OPTOELECTRONIC COMPONENT AND METHOD FOR EXCHANGING AN OPTOELECTRONIC COMPONENT

Abstract

According to the present disclosure, an optoelectronic component is provided with an organic layer stack, in which light is generated in operation of the optoelectronic component, at least one marking element, by means of which the optoelectronic component is identifiable, wherein the at least one marking element can be read out under irradiation using electromagnetic radiation from the nonvisible spectral range, the at least one marking element can be read out at a main surface of the optoelectronic component, and wherein the at least one marking element is arranged at or under the main surface in the region of the illuminated area.

Claims

1. An optoelectronic component comprising an organic layer stack, in which light is generated in operation of the optoelectronic component, at least one marking element, by means of which the optoelectronic component is identifiable, wherein the at least one marking element can be read out under irradiation using electromagnetic radiation from the nonvisible spectral range, the at least one marking element can be read out at a main surface of the optoelectronic component, and wherein the at least one marking element is arranged at or under the main surface in the region of the illuminated area.

2. The optoelectronic component as claimed in claim 1, wherein the main surface comprises an illuminated area, through which at least a part of the light generated in operation leaves the optoelectronic component.

3. The optoelectronic component as claimed in claim 1, wherein the at least one marking element is not visible to the human observer and can exclusively be read out under irradiation using the electromagnetic radiation from the nonvisible spectral range.

4. The optoelectronic component as claimed in claim 1, wherein the at least one marking element, upon the irradiation using the electromagnetic radiation from the nonvisible spectral range, emits further electromagnetic radiation from the nonvisible spectral range, which is different from the electromagnetic radiation from the nonvisible spectral range.

5. The optoelectronic component as claimed in the claim 1, wherein the at least one marking element is arranged in a lateral direction at or under the main surface laterally to the illuminated area.

6. (canceled)

7. The optoelectronic component as claimed in claim 1, wherein the at least one marking element is arranged between two parts of the optoelectronic component.

8. The optoelectronic component as claimed in claim 1, wherein the at least one marking element is arranged inside a part of the optoelectronic component.

9. The optoelectronic component as claimed in claim 8, wherein the part is selected from the following group: main surface, carrier, organic layer stack, insulation, first electrode, second electrode, encapsulation, bonding agent, cover.

10. The optoelectronic component as claimed in claim 1, comprising at least two marking elements, wherein the marking elements are arranged offset and/or spaced apart in relation to one another in a lateral direction and/or a vertical direction.

11. The optoelectronic component as claimed in claim 1, wherein the at least one marking element is formed using a sensitive phosphor and the at least one marking element is arranged inside an encapsulation of the optoelectronic component.

12. A method for exchanging an optoelectronic component comprising the following steps: irradiating a main surface of an optoelectronic component using electromagnetic radiation from the nonvisible spectral range, reading out at least one marking element, which can be read out under the irradiation using the electromagnetic radiation from the nonvisible spectral range and which is arranged at or under the main surface, identifying the optoelectronic component on the basis of the marking element, and exchanging the optoelectronic component with a structurally-equivalent optoelectronic component, wherein the optoelectronic component comprises, an organic layer stack, in which light is generated in operation of the optoelectronic component, and at least one marking element, by means of which the optoelectronic component is identifiable, wherein the at least one marking element can be read out under irradiation using electromagnetic radiation from the nonvisible spectral range, the at least one marking element can be read out at a main surface of the optoelectronic component, and wherein the at least one marking element is arranged at or under the main surface in the region of the illuminated area.

13. (canceled)

Description

[0043] The optoelectronic components described here and the method described here are explained in greater detail hereafter on the basis of embodiments and the associated figures.

[0044] Embodiments of components described here are explained in greater detail on the basis of the schematic illustrations of FIGS. 1A, 1B, 1C, 2A, 2B, 3A, 3B, 4A, 4B, 5A, 5B, 6A, 6B, 6C, 6D, 7A, 7B.

[0045] Identical, equivalent, or identically-acting elements are provided with identical reference signs in the figures. The figures and the size relationships of the elements shown in the figures in relation to one another are not to scale. Rather, individual elements can be shown exaggeratedly large for better illustration and/or for better comprehension.

[0046] FIGS. 1A to 1C show a first embodiment of an optoelectronic component described here on the basis of schematic top views of the main surface 1. The optoelectronic component is, for example, an organic light-emitting diode (OLED). The illuminated area 10 is arranged on the main surface 1 of the optoelectronic component 100.

[0047] The optoelectronic component 100 emits the generated light in operation from the illuminated area 10. The illuminated area 10 only occupies a part of the main surface 1 in this case and is enclosed in a frame-like manner by a region which encloses the illuminated area 10 in the lateral directions L, which extend in parallel to the main surface 1, for example. Outside the illuminated area 10, the contact points 2, using which the optoelectronic component 100 can be electrically contacted from the outside, are arranged on the main surface 1. FIG. 1A shows the optoelectronic component schematically in the turned-on state, in which the illuminated area 10 emits light, represented by the shading of the area 10.

[0048] FIG. 1B schematically shows the same optoelectronic component in the turned-off state, in which no light is emitted from the illuminated area 10.

[0049] FIGS. 1A and 1B each show the optoelectronic component 100 in a state in which the optoelectronic component is not irradiated using electromagnetic radiation from the nonvisible spectral range.

[0050] In contrast thereto, FIG. 1C shows the state of the optoelectronic component when it is irradiated using electromagnetic radiation from the nonvisible spectral range, under which the marking elements 11 can be read out. Under irradiation using this electromagnetic radiation, which can be, for example, UV radiation or infrared radiation, depending on the material which is used to form the marking elements, the marking elements 11 can be read out. For example, the optoelectronic component includes two marking elements 11 in the present case. A first marking element 11 is formed as a dot matrix code and can be read out at the main surface 1, wherein the marking element can be read out outside the illuminated area 10. The second marking element is formed as a symbol or inscription, which can be read out at the illuminated area 10. Both marking elements can bear different items of information. Thus, the marking element which is formed as a dot matrix code can bear, for example, items of information such as a component number, a manufacturing date, a manufacturing location, and the like. The marking element which can be read out at the illuminated area 10 can be, for example, a producer logo or a tradename. The marking elements 11 can, upon the irradiation by the nonvisible electromagnetic radiation, emit further nonvisible electromagnetic radiation, for example, which is read out with an aid, or they can emit in the range of visible light. In this case, the different marking elements can differ with respect to the type of emission as visible or nonvisible, respectively.

[0051] In this case, it is shown in FIG. 1C that two marking elements 11 are arranged offset in relation to one another in the lateral direction L. However, it would also be possible that two or more marking elements are arranged not offset in the lateral direction and one above another in the vertical direction V. In this case, in particular marking elements can be used which emit electromagnetic radiation from different spectral ranges under excitation, so that accordingly different items of information can be read out in the different spectral ranges. For example, an emission in the infrared range, which can be read out using an aid, can be overlaid by an emission in the visible range, which can be recognized with the naked eye, so that the user who reads out the information obtains items of information about where he can read out the nonvisible information and can place the detection or readout device accordingly.

[0052] Further embodiments of optoelectronic components described here are explained in greater detail on the basis of the schematic sectional illustration of the following figures.

[0053] An optoelectronic component is shown in conjunction with FIG. 2A which has a carrier 3, which is formed using a radiation-transmissive material, for example. The carrier 3 can be formed using glass or a film, for example. The first electrode 6a, which is embodied as radiation-transmissive at least in part and is formed for this purpose, for example, using a material such as a transparent conductive oxide (TCO) and/or a thin metal film, is arranged on the upper side of the carrier 3.

[0054] The organic layer stack 4, in which the light 12 emitted by the optoelectronic component 100 is generated in operation, adjoins on the side of the first electrode 6a facing away from the carrier 3.

[0055] The second electrode 6b, which is electrically insulated by an insulation 5 from the first electrode 6, adjoins on the upper side of the organic layer stack 4 facing away from the carrier 3. The first electrode 6a and the second electrode 6b are electrically conductively connected to different contact points 2, which can be contacted from outside the optoelectronic component 100.

[0056] The first and/or the second electrode can, for example, contain at least one of the following materials or can consist of one of these materials: ITO, graphene, Mo, Al, Cr, Ag, Mg.

[0057] The second electrode 6b can be designed as radiation-transmissive or radiation-reflective. The optoelectronic component 100 which is described in conjunction with FIG. 2B or in conjunction with one of the other figures can be a component which emits on one side, for example, a top emitter or a bottom emitter, or a component which emits on two sides, for example a transparent OLED. If it is a component which emits on two sides, light 12 is thus emitted from the illuminated area 10 at the main surface 1 and further light 12 is emitted from the further illuminated area 10 at the further main surface 1.

[0058] At least the organic layer stack 4 is enclosed by the encapsulation layer 7, which can be, for example, a thin-film encapsulation, a cavity encapsulation, or the like. The encapsulation 7 can also contain, for example, at least one ALD layer, which is produced by means of an ALD method (ALDatomic layer deposition).

[0059] On the side of the encapsulation 7 facing away from the carrier 3, in the embodiment of FIG. 2B, a bonding agent 8 follows, for example an adhesive, via which a cover 9 is bonded to the encapsulation 7. The cover 9 can be, for example, a plastic film, a metal film, and/or a thin glass. The cover 9 is used, for example, for the mechanical protection of the optoelectronic component 100, in particular as scratch protection for the encapsulation 7.

[0060] Furthermore, it is possible that in the embodiment of FIG. 2A, the second electrode 6b is formed as reflective. In this case, the marking element 11 can be read out from the main surface 1 facing away from the illuminated area 10. This main surface 1 then does not include a further illuminated area 10.

[0061] The embodiment of the second electrode 6b as a reflective or as a transparent electrode is possible in all embodiments described here.

[0062] In the embodiment of FIG. 2B, a marking element 11 is arranged in the region of the illuminated area 10 between the encapsulation 7 and the adhesive 8, wherein the marking element 11 can be covered by the adhesive 8, which also functions in this manner as a planarization layer. The marking element 11 can be formed as intransparent, for example. In this case, the cover 9 is formed as reflective at least in part. The marking element 11 can be read out at the main surface 1 in the region of the illuminated area 10.

[0063] In contrast thereto, the embodiment of FIG. 2B shows a marking element 11 which is designed as transmissive to visible light and which is arranged in the region between the first electrode 6a and the organic layer stack 4. This marking element 11 can also be read out at the main surface 1 in the region of the illuminated area 10. It is also possible in this case that the two marking elements shown in FIGS. 2A and 2B are provided jointly in a single optoelectronic component 100 and upon illumination using the electromagnetic radiation in the nonvisible spectral range, emit electromagnetic radiation from spectral ranges which differ from one another.

[0064] The embodiments illustrated in conjunction with FIGS. 3A and 3B correspond to the embodiments shown in conjunction with FIGS. 2A and 2B, wherein two or more marking elements 11 are arranged laterally spaced apart, but vertically at the same height in relation to one another in these embodiments. This means the marking elements 11 have no distance from one another in the vertical direction V. In this case, different items of information can be coded via different marking elements, wherein the marking elements can be embodied differently.

[0065] Embodiments are shown in conjunction with FIGS. 4A and 4B, in which the marking elements 11 are arranged at different points in the lateral direction L. In the embodiment of FIG. 4B, the marking elements 11 are arranged outside the illuminated area in the edge region of the main surface 1. The marking elements 11 can be read out in this case from the front side of the optoelectronic component 100, which includes the illuminated area 10, or from its rear surface.

[0066] In the embodiment of FIG. 4B, the marking elements 11 are arranged inside the illuminated area 10 and outside the illuminated area 10 and can each be read out from the front side at the main surface 1, which includes the illuminated area 10.

[0067] In conjunction with FIGS. 5A and 5B, it is explained that the marking elements 11 can be embodied in different sizes. It is thus possible that a marking element 11 occupies an area of at least 10%, in particular at least 25% of the entire main surface of the optoelectronic component. Furthermore, it is possible that a marking element occupies at most 5% of this area, see FIG. 5B in this regard.

[0068] It is described in conjunction with FIGS. 6A, 6B, 6C, and 6D that the marking elements described here can be arranged at different points of the optoelectronic component 100 in the vertical direction V.

[0069] FIG. 6A shows an embodiment in which the marking element is arranged on the encapsulation 7 between the encapsulation 7 and the bonding agent 8. Such a marking element 11 is not located inside the encapsulation of the optoelectronic component 100 and is therefore preferably formed using materials which are less sensitive to moisture and atmospheric gases than the organic layer stack 4.

[0070] In the embodiment of FIG. 6B, the marking element 11 is located between the carrier 3 and the first electrode 6A, and therefore inside the encapsulation of the optoelectronic component 100, which enables the use of sensitive phosphors.

[0071] In the embodiment of FIG. 6C, the marking element 11 is arranged at the side of the carrier 3 facing away from the layer stack 4 and therefore outside the encapsulation. Such a marking element 11 is also particularly easily applicable subsequently, which is accompanied by the disadvantage that it is poorly protected from chemical and mechanical stresses.

[0072] In the embodiment of FIG. 6D, the marking element 11 is arranged on the second electrode 6b inside the encapsulation 7. Such a marking element 11 also profits from the encapsulation for the organic layer stack 4.

[0073] In the embodiments of FIGS. 7A and 7B, the marking elements are arranged inside the cover 9 and/or inside the carrier 3. Such marking elements can already be manufactured during the manufacturing of the cover 9 and/or the carrier 3, whereby the process sequence for the production of the optoelectronic component does not have to be modified in comparison to optoelectronic components without marking element 11 and nonetheless there is good chemical and mechanical protection of the marking elements.

[0074] Overall, an optoelectronic component 100 described here can be identified particularly simply and therefore differentiated from components of another construction. The marking of the optoelectronic component facilitates the exchange thereof and prevents counterfeits of the components. The optoelectronic components may be identified rapidly, which facilitates the troubleshooting and the complaint by the customer. By way of the identification options, for example, upon the use of the optoelectronic component in a motor vehicle headlight, clearing up traffic offenses can be facilitated, by coding items of vehicle type information in the marking elements. The marking elements described here can be produced particularly simply and cost-effectively by printing processes, for example.

[0075] Furthermore, it is possible to introduce the marking elements described here into other parts (not shown) of the optoelectronic component. For example, the optoelectronic component may include a decoupling film at its radiation exit side, at least in the region of the illuminated area 10, which increases the probability of the light exit from the optoelectronic component. A marking element described here can also be applied below or in or on such a decoupling film. The described marking elements advantageously do not influence the appearance of the optoelectronic component in the turned-on state or in the turned-off state.

[0076] The invention is not restricted thereto by the description on the basis of the embodiments. Rather, the invention includes every novel feature and every combination of features, which in particular includes every combination of features in the patent claims, even if this feature or this combination is not itself explicitly specified in the patent claims or embodiments.

LIST OF REFERENCE NUMERALS

[0077] 1, 1 main surface [0078] 2 contact points [0079] 3 carrier [0080] 4 layer stack [0081] 5 insulation [0082] 6a first electrode [0083] 6b second electrode [0084] 7 encapsulation [0085] 8 bonding agent [0086] 9 cover [0087] 10, 10 illuminated area [0088] 11 marking element [0089] 12, 12 light [0090] 100 optoelectronic component