Phosphaphenanthrene-based compound and related preparation method and application
09896551 ยท 2018-02-20
Assignee
Inventors
- Zhi-Long Hu (Zhongshan, CN)
- Chen-Yu Hsieh (Taoyuan, TW)
- Xing-Fa Chen (Zhongshan, CN)
- Xiang Xiong (Zhongshan, CN)
Cpc classification
C08G79/04
CHEMISTRY; METALLURGY
International classification
Abstract
Provided is a phosphaphenanthrene-based compound represented by the following chemical structure: ##STR00001##
The phosphaphenanthrene-based compound can be added in a resin composition and made into a prepreg or resin film. The prepreg or resin film made from such resin composition has low coefficient of thermal expansion, low dielectric constant and dissipation factor, and flame retardancy, thereby being suitable for copper-clad laminate or printed circuit board.
Claims
1. A phosphaphenanthrene-based compound having a structure expressed by formula (I) below: ##STR00029## wherein R and R are each independently a hydrogen atom, a vinyl-substituted alkyl group with 3 to 20 carbon atoms, a vinyl-substituted cycloalkyl group with 8 to 20 carbon atoms, a vinyl-substituted benzyl group with 9 to 20 carbon atoms, or a vinyl-substituted aromatic functional group with 8 to 20 carbon atoms, a vinyl- and carbonyl-substituted alkyl group with 4 to 20 carbon atoms, a vinyl- and carbonyl-substituted cycloalkyl group with 8 to 20 carbon atoms, a vinyl- and carbonyl-substituted aromatic group with 9 to 20 carbon atoms, a vinyl- and carbonyl-substituted benzyl group with 10 to 20 carbon atoms, or ##STR00030## wherein at least one of R or R is not hydrogen; and A is a covalent bond, a methylene, a cycloalkane-diyl group with 3 to 12 carbon atoms, a cycloalkene-diyl group with 6 to 12 carbon atoms, an alkane-diyl group with 2 to 12 carbon atoms, ##STR00031## wherein R.sub.1 and R.sub.2 are each independently an alkyl group with 1 to 3 carbon atoms, X is CH.sub.2, ##STR00032## and n is an integer ranging from 0 to 4.
2. The phosphaphenanthrene-based compound according to claim 1, wherein R and R are each independently a vinyl-substituted alkyl group with 3 to 20 carbon atoms, or a vinyl-substituted benzyl group with 9 to 20 carbon atoms.
3. The phosphaphenanthrene-based compound according to claim 1, wherein R and R are each independently ##STR00033##
4. The phosphaphenanthrene-based compound according to claim 1, wherein the phosphaphenanthrene-based compound has a structure expressed below: ##STR00034## wherein A is ##STR00035## wherein R.sub.1 and R.sub.2 are each independently an alkyl group with 1 to 3 carbon atoms, X is CH.sub.2, ##STR00036## and n is an integer ranging from 0 to 4.
5. The phosphaphenanthrene-based compound according to claim 1, wherein the phosphaphenanthrene-based compound has a structure expressed below: ##STR00037## ##STR00038## ##STR00039## ##STR00040##
6. A resin composition comprising the phosphaphenanthrene-based compound according to claim 1.
7. The resin composition according to claim 6, wherein the resin composition comprises a reactant, an amount of the reactant is 100 parts by weight, an amount of the phosphaphenanthrene-based compound ranges from 5 parts by weight to 80 parts by weight, and the reactant comprises any one of epoxy resin, phenol resin, isocyanurate resin, cyanate ester resin, benzoxazine resin, styrene-maleic anhydride, polyester, maleimide, polyphenylene ether resin, amine curing agent, phenoxy resin, styrene, polyamide, polyimide, and polyolefin, or a combination thereof.
8. The resin composition according to claim 7, wherein the resin composition comprises an additive, and an amount of the reactant is 100 parts by weight, an amount of the additive is ranging from 0.01 parts by weight to 500 parts by weight, the additive comprises at least one component selected from a group consisting of a curing accelerator, a flame retardant, an inorganic filler, a solvent, a toughing agent, and a silane coupling agent.
9. A product comprising a cured product made from the resin composition according to claim 6.
10. A product comprising a semi-cured product made from the resin composition according to claim 6.
11. A method of manufacturing the phosphaphenanthrene-based compound of claim 1, comprising: reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with a di-aldehyde compound to form a phosphaphenanthrene-based compound having hydroxyl group; and reacting the phosphaphenanthrene-based compound having hydroxyl group with a vinyl compound to form the phosphaphenanthrene-based compound, the phosphaphenanthrene-based compound having the structure expressed by formula (I), wherein R and R are each independently a hydrogen atom, a vinyl-substituted alkyl group with 3 to 20 carbon atoms, a vinyl-substituted cycloalkyl group with 8 to 20 carbon atoms, a vinyl-substituted benzyl group with 9 to 20 carbon atoms, a vinyl-substituted aromatic group with 8 to 20 carbon atoms, a vinyl- and carbonyl-substituted alkyl group with 4 to 20 carbon atoms, a vinyl- and carbonyl-substituted cycloalkyl group with 8 to 20 carbon atoms, a vinyl- and carbonyl-substituted aromatic group with 9 to 20 carbon atoms, a vinyl- and carbonyl-substituted benzyl group with 10 to 20 carbon atoms, or ##STR00041## wherein at least one of R or R is not hydrogen; and A is ##STR00042## wherein R.sub.1 and R.sub.2 are each independently an alkyl group with 1 to 3 carbon atoms, X is CH.sub.2, ##STR00043## and n is an integer ranging from 0 to 4.
12. The method of manufacturing the phosphaphenanthrene-based compound according to claim 11, wherein the di-aldehyde compound is at least one selected from the group consisting of the following: 1,4-phthalaldehyde,1,3-phthalaldehyde,1,2-phthalaldehyde, 2,3-naphthalenedicarboxaldehyde, 1,6-naphthalenedicarboxaldehyde, 1,8-naphthalenedicarboxaldehyde, 1,7-naphthalenedicarboxaldehyde, 4,4-biphenyldicarboxaldehyde, 4,4-xenygloxal, bisphenol A based di-aldehyde, bisphenol F based di-aldehyde, and bisphenol E based di-aldehyde.
13. The method of manufacturing the phosphaphenanthrene-based compound according to claim 11, wherein the step of reacting the phosphaphenanthrene-based compound having hydroxyl group with the vinyl compound to form the phosphaphenanthrene-based compound comprises carrying out a reaction of the phosphaphenanthrene-based compound having hydroxyl group and the vinyl compound in the presence of hydroxide and tetrabutylammonium halide so as to form a vinyl-containing phosphaphenanthrene-based compound.
14. The method of manufacturing the phosphaphenanthrene-based compound according to claim 13, wherein an addition amount of the phosphaphenanthrene-based compound having hydroxyl group is 1 mole, an addition amount of the vinyl compound ranges from 2 moles to 4 moles, an addition amount of the hydroxide ranges from 2 moles to 4 moles, and an addition amount of the tetrabutylammonium halide ranges from 0.1 moles to 0.3 moles.
15. The method of manufacturing the phosphaphenanthrene-based compound according to claim 11, wherein a mole ratio of the 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and the di-aldehyde compound ranges from 2:1 to 4:1.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
DETAILED DESCRIPTION
(7) In order to verify the characteristics of the phosphaphenanthrene-based compound and related preparation method and applications, embodiments of the present invention are listed below as examples. Those skilled in this art may easily understand the benefits and effects that can be achieved by the present invention via the content of this specification, and may make various modifications without departing from the spirit of the present invention.
(8) The chemicals for use in the embodiments are as follows:
(9) 1. Methacrylate-terminated bisphenol A polyphenylene ether resin, available from Sabic under the trade name SA-9000.
(10) 2. Vinylbenzyl-terminated biphenyl polyphenylene ether resin, available from Mitsubishi Gas Chemical under the trade name OPE-2st.
(11) 3. Bisphenol A cyanate ester resin, available from Lonza under the trade name of BA-230S.
(12) 4. Cyanate ester resin, available from Lonza under the trade name of BTP-6020S.
(13) 5. Phenylmethane maleimide, available from Japan Daihachi Chemical under the trade name of BMI-2300.
(14) 6. Bis (3-ethyl-5-methyl-4-maleimidophenyl) methane), available from KI Chemical under the trade name of BMI-70.
(15) 7. 2,5-dimethyl-2,5-di(tert-butylperoxy)-3-hexyne, available from Nippon Oils & Fats under the trade name of 25B.
(16) 8. Phosphazene, available from Otsuka Chemical under the trade name of SPB-100.
(17) 9. Resorcinol bis [di (2,6-dimethylphenyl) phosphate], available from Japan Daihachi Chemical under the trade name of PX-200.
(18) 10. Fused silica, available from Sibelco under the trade name of fused silica.
(19) 11. Diethyl aluminum phosphate (organophosphates), available from Clariant under the trade name of OP-935.
(20) 12. DOPO bisphenol A novolac hardener, available from Dow Chemical under the trade name of XZ92741.
(21) 13. 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), available from Sanko.
(22) 14. 2-(10H-9-oxa-10-phospha-1-phenanthryl) hydroquinone phosphorus oxide, abbreviation as DOPO-HQ, available from Sanko.
(23) 15. Zinc octoate, available from Kingyorker.
Embodiment 1: Preparation of Phosphaphenanthrene-Based Compound
(24) 500 ml of toluene, 0.4 mol (approximately 78.64 g) of DOPO and 0.2 mol of 1,4-phthalaldehyde (about 26.82 g) are placed in a 1000 ml the three-necked flask equipped with a thermometer and a condenser and are heated and stirred for 5 hours under a reflux environment. The solution is cooled to room temperature, filtered off and dried under vacuum, then a white powder is obtained. The yield is 87.6%.
(25) The obtained white powder is analyzed by the reflection-type Fourier transform infrared spectroscopy (FTIR), and the result is shown in
(26) ##STR00024##
(27) Further, the white powder is analyzed by a differential scanning calorimeter (DSC) and the observed melting point of the white powder is 248.4 t, wherein the result is shown in
(28) In addition, about 5 grams per serving of the phosphaphenanthrene-based compound are weighed and added to about 30 ml of solvents respectively. Stir with or without heating the solution to dissolve the solute. Observe the dissolution of the phosphaphenanthrene-based compound in different solvents, and the results are shown in Table 1, wherein the numeral 1 represents easily soluble, which means the solute is dissolved with stirring at room temperature and the solution is clear; the numeral 2 represents soluble, which means the solute is dissolved with stirring when being heated up to 120 C. and the solution is clear; the numeral 3 represents insoluble, which means the solute is not dissolve even being heated and stirred.
(29) TABLE-US-00001 TABLE 1 The dissolution of the phosphaphenanthrene-based compound (with the structure of formula (VIII)) in different solvents Solvent Dissolution Dimethylacetamide (DMAC) 3 Proprylene glycol monomethyl ether (PM) 3 Cyclohexanone (CYC) 3 Methyl ethyl ketone (MEK) 3 1-Methoxy-2-propyl acetate (PMA) 3 Toluene (TL) 3 N,N-Dimethylformamide (DMF) 2 Methanol (MT) 3
Embodiment 2: Preparation of Phosphaphenanthrene-Based Compound
(30) 500 ml of toluene, 0.4 mol (approximately 78.64 grams) of DOPO and 0.2 mol of 1,4-phthalaldehyde (about 26.82 g) are placed in a 1000 ml three-necked flask equipped with a thermometer and a condenser and are heated and stirred for 5 hours under a reflux environment. The solution is cooled to room temperature, filtered off and dried under vacuum, and then a white powder is obtained. The yield is 91.5%. From the analysis results of the FTIR and .sup.1H-NMR, it is convinced that the white powder has a structure expressed by formula (VIII) above.
(31) Then, add 0.5 mol of the white powder and 1.5 mol of sodium hydroxide to a four-necked flask with 1 liter of toluene. Next, heat the solution up to 70 C. and stir it for 30 minutes. Subsequently, add 1.5 mol of 4-chloro-methyl styrene and 0.1 mol of tetrabutylammonium bromide to the solution. Stir for 10 hours. After the reaction is completed and the solution is cooled to room temperature, the solution is filtered off, washed with toluene several times, and dried for 10 hours. A product is obtained with a yield of 80.9%.
(32) The aforementioned product is analyzed by the reflection-type FTIR, and the result is shown in
(33) ##STR00025##
(34) In addition, about 5 grams per serving of the phosphaphenanthrene-based compound (as shown in formula (XVI)) are weighed and added to about 30 ml of solvents respectively. Stir with or without heating to dissolve the solute. Observe dissolution of the phosphaphenanthrene-based compound in different solvents, and the results are shown in Table 2, wherein the numeral 1 represents easily soluble, which means the solute is dissolved with stirring at room temperature and the solution is clear; the numeral 2 represents soluble, which means the solute is dissolved with stirring when being heated up to 120 t and the solution is clear; the numeral 3 represents insoluble, which means the solute is not dissolve even being heated and stirred.
(35) TABLE-US-00002 TABLE 2 The dissolution of the phosphaphenanthrene-based compound (with the structure of formula (XVI)) in different solvents Solvent Dissolution Dimethylacetamide 1 Methyl ethyl ketone 2 Toluene 1 Dimethylformamide 1
(36) From the comparison of the result in Table 1 and Table 2, with the introduction of methyl styene group to the phosphaphenanthrene-based compound with the aforementioned formula (VIII), the solubility of the phosphaphenanthrene-based compound can be enhanced, such that the phosphaphenanthrene-based compound with the aforementioned formula (XVI) has good solubility in various solvents.
(37) Comparison 1: The Conventional Phosphaphenanthrene-Based Compound
(38) Add 0.5 mol of the DOPO-HQ (available from Nu tech fine chemical) and 1.5 mol of sodium hydroxide to a four-necked flask with 1 liter of toluene. Next, heat the solution up to 70 C. and stir it for 30 minutes. Subsequently, add 1.5 mol of 4-chloro-methyl styrene and 0.1 mol of tetrabutylammonium bromide to the solution. Stir for 10 hours. After the reaction is completed, cool the system to room temperature, filter the solution and wash with toluene several times, and dry for 10 hours to obtain a compound shown below, a yield of which is 65%.
(39) ##STR00026##
(40) Comparison 2: The Conventional Phosphaphenanthrene-Based Compound
(41) Add 1.5 mol DOPO (available from Nu tech fine chemical) and 1 liter of toluene to a glass reactor equipped with a mechanical stirrer, a condenser, a thermometer and nitrogen protection, stir with heating up to 70 C. Then, add 0.6 mol of 4,4-diphenoquinone (DQ) (purchased from J & K Technology Co., Ltd.). After stirring for 2 hours at 70 C., cool the solution to room temperature. The solution is filtered off and washes with toluene several times, and dried for 10 hours to obtain a white DOPO biphenol. A yield is 69%. The DOPO biphenol has a structure as shown below.
(42) ##STR00027##
(43) Then, add 0.5 mol of DOPO biphenol and 1.5 mol of potassium hydroxide to a four-necked flask with 1 liter of toluene. Heat the solution to 70 t and stir it for 30 min. Then, add 1.5 mol of methyl 4-chloromethyl styrene and 0.1 mol of tetrabutylammonium bromide. Stir for 10 hours. After the reaction is completed, cool the solution to room temperature. The solution is filtered off and washed with toluene several times, and dried for 10 hours to obtain a product shown below. A yield is 58%.
(44) ##STR00028##
(45) From the results of the embodiments 1 to 2 and comparisons 1 to 2 above, it infers that under the same synthesis conditions, the phosphaphenanthrene-based compound of the embodiments 1 to 2, by the way of changing the chemical structure, have higher yield than the conventional phosphaphenanthrene-based compounds.
Test Example 1: Solvent Compatibility
(46) The phosphaphenanthrene-based compound of the embodiment 2, the conventional phosphaphenanthrene-based compound of the comparison 1 and the conventional phosphaphenanthrene-based compound of the comparison 2 are used as test samples of the test example 1. The test samples are respectively dissolved in toluene, methyl ethyl ketone, and acetone, so as to give a test to the compatibilities of the test samples in these solvents. The results observed by naked eyes are shown in Table 3.
(47) TABLE-US-00003 TABLE 3 The test results of compatibilities of the phosphaphenanthrene-based compound of the embodiment 2 and the conventional phosphaphenanthrene-based compounds of the comparison parison 2 in different solvents Observation Solvent time Embodiment 2 Comparison 1 Comparison 2 Toluene The initial Soluble, clear Soluble, clear Soluble, clear state light yellow light yellow light yellow solution solution solution Stand for 12 No No No hours precipitation, precipitation, precipitation, clear light clear light clear light yellow yellow yellow solution solution solution Methyl The initial Soluble, clear Soluble, clear Soluble, clear ethyl state light light light yellow ketone yellow yellow solution solution solution Stand for 12 No Precipitated Precipitated hours precipitation, with white with white clear light educt, cloudy educt, cloudy yellow solution with solution with solution white white precipitate at precipitate at the vessel the vessel bottom bottom Acetone The initial Soluble, clear Soluble, clear Soluble, clear state light yellow light yellow light yellow solution solution solution Stand for 12 No Precipitated Precipitated hours precipitation, with white with white as a clear light educt, cloudy educt, cloudy yellow solution with solution with solution white white precipitate at precipitate at the vessel the vessel bottom bottom
(48) As shown in Table 3, the phosphaphenanthrene-based compound of the embodiment 2 is soluble in toluene, methyl ethyl ketone and acetone, and no white educt would appear after being placed for 12 hours, which shows that the phosphaphenanthrene-based compound of the embodiment 2 has good compatibility with toluene, methyl ethyl ketone and acetone. Conversely, though the conventional phosphaphenanthrene-based compounds of the comparison 1 to 2 are soluble in methyl ethyl ketone and acetone, apparent white educts can be observed by naked eyes and are appeared at the bottom of the vessels after standing for 12 hours.
(49) Toluene, methyl ethyl ketone and acetone or a combination thereof are commonly used in the production process of prepregs. To dissolve the phosphaphenanthrene-based compound of the embodiment 2 in ketone solvents does not cause precipitation problems. On the contrary, when the conventional phosphaphenanthrene-based compounds of the comparisons 1 to 2 are selected to be dissolved in ketone solvents, educts will appear and thus the conventional phosphaphenanthrene-based compounds have disadvantages of bring unstable quality and lower flame retardancy.
(50) From the above comparison results, the phosphaphenanthrene-based compound of the present invention has better compatibility with ketone solvents than the conventional phosphaphenanthrene-based compounds. In addition, no educt would appear after the solution is placed for a period of time, such that the quality and flame retardancy of the phosphaphenanthrene-based compound of the present invention are assured.
Embodiment 3: Preparation of Resin Composition Containing Phosphaphenanthrene-Based Compound
(51) According to the ratio listed in Table 4, the phosphaphenanthrene-based compound prepared in the embodiment 1 (as shown in formula (VIII)) and the phosphaphenanthrene-based compound prepared in the embodiment 2 (as shown in formula (XVI)) are respectively adequately mixed with polyphenylene ether resin, cyanate ester resin, maleimide, flame retardants, inorganic fillers, curing accelerator and solvent to form resin compositions having the phosphaphenanthrene-based compound, i.e., example 1 to example 12 (hereinafter denoted as E1 to E12).
(52) Comparison 3: Preparation of Resin Composition
(53) According to the ratio listed in Table 5, the phosphaphenanthrene-based compound prepared in the embodiment 1 (as shown in formula (VIII)) and the phosphaphenanthrene-based compound prepared in the embodiment 2 (as shown in formula (XVI)) are selectively mixed with polyphenylene ether resin, cyanate ester resin, maleimide, flame retardants, inorganic fillers, curing accelerator and solvent adequately to form resin compositions of comparative example 1 to comparative example 13 (hereinafter denoted as C1 to C13) by fully mixing each component in Table 5.
(54) Wherein, none of the phosphaphenanthrene-based compounds formed according to the embodiment 1 to 2 are mixed in the resin compositions of C1 to C3, C6 to C8 and C11 to C13 do not mix with.
Test Example 2: Analysis of the Properties of Resin Composition
(55) The resin compositions having the phosphaphenanthrene-based compounds in E1 to E12 and the resin compositions in C1 to C13 are selected in this test example. Each selected resin composition is evenly mixed in a blender by batch before being put into an impregnation tank respectively. Then, a glass fiber fabric (the specification of E-glass fiber fabric is 2116, available from Nan Ya Plastics Industry) is immersed into the impregnation tank to allow the resin composition to adhere to the glass fiber fabric before undergoing a heat baking process under 120 C.-160 C. to become semi-cured, thereby forming a prepreg.
(56) Preparation of the Test Samples for Property Analysis:
(57) 1. Copper-Clad Laminate:
(58) The copper-clad laminate of each of the aforementioned test sample is prepared in the following. Two pieces of copper foils with a thickness of 18 m, and four pieces of the prepregs manufactured according to the selected test sample are supplied, wherein each prepreg has a thickness of 0.127 mm. The content of the resin of each prepreg is about 55%. The copper foil, four pieces of the prepregs and copper foil are stacked in sequence before being laminated against each other under vacuum at 210 C. for two hours to form a copper-clad laminate, wherein, the stacked four pieces of prepregs are cured to form an insulating layer between the two copper foils, and the content of the resin of the insulating layer is about 55%.
(59) 2. Copper-Free Laminate (Four Plies):
(60) The aforementioned copper-clad laminate is etched to remove the two copper foils to obtain the copper-free laminate (four plies). Wherein the copper-free laminate (four plies) are formed with four laminated prepregs, and the content of the resin of the copper-free laminate (four plies) is about 55%.
(61) 3. Copper-Free Laminate (Double Plies):
(62) Two pieces of copper foils with a thickness of 18 m and two pieces of the prepregs manufactured according to the selected test samples mentioned above are supplied, wherein each of the prepregs has a thickness of 0.127 mm. The content of the resin of each prepreg is about 55%. The copper foil, two pieces of the prepreg and copper foil are stacked in sequence before being laminated against each other under vacuum at 210 C. for two hours to form a double plies copper-clad laminate.
(63) Next, the double plies copper-clad laminate undergoes etching to remove the two copper foils so as to obtain the copper-free laminate (double plies). Wherein the insulating laminate is formed with two laminated prepregs, and the content of the resin of the copper-free laminate (double plies) is about 55%.
(64) The property analysis of this test example includes the following items.
(65) 1. Glass transition temperature (Tg):
(66) To measure the glass transition temperature, the copper-free laminate (four plies) is selected as the test sample. The glass transition temperature of each test sample is measured by a dynamic mechanical analysis (DMA) according to IPC-TM-650 2.4.24.4 test method.
(67) 2. Coefficient of thermal expansion (CTE z-axis):
(68) To measure the coefficient of thermal expansion, the copper-free laminate (four plies) is selected as the test sample. The coefficient of thermal expansion of each test samples is measured by a thermal mechanical analyzer (TMA) according to IPC-TM-650 2.4.24.5 test method, wherein the unit is ppm/ C. A lower coefficient of thermal expansion indicates that the expansion proportion of the test sample under heating is smaller, which means the resin composition has better properties when it is applied to the printed circuit board.
(69) 3. Solder dipping (S/D):
(70) To measure the solder dipping, the copper-clad laminate (four plies) is selected as the test sample. Each test sample is immersed in the solder pot with a constant temperature of 288 C. for 10 seconds each time. Repeat the step above to test the total cycle of heat resistance without delamination of each test sample. the more total cycle of the test sample indicates that the heat resistance of the copper-clad laminate formed with the resin composition is better.
(71) 4. Pressure cooking test (PCT):
(72) In PCT, the copper-free laminate (four plies) is selected as the test sample. Each test sample is placed in an environment with a temperature of 121 C. and a 100% relative humidity to absorb moisture for 3 hours. Then, each test sample is immersed in a solder pot with a constant temperature of 288 C. for 20 seconds to see if any of the test samples delaminates. Pass of test result means no delamination. If the test sample does not rupture after the PCT, the resin composition applied to a printed circuit board has good heat resistance after moisture absorption.
(73) 5. Dielectric constant (Dk) and dissipation factor (Df):
(74) To measure the dielectric constant and dissipation factor, the copper-free laminate (double plies) is selected as the test sample, measured at 10 GHz by a microwave dielectrometer (purchased from AET) according to JIS C2565 test method. The lower dielectric constant and lower dissipation factor indicates that the dielectric properties of the test sample are better.
(75) 6. Flame retardancy:
(76) In the flame retardancy test, the copper-free laminate (four plies) is selected as the test sample. The flame resistance test is performed according to UL94 test method, and the analysis results are illustrated in the rankings V-0, V-1, and V-2, wherein the ranking V-0 is superior to V-1 and V-1 is superior to V-2.
(77) The results of measurement of the test samples prepared by the resin compositions having the phosphaphenanthrene-based compounds in embodiments E1 to E12 are enumerated in Table 6. The results of measurement of the test samples prepared by the resin compositions in comparisons C1 to C13 are enumerated in Table 7.
(78) TABLE-US-00004 TABLE 4 The ratio of the resin composition having the phosphaphenanthrene- based compound in E1 to E12 (unit: parts by weight) Component E1 E2 E3 E4 E5 E6 Polyphenylene ether OPE-2st 50 50 50 50 50 50 resin SA-9000 50 50 50 50 50 50 Cyanate resin BA-230S 10 10 10 0 0 0 BTP-6020S 10 10 10 20 20 0 Maleimide BMI-2300 10 10 10 20 20 10 BMI-70 10 10 10 0 0 10 Phosphaphenanthrene- Embodiment 1 55 0 0 45 0 40 based compound Embodiment 2 0 55 70 0 45 0 Flame retardant OP-935 0 0 0 0 0 0 Inorganic filler Fused silica 40 40 40 40 40 40 Solvent MEK 30 30 30 30 30 30 Toluene 30 30 30 30 30 30 Curing accelerator Zinc octoate 0.03 0.03 0.03 0.03 0.03 0.03 25B 1 1 1 1 1 1 Component E7 E8 E9 E10 E11 E12 Polyphenylene ether OPE-2st 50 50 50 80 70 50 resin SA-9000 50 50 50 70 30 50 Cyanate resin BA-230S 0 10 10 5 5 10 BTP-6020S 0 10 10 5 5 10 Maleimide BMI-2300 10 10 10 20 10 10 BMI-70 10 10 10 20 20 10 Phosphaphenanthrene- Embodiment 1 0 20 0 0 0 0 based compound Embodiment 2 40 0 10 100 55 112 Flame retardant OP-935 0 7 10 0 0 0 Inorganic filler Fused silica 40 40 40 60 40 40 Solvent MEK 30 30 30 30 30 30 Toluene 30 30 30 70 30 30 Curing accelerator Zinc octoate 0.03 0.03 0.03 0.03 0.03 0.03 25B 1 1 1 1 1 1
(79) TABLE-US-00005 TABLE 5 The ratio of the resin composition in C1 to C13 (unit: parts by weight) Component C1 C2 C3 C4 C5 C6 C7 Polyphenylene OPE-2st 50 50 50 50 50 50 50 ether resin SA-9000 50 50 50 50 50 50 50 Cyanate resin BA-230S 10 10 10 10 10 10 10 BTP-6020S 10 10 10 10 10 10 10 Maleimide BMI-2300 10 10 10 10 10 10 10 BMI-70 10 10 10 10 10 10 10 Phosphaphenanthrene- Embodiment 1 0 0 0 5 0 0 0 based compound Embodiment 2 0 0 0 0 5 0 0 Flame retardant OP-935 0 0 0 0 0 27 20 SPB-100 55 0 0 0 0 0 7 PX-200 0 55 0 0 0 0 0 XZ92741 0 0 55 0 0 0 0 DOPO 0 0 0 0 0 0 0 DOPO-HQ 0 0 0 0 0 0 0 Inorganic filler Fused 40 40 40 40 40 40 40 silica Solvent MEK 30 30 30 30 30 30 30 Toluene 30 30 30 30 30 30 30 Curing accelerator Zinc 0.03 0.03 0.03 0.03 0.03 0.03 0.03 octoate 25B 1 1 1 1 1 1 1 Component C8 C9 C10 C11 C12 C13 Polyphenylene OPE-2st 50 50 50 50 50 70 ether resin SA-9000 50 50 50 50 50 30 Cyanate resin BA-230S 0 10 10 10 10 5 BTP-6020S 0 10 10 10 10 5 Maleimide BMI-2300 10 10 10 10 10 10 BMI-70 10 10 10 10 10 20 Phosphaphenanthrene- Embodiment 1 0 150 0 0 0 0 based compound Embodiment 2 0 0 150 0 0 0 Flame retardant OP-935 0 0 0 0 0 5 SPB-100 0 0 0 0 0 30 PX-200 0 0 0 0 0 10 XZ92741 40 0 0 0 0 5 DOPO 0 0 0 55 0 0 DOPO-HQ 0 0 0 0 55 0 Inorganic filler Fused silica 40 40 40 40 40 40 Solvent MEK 30 30 30 30 30 30 Toluene 30 30 30 30 30 30 Curing accelerator Zinc octoate 0.03 0.03 0.03 0.03 0.03 0.03 25B 1 1 1 1 1 1
(80) TABLE-US-00006 TABLE 6 The results of property analysis of the test samples made from the resin composition of E1 to E12 Property item E1 E2 E3 E4 E5 E6 Glass transition 205 203 198 207 205 198 temperature ( C.) Coefficient of 49 49 47 51 51 53 thermal expansion (ppm/ C.) Solder dipping >20 >20 >20 >20 >20 >20 PCT pass pass pass pass pass pass Dielectric 3.75 3.65 3.71 3.74 3.64 3.71 constant Dissipation factor 0.0095 0.0068 0.0067 0.0093 0.0065 0.0085 Flame retardancy V-0 V-0 V-0 V-0 V-0 V-0 Property item E7 E8 E9 E10 E11 E12 Glass transition 195 208 210 211 206 201 temperature ( C.) Coefficient of 53 55 58 53 49 50 thermal expansion (ppm/ C.) Solder dipping >20 >20 >20 >20 >20 >20 PCT pass pass pass pass pass pass Dielectric 3.62 3.75 3.72 3.73 3.62 3.71 constant Dissipation factor 0.0058 0.0082 0.0070 0.0064 0.0057 0.0066 Flame retardancy V-0 V-0 V-0 V-0 V-0 V-0
(81) TABLE-US-00007 TABLE 7 The results of property analysis of the test samples made from the resin composition of C1 to C13 Property item C1 C2 C3 C4 C5 C6 C7 Glass 165 145 148 212 212 208 195 transition temperature ( C.) Coefficient 66 74 60 49 49 63 63 of thermal expansion (ppm/ C.) Solder 20 15 4 >20 >20 15 15 dipping PCT pass delami- delami- pass pass delami- delami- nated nated nated nated Dielectric 3.98 3.98 4.05 3.71 3.65 3.94 3.92 constant Dissipation 0.0097 0.0089 0.0115 0.0073 0.0065 0.0108 0.0105 factor Flame V-0 V-1 V-0 V-2 V-2 V-0 V-1 retardancy Property item C8 C9 C10 C11 C12 C13 Glass 170 191 201 172 185 188 transition temperature ( C.) Coefficient 61 60 58 70 71 60 of thermal expansion (ppm/ C.) Solder 8 10 15 5 3 18 dipping PCT delami- delami- pass delami- delami- delami- nated nated nated nated nated Dielectric 4.05 4.05 3.83 4.12 4.18 3.89 constant Dissipation 0.0121 0.0121 0.0068 0.0121 0.0135 0.0085 factor Flame V-0 V-0 V-0 V-0 V-0 V-0 resistance
(82) From the results of E1 or E2 in Table 6 compared to any one of the results of C1 to C3 in Table 7, it is convinced that the laminate made from the phosphaphenanthrene-based compound of the present invention has lower coefficient of thermal expansion, higher glass transition temperature, better heat resistance and better heat resistance after moisture absorption.
(83) In particular, when the phosphaphenanthrene-based compound has a vinyl group (E2), the laminate prepared thereof have low dielectric constant and low dissipation factor. As such, the further introduction of the vinyl group effectively improves the dielectric constant and dissipation factor of the laminate. The effects mentioned above may also be seen from comparing E2, E3, E5 and E7 with E1, E4, E6 and E8.
(84) In addition, from the results of E1 or E2 in Table 6 compared to the results of C11 or C12 in Table 7, though the laminate made from the resin composition containing the commercially available flame retardants such as DOPO or DOPO-HQ may have expected flame retardancy, its overall performance (such as heat resistance, heat resistance after moisture absorption and dielectric properties) is poor. On the other hand, the laminate made from the resin composition having the phosphaphenanthrene-based compound of the present invention have advantages such as lower coefficient of thermal expansion, higher heat resistance, higher glass transition temperature and lower dielectric constant and dissipation factor at the same time.
(85) From the results of E6 or E7 in Table 6 compared to the results of C8 in Table 7, it is convinced that the laminate made from the resin composition having the phosphaphenanthrene-based compound of the present invention has lower coefficient of thermal expansion, higher glass transition temperature, better heat resistance and better heat resistance after moisture absorption at the same time.
(86) From the results of E1 in Table 6 compared to the results of C4 in Table 7 and the results of E2 in Table 6 compared to the results of C5 in Table 7, it is convinced that if the content of the phosphaphenanthrene-based compound is too low, the laminate made from the resin composition is hard to have a suitable flame retardancy. In addition, from the results of C9, it is convinced that if the content of the phosphaphenanthrene-based compound in the resin composition is too high, the laminate made from the resin composition is hard to pass the PCT (i.e., delamination), and has disadvantages such as lower glass transition temperature, higher coefficient of thermal expansion, reduced heat resistance and higher dielectric properties. Furthermore, from the results of E12 in Table 6 compared to the results of C10 in Table 7, it is convinced that if the content of the phosphaphenanthrene-based compound of embodiment 2 in the resin composition is too high, the laminate prepared therefrom might pass the PCT (i.e., no delamination), but the laminate may still have problems such as lower glass transition temperature, higher coefficient of thermal expansion, reduced heat resistance and higher dielectric properties.
(87) Further, from the results of E8 compared to the results of E1 and the results of E9 compared to the results of E2, it is convinced that when the phosphaphenanthrene-based compound of the present invention is used with other flame retardants, the laminate made from the resin composition may have similar flame retardancy, dielectric properties, and heat resistance and heat resistance after moisture absorption with a reduced amount of the phosphaphenanthrene-based compound added in the resin composition. However, from the results of E11 in Table 6 compared to the results of C13 in Table 7, it is convinced that though the resin composition doped with a combination of a variety of conventional phosphorus-containing flame retardants, the overall performance of the laminate prepared therefrom is still worse than that of the laminate made from the resin composition having the phosphaphenanthrene-based compound of the present invention. In addition, from the results of E8 compared to the results of C6 or C7, it is convinced that the laminate made from the resin composition containing conventional phosphorus-based flame retardant has higher coefficient of thermal expansion, higher dielectric properties, reduced heat resistance, and unsatisfactory heat resistance after moisture absorption, and the flame retardancy of the laminate is unexpectedly worse than the flame resistance of the laminate made from the resin composition containing the phosphaphenanthrene-based compound of the present invention.
(88) The present invention is disclosed above by preferred embodiments. However, those skilled in the art should understand that the preferred embodiments are illustrative of the present invention only, but should not be interpreted as restrictive of the scope of the present invention. Accordingly, the legal protection for the present invention should be defined by the appended claims, and should not be limited to the aforementioned embodiments.
(89) Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.