Laminated body

Abstract

The present invention relates to a laminated body containing at least (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, in which the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer and the substrate by sputtering using a reactive sputtering gas, and the second metal layer is constituted by an oxide or nitride of a Cu alloy containing at least Zn.

Claims

1. A laminated body comprising at least: (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, wherein the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer and the substrate by sputtering using a reactive sputtering gas, wherein the second metal layer is constituted by an oxide or nitride of a Cu alloy comprising at least Zn.

2. The laminated body according to claim 1, wherein the second metal layer is overlaid both on the surface of the first metal layer opposite to the substrate and between the first metal layer and the substrate so as to sandwich the first metal layer without interposing the substrate.

3. The laminated body according to claim 1, wherein the first metal layer is constituted by a Cu alloy, and the Cu alloy has a composition comprising Zn and at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr, with the balance being Cu and inevitable impurities.

4. The laminated body according to claim 3, wherein the Cu alloy constituting the first metal layer has a composition comprising Zn in a content of from 0.1 at % to 10 at % and comprising the at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr in a total content of from 0.1 at % to 6 at %, with the balance being Cu and inevitable impurities.

5. The laminated body according to claim 1, wherein the first metal layer has an electric resistivity of 8.0 .Math.cm or less.

6. The laminated body according to claim 1, wherein the first metal layer is in close contact with the transparent substrate or/and the second metal layer, and a degree of adhesion therebetween is classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999.

7. The laminated body according to claim 1, wherein the second metal layer is formed by sputtering using a target material, and the target material is composed of a Cu alloy having a composition comprising Zn with the balance being Cu and inevitable impurities, or a Cu alloy having a composition comprising Zn and at least one element selected from the group consisting of Al, Ti, Sn, and Ni, with the balance being Cu and inevitable impurities.

8. The laminated body according to claim 1, wherein the second metal layer has a composition comprising Zn in a content of from 0.1 at % to less than 25 at %, with the balance being Cu, and O or N, and inevitable impurities.

9. The laminated body according to claim 1, wherein the second metal layer has a composition comprising Zn in a content of from 0.1 at % to less than 25 at % and at least one element selected from the group consisting of Al, Ti, Sn, and Ni in a total content of from 0.1 at % to less than 15 at %, with the balance being Cu, and O or N, and inevitable impurities.

10. The laminated body according to claim 7, wherein the second metal layer is in close contact with the transparent substrate or/and the first metal layer, and a degree of adhesion therebetween is classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1A is a view illustrating a laminated body of an embodiment of the present invention.

(2) FIG. 1B is a view illustrating a laminated body of another embodiment of the present invention.

(3) FIG. 2A is a view illustrating a laminated body of further another embodiment of the present invention.

(4) FIG. 2B is a view illustrating a laminated body of further another embodiment of the present invention.

(5) FIG. 3 is an explanatory view illustrating a production procedure of the laminated body 10 of FIG. 1A.

(6) FIG. 4A is an explanatory view illustrating production procedures of the laminated body 20 of FIG. 1B.

(7) FIG. 4B is an explanatory view illustrating production procedures of the laminated body 22 of FIG. 2A.

(8) FIG. 5A is a view illustrating an example of a laminate structure of an essential part of a touch panel sensor.

(9) FIG. 5B is a view illustrating another example of a laminate structure of an essential part of a touch panel sensor.

(10) FIG. 5C is a view illustrating further another example of a laminate structure of an essential part of a touch panel sensor.

(11) FIG. 6A is a view illustrating further another example of a laminate structure of an essential part of a touch panel sensor.

(12) FIG. 6B is a view illustrating further another example of a laminate structure of an essential part of a touch panel sensor.

(13) FIG. 6C is a view illustrating further another example of a laminate structure of an essential part of a touch panel sensor.

DETAILED DESCRIPTION OF THE INVENTION

(14) The following will describe embodiments of the present invention in detail.

(15) In FIG. 1A, the numeral 10A indicates one example of the laminated body of the present invention.

(16) In the drawings, 12 is a transparent substrate and on one surface (upper surface in the drawing) of the substrate 12 is overlaid a first metal layer 14 that forms an electrode in a film form over the whole surface of the substrate 12. Further, on the surface opposite to the substrate 12, i.e., the upper surface, in the drawing, of the first metal layer 14 is overlaid a second metal layer 16 to be a dark color layer by lamination.

(17) The second metal layer 16 is also formed in a film form over the whole surface of the first metal layer 14.

(18) The transparent substrate 12 may be formed of glass such as soda lime glass and also may be formed of a resin material such as polyethylene terephthalate (PET), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polycarbonate (PC), polymethyl methacrylate (PMMA), or polyimide (PI). As the resin material, polyethylene terephthalate (PET) is preferred.

(19) The thickness of the substrate 12 is desirably within the range of from 10 m to 10 mm and more preferably from 100 m to 1 mm.

(20) The first metal layer 14 preferably has such high conductivity that electric resistivity is 8.0 .Math.cm or less, and as a material for achieving such high conductivity, use can be made of a Cu alloy. Moreover, as the Cu alloy, preferable is a Cu alloy having a composition containing Zn and at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr, with the balance being Cu and inevitable impurities. The lower limit of the electric resistivity is not particularly limited, but may be 1.7 .Math.cm or more.

(21) When the Cu alloy containing an element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr (hereinafter sometimes referred to as M element) together with Zn is subjected to a thermal treatment at a predetermined temperature (at from 50 C. to 320 C., preferably at from 100 C. to 200 C.), the M element is thickened in the periphery of the interface of the substrate and also Zn, which is difficult to thicken alone, is thickened in the periphery of the interface. Since Zn having high affinity with oxygen is thickened in the interface, the degree of adhesion between the Cu alloy and the transparent substrate 12 increases. This effect is particularly remarkable when a polyethylene terephthalate (PET) resin is used as the substrate 12.

(22) According to this embodiment, it is possible to omit an intervention of an extra adhesive layer between the substrate 12 and the first metal layer 14.

(23) For enhancing the bonding properties sufficiently, the above Cu alloy is desirably formed as an alloy containing Zn in a content of from 0.1 at % to 10 at % and containing the M element, i.e., at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr in a total content of from 0.1 at % to 6 at %.

(24) For omitting the adhesive layer between the first metal layer 14 and the substrate 12 and between the first metal layer 14 and the second metal layer 16, the degree of adhesion between the first metal layer 14 and the substrate 12 or/and the second metal layer 16 is desirably classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999.

(25) With regard to thickness, the first metal layer 14 is desirably formed in a thickness of from 10 nm to 1 m and more preferably from 50 nm to 500 nm.

(26) The second metal layer 16 to be a dark color layer is overlaid on the upper surface, in the drawing, of the first metal layer 14 by reactive sputtering.

(27) Since the second metal layer 16 is a layer for the purpose of eliminating the metal luster on the upper surface of the first metal layer 14 to darken it, light reflectance of the second metal layer is suppressed to 20% or less.

(28) In the present embodiment, the second metal layer 16 is formed of an oxide or nitride of a Cu alloy containing at least Zn by using reactive sputtering.

(29) Here, the reason why the reflectance is controlled to 20% or less is that, as the reflectance of 20% being a border, light reflection by the extra-fine metal lines to be mentioned later can be hardly felt and good visibility for the display part of a touch panel can be secured when the reflectance is 20% or less.

(30) The second metal layer 16 as a dark color layer desirably has a light reflectance of 15% or less.

(31) As a target material for forming the second metal layer 16, use can be made of various metals as long as they are metals having darkening ability. However, for having the darkening function and enhancing the bonding properties with the first metal layer 14 or/and with the substrate 12 (cases of FIG. 1B and the like to be mentioned later), it is desired to use a Cu alloy containing Zn as a target material.

(32) The thickness of the second metal layer 16 is desirably in the range of from 5 nm to 1 m and more preferably from 10 nm to 500 nm.

(33) In this case, the second metal layer can be formed by sputtering using a target material of a Cu alloy having a composition containing Zn with the balance being Cu and inevitable impurities, or a Cu alloy having a composition containing Zn and at least one element selected from the group consisting of Al, Ti, Sn, and Ni, with the balance being Cu and inevitable impurities.

(34) In the case where the Cu alloy of the target material has a composition containing Zn with the balance being Cu and inevitable impurities, it is preferable that the obtained second metal layer has a composition containing Zn in a content of from 0.1 at % to less than 25 at %, with the balance being Cu, and O or N, and inevitable impurities.

(35) In the case where the Cu alloy of the target material has a composition containing Zn and at least one element selected from the group consisting of Al, Ti, Sn, and Ni, with the balance being Cu and inevitable impurities, it is preferable that the obtained second metal layer has a composition containing Zn in a content of from 0.1 at % to less than 25 at % and at least one element selected from the group consisting of Al, Ti, Sn, and Ni in a total content of from 0.1 at % to less than 15 at %, with the balance being Cu, and O or N, and inevitable impurities.

(36) The degree of adhesion between the second metal layer 16 and the transparent substrate 12 or/and the first metal layer 14 is desirably classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999.

(37) The laminated body 10A is used as an element for a touch panel sensor actually through processing it. The numeral 10 indicates a laminated body after the processing.

(38) In the laminated body 10 after processing, an excessive portion of the film-form first metal layer 14 in the laminated body 10A before processing is removed and a large number of extra-fine lines S1 alone remain as the first metal layer 14. The remaining extra-fine lines S1 are paralleled one another to form stripe-shaped pattern electrodes 14D.

(39) Also with regard to the second metal layer 16, an excessive portion is removed and only the portion covering the upper surface, in the drawing, of the extra-fine lines S1 is allowed to remain as extra-fine lines S2. They have a function of absorbing light entering into the upper surface, in the drawing, of the extra-fine lines S1 to suppress the reflection of the light from the extra-fine lines S1.

(40) Both of the laminated bodies 10A and 10 in FIG. 1A in this embodiment are included in the concept of the laminated body of the present invention. The same shall apply to the laminated bodies 20A and 20 in FIG. 1B, laminated bodies 22A and 22 in FIG. 2A, and laminated bodies 24A and 24 in FIG. 2B, which are to be described later.

(41) In the laminated body 10, most of the light entering from the outside from the second metal layer 16 side toward the substrate 12 side are absorbed by the second metal layer 16 that is a dark color layer, specifically by the extra-fine lines S2, to thereby suppress the reflection from the first metal layer 14, i.e., the extra-fine lines S1 of the electrodes 14D.

(42) Therefore, the visibility for an indication on a display device is substantially not impaired due to the reflection of the light from the electrodes 14D composed of a large number of extra-fine lines S1 and thus good visibility can be secured.

(43) In the laminated body 10, the line width of the extra-fine lines S1 (also of the extra-fine lines S2) is desirably within the range of from 0.5 m to 20 m, more preferably from 1 m to 10 m and further preferably 1 m to 5 m.

(44) FIG. 3 illustrates a process example of a procedure for producing the laminated body 10 via the laminated body 10A.

(45) As illustrated in the drawings, at the production of the laminated body 10, on the upper surface of the transparent substrate 12, the first metal layer 14 is first overlaid in a film form over the whole surface of the substrate 12 by non-reactive sputtering using a gas not reactive with a target material as a sputtering gas, as illustrated in (I) and (II) of FIG. 3.

(46) Subsequently, as illustrated in (III) of FIG. 3, on the upper surface of the first metal layer 14, the second metal layer 16 is overlaid in a film form over the whole surface of the first metal layer 14 by reactive sputtering using O.sub.2 or N.sub.2 gas.

(47) Thereafter, a photosensitive resist 18 is applied over the whole surface of the upper surface of the second metal layer 16 in a film form, light exposure is performed on the resist 18 only on non-removal portions of the second metal layer 16 and the first metal layer 14, to cure the resist 18 on the non-removal portions to remain, and the resist 18 on the other portions are removed, as illustrated in (IV) of FIG. 3. Thereafter, as illustrated in (V) of FIG. 3, etching is performed to remove portions of the first metal layer 14 and the second metal layer 16, which are not masked with the resist 18. Finally, the resist 18 is removed, thereby obtaining the laminated body 10, as illustrated in (VI) of FIG. 3.

(48) This is just an example of the production process. In this example, a so-called wet-etching method is used but it is also possible to use a dry-etching method instead.

(49) In FIG. 1B, the numeral 20A indicates an example of another embodiment of the laminated body in the present invention.

(50) In the laminated body 20A, the second metal layer 16 is formed between the first metal layer 14 and the transparent substrate 12.

(51) Also in the laminated body 20A, the first metal layer 14 and the second metal layer 16 are both formed in a film form by sputtering.

(52) Of these, the second metal layer 16 is formed by reactive sputtering using O.sub.2 or N.sub.2 gas that reacts with the target material as a sputtering gas, as described in the above.

(53) The numeral 20 is a laminated body in a form that the laminated body 20A is processed so as to be used as an element for an actual touch panel sensor. In the laminated body 20, the first metal layer 14 and the second metal layer 16 are partly removed except for necessary portions.

(54) The remaining portions of the first metal layer 14 extend one another in parallel as a large number of metal extra-fine lines S1 to form stripe-shaped pattern electrodes 14D.

(55) Similarly, also as for the second metal layer 16, other excessive portions are removed except for the portions of the extra-fine lines S1 and the extra-fine lines S2 of the remaining portions cover the lower surface, in the drawing, of the extra-fine lines S1 of the first metal layer 14, specifically, of the electrodes 14D.

(56) The laminated body 20 of FIG. 1B can be used with disposing by turning its orientation illustrated in the drawing upside down, at the application to a touch panel sensor,

(57) When it is used as such, the light entering upward from the lower side in the drawing, which is to be a viewing side, can be absorbed by the second metal layer 16, specifically by the extra-fine lines S2, to thereby suppress the reflection of the incident light on the electrodes D14, to downward in the drawing.

(58) Accordingly, the impairment of visibility for the display part due to the metal-made electrodes D14 can be substantially prevented.

(59) The laminated body 20 can be also used with disposing it in an orientation as illustrated in FIG. 1B, at the application to a touch panel sensor.

(60) In the case of disposing it in such a manner, the upward outgoing light from the display part of a display device positioned below in the drawing is absorbed by the second metal layer 16, so that the impairment of visibility caused by reflecting the outgoing light to downward, returning the reflection light to the display device side, and projecting the returning light in the displaying portion can be substantially prevented.

(61) The laminated bodies 20A and 20 can be produced in fundamentally the same procedures as described above. FIG. 4A illustrates an example of the process.

(62) In FIG. 2A, the numeral 22A indicates an example of further another embodiment of the laminated body of the present invention.

(63) In the laminated body 22A, the transparent substrate 12, the second metal layer 16, the first metal layer 14, and the second metal layer 16 are formed in this order upward from a lower side in the drawing.

(64) That is, in the laminated body 22A of this example, the second metal layer 16 to be a dark color layer is formed on the upper surface in the drawing, opposite to the substrate 12, of the first metal layer 14 and also the same second metal layer 16 to be a dark color layer is formed on the lower side of the first metal layer 14, i.e., between the first metal layer 14 and the substrate 12.

(65) In the laminated body 22A, the first metal layer 14 is formed in a film form over the whole surface of the substrate 12 and furthermore, the second metal layer 16 is also formed in a film form over the whole surface of the first metal layer 14.

(66) On the other hand, in the laminated body 22, as for the first metal layer 14, excessive portions are removed with remaining necessary portions and the remaining large number of extra-fine lines S1 are paralleled one another to form stripe-shaped pattern electrodes 14D. Similarly, corresponding to this, also as for the second metal layer 16, the extra-fine lines S2 cover the first metal layer 14, specifically the upper surface and lower surface, in the drawing, of the extra-fine lines S1 of the electrodes 14D to suppress the reflection of upward light and downward light, in the drawing, by the electrodes 14D (extra-fine lines S1).

(67) The laminated body 22 of this example can satisfactorily absorb both of the downward incident light from the upper outside in the drawing and the light emitted upward from the lower display device to enter into the laminated body 22 and thus it can suppress upward reflection and downward reflection in the drawing, when the laminated body is disposed on an upper surface side of a display device in an orientation as illustrated in FIG. 2A, at the application to a touch panel sensor.

(68) Accordingly, even in the case of using the electrodes 14D composed of the metal lines, good visibility for the display part can be secured.

(69) The laminated bodies 22A and 22 of FIG. 2A can be produced in fundamentally the same process as described above. FIG. 4B specifically illustrates the process.

(70) In FIG. 2B, the numeral 24A illustrates an example of further another form of the laminated body of the present invention.

(71) The laminated body 24A of this example is an example in which the first metal layers 14-1 and 14-2 are provided on both of one surface side and the other surface side of the transparent substrate 12, respectively.

(72) The laminated body 24 is obtained by processing the laminated body 24A. In the laminated body 24, to the extra-fine lines S1 constituting one electrodes 14-1D, extra-fine lines S1 constituting the other electrodes 14-2D extend in an orthogonal orientation, and they form a grid-like pattern in plan view as a whole.

(73) That is, the one electrodes 14-1D is configured as X-side electrodes extending to an X-axis direction and the other electrodes 14-2D is configured as Y-side electrodes extending to a Y-axis direction.

(74) Therefore, in the laminated body 24, an operation performed by an operator can be detected and specified as a two-dimensional position information.

(75) Moreover, the laminated body 24 can satisfactorily absorb both of the downward incident light from an upper side in the drawing and the upward incident light from a lower side in the drawing, and thus it can prevent the impairment of visibility resulting from much reflection of the incident light.

(76) FIG. 5A, FIG. 5B and FIG. 5C illustrate examples of a laminate structure of an essential portion of a touch panel sensor.

(77) The example of FIG. 5A has a structure in which the transparent substrate 12, the second metal layer 16 as a dark color layer, the Y-side electrodes 14-2D composed of the first metal layer, the second metal layer 16, the second metal layer 16, the X-side electrodes 14-1D composed of the first metal layer, the second metal layer 16, and the transparent substrate 12 are formed upward from a lower side in the drawing.

(78) The laminated body 26 of this example can be configured by overlaying two laminated bodies 22 illustrated in FIG. 2A disposing so that the electrodes 14D (to be 14-1D and 14-2D) face each other in an orthogonal manner, and adhering these two laminated bodies with each other by using an optical adhesive layer (OCA) 27.

(79) The laminated body 26 can absorb the light entering downward from an upper side in the drawing toward the electrode 14-1D by the second metal layer 16 on the upper surface, in the drawing, of the electrode 14-1D, and thus it can suppress the reflection by the electrode 14-1D.

(80) Also, the laminated body 26 can absorb the light entering upward from a lower side in the drawing toward the electrode 14-1D by the second metal layer 16 on the lower surface, in the drawing, of the electrode 14-1D, and thus it can suppress the reflection by the electrode 14-1D.

(81) On the other hand, as for the light entering downward from the upper side in the drawing toward the electrode 14-2D, the light is absorbed by the second metal layer 16 on the upper surface of the electrode 14-2D and thus the upward reflection by the electrode 14-2D can be suppressed.

(82) Also, as for the light entering upward from the lower side in the drawing toward the electrode 14-2D, the light is absorbed by the second metal layer 16 on the lower surface of the electrode 14-2D and thus the downward reflection by the electrode 14-2D can be suppressed.

(83) That is, in the case where the laminated body 26 is disposed on an upper side of the display device placed on a lower side in the drawing, irrespective of the upward or downward direction of the orientation of the laminated body 26, the reflection by the metal-made electrodes can be effectively suppressed for any of the external light entering downward from an upper side in the drawing and the light entering upward from a lower side in the drawing from the display device, and thus the visibility for an indication on the display part can be highly secured against the reflection of light by the electrodes.

(84) The laminated body 28 illustrated in FIG. 5B has a structure in which the second metal layer 16, the Y-side electrodes 14-2D composed of the first metal layer, the second metal layer 16, the transparent substrate 12, the transparent substrate 12, the second metal layer 16, the X-side electrodes 14-1D, and the second metal layer 16 are formed in this order upward from a lower side in the drawing. Even in the laminated body 28 illustrated in FIG. 5B, it can be configured by adhering two laminated bodies 22 of FIG. 2A.

(85) Specifically, the laminated body 28 can be configured by overlaying two laminated bodies 22 back to back at each substrate 12 disposing so that the respective electrodes 14D (to be 14-1D and 14-2D) are reversed in an orthogonal manner, and adhering these two laminated bodies with each other by using the optical adhesive layer 27.

(86) The laminated body 28, similarly to the laminated body 26, in any of the cases where the laminated body 28 is disposed upward or downward orientation, any of the light from the outside and the light from the display device can be satisfactorily absorbed and the reflection thereof can be suppressed, so that the visibility for the display part of the display device can be highly secured.

(87) The laminated body 30 of FIG. 5C has a structure in which the transparent substrate 12, the second metal layer 16, the Y-side electrodes 14-2D, the second metal layer 16, the transparent substrate 12, the second metal layer 16, the X-side electrodes 14-1D, and the second metal layer 16 are formed in this order upward from a lower side in the drawing.

(88) The laminated body 30 illustrated in FIG. 5C can be also easily configured by using the laminated body 22 illustrated in FIG. 2A. Concretely, the laminated body 30 can be configured by overlaying two laminated bodies 22 each in the same orientation disposing so that the respective electrodes 14D (to be 14-2D and 14-1D) are upward in the drawing in an orthogonal manner, and adhering these two laminated bodies with each other by using an optical adhesive layer 27.

(89) The laminated body 30 can exhibit fundamentally the same effect as in the laminated bodies 26 and 28 for the reflection of light.

(90) In the examples illustrated in FIG. 5A, FIG. 5B and FIG. 5C, the second metal layers 16 are provided on the respective upper surfaces and lower surfaces, in the drawing, of the X-side electrodes 14-1D and the Y-side electrodes 14-2D. However, it is also possible to provide the second metal layers 16 on only the respective upper surfaces of the X-side electrodes 14-1D and the Y-side electrodes 14-2D as in laminated bodies 32, 34, and 36 illustrated in FIG. 6A, FIG. 6B, and FIG. 6C.

(91) In these cases, the laminated bodies 32 and 34 can be configured by adhering the laminated body 10 illustrated in FIG. 1A and the laminated body 20 illustrated in FIG. 1B and the laminated body 36 can be configured by adhering two laminated bodies 10 illustrated in FIG. 1A.

(92) As above, some examples of laminate structures in a touch panel sensor are explained but there are other various laminate structures for a touch panel sensor. The laminated body of the present invention can satisfactorily correspond to various types of such laminate structures by changing the combination thereof.

EXAMPLES

(93) The following will specifically describe Examples of the present invention.

Examples 1 to 110

(94) The laminated bodies having respective compositions and respective laminate structures shown in Table 1 were produced as mentioned below and properties thereof, such as film formability, electric resistivity, degree of adhesion, and reflectance were measured by the following methods to perform evaluation.

(95) The composition of the first metal layer shown in Table 1 represents the composition of a target material used in sputtering and the composition of the second metal layer represents the composition of the second metal layer itself prepared by sputtering.

(96) (Production of Various Laminated Bodies)

(97) A sputtering target having a size of 100 mm in diameter5 mm in length was prepared by cutting out from a metal ingot having a size of 150 mm in diameter45 mm in length having respective compositions.

(98) A sheet-shaped PET having a size of 50 mm50 mm2 mm was used (soda lime glass or the like may be used) as a transparent substrate on which a metal layer (a metal film herein) is to be formed. Various metal layers were formed on the substrate by sputtering.

(99) The non-reactive sputtering for forming the first metal film (first metal layer) was performed with controlling the degree of vacuum to 510.sup.4 Pa and introducing Ar gas (inert gas) into a chamber. It was performed at a sputtering pressure of from 0.1 Pa to 1.0 Pa and an electric power of from 100 W to 500 W.

(100) The reactive sputtering for forming the second metal film (second metal layer) was performed with controlling the degree of vacuum to 510.sup.4 Pa and introducing O.sub.2 or N.sub.2 gas into a chamber. It was performed at a sputtering pressure of from 0.1 Pa to 1.0 Pa and an electric power of 100 W to 500 W.

(101) (1) Preparation of Laminated Body of Second Metal Film/First Metal Film/Substrate

(102) A Cu alloy film having a thickness of 300 nm was formed as a first metal film (first metal layer) on a transparent substrate by sputtering, and then a second metal film (second metal layer) shown in Table 1 was formed in a thickness of 50 nm on the first metal film.

(103) Accordingly, a laminated body of second metal film/first metal film/substrate having a structure in which the first metal film and the second metal film were laminated on the transparent substrate in the order was prepared.

(104) (2) Preparation of Laminated Body of First Metal Film/Second Metal Film/Substrate

(105) A second metal film was formed in a thickness of 50 nm on a transparent substrate by sputtering, and then a first metal film (first metal layer) composed of a Cu alloy was formed in a thickness of 300 nm thereon.

(106) Accordingly, a laminated body having a laminate structure of first metal film/second metal film/substrate, which contains a transparent substrate composed of a PET sheet, the second metal film formed on the substrate and the first metal film formed thereon, was prepared.

(107) (3) Preparation of Laminated Body of Second Metal Film/First Metal Film/Second Metal Film/Substrate

(108) A second metal film was formed in a thickness of 50 nm on a transparent substrate by sputtering, a first metal film was formed in a thickness of 300 nm thereon and the second metal film was formed in a thickness of 50 nm further thereon.

(109) Accordingly, a laminated body having a laminate structure of second metal film/first metal film/second metal film/substrate, which contains a transparent substrate composed of a PET sheet, the second metal film formed thereon, the first metal film further formed thereon, and the second metal film further formed thereon, was prepared.

(110) (Measurement of Electric Resistivity)

(111) Electric resistivity was measured at five points of a film by a four-probe method and the average value thereof was calculated to obtain the electric resistivity (.Math.cm).

(112) (Adhesiveness Test)

(113) The degree of adhesion of each metal film was evaluated in accordance with JIS K5600-5-6:1999.

(114) (Measurement of Reflectance)

(115) The measurement of reflectance was performed in accordance with JIS K 7105:1981. Specifically, the measurement was performed in a wavelength range of visible light (400 nm to 800 nm) by using an ultraviolet-visible spectrophotometer, the reflectance at every 1 nm of wavelength was measured, and a value of (Sum of reflectance values)/(Wavelength range of visible light)100 was taken as reflectance.

(116) The measurement of reflectance was conducted both in the reflectance at the time of viewing the first metal film side from the substrate side, i.e., the measurement of reflection light at the time when light entered from the substrate side toward the first metal film and the reflectance at the time of viewing the substrate side from the first metal film side, i.e., the measurement of reflection light at the time when light entered from the first metal film side toward the substrate side.

(117) TABLE-US-00001 TABLE 1 Chemical composition (at %) First metal film Second metal film Cu Zn B Mg Al Ca Ti Cr Cu Zn Al Ti Sn Ni O N Example 1 98.6 0.4 1 47.5 2 0.5 50 2 98.6 0.4 1 47.5 2 0.5 50 3 98.6 0.4 1 47.5 2 0.5 50 4 98.6 0.4 1 47.5 2 0.5 50 5 98.6 0.4 1 47.5 2 0.5 50 6 98.6 0.4 1 47.5 2 0.5 50 7 95.8 4 0.2 47.5 2 0.5 50 8 95.8 4 0.2 47.5 2 0.5 50 9 95.8 4 0.2 47.5 2 0.5 50 10 95.8 4 0.2 47.5 2 0.5 50 11 95.8 4 0.2 47.5 2 0.5 50 12 95.8 4 0.2 47.5 2 0.5 50 13 91 4 5 47.5 2 0.5 50 14 91 4 5 47.5 2 0.5 50 15 91 4 5 47.5 2 0.5 50 16 91 4 5 47.5 2 0.5 50 17 91 4 5 47.5 2 0.5 50 18 91 4 5 47.5 2 0.5 50 19 92 7 1 47.5 2 0.5 50 20 92 7 1 47.5 2 0.5 50 21 92 7 1 47.5 2 0.5 50 22 92 7 1 47.5 2 0.5 50 23 92 7 1 47.5 2 0.5 50 24 92 7 1 47.5 2 0.5 50 25 95.8 4 0.2 47.5 2 0.5 50 26 95.8 4 0.2 47.5 2 0.5 50 27 98.6 0.4 1 47.5 2 0.5 50 28 98.6 0.4 1 47.5 2 0.5 50 29 98.6 0.4 1 47.5 2 0.5 50 30 98.6 0.4 1 47.5 2 0.5 50 31 98.6 0.4 1 47.5 2 0.5 50 32 98.6 0.4 1 47.5 2 0.5 50 33 95.8 4 0.2 47.5 2 0.5 50 34 95.8 4 0.2 47.5 2 0.5 50 35 95.8 4 0.2 47.5 2 0.5 50 36 95.8 4 0.2 47.5 2 0.5 50 37 95.8 4 0.2 47.5 2 0.5 50 38 95.8 4 0.2 47.5 2 0.5 50 39 91 4 5 47.5 2 0.5 50 40 91 4 5 47.5 2 0.5 50 41 91 4 5 47.5 2 0.5 50 42 91 4 5 47.5 2 0.5 50 43 91 4 5 47.5 2 0.5 50 44 91 4 5 47.5 2 0.5 50 45 92 7 1 47.5 2 0.5 50 46 92 7 1 47.5 2 0.5 50 47 92 7 1 47.5 2 0.5 50 48 92 7 1 47.5 2 0.5 50 49 92 7 1 47.5 2 0.5 50 50 92 7 1 47.5 2 0.5 50 51 95.8 4 0.2 47.5 2 0.5 50 52 95.8 4 0.2 47.5 2 0.5 50 53 95.8 4 0.2 71.25 3 0.75 25 54 95.8 4 0.2 71.25 3 0.75 25 55 95.8 4 0.2 71.25 3 0.75 25 56 95.8 4 0.2 71.25 3 0.75 25 57 95.8 4 0.2 71.25 3 0.75 25 58 95.8 4 0.2 71.25 3 0.75 25 59 95.8 4 0.2 71.25 3 0.75 25 60 95.8 4 0.2 71.25 3 0.75 25 61 95.8 4 0.2 71.25 3 0.75 25 62 95.8 4 0.2 71.25 3 0.75 25 63 95.8 4 0.2 71.25 3 0.75 25 64 95.8 4 0.2 71.25 3 0.75 25 65 95.8 4 0.2 71.25 3 0.75 25 66 95.8 4 0.2 71.25 3 0.75 25 67 95.8 4 0.2 71.25 3 0.75 25 68 95.8 4 0.2 71.25 3 0.75 25 69 95.8 4 0.2 45 5 50 70 95.8 4 0.2 40 10 50 71 95.8 4 0.2 35 15 50 72 95.8 4 0.2 67.5 7.5 25 73 95.8 4 0.2 60 15 25 74 95.8 4 0.2 52.5 22.5 25 75 95.8 4 0.2 49.4 0.5 0.1 50 76 95.8 4 0.2 49.25 0.5 0.25 50 77 95.8 4 0.2 47 0.5 2.5 50 78 95.8 4 0.2 44.9 5 0.1 50 79 95.8 4 0.2 44.75 5 0.25 50 80 95.8 4 0.2 42.5 5 2.5 50 81 95.8 4 0.2 49.4 0.5 0.1 50 82 95.8 4 0.2 49.25 0.5 0.25 50 83 95.8 4 0.2 47 0.5 2.5 50 84 95.8 4 0.2 44.9 5 0.1 50 85 95.8 4 0.2 44.75 5 0.25 50 86 95.8 4 0.2 42.5 5 2.5 50 87 95.8 4 0.2 47.5 2 0.5 50 88 95.8 4 0.2 47.5 2 0.5 50 89 95.8 4 0.2 57 2.4 0.6 40 90 95.8 4 0.2 66.5 2.8 0.7 30 91 95.8 4 0.2 57 2.4 0.6 40 92 95.8 4 0.2 66.5 2.8 0.7 30 93 95.8 4 0.2 74.1 0.75 0.15 25 94 95.8 4 0.2 73.88 0.75 0.375 25 95 95.8 4 0.2 70.5 0.75 3.75 25 96 95.8 4 0.2 67.35 7.5 0.15 25 97 95.8 4 0.2 67.13 7.5 0.375 25 98 95.8 4 0.2 63.75 7.5 3.75 25 99 95.8 4 0.2 74.1 0.75 0.15 25 100 95.8 4 0.2 73.88 0.75 0.375 25 101 95.8 4 0.2 70.5 0.75 3.75 25 102 95.8 4 0.2 67.35 7.5 0.15 25 103 95.8 4 0.2 67.13 7.5 0.375 25 104 95.8 4 0.2 63.75 7.5 3.75 25 105 95.8 4 0.2 71.25 3 0.75 25 106 95.8 4 0.2 71.25 3 0.75 25 107 95.8 4 0.2 76 3.2 0.8 20 108 95.8 4 0.2 80.75 3.4 0.85 15 109 95.8 4 0.2 76 3.2 0.8 20 110 95.8 4 0.2 80.75 3.4 0.85 15 Comparative 1 100 Example 2 99.96 0.04 3 96 4 4 96 4 5 96 4 6 96 4 7 96 4 8 96 4 9 96 4 10 97.9 0.1 2 11 97.9 0.1 2 12 97.9 0.1 2 13 97.9 0.1 2 14 97.9 0.1 2 15 97.9 0.1 2 16 95.98 4 0.02 17 95.98 4 0.02 18 95.98 4 0.02 19 95.98 4 0.02 20 95.98 4 0.02 21 95.98 4 0.02 22 87 4 9 23 87 4 9 24 87 4 9 25 87 4 9 26 87 4 9 27 87 4 9 28 88 12 29 87 12 1 30 87 12 1 31 87 12 1 32 87 12 1 33 87 12 1 34 87 12 1 35 95.8 4 0.2 25 25 50 36 95.8 4 0.2 33 2 15 50 37 95.8 4 0.2 33 2 15 50 38 95.8 4 0.2 37.5 37.5 25 39 95.8 4 0.2 49.5 3 22.5 25 40 95.8 4 0.2 49.5 3 22.5 25 41 95.8 4 0.2 50 50 42 95.8 4 0.2 49.5 0.5 50 43 95.8 4 0.2 75 25 44 95.8 4 0.2 74.25 0.75 25 45 95.8 4 0.2 95 4 1 46 95.8 4 0.2 85.5 3.6 0.9 10 47 95.8 4 0.2 76 3.2 0.8 20 48 95.8 4 0.2 95 4 1 49 95.8 4 0.2 85.5 3.6 0.9 10 50 95.8 4 0.2 76 3.2 0.8 20 51 95.8 4 0.2 90.25 3.8 0.95 5 52 95.8 4 0.2 85.5 3.6 0.9 10 53 95.8 4 0.2 90.25 3.8 0.95 5 54 95.8 4 0.2 85.5 3.6 0.9 10

Comparative Examples 1 to 54

(118) A first metal film was formed on a transparent substrate by using a target of pure Cu or a Cu alloy in the same manner as in Examples without formation of the second metal film to obtain respective laminated bodies (Comparative Examples 1 to 34). Further, there were also prepared laminated bodies having a laminate structure of first metal film/second metal film/substrate in which the composition of the first metal film was constant and only the composition of the second metal film was changed (Comparative Examples 35 to 54). Then, for each laminated body, evaluation on various properties was conducted in the same manner as in Examples. The results are shown in Table 2.

(119) TABLE-US-00002 TABLE 2 Properties Electric resistivity Reflectance Film formability ( .Math. cm) Adhesiveness (%) Visibility 1st 2nd 1st 2nd 1st 2nd Metal Metal metal metal metal metal metal metal film Substrate film Substrate film film film film film film side side side side Structure Example 1 good good 6.5 good good 66.62 10.83 bad good 1st metal/2nd metal/Substrate 2 good good 7.6 good good 65.91 9.00 bad good 1st metal/2nd metal/Substrate 3 good good 7.0 good good 64.54 8.42 bad good 1st metal/2nd metal/Substrate 4 good good 7.7 good good 62.26 13.21 bad good 1st metal/2nd metal/Substrate 5 good good 6.5 good good 68.32 11.34 bad good 1st metal/2nd metal/Substrate 6 good good 6.9 good good 66.28 8.44 bad good 1st metal/2nd metal/Substrate 7 good good 5.3 good good 68.33 12.67 bad good 1st metal/2nd metal/Substrate 8 good good 5.6 good good 64.81 11.95 bad good 1st metal/2nd metal/Substrate 9 good good 5.7 good good 67.85 13.73 bad good 1st metal/2nd metal/Substrate 10 good good 6.1 good good 65.46 13.71 bad good 1st metal/2nd metal/Substrate 11 good good 5.0 good good 64.48 9.34 bad good 1st metal/2nd metal/Substrate 12 good good 5.1 good good 65.43 10.86 bad good 1st metal/2nd metal/Substrate 13 good good 6.5 good good 62.76 13.38 bad good 1st metal/2nd metal/Substrate 14 good good 7.8 good good 66.03 11.67 bad good 1st metal/2nd metal/Substrate 15 good good 7.4 good good 67.89 10.06 bad good 1st metal/2nd metal/Substrate 16 good good 7.6 good good 64.18 8.21 bad good 1st metal/2nd metal/Substrate 17 good good 6.4 good good 64.82 9.05 bad good 1st metal/2nd metal/Substrate 18 good good 6.2 good good 65.44 8.87 bad good 1st metal/2nd metal/Substrate 19 good good 6.3 good good 63.79 10.44 bad good 1st metal/2nd metal/Substrate 20 good good 6.9 good good 62.91 9.63 bad good 1st metal/2nd metal/Substrate 21 good good 6.5 good good 63.84 11.67 bad good 1st metal/2nd metal/Substrate 22 good good 7.4 good good 67.19 11.48 bad good 1st metal/2nd metal/Substrate 23 good good 6.1 good good 67.10 12.28 bad good 1st metal/2nd metal/Substrate 24 good good 7.4 good good 67.75 12.12 bad good 1st metal/2nd metal/Substrate 25 good good good good 11.70 68.09 good bad 2nd metal/1st metal/Substrate 26 good good good good 12.48 9.21 good good 2nd/1st/2nd/Substrate 27 good good 6.5 good good 62.75 11.38 bad good 1st metal/2nd metal/Substrate 28 good good 7.7 good good 65.40 13.56 bad good 1st metal/2nd metal/Substrate 29 good good 7.0 good good 66.34 10.89 bad good 1st metal/2nd metal/Substrate 30 good good 7.7 good good 62.22 10.10 bad good 1st metal/2nd metal/Substrate 31 good good 6.3 good good 68.14 8.20 bad good 1st metal/2nd metal/Substrate 32 good good 6.7 good good 62.45 8.96 bad good 1st metal/2nd metal/Substrate 33 good good 4.9 good good 63.32 11.23 bad good 1st metal/2nd metal/Substrate 34 good good 5.3 good good 66.99 9.84 bad good 1st metal/2nd metal/Substrate 35 good good 5.4 good good 61.89 10.83 bad good 1st metal/2nd metal/Substrate 36 good good 6.3 good good 63.27 9.92 bad good 1st metal/2nd metal/Substrate 37 good good 5.1 good good 62.38 12.01 bad good 1st metal/2nd metal/Substrate 38 good good 5.3 good good 66.27 13.85 bad good 1st metal/2nd metal/Substrate 39 good good 6.5 good good 63.64 11.34 bad good 1st metal/2nd metal/Substrate 40 good good 7.7 good good 63.22 12.80 bad good 1st metal/2nd metal/Substrate 41 good good 7.3 good good 68.88 10.31 bad good 1st metal/2nd metal/Substrate 42 good good 7.6 good good 67.20 12.26 bad good 1st metal/2nd metal/Substrate 43 good good 6.5 good good 67.97 12.15 bad good 1st metal/2nd metal/Substrate 44 good good 6.5 good good 65.32 10.97 bad good 1st metal/2nd metal/Substrate 45 good good 6.3 good good 67.08 11.44 bad good 1st metal/2nd metal/Substrate 46 good good 6.6 good good 62.81 13.12 bad good 1st metal/2nd metal/Substrate 47 good good 6.7 good good 62.54 11.47 bad good 1st metal/2nd metal/Substrate 48 good good 7.6 good good 66.54 13.48 bad good 1st metal/2nd metal/Substrate 49 good good 6.1 good good 67.77 11.27 bad good 1st metal/2nd metal/Substrate 50 good good 7.8 good good 63.89 9.12 bad good 1st metal/2nd metal/Substrate 51 good good good good 13.34 67.68 good bad 2nd metal/1st metal/Substrate 52 good good good good 9.90 11.52 good good 2nd/1st/2nd/Substrate 53 good good 5.1 good good 64.77 10.93 bad good 1st metal/2nd metal/Substrate 54 good good 5.1 good good 65.36 11.88 bad good 1st metal/2nd metal/Substrate 55 good good 5.3 good good 64.14 11.51 bad good 1st metal/2nd metal/Substrate 56 good good 6.5 good good 63.53 12.55 bad good 1st metal/2nd metal/Substrate 57 good good 5.3 good good 64.63 10.12 bad good 1st metal/2nd metal/Substrate 58 good good 5.2 good good 67.85 10.39 bad good 1st metal/2nd metal/Substrate 59 good good good good 13.40 67.58 good bad 2nd metal/1st metal/Substrate 60 good good good good 9.17 12.25 good good 2nd/1st/2nd/Substrate 61 good good 5.0 good good 64.12 11.23 bad good 1st metal/2nd metal/Substrate 62 good good 5.2 good good 61.36 9.84 bad good 1st metal/2nd metal/Substrate 63 good good 5.2 good good 64.45 10.83 bad good 1st metal/2nd metal/Substrate 64 good good 6.2 good good 68.06 9.92 bad good 1st metal/2nd metal/Substrate 65 good good 5.3 good good 61.80 12.01 bad good 1st metal/2nd metal/Substrate 66 good good 5.0 good good 63.28 13.85 bad good 1st metal/2nd metal/Substrate 67 good good good good 11.15 66.88 good bad 2nd metal/1st metal/Substrate 68 good good good good 9.49 9.54 good good 2nd/1st/2nd/Substrate 69 good good 5.4 good good 13.97 bad good 1st metal/2nd metal/Substrate 70 good good 5.5 good good 14.12 bad good 1st metal/2nd metal/Substrate 71 good good 5.9 good good 15.58 bad good 1st metal/2nd metal/Substrate 72 good good 5.8 good good 16.77 bad good 1st metal/2nd metal/Substrate 73 good good 5.2 good good 13.10 bad good 1st metal/2nd metal/Substrate 74 good good 5.2 good good 12.83 bad good 1st metal/2nd metal/Substrate 75 good good 5.7 good good 11.15 bad good 1st metal/2nd metal/Substrate 76 good good 5.2 good good 12.60 bad good 1st metal/2nd metal/Substrate 77 good good 5.9 good good 11.54 bad good 1st metal/2nd metal/Substrate 78 good good 5.1 good good 12.63 bad good 1st metal/2nd metal/Substrate 79 good good 5.1 good good 11.28 bad good 1st metal/2nd metal/Substrate 80 good good 5.7 good good 12.07 bad good 1st metal/2nd metal/Substrate 81 good good 5.1 good good 11.43 bad good 1st metal/2nd metal/Substrate 82 good good 5.5 good good 10.67 bad good 1st metal/2nd metal/Substrate 83 good good 5.9 good good 9.28 bad good 1st metal/2nd metal/Substrate 84 good good 5.7 good good 10.43 bad good 1st metal/2nd metal/Substrate 85 good good 5.0 good good 11.46 bad good 1st metal/2nd metal/Substrate 86 good good 5.5 good good 12.90 bad good 1st metal/2nd metal/Substrate 87 good good 5.3 good good 13.98 bad good 1st metal/2nd metal/Substrate 88 good good 5.2 good good 10.58 bad good 1st metal/2nd metal/Substrate 89 good good 5.4 good good 14.72 bad good 1st metal/2nd metal/Substrate 90 good good 5.8 good good 10.38 bad good 1st metal/2nd metal/Substrate 91 good good 5.3 good good 12.99 bad good 1st metal/2nd metal/Substrate 92 good good 5.5 good good 16.37 bad good 1st metal/2nd metal/Substrate 93 good good 5.4 good good 15.60 bad good 1st metal/2nd metal/Substrate 94 good good 5.7 good good 10.15 bad good 1st metal/2nd metal/Substrate 95 good good 5.6 good good 12.64 bad good 1st metal/2nd metal/Substrate 96 good good 5.4 good good 10.86 bad good 1st metal/2nd metal/Substrate 97 good good 5.1 good good 12.11 bad good 1st metal/2nd metal/Substrate 98 good good 5.7 good good 15.24 bad good 1st metal/2nd metal/Substrate 99 good good 5.8 good good 15.88 bad good 1st metal/2nd metal/Substrate 100 good good 5.2 good good 11.53 bad good 1st metal/2nd metal/Substrate 101 good good 5.5 good good 11.17 bad good 1st metal/2nd metal/Substrate 102 good good 5.6 good good 10.22 bad good 1st metal/2nd metal/Substrate 103 good good 5.1 good good 10.29 bad good 1st metal/2nd metal/Substrate 104 good good 5.8 good good 14.50 bad good 1st metal/2nd metal/Substrate 105 good good 5.5 good good 13.01 bad good 1st metal/2nd metal/Substrate 106 good good 5.2 good good 14.93 bad good 1st metal/2nd metal/Substrate 107 good good 5.3 good good 16.22 bad good 1st metal/2nd metal/Substrate 108 good good 5.6 good good 19.10 bad good 1st metal/2nd metal/Substrate 109 good good 5.7 good good 13.72 bad good 1st meta1/2nd metal/Substrate 110 good good 5.1 good good 17.92 bad good 1st metal/2nd metal/Substrate Comp. 1 bad 1st metal/Substrate Ex. 2 bad 1st metal/Substrate 3 good 6.4 bad 68.66 61.64 bad bad 1st metal/Substrate 4 good 11.9 bad 67.78 66.06 bad bad 1st metal/Substrate 5 good 12.4 bad 67.18 65.54 bad bad 1st metal/Substrate 6 good 10.6 bad 68.97 65.79 bad bad 1st metal/Substrate Comparative 7 good 13.5 bad 61.50 65.87 bad bad 1st metal/Substrate Example 8 good 17.9 bad 68.80 67.25 bad bad 1st metal/Substrate 9 good 14.1 bad 63.60 63.50 bad bad 1st metal/Substrate 10 good 7.5 good 64.72 65.85 bad bad 1st metal/Substrate 11 good 6.9 good 65.30 68.94 bad bad 1st metal/Substrate 12 good 7.6 good 63.05 64.05 bad bad 1st metal/Substrate 13 good 6.3 good 65.38 61.52 bad bad 1st metal/Substrate 14 good 7.5 good 62.73 66.77 bad bad 1st metal/Substrate 15 good 7.5 good 63.38 64.11 bad bad 1st metal/Substrate 16 good 6.4 bad 63.00 64.03 bad bad 1st metal/Substrate 17 good 6.7 bad 63.30 62.66 bad bad 1st metal/Substrate 18 good 6.5 bad 62.93 62.16 bad bad 1st metal/Substrate 19 good 6.6 bad 65.12 68.16 bad bad 1st metal/Substrate 20 good 6.7 bad 61.63 63.27 bad bad 1st metal/Substrate 21 good 6.4 bad 67.28 63.42 bad bad 1st metal/Substrate 22 good 8.5 good 67.33 67.58 bad bad 1st metal/Substrate 23 good 9.5 good 64.91 65.27 bad bad 1st metal/Substrate 24 good 8.7 good 61.48 67.69 bad bad 1st metal/Substrate 25 good 9.3 good 61.71 63.19 bad bad 1st metal/Substrate 26 good 9.3 good 61.23 62.22 bad bad 1st metal/Substrate 27 good 9.5 good 66.73 65.07 bad bad 1st metal/Substrate 28 good 14.7 good 66.47 63.94 bad bad 1st metal/Substrate 29 good 13.1 good 61.50 62.52 bad bad 1st metal/Substrate 30 good 13.4 good 64.37 68.89 bad bad 1st metal/Substrate 31 good 13.8 good 63.37 68.84 bad bad 1st metal/Substrate 32 good 14.0 good 65.73 62.65 bad bad 1st metal/Substrate 33 good 13.7 good 64.96 67.58 bad bad 1st metal/Substrate 34 good 13.3 good 68.54 67.20 bad bad 1st metal/Substrate 35 good good 5.0 good good 39.16 bad bad 1st metal/2nd metal/Substrate 36 good good 5.8 good good 30.88 bad bad 1st metal/2nd metal/Substrate 37 good good 5.1 good good 28.14 bad bad 1st metal/2nd metal/Substrate 38 good good 5.8 good good 41.55 bad bad 1st metal/2nd metal/Substrate 39 good good 5.8 good good 34.11 bad bad 1st metal/2nd metal/Substrate 40 good good 5.1 good good 32.13 bad bad 1st metal/2nd metal/Substrate 41 good good 5.3 good good 26.91 bad bad 1st metal/2nd metal/Substrate 42 good good 5.2 good good 26.36 bad bad 1st metal/2nd metal/Substrate 43 good good 5.6 good good 29.67 bad bad 1st metal/2nd metal/Substrate 44 good good 5.3 good good 28.14 bad bad 1st metal/2nd metal/Substrate 45 good good 5.8 good good 65.00 bad bad 1st metal/2nd metal/Substrate 46 good good 5.6 good good 41.96 bad bad 1st metal/2nd metal/Substrate 47 good good 5.2 good good 27.11 bad bad 1st metal/2nd metal/Substrate 48 good good 5.5 good good 63.13 bad bad 1st metal/2nd metal/Substrate 49 good good 5.4 good good 37.74 bad bad 1st metal/2nd metal/Substrate 50 good good 5.8 good good 25.61 bad bad 1st metal/2nd metal/Substrate 51 good good 5.6 good good 43.52 bad bad 1st metal/2nd metal/Substrate 52 good good 5.4 good good 30.09 bad bad 1st metal/2nd metal/Substrate 53 good good 5.4 good good 38.49 bad bad 1st metal/2nd metal/Substrate 54 good good 5.1 good good 26.36 bad bad 1st metal/2nd metal/Substrate
[Reflectance and Visibility]

(120) As can be seen from the results shown in Table 2, Comparative Examples 1 to 34 did not have the second metal film (second metal layer) and thus, the values of reflectance exceeded 20% at any of the metal film side and the substrate side, so that visibility was poor.

(121) On the other hand, as for Examples 1 to 110 in which the second metal film was formed, the reflectance on the substrate side was suppressed as low as 20% or less in the cases where the second metal film was formed between the first metal film and the substrate, and also in the case where the second metal film was formed on the upper surface of the first metal film, i.e., on the surface opposite to the substrate, the reflectance on the metal film side was satisfactory as 20% or less, so that the effect of forming the second metal film was obtained.

(122) Particularly, in Examples 26, 52, 60, and 68 in which the second metal film was formed both on the upper surface of the first metal film (the surface opposite to the substrate) and between the first metal film and the substrate, the reflectance at the time of viewing from the substrate side and the reflectance at the time of viewing from the metal film side were both 20% or less and thus light reflection was suppressed in two directions which are opposite to each other.

(123) Also in Comparative Examples 35 to 54, the second metal film was formed between the first metal film and the substrate but the reflectance was high as exceeding 20% on the substrate side.

(124) Of these, in Comparative Examples 41 to 44, since the second metal film did not contain Zn, the reflectance became large on the substrate side. On the other hand, in Comparative Examples 35 and 38, since 25% or more of Zn was contained in the second metal film, the reflectance became large on the substrate side.

(125) From these results, the addition of Zn affords an effect of reducing reflectance owing to the oxidation or nitridation of the added element Zn and thus is effective for suppressing the reflectance of the second metal film but it is realized that an excessive addition of 25 at % or more brings about a contrary effect.

(126) Therefore, the content of Zn in the second metal film is desirably from 0.1 at % to less than 25 at %.

(127) Since 15 at % or more of Al was contained in Comparative Examples 36 and 39 and 15 at % or more of Ti was contained in Comparative Examples 37 and 40, the reflectance became large on the substrate side in each case.

(128) From these results, even when Al or Ti is contained in addition to Zn, the reflectance gets worse with exceeding a predetermined value in the case where the addition amount is 15 at % or more.

(129) Therefore, in the case where the second metal film contains Al, Ti, Sn, and/or Ni together with Zn, the total content of the Al, Ti, Sn, and Ni elements is desirably controlled to from 0.1 at % to less than 15 at %.

(130) Moreover, as in Comparative Examples 45 to 54, the reflectance exceeded 20% on the substrate side also in the case where the content of 0 in the second metal film was 20 at % or less or in the case where that of N was 10 at % or less.

(131) From these results, in order to suppress the reflectance as low, it is desired to contain 30 at % or more of 0 or 15 at % or more of N in the second metal film.

(132) [Electric Resistivity]

(133) In Examples 1 to 110 in which a Cu alloy containing Cu, Zn and at least one element (M element) selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr was used as the first metal film, since 0.1 at % to 6 at % of the M element was contained and 0.1 at % to 10 at % of Zn was contained, the electric resistivity was low as 8.0 .Math.cm or less in all of these Examples, so that sufficient performance as an electrode was exhibited in any case.

(134) On the other hand, regarding Comparative Examples, the electric resistivity was satisfactory as 8.0 .Math.cm or less in Comparative Example 3 but the electric resistivity was high as exceeding 8.0 .Math.cm in Comparative Examples 4 to 9 and Comparative Examples 22 to 34, and thus resistance values were high in these cases.

(135) From these results, it is realized that the case where Cu is alloyed with Zn alone is good but the electric resistivity gets worse beyond a predetermined value in the case where Cu is alloyed with the M element alone without alloying with Zn, the electric resistivity also gets worse beyond a predetermined value when the content of the M element is excessive beyond 6 at % even in the case where the M element is contained as an alloy metal together with Zn, and the electric resistivity similarly also gets worse beyond a predetermined value when the amount of Zn added is excessive beyond 10 at % even in the case where Zn is contained together with the M element.

(136) Therefore, in the case where a Cu alloy is used as the first metal film, it is desired that both of the M element and Zn element are contained as alloy elements and furthermore the M element is contained in a content of from 0.1 at % to 6 at % and Zn is contained in a content of from 1 at % to 10 at %.

(137) [Adhesiveness]

(138) Adhesiveness was judged as good when the evaluated degree of adhesion is classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999 and judged as poor when it falls outside of the classification 0 to 3.

(139) In Comparative Examples 3 to 9, the first metal film was constituted by a Cu alloy but, since the composition did not contain both elements of the M element such as B, Mg, Al, Ca, Ti, or Cr and Zn simultaneously, the adhesiveness was poor.

(140) In Comparative Examples 16 to 21, the first metal film was constituted by a Cu alloy and the composition contained both elements of the M element such as B, Mg, Al, Ca, Ti, or Cr and Zn simultaneously but, since the total content of the M element of B, Mg, Al, Ca, Ti, and Cr was less than 0.1 at %, the adhesiveness was poor.

(141) On the other hand, in Examples 1 to 110, both of the first metal film and the second metal film exhibited good adhesiveness.

(142) The embodiments and Examples of the present invention are described in detail in the above but they are only examples and the present invention can be practiced in variously changed manners in the range where they do not depart from the gist thereof.

(143) The present application is based on the Japanese patent application No. 2014-217771 filed on Oct. 24, 2014, and the contents thereof are incorporated herein by reference.

DESCRIPTION OF REFERENCE NUMERALS AND SIGNS

(144) 10, 10A, 20, 20A, 22, 22A, 24, 24A, 26, 28, 30, 32, 34, 36: Laminated body 12: Substrate 14, 14-1, 14-2: First metal layer 14D, 14-1D, 14-2D: Electrode 16: Second metal layer