SLIPRING BRUSH COMPRISING STRUCTURED WIRES
20180069362 · 2018-03-08
Inventors
Cpc classification
C25D15/02
CHEMISTRY; METALLURGY
H01R43/28
ELECTRICITY
Y10T29/49194
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01R39/10
ELECTRICITY
B23K26/364
PERFORMING OPERATIONS; TRANSPORTING
B21C37/045
PERFORMING OPERATIONS; TRANSPORTING
H01R39/24
ELECTRICITY
International classification
Abstract
A method for making contact wires for sliprings comprising the steps of: coating and/or plating a wire with a first metal of the group of nickel, chrome or a combination thereof; coating and/or plating the wire with a second metal of the group of gold, silver, or a combination thereof; delivering laser radiation and generating an interference pattern of the laser radiation to the surface of the wire; heating the surface selectively as defined by the interference pattern, modifying of the crystal structure and/or providing protrusions and/or recesses due to melting and/or evaporation of the surface material.
Claims
1. A method for making contact wires for sliprings, the method comprising the steps of: a. pulling a wire through a drawing die, thereby impressing a surface structure into the wire; b. processing the wire by at least one of (i) coating and (ii) plating the wire with a first metal comprising at least one of nickel and chrome; and c. further processing the wire by at least one of (a) coating and (b) plating the wire with a second metal comprising at least one of gold and silver.
2. A method for making contact wires for sliprings, the method comprising the steps of: a. processing a wire by at least one of (i) coating and (ii) plating the wire with a first metal comprising at least one of nickel and chrome; b. further processing the wire by at least one of (a) coating and (b) plating the wire with a second metal comprising gold and silver; c. delivering laser radiation to an outer surface of the wire to generate an interference pattern of the laser radiation thereon; d. heating the outer surface selectively as defined by the interference pattern; and e. carrying out at least one of (i) modifying a crystal structure of a surface material, (ii) providing protrusions and/or recesses at the outer surface of the wire due to at least one of melting and evaporation of the surface material.
3. The method according to claim 2, by selectively applying the laser radiation to predetermined sections of the outer surface of the wire.
4. The method according to claim 2, wherein steps c, d, and e. are carried out before any of steps a. and b.;
5. The method according to claim 2, wherein steps c., d., and e. are carried out after any of steps a. and b.
6. A device for manufacturing of structured contact wires for sliprings, the device comprising a drawing die having protrusions and recesses, and a drive means for pulling a wire through the drawing die.
7. A device for manufacturing of structured contact wires for sliprings, the device comprising: at least one laser source configured to generate at least one laser beam; at least one beam-splitter configured to split the at least one laser beam into at least two partial beams; at least one optical component configured to interact with the at least two partial beams by one or more of deflecting, guiding, and collimating said at least two partial beams to redirect said at least two partical beams to a focus spot; and at least one transport means configured to handle a contact wire by one or more of transporting, guiding, and holding the contact wire at the focus spot.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In the following, the invention will be described by way of examples, and without limitation of the general inventive concept, based on embodiments and with reference to the drawings.
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[0036] While various modifications and alternative forms of implementation of the idea of the invention are within the scope of the invention, specific embodiments thereof are shown by way of example in the drawings and are described below in detail. It should be understood, however, that the drawings and related detailed description are not intended to limit the implementation of the idea if the invention to any particular form disclosed in this application, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present invention as defined by the appended claims.
DETAILED DESCRIPTION
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[0046] Specifically for manufacturing the embodiments of
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[0057] It will be appreciated by those skilled in the art having the benefit of this disclosure that implementations of this invention are directed to provide structured wires for sliprings and a method for manufacturing of such wires. Further modifications and alternative embodiments of various aspects of the invention will be apparent to those skilled in the art in view of this description. Accordingly, this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the general manner of carrying out the invention. It is to be understood that the forms of the invention shown and described herein are to be taken as the presently preferred embodiments. Elements and materials may be substituted for those illustrated and described herein, parts and processes may be reversed, and certain features of the invention may be utilized independently, all as would be apparent to one skilled in the art after having the benefit of this description of the invention. Changes may be made in the elements described herein without departing from the spirit and scope of the invention as described in the following claims.
LIST OF REFERENCE NUMERALS
[0058] 100 brush block [0059] 110 insulating body [0060] 121 soldering connection [0061] 122 soldering connection [0062] 160 slipring module [0063] 161 sliding track [0064] 162 insulating body [0065] 165 center axis [0066] 201 contact wire [0067] 202 contact wire [0068] 211 contact area [0069] 212 contact area [0070] 300 first contact wire embodiment [0071] 301, 302, 303 linear structures [0072] 310 second contact wire embodiment [0073] 311, 312, 313, 314 spiral structures [0074] 320 third contact wire embodiment [0075] 321, 322, 323, 324 spiral dots [0076] 330 fourth contact wire embodiment [0077] 331 fine linear structures [0078] 340 fifth contact wire embodiment [0079] 341 fine spiral structures [0080] 350 sixth contact wire embodiment [0081] 351 fine dotted structures [0082] 360 seventh contact wire embodiment [0083] 361 micropattern [0084] 370 eighth contact wire embodiment [0085] 371 microstructures [0086] 380 contact wire embodiment [0087] 381 core material [0088] 382 half circumference section [0089] 390 contact wire embodiment [0090] 391 core material [0091] 392 90 degree section [0092] 400 contact wire embodiment [0093] 401 core material [0094] 402, 403 45 degrees sections [0095] 410 contact wire [0096] 411 wire body [0097] 412 structured area [0098] 420 sliding brush [0099] 421 contact wire core [0100] 422, 423 structured areas [0101] 440 contact brush [0102] 441 brush core [0103] 442 inner layer [0104] 443 outer layer [0105] 601 laser [0106] 602 laser beam [0107] 610 splitting mirror [0108] 611 first partial beam [0109] 612 second partial beam [0110] 615 mirror [0111] 620 first beam lens [0112] 621 second beam lens [0113] 630 focus spot [0114] 650 spool storing unstructured wire [0115] 651 spool storing structured wire [0116] 800 drawing die [0117] 801 inner opening [0118] 802 protrusions [0119] 803 recesses