SELF-ENERGY TYPE THERMAL RESPONSE MONITORING DEVICE
20220349759 ยท 2022-11-03
Assignee
Inventors
- Pengcheng JIAO (Zhejiang, CN)
- Bozhi HOU (Zhejiang, CN)
- Jie Yang (Zhejiang, CN)
- Yang YANG (Zhejiang, CN)
Cpc classification
G01M5/0083
PHYSICS
G01B7/16
PHYSICS
International classification
Abstract
A self-energy type thermal response monitoring device includes a periphery constraint assembly, a variable-frequency beam arranged in the periphery constraint assembly, piezoelectric patches covering the variable-frequency beam, and an electric signal collector electrically connected to the piezoelectric patches. Deformation of the variable-frequency beam is limited by innovatively using rigid constraint, and a low-frequency thermal load is converted into a high-frequency post-buckling impact to trigger a piezoelectric material to generate an electric signal.
Claims
1. A self-energy type thermal response monitoring device, comprising a periphery constraint assembly, a variable-frequency beam arranged in the periphery constraint assembly, piezoelectric patches covering the variable-frequency beam, and an electric signal collector electrically connected to the piezoelectric patches.
2. The self-energy type thermal response monitoring device according to claim 1, wherein the periphery constraint assembly comprises a lower support, side constraint parts fixedly connected to two sides of the lower support, and an upper support movably arranged at upper ends of the two side constraint parts; the variable-frequency beam is located in an accommodating space enclosed by the upper support, the lower support, and the side constraint parts; and an upper end and a lower end of the variable-frequency beam are fixedly connected to the upper support and the lower support respectively.
3. The self-energy type thermal response monitoring device according to claim 2, wherein gaps are existent between the variable-frequency beam and the side constraint parts, and the variable-frequency beam is closer to one of the side constraint parts than the other one of the side constraint parts.
4. The self-energy type thermal response monitoring device according to claim 2, wherein two piezoelectric patches are provided, which respectively covers two sides, corresponding to the side constraint parts, of the variable-frequency beam; and the two piezoelectric patches are respectively connected to the electric signal collector through wires.
5. The self-energy type thermal response monitoring device according to claim 4, wherein the upper support, the side constraint parts and the lower support are all made of a rigid material, the variable-frequency beam is an elongate flexible beam, and the variable-frequency beam is able to generate a post-buckling phenomenon to make the piezoelectric patches arranged at the two sides of the variable-frequency beam contact the side constraint parts.
6. The self-energy type thermal response monitoring device according to claim 4, wherein piezoelectric patches are each made of a piezoelectric material, the piezoelectric patches generate electric signals under pressure, and the electric signals are transmitted to the external electric signal collector through the wires.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0015]
[0016]
[0017]
[0018]
[0019]
[0020] In the drawings: 1-upper support; 2-piezoelectric patch; 3-side constraint part; 4-variable-frequency beam; 5-lower support; 6-wire; 7-electric signal collector.
DESCRIPTION OF THE EMBODIMENTS
[0021] As shown in the figure, a self-energy type thermal response monitoring device comprises a periphery constraint assembly, a variable-frequency beam 4 arranged in the periphery constraint assembly, piezoelectric patches 2 covering the variable-frequency beam 4, and an electric signal collector 7 electrically connected to the piezoelectric patches 2.
[0022] As an optimized structure of the present invention, the periphery constraint assembly comprises a lower support 5, side constraint parts 3 fixedly connected to two sides of the lower support 5, and an upper support 1 movably arranged at upper ends of the two side constraint parts 3. The variable-frequency beam 4 is located in an accommodating space enclosed by the upper support 1, the lower support 5, and the side constraint parts 3. An upper end and a lower end of the variable-frequency beam 4 are fixedly connected to the upper support 1 and the lower support 5 respectively. The side constraint parts 3 are not in contact with the upper support 1, and the upper support 1 is supported on an upper end of the variable-frequency beam 4.
[0023] As an optimized structure of the present invention, gaps are existent between the variable-frequency beam 4 and the side constraint parts 3, and the variable-frequency beam 4 is closer to one of the side constraint parts 3 than the other side constraint part 3.
[0024] As an optimized structure of the present invention, two piezoelectric patches 2 are provided, which respectively covers two sides, corresponding to the side constraint parts 3, of the variable-frequency beam 4. The two piezoelectric patches 2 are respectively connected to the electric signal collector 7 through wires 6.
[0025] As an optimized structure of the present invention, the upper support 1, the side constraint parts 3 and the lower support 5 are all made of a rigid material, the variable-frequency beam 2 is an elongate flexible beam, and the variable-frequency beam 4 can generate a post-buckling phenomenon to make the piezoelectric patches 2 arranged at the two sides of the variable-frequency beam 4 contact the side constraint parts 3.
[0026] As an optimized structure of the present invention, the piezoelectric patches 5 are each made of a piezoelectric material, and then the piezoelectric patches 5 generate electric signals under pressure, and the electric signals are transmitted to the external electric signal collector 7 through the wires 6.
[0027] The working process of the self-energy thermal response monitoring technology is explained with
[0028] The mechanical process of the self-energy thermal response monitoring technology is explained with
[0029] It should be ultimately noted that various embodiments are merely used for describing the technical solutions of the present invention rather than limiting the same; while the present invention is described in detail with reference to the various embodiments, it should be understood by those of ordinary skill in the art that it is still possible to modify the technical solutions recorded in the foregoing embodiments, or to equivalently replace a part or all of the technical features thereof; and these modifications or replacements cannot make the essence of the corresponding technical scheme depart from the scope of the technical solutions of various embodiments of the present invention.