Portable method and apparatus for folding plastic composite flooring
11485166 · 2022-11-01
Assignee
Inventors
Cpc classification
E04F15/105
FIXED CONSTRUCTIONS
E04F15/0215
FIXED CONSTRUCTIONS
B29C51/422
PERFORMING OPERATIONS; TRANSPORTING
International classification
Abstract
A method of folding plastic composition flooring, including but not limited to LVP, LVT, SPC or WPC, to form a desired shape, such as stair noses, baseboards, quarter rounds, T-moldings, endcaps, or the like. The method includes the steps of incorporating a thermal insulation layer between the plastic composite flooring and a heat generator, applying heat until reaching a heat transmission coefficient to allow the plastic composite flooring to become malleable, removing the heat, applying pressure to the heated section of the plastic composite flooring to form into a desired shape using a positive and negative embossing die mold on the top and bottom heated section of the plastic composite flooring, and removing the embossing die-molds once the plastic composite flooring has cooled down to its initial temperature.
Claims
1. A method of folding plastic composition flooring to form a desired shape at the point of use comprising the steps of: positioning a thermal insulation layer having predetermined spaced apart gap spaces between a piece of plastic composite flooring and a heat generator; applying heat from said heat generator through said gap spaces of said thermal insulation layer onto sections of said plastic composite flooring until reaching a heat transmission coefficient wherein said sections of said plastic composite flooring becomes malleable; placing said plastic composite flooring into a mold formed from a negative embossing die and a positive embossing die; introducing a predetermined amount of pressure to said positive embossing die to cause a folding of said sections of said plastic composite flooring into a desired shape as defined by said negative embossing die; maintaining said predetermined amount of pressure for a predetermined amount of time; displacing said dies to allow said plastic composite flooring to cool.
2. The method of folding plastic composition flooring according to claim 1, wherein said gap spaces are constructed and arranged to allow heat transfer from said heat generator to said plastic composite flooring.
3. The method of folding plastic composition flooring according to claim 1, wherein said mold is comprised of a positive embossing die and a negative embossing die applied on the top and bottom of said plastic composite flooring heated section.
4. The method of folding plastic composition flooring according to claim 1, including the step of applying a predetermined pressure to said die when said heated sections are at predetermined temperature for ease of forming a desired shape.
5. The method of folding plastic composition flooring according to claim 1, including the step of calculating an external bending curve length of a desired shape on a mold and heating said plastic composite flooring to a length of at least said external bending curve length.
6. The method of folding plastic composition flooring according to claim 5, including the step of increasing the temperature of a heated section by about ten percent of said external bending curve length to accommodate rounded finishes on said plastic composite flooring.
7. The method of folding plastic composition flooring according to claim 1 wherein said compostions is selected from the group consisting of SPC, WPC, LVP or LVT.
8. The method of folding plastic composition flooring according to claim 1 including the step of locking said positive embossing die to said negative embossing die.
9. The method of folding plastic composition flooring according to claim 1 wherein said positive embossing die includes water circulation channels for receipt of cooling water to accelerate cooling of said plastic composite flooring after heating.
10. The method of folding plastic composition flooring according to claim 1 wherein said plastic composition includes an insert, said insert positioned between said spaced apart sections.
Description
BRIEF DESCRIPTION OF THE FIGURES
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DETAILED DESCRIPTION OF THE INVENTION
(13) Referring now to
(14) Example 1: Material—WPC, thickness—4 mm, temperature—350° F., time—25 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—20 lbs.
(15) Example 2: Material—WPC, thickness—5.5 mm, temperature—350° F., time—30 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—30 lbs.
(16) Example 3: Material—WPC, thickness—6.5 mm, temperature—350° F., time—40 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—35 lbs.
(17) Example 4: Material—WPC, thickness—9 mm, temperature—350° F., time—60 seconds, burning side material temperature—160° F., minimum pressure to bend every 12 inches—38 lbs.
(18) Example 5: Material—SPC, thickness—3 mm, temperature—350° F., time—30 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—20 lbs.
(19) Example 6: Material—SPC, thickness—5.5 mm, temperature—350° F., time—40 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—25 lbs.
(20) Example 7: Material—SPC, thickness—9 mm, temperature—350° F., time—40 seconds, burning side material temperature—170° F., minimum pressure to bend every 12 inches—35 lbs.
(21) The thermal insulation layer 20 includes a predetermined gap space 22 to allow for proper heat transfer from the heat generator 30 to the plastic composite flooring 10. On the plastic composite flooring 10 there will be sections 15, 17 used as the area for folding to conform to a specific shape. Sections 15 and 17 on the plastic composite flooring 10 each have an equal length L2 that will be placed above the gap space 22 on the thermal insulation layer 20. This gap space 22 is sized to allow the heated plastic composite flooring 10 to form the corner sections 15, 17, forming a bottom wall 16 in
(22) The heat generator 30 must reach a heat transmission coefficient to allow the plastic composite flooring 10 to become malleable. Every plastic composite flooring 10 will have varying density and thickness, which will affect the required temperature needed to make the plastic composite flooring 10 malleable. Furthermore, each commercial brand has a variation in its density which could affect the heat transmission coefficient of the composite flooring, which may increase or decrease the time required to properly heat it to the point it becomes malleable at its heat transmission coefficient.
(23) The heat generator 30 is removed after the plastic composite flooring 10 is heated and placed into a mold 40. A die is used to apply to sections of plastic composite flooring that have been heated. The heat generator can be a process selected from microwave, infrared, vapor, resistance, solar, induction, indirect flame, direct flame, hot air circulation, direct friction, or the like heat source. In the preferred embodiment, the material is heated to a temperature wherein the corner sections 15, 17 are sufficiently malleable for folding and placement within a die having either a positive, or a negative and positive, embossing mold to form the desired shape. Once the plastic composite flooring 10 is molded into position, the material is allowed to cool, wherein the desired shape is maintained.
(24) The mold 40 is comprised of positive and negative embossing dies, 42 and 44, wherein the positive and negative embossing dies, 42 and 44, are applied on the top and bottom surfaces, 12 and 14, of the heated section of the plastic composite flooring 16. In order to create the desired shape, it is necessary to apply pressure based on each material's requirement to the positive and negative embossing die, 42 and 44, until both the dies are locked in place. The mold 40 must match the shape looking to be conformed, such as a rounded or square profile, shown in
(25) The final step is removing the mold 40 once the plastic composite flooring 10 has cooled down to its initial temperature. Once the cooling step is done, the folded plastic composite flooring 10 will keep its desired shape without losing any of its inherent structural properties, as shown in
(26) In circumstances where the desired shape is rounded, as shown in
(27) The heat insulator 30, thermal insulation layer 20, and mold 40 (positive and negative embossing die, 42 and 44) form a kit that is lightweight and easily transportable to jobsites. The installer at the jobsite is able to use the conventional flooring material to form stair noses, baseboards, quarter rounds, T-moldings, endcaps, and so forth, at the installation location. Use of the kit eliminates the need to match provisions to the conventional flooring, thereby assuring the provisions exactly match the flooring, including grain, color, shading, and texture.
(28) The composite flooring may include an inset, such as a decorative strip, a reflective strip, or an LED strip to highlight a step, baseboard, or any other object constructed from the composite material. The folding method allows the inset to be placed at a predetermined position. For example, the insert can be used to differentiate between individual stair steps. Based upon consumer preference, the use of a decorative strip having a design or color can help differentiate in daylight conditions. The use of a reflective or fluorescent strip provides a glow in the dark element that helps to differentiate the steps in low light conditions.
(29) Referring to
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(32) It is to be understood that while a certain form of the invention is illustrated, it is not to be limited to the specific form or arrangement herein described and shown. It will be apparent to those skilled in the art that various changes may be made without departing from the scope of the invention and the invention is not to be considered limited to what is shown and described in the specification and any drawings/figures included herein. The invention is readily adaptable to LVP, LVT, SPC, WPC or the like materials.
(33) One skilled in the art will readily appreciate that the present invention is well adapted to carry out the objectives and obtain the ends and advantages mentioned, as well as those inherent therein. The embodiments, methods, procedures and techniques described herein are presently representative of the preferred embodiments, are intended to be exemplary, and are not intended as limitations on the scope. Changes therein and other uses will occur to those skilled in the art which are encompassed within the spirit of the invention and are defined by the scope of the appended claims. Although the invention has been described in connection with specific preferred embodiments, it should be understood that the invention as claimed should not be unduly limited to such specific embodiments. Indeed, various modifications of the described modes for carrying out the invention which are obvious to those skilled in the art are intended to be within the scope of the following claims.
(34) The use of the word “a” or “an” when used in conjunction with the term “comprising” in the claims and/or the specification may mean “one,” but it is also consistent with the meaning of “one or more” or “at least one.” The use of the term “or” in the claims is used to mean “and/or” unless explicitly indicated to refer to alternatives only or the alternative are mutually exclusive, although the disclosure supports a definition that refers to only alternatives and “and/or.”
(35) The terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”) and “contain” (and any form of contain, such as “contains” and “containing”) are open-ended linking verbs. As a result, a method or device that “comprises,” “has,” “includes” or “contains” one or more steps or elements, possesses those one or more steps or elements, but is not limited to possessing only those one or more elements. Likewise, a step of a method or an element of a device that “comprises,” “has,” “includes” or “contains” one or more features, possesses those one or more features, but is not limited to possessing only those one or more features. Furthermore, a device or structure that is configured in a certain way is configured in at least that way, but may also be configured in ways that are not listed.