Method for providing a thermal absorber
09890972 ยท 2018-02-13
Assignee
Inventors
Cpc classification
F24S70/225
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C23C14/024
CHEMISTRY; METALLURGY
Y02E10/40
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
C23C14/00
CHEMISTRY; METALLURGY
Abstract
A method for providing a thermal absorber, which can be used in solar thermal collectors. The method includes a step of depositing on a substrate a first layer having a composition that comprises titanium, aluminium, nitrogen, and one of following elements: silicon, yttrium, cerium, and chromium. The method further optionally includes a step of depositing a second layer deposited on the first layer, the second layer having a composition including titanium, aluminium, nitrogen, oxygen and one of the elements of silicon, yttrium, cerium, and chromium, and a step of depositing a third layer having a composition including titanium, aluminium, silicon, nitrogen, and oxygen, the third layer being a top layer of the thermal absorber.
Claims
1. A method for providing a thermal absorber, the method comprising: depositing on a surface of a substrate a first layer as a light absorbing layer and as a diffusion barrier for preventing a diffusion of elements from the substrate into a coating of the substrate; depositing a second layer on the first layer of the thermal absorber; and depositing a top layer on the second layer; wherein the first layer belonging to the coating; wherein the first layer has a composition comprising titanium, aluminium, silicon and nitrogen, having a first layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a and TiAIN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a between 0.9-1.1; wherein the second layer has a composition comprising titanium, aluminium, silicon, nitrogen, and oxygen having a second layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8; and wherein the top layer has a composition comprising titanium, aluminium, silicon, nitrogen and oxygen having a top layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is at most 0.2, a value of y is at most 0.2, a value of z is at most 1, a value of a is at most 2, and a value of b is at most 2.
2. The method of claim 1, wherein the second layer is deposited directly on a top surface of the first layer.
3. The method of claim 1, wherein the top layer is deposited directly on a top surface of the second layer.
4. The method of claim 1, wherein the first layer, the second layer, or the top layer is deposited by a magnetron sputtering process, a high power impulse magnetron sputtering process, an atomic layer deposition process, a pulsed laser deposition process, or a physically enhanced chemical vapor deposition process.
5. A thermal absorber comprising a substrate having a first layer deposited on top of a surface of the substrate thereon as a light absorbing layer and as a diffusion barrier for preventing a diffusion of elements from the substrate into a coating of the substrate; a second layer deposited on the first layer of the thermal absorber; and a top layer deposited on a top surface of the second layer on the thermal absorber; wherein the first layer belonging to the coating; wherein the first layer has a composition comprising titanium, aluminium, silicon and nitrogen, having a first layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a and TiAIN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a between 0.9-1.1; wherein the second layer has a composition comprising titanium, aluminium, silicon, nitrogen, and oxygen having a second layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8; and wherein the top layer has a composition comprising titanium, aluminium, silicon, nitrogen and oxygen having a top layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is at most 0.2, a value of y is at most 0.2, a value of z is at most 1, a value of a is at most 2, and a value of b is at most 2.
6. A solar thermal collector comprising a thermal absorber, the thermal absorber comprising a substrate having: a first layer deposited on top of a surface of the substrate thereon as a light absorbing layer and as a diffusion barrier for preventing a diffusion of elements from the substrate into a coating of the substrate; a second layer deposited on the first layer of the thermal absorber; and a top layer deposited on a top surface of the second layer on the thermal absorber; wherein the first layer belonging to the coating; wherein the first layer has a composition comprising titanium, aluminium, silicon and nitrogen, having a first layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a and TiAIN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a between 0.9-1.1; wherein the second layer has a composition comprising titanium, aluminium, silicon, nitrogen, and oxygen having a second layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8; and wherein the top layer has a composition comprising titanium, aluminium, silicon, nitrogen and oxygen having a top layer formula of (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, wherein a value of x is at most 0.2, a value of y is at most 0.2, a value of z is at most 1, a value of a is at most 2, and a value of b is at most 2.
7. The thermal absorber of claim 5, wherein the second layer is deposited directly on a top surface of the first layer.
8. The thermal absorber of claim 5, wherein the top layer is deposited directly on a top surface of the second layer.
9. The solar thermal collector of claim 6, wherein the top layer is deposited directly on a top surface of the second layer.
10. The thermal absorber of claim 6, wherein the second layer is deposited directly on a top surface of the first layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Next, the preferred embodiments of the invention will be described with reference to the accompanying drawings, in which:
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DETAILED DESCRIPTION
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(8) During the method start-up in step 110, a vacuum deposition chamber and necessary materials and equipments utilized in a layer deposition process are set up. Then, in step 120, a metallic or non-metallic substrate is cleaned mechanically and/or chemically so that it is possible to deposit the thermal absorber coating on the substrate. Naturally, these steps 110 and 120 can be performed in an opposite order or together.
(9) In step 130 a first layer is deposited directly on the surface of the substrate and a typical substrate temperature during the deposition is, for example, 90 C.-450 C. In addition, during the deposition process, the substrate may be subjected to a negative polarization of 50 to 150 V.
(10) According to an embodiment of the invention relating to the method disclosed in any of the previous embodiments, the first layer of a coating is deposited directly on top of the substrate.
(11) According to an embodiment of the invention relating to the thermal absorber disclosed in any of the previous embodiments, the first layer of a coating is deposited directly on top of the substrate.
(12) The deposited first layer, which layer thickness is 10 nm-600 nm, comprises titanium, aluminium, silicon, and nitrogen (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a, is deposited in vacuum, for example, by magnetron sputtering from a substrate with a composition similar to the composition of the layer to be deposited or by simultaneous sputtering from the three pure element targets in a reactive atmosphere containing nitrogen. Alternatively, yttrium, cerium, or chromium can be used instead of silicon. Indices x, y, z, and a, and later on also indice b indicate a stoichiometric or non-stoichiometric composition of a coating layer. The values for x, y, z, and a can be, for example, 0.4, 0.5, 0.1, and 1.0 respectively.
(13) According to an embodiment of the invention, and in particular according to the method.sub.s disclosed in any of the previous embodiments, the composition of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a, where a value of x is typically between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a is between 0.9-1.1.
(14) According to an embodiment of the invention relating to the thermal absorber, which is disclosed in any of the previous embodiments, the composition of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a, where a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a is between 0.9-1.1.
(15) The function of this first layer is to absorb the incident light, to prevent or reduce a corrosion of the substrate due to environmental gases, and to prevent or reduce a diffusion of elements from the substrate into the coating.
(16) Despite its definition or name, the first layer does not have to be a first layer to be deposited on the substrate but it can also be a layer which has, for example, the above described composition and which is deposited on one or more other layers provided on the surface of the substrate.
(17) Once the first layer is on the substrate, a second layer of the coating is deposited on the surface of the first layer in step 140. The second layer comprises titanium, aluminium, silicon, nitrogen, and oxygen. Alternatively, yttrium, cerium, or chromium can be used instead of silicon.
(18) According to an embodiment of the invention, the method, which is disclosed in any of the previous embodiments, comprises a step of depositing a second layer of the coating having a composition that comprises titanium, aluminium, nitrogen, oxygen and one of following elements: silicon, yttrium, cerium, and chromium on the first layer.
(19) According to an embodiment of the invention the thermal absorber, which is disclosed in any of the previous embodiments, comprises a second layer of the coating, which is deposited on the first layer, having a composition that comprises titanium, aluminium, nitrogen, oxygen and one of following elements: silicon, yttrium, cerium, and chromium.
(20) The second layer, which layer thickness is between 10 nm-150 nm, comprises titanium, aluminium, silicon, nitrogen, and oxygen (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b. Typical substrate temperatures during the deposition process are also, for example, 90 C.-450 C. The layer is deposited, for example, by magnetron sputtering from a target with a composition similar to the composition of the second layer to be deposited or by simultaneous sputtering from two or three metallic alloy targets in a reactive atmosphere containing nitrogen and oxygen. The function of this second layer is to absorb partially the incident light and to enhance the interference at selected wavelengthes.
(21) In one embodiment the values for x, y, z, a, and b can be, for example, 0.4, 0.5, 0.1, 0.8, and 0.3 respectively.
(22) According to an embodiment of the invention relating to the method, which is disclosed in any of the previous embodiments, the composition of the second layer deposited directly on the top of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8.
(23) According to an embodiment of the invention relating to the thermal absorber, which is disclosed in any of the previous embodiments, the composition of the second layer deposited directly on the top of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8.
(24) Then, in step 150, a top layer of the coating is deposited on the surface of the second layer. The thickness of this layer is between 50 nm-250 nm and it comprises titanium, aluminium, silicon, nitrogen, and oxygen.
(25) According to an embodiment of the invention, the method, which is disclosed in any of the previous embodiments, comprises a step of depositing a third layer of the coating having a composition that comprises titanium, aluminium, silicon, nitrogen, and oxygen as a top layer of the thermal absorber coating.
(26) According to an embodiment of the invention, the thermal absorber, which is disclosed in any of the previous embodiments, comprises a third layer of the coating having a composition that comprises titanium, aluminium, silicon, nitrogen, and oxygen, the third layer is deposited as a top layer of the thermal absorber coating.
(27) Typical substrate temperatures during the deposition process of the top layer is also, for example, between room temperature and 450 C. The top layer is deposited, for example, by magnetron sputtering from a substrate with a composition similar to the composition of the top layer to be deposited or by simultaneous sputtering from several pure element targets in a reactive atmosphere containing nitrogen and oxygen. The function of the third layer is to serve as an antireflection layer in the optical multilayer stack and it may isolate the coating from the environmental gases.
(28) According to an embodiment of the invention relating to the method, which is disclosed in any of the previous embodiments, the composition of the third layer deposited directly on the top of the second layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0-0.2, a value of y is between 0-0.2, a value of z is between 0-1, a value of a is between 0-2, and a value of b is between 0-2.
(29) According to an embodiment of the invention relating to the thermal absorber, which is disclosed in any of the previous embodiments, the composition of the third layer deposited directly on the top of the second layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0-0.2, a value of y is between 0-0.2, a value of z is between 0-1, a value of a is between 0-2, and a value of b is between 0-2.
(30) The layers are deposited on the substrate by Physical Vapor Deposition process, for example, by using a conventional magnetron sputtering, high power impulse magnetron sputtering, Atomic Layer Deposition, Pulsed Laser Deposition, or Physically Enhanced Chemical Vapor Deposition. It is not necessary to use the same technique for each layer, but it is also possible to deposit part of the layers by using one process and other layer(s) by means of another process.
(31) According to an embodiment of the invention relating to the method, which is disclosed in any of the previous embodiments, the first layer, second layer, or third layer is deposited on the substrate by a magnetron sputtering process, a high power impulse magnetron sputtering process, an atomic layer deposition process, a pulsed laser deposition process, or a physically enhanced chemical vapor deposition process.
(32) According to an embodiment of the invention relating to the thermal absorber, which is disclosed in any of the previous embodiments, the first layer, second layer, or third layer is deposited on the substrate by a magnetron sputtering process, a high power impulse magnetron sputtering process, an atomic layer deposition process, a pulsed laser deposition process, or a physically enhanced chemical vapor deposition process.
(33) Finally, when the deposition process has ended, the absorber comprising the substrate and provided coating is removed from the deposition chamber and apparatus, and the method 100 ends in step 160.
(34) Referring to
(35)
(36) The first layer 310 deposited, for example, by magnetron sputtering in vacuum comprises a dense structure, wherein TiAlSiN crystallites 320 are dispersed in a Si.sub.3N.sub.4 matrix 330. The first layer 310, which is characterized by a high hardness, shows very low diffusability by most foreign elements and a high optical absorbance. The function of the layer 310 is to absorb the incident light and hinder a diffusion of elements from the substrate towards the coating or from the environment towards the substrate as mentioned before.
(37) According to an embodiment of the invention relating to the method, which is disclosed in any of the previous embodiments, the composition of the first layer comprises TiAlN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, and the first layer provides a diffusion barrier against elements of the substrate.
(38) According to an embodiment of the invention relating to the thermal absorber, which is disclosed in any of the previous embodiments, the composition of the first layer comprises TiAlN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, and the first layer provides a diffusion barrier against elements of the substrate.
(39) In one embodiment of the invention, a substrate is a flat or curved copper, aluminium, or stainless steel foil, or copper, aluminium, or stainless steel tube. The metallic substrate is mechanically and/or chemically cleaned before the coating process. The deposition of the first layer is performed by magnetron sputtering in a reactive atmosphere from pure element targets in vacuum at a temperature that is between 200 C.-350 C. The resulted first Ti.sub.xAl.sub.ySi.sub.zN.sub.a layer has a layer thickness between 10 nm-100 nm and the composition, where a value of x is 0.44, a value of y is 0.44, a value of z in the composition is 0.12, and value of a is 1.0. Second and third layers are also deposited by magnetron sputtering, and a thickness of the second layer is 10 nm-150 nm and a third layer thickness between 80 nm-250 nm.
(40) In another embodiment of the invention, a substrate comprises a flat or curved copper or stainless steel foil, or copper or stainless steel tube. The metallic substrate is also mechanically and/or chemically cleaned before the coating. The coating layer is deposited in vacuum similarly to the previous embodiment, but with a thickness between 200 nm-800 nm. The resulted Ti.sub.xAl.sub.ySi.sub.zN.sub.a layer has a layer thickness between 10 nm-100 nm and the composition, where a value of x is 0.24, a value of y is 0.64, a value of z is 0.12, and a value of a in the composition is 1.0. After depositing the first coating layer on the selected substrate, the coated substrate is exposed to a controlled atmosphere, rich in oxygen, at temperatures between 750 C.-900 C. for a time period between 5-300 minutes. During this thermal treatment that is a simple and economic procedure applicable to three dimensional substrates two additional layers, i.e. a second and third layer, are formed. The second layer is a conversion layer that marks a gradual decrease of a nitrogen content from the first layer to the third (top) layer. This gradual decrease is accompanied by a gradual increase of an oxygen content from the first layer to the third layer. Simultaneously, a metal content of layer changes, compared to the first layer. The third layer comprises a very dense dielectric oxide, relatively rich in Al.sub.2O.sub.3.
(41) The general trend of an elemental composition distribution within the heat treated absorber coating is described in distribution
(42) Yet in another embodiment of the invention, a substrate is a flat or curved plastic foil or plastic tube that is mechanically and/or chemically cleaned before a coating process. The thickness of a first layer is in this embodiment between 50 nm-100 nm and the value of z in the composition is between 0.05 and 0.01. A deposition temperature is chosen at 90 C., and a second and third layer are deposited by magnetron sputtering so that a second layer thickness is 50 nm-150 nm and a third layer thickness is between 100 nm-200 nm. During the deposition of each layer the substrate is exposed to an additional or intrinsic ion bombardment that can be achieved by high power impulse magnetron sputtering.
(43)
(44) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the first layer of a coating is deposited directly on top of the substrate.
(45) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the composition of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.a, where a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, a value of z is between 0.03-0.2, and a value of a between 0.9-1.1.
(46) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the composition of the first layer comprises TiAlN crystallites with Si.sub.3N.sub.4 forming an amorphous matrix, and the first layer provides a diffusion barrier against elements of the substrate.
(47) According to an embodiment of the invention, the solar thermal collector, which is disclosed in any of the previous embodiments, comprises a second layer of the coating, which is deposited on the first layer, having a composition that comprises titanium, aluminium, nitrogen, oxygen and one of following elements: silicon, yttrium, cerium, and chromium.
(48) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the composition of the second layer deposited directly on the top of the first layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0.3-0.5, a value of y is between 0.3-0.6, value of a z is between 0.03-0.2, a value of a is between 0.2-0.8, and a value of b is between 0.2-0.8.
(49) According to an embodiment of the invention, the solar thermal collector, which is disclosed in any of the previous embodiments, comprises a third layer of the coating having a composition that comprises titanium, aluminium, silicon, nitrogen, and oxygen, the third layer is deposited as a top layer of the thermal absorber.
(50) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the composition of the third layer deposited directly on the top of the second layer comprises (Ti.sub.xAl.sub.ySi.sub.z)N.sub.aO.sub.b, where a value of x is between 0-0.2, a value of y is between 0-0.2, a value of z is between 0-1, a value of a is between 0-2, and a value of b is between 0-2.
(51) According to an embodiment of the invention relating to the solar thermal collector, which is disclosed in any of the previous embodiments, the first layer, second layer, or third layer is deposited on the substrate by a magnetron sputtering process, a high power impulse magnetron sputtering process, an atomic layer deposition process, a pulsed laser deposition process, or a physically enhanced chemical vapor deposition process.
(52) The flat plate-type collector 500 comprises a transparent cover 520 made of, for example, glass or polycarbonate, which is configured to allow the solar radiation to pass to the absorber element 510 and reduce a heat loss from the absorber element 510, and a collector frame 530. The cover 520 and frame 530 shelter said absorber element 510 and tubes 540 connected to the absorber element 510, wherein a heat transport fluid, for example, air, water, or antifreeze, flows so that the absorbed heat is removed from the absorber element 510. The heat transport fluid circulates through the tubes 540 and transports the resulted heat to a water tank directly in the case of water flowing in the tubes 540. On the bottom of the collar collector 500, under the tubes 540 is yet a heat insulation 550.
(53) The invention has been now explained above with reference to the aforesaid embodiments and the several advantages of the invention have been demonstrated. It is clear that the invention is not only restricted to these embodiments, but comprises all possible embodiments within the spirit and scope of the invention thought and the following patent claims.