structural element is formed as a heat sink for dissipating thermal energy from the printed circuit board.

15. The method of claim 14, wherein the heat sink is thermally coupled to the printed circuit board as a whole or to individual regions of the printed circuit board which have a particularly high heat generation during operation.

16. The method of claim 14, further comprising forming the heat sink by providing a metal sheet or copper foil, coating the metal sheet or copper foil during an injection molding process, and thermally connecting the metal sheet to the circuit.

17. The method of claim 14, further comprising forming the heat sink by providing the heat sink as an inlay, or a separate part which is covered with polymer mass, during an injection molding process.

18. The method of claim 14, wherein the heat sink is formed concomitantly with the circuit, by applying metallic coating forming the conductor tracks during the step of providing the circuit.

19. The method of claim 1, wherein the at least one coupling means comprises a frictional connection, double friction surfaces, a positive locking keyed portion, an adhesive force, or a laser weld.

20. The method of claim 1, wherein each of the plurality of plastic substrates is formed with a surface suited for application of the circuit after the selecting and connecting step of the at least two substrate parts.

21. The method of claim 1, wherein the circuit is applied by laser direct structuring (LDS), a molded interconnection device (MID) method, or printing.

22. The method of claim 2, wherein the further structural element is configured to facilitate at least one of the application of the circuit by smoothening transitions, compensating relative movements between connected substrate parts, and compensating tolerances of substrate parts dimensions.

23. The method of claim 1, wherein the circuit element of the one or more first substrate parts is connected to the circuit element of the one or more second substrate parts by soldering and soldering points are placed in regions of transitions between two connected substrate parts.

24. The method of claim 23, wherein an amount of soldering substrate material is adapted to the transitions and two tension points are provided.

25. The method of claim 1, wherein a layout of the circuit can be optimized depending on a type and amount of connected substrate parts.

26. The method of claim 1, further comprising forming at least one drill hole or bore into the connected substrate parts and at least partly filling with soldering material during the application of the circuit to enhance heat transfer to a heat sink.

27. The method of claim 1, wherein the plurality of plastic substrate parts are molded with a hole or a bore.

28. The method of claim 1, wherein the plurality of plastic substrate parts are at least partly flexible.

29. A printed circuit board, comprising: a plurality of plastic substrate parts comprising one or more first substrate parts each comprising at least one coupling means; and one or more second substrate parts each comprising at least one receiving means to receive the coupling means, wherein at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means, and the connected substrate parts comprise a circuit.

30. The printed circuit board of claim 29, wherein at least one of the plurality of plastic substrate parts is formed with at least one further structural element.

31. The printed circuit board of claim 30, wherein the at least one further structural element comprises at least one of a connector or a fastener for affixing the printed circuit board to other components, a positioning element, a guiding element, and a functional element for increasing mechanical stability of the printed circuit board.

32. The printed circuit board of claim 29, wherein the plurality of plastic substrate parts are not manufactured from FR4 epoxy glass.

33. The printed circuit board of claim 29, wherein the plurality of plastic substrate parts are manufactured from a resin.

34. The printed circuit board of claim 31, wherein at least one of the coupling means, the further structural element, and the guiding element is configured to facilitate the connection of two substrate parts.

35. The printed circuit board of claim 30, wherein at least one of the coupling means and the further structural element is configured to be coupled to or received by a receiving means of another substrate element.

36. The printed circuit board of claim 29, wherein the coupling means comprises a clip element, a tongue, or a hook, and the receiving means comprises a slot, lug, pocket, recess, or undercut.

37. The printed circuit board of claim 30, wherein the further structural element comprises a further coupling element or a clip connector.

38. The printed circuit board of claim 30, wherein the further structural element comprises a positioning element, a positioning pin, or a groove.

39. The printed circuit board of claim 30, wherein the further structural element comprises a bracing element, a ridge, or a ligament.

40. The printed circuit board of claim 30, wherein the further structural element comprises a heat sink for dissipating thermal energy from the printed circuit board.

41. The printed circuit board of claim 40, wherein the heat sink is thermally coupled to the printed circuit board as a whole or to individual regions of the printed circuit board which have a particularly high heat generation during operation.

42. The printed circuit board of claim 40, wherein the heat sink comprises a metal sheet or copper foil thermally connected to the circuit.

43. The printed circuit board of claim 29, wherein the at least one coupling means comprises a frictional connection, double friction surfaces, a positive locking keyed portion, an adhesive force, or a laser weld.

44. The printed circuit board of claim 29, wherein each of the plurality of plastic substrates comprises a surface suited for application of the circuit.

45. The printed circuit board of claim 30, wherein the further structural element is configured to facilitate at least one of the application of the circuit by smoothening transitions, compensating relative movements between connected substrate parts, or compensating tolerances of substrate parts dimensions.

46. The printed circuit board of claim 29, wherein the circuit element of the one or more first substrate parts is connected to the circuit element of the one or more second substrate parts by soldering and soldering points are placed in regions of transitions between two connected substrate parts.

47. The printed circuit board of claim 46, wherein an amount of soldering substrate material is adapted to the transitions and two tension points are provided.

48. The printed circuit board of claim 29, wherein a layout of the circuit can be optimized depending on a type and amount of connected substrate parts.

49. The printed circuit board of claim 29, wherein the printed circuit board comprises at least one drill hole or bore which is configured to be filled with soldering material during the application of the circuit to enhance heat transfer to a heat sink.

50. The printed circuit board of claim 29, wherein the plurality of plastic substrate parts are molded with a hole or a bore.

51. The printed circuit board of claim 29, wherein the plurality of plastic substrate parts are at least partly flexible.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG. 1 is a diagram illustrating a first printed circuit board body.

[0035] FIG. 2 is a diagram illustrating a second printed circuit board body.

[0036] FIG. 3 is a diagram illustrating an example of a printed circuit board.

[0037] FIG. 4 is a diagram illustrating another example of a printed circuit board body.

[0038] FIG. 5 is a diagram illustrating yet another example of a printed circuit board body.

[0039] FIG. 6 is a diagram illustrating a side view of a further example of a printed circuited body with additional connecting elements.

DETAILED DESCRIPTION

[0040] The present invention will now be described with occasional reference to the specific embodiments of the invention. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for describing particular embodiments only and is not intended to be limiting of the invention. As used in the description of the invention and the appended claims, the singular forms a, an, and the are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0042] Unless otherwise indicated, all numbers expressing quantities of dimensions such as length, width, height, and so forth as used in the specification and claims are to be understood as being modified in all instances by the term about. Accordingly, unless otherwise indicated, the numerical properties set forth in the specification and claims are approximations that may vary depending on the desired properties sought to be obtained in embodiments of the present invention. Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the invention are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical values, however, inherently contain certain errors necessarily resulting from error found in their respective measurements.

[0043] FIG. 1 is a diagram illustrating a first printed circuit board body.

[0044] Referring to the example illustrated in FIG. 1, a first printed circuit board body 10a includes a first substrate part 2a having coupling means 4a and a first circuit part 8a, which are already arranged on the first substrate part 2a. According to the invention, however, either of the first circuit part 8a and coupling means 4a can be arranged by known techniques even after the assembly of two or more substrate parts.

[0045] The first printed circuit board body 10a shown in the embodiment of FIG. 1 includes only one coupling means 4a, but it can also include additional coupling means or corresponding receiving means such that any number of printed circuit board bodies having the same, similar or different layouts can be connected with each other.

[0046] FIG. 2 is a diagram illustrating a second printed circuit board body.

[0047] Referring to the example illustrated in FIG. 2, a second printed circuit board body 10b includes a second substrate part 2b having receiving means 4b and a second circuit part 8b. The receiving means 4b of the second printed circuit board body 10b is designed such that it can be detachably connected with the receiving means 4a of the first printed circuit board body 10a in a positive locking way. A complementary shaped key or portion is one example of a positive locking coupling mode.

[0048] When the first printed circuit board body 10a is joined with the second printed circuit board body 10b, the coupling means 4a and the receiving means 4b engage with each other such that they are positively locked with each other. In another example, the coupling means 4a and the receiving means 4b can have different forms and do not need to completely engage with each other. In particular, the printed circuit board bodies 10a, 10b can contact each other only partly or only at the contact points of the coupling means and the receiving means 4a, 4b.

[0049] FIG. 3 is a diagram illustrating an example of a printed circuit board.

[0050] Referring to FIG. 3, a printed circuit board 10 includes the first printed circuit board body 10a and the second printed circuit board body 10b. The first and the second printed circuit board bodies 10a, 10b are positively locked with each other by the coupling means 4a and the receiving means 4b of the two substrate parts 2b, 2b. Moreover, both circuit parts 8a, 8b are conductively connected with each other. As a result, there is a printed circuit board 10 with a substrate 2 including two substrate parts 2a, 2b and one circuit 8 including two circuit parts 8a, 8b.

[0051] In one exemplary embodiment the second printed circuit board body 10b can provide a power supply, whereas the first printed circuit board body 10a can be provided with loads such as sensors, motors, lamps or corresponding control units, which are to be connected to the power supply. In the exemplary case of a rear view device for a motor vehicle, a mirror can have a larger or smaller number of electrical loads, depending on the vehicle's trim level. A power supply on a printed circuit board body can be designed such that it can be used for two or more trim levels, i.e. power can be supplied to a varying number of loads.

[0052] Furthermore, a plurality of printed circuit board bodies, in particular each including at least one coupling means and at least one receiving means, can have a circuit with a continuously conductive structure, which is preferably available both at the coupling means and the receiving means. Additional printed circuit board bodies attached to it can thus be connected to this continuously conductive structure. For example, a timing and/or data line and/or a power supply can be used in the conductive structures of a plurality of printed circuit board bodies. The power supply provided by one printed circuit board body can, for example, be used for loads on a plurality of printed circuit board bodies.

[0053] In an example, the coupling and receiving may have different designs or shapes such that only those coupling and receiving means with matching designs or shapes can be connected with each other to create a useful connection of the conductive structures.

[0054] In an example of manufacturing a rear view device, such as a motor vehicle rear view mirror or a display, a housing may be provided. This can be a known housing of a vehicle rear view mirror. Then a first printed circuit board body 10a having at least one coupling means 4a and a second printed circuit board body 10b having at least one receiving means 4b may be provided. The first printed circuit board body 10a is fastened by means of the coupling means 4a to the second printed circuit board body 10b by means of the receiving means 4b. This fastening can be a releasable or a permanent connection. Furthermore, a circuit 8 is fastened to the first printed circuit board body 10a by means of a first circuit part 8a and to the second printed circuit board body 10b by means of a second circuit part 8b. The circuit 8 can optionally be arranged on a first substrate part 2a of the first printed circuit board body 10a and on a second substrate part 2b of the second printed circuit board body 10b by way of laser direct structuring. As mentioned above, the circuit 8 can be an electrically conductive structure. Electric circuits and/or loads can also be arranged on the printed circuit board bodies.

[0055] In some embodiments, at least a portion of the electrical circuit 8 extends to an edge of the a substrate part, and includes one or more contact surfaces for making electrical connections to other portions of the electrical circuit 8 that are on an adjacent substrate portion. For example, the electrical connections of the circuit 8 may pass through the coupling means area of the substrates. In this way, the complete circuit may span multiple substrate parts.

[0056] FIGS. 4-6 are diagrams illustrating other examples of printed circuit boards.

[0057] Referring to FIGS. 4-6, the coupling means 4a of the first substrate part 2a can be formed as a clip to be inserted into an opening forming the receiving part 4b of the second substrate part 2b. The coupling means may include a hook-like or clip-like fastening element 12, which, upon connection of the first substrate part 2a to the second substrate part 2b hooks into a complementary receptor 14 of the receiving part 4b.

[0058] Additionally, the second substrate part 2b includes a heat sink 16, as illustrated in FIG. 4. The heat sink 16 can be provided as a thin metal sheet or foil which is inserted into an injection molding form before forming the second substrate part 2b by injecting a polymer mass into the mold. To thermally connect the heat sink 16 to the circuitry, a hole can be drilled through the body of the second substrate part and filled with solder, thus providing a connection with high thermal conductivity between the heat sink 16 and the circuitry.

[0059] FIG. 4 also shows a surface 22a, 22b of each substrate part 2a, 2b, respectively, which is suited for the application of a circuit (not shown) as soon as the two substrate parts 2a, 2b are connected by inserting the clip-like fastening element 12 into a slot like receiving part 4b.

[0060] FIG. 5 shows another embodiment with the coupling means 4a of the first substrate part 2a being in form of clips 12 and the complementary receiving portion 4b being provided as a pocket 14 within the second substrate part 2b.

[0061] Furthermore, as shown in FIG. 6, any substrate part 2 can include further connecting elements 18. In the embodiment shown in the figure, the connecting elements 18 include a body portion 20 and a hook portion 22. Both the body portion 20 and the hook portion 22 can be formed during the injection molding process. In another example, it is possible to provide the hook portion as an inlay which is embedded in the plastic of the substrate part body during injection molding as described for the heat sink 16. The connecting elements 18 can, for example, be used to fasten the substrate part 2 to a casing, a base plate or similar structural elements.

[0062] It is further possible to provide additional structural elements, such as reinforcing or bracing ribs, different forms of connecting elements and the like.

[0063] As soon as the first and second substrate parts 2a and 2b of one of the embodiments of FIGS. 4, 5 and 6 have been connected with each other, a not shown circuit can be applied on the respective surfaces 22a, 22b, for example, by a laser direct structuring method. In order to enhance stability as well as life period, soldering points can be added to the connection regions of the substrate parts 2a, 2b.

[0064] The principle and mode of operation of the invention has been described in certain embodiments. However, it should be noted that the invention may be practiced in other embodiments than those specifically illustrated and described without departing from its scope.