Tuning fork crystal oscillator plate and manufacturing method therefor, and piezoelectric device

Abstract

The present invention provides a tuning fork crystal oscillator plate and a manufacturing method therefor, and a piezoelectric device. The tuning fork crystal oscillator plate has a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps; and outer surfaces of the step-shaped sinking groove are all plated with electrodes. The piezoelectric oscillator plate manufactured by the present invention has the advantages of low impedance, high frequency precision and low energy consumption.

Claims

1. A tuning fork crystal oscillator plate, having a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps, and the n steps are formed by n times of photolithography and corrosion, where n is a natural number and is greater than or equal to 2; outer surfaces of the step-shaped sinking groove are all plated with electrodes; the step-shaped sinking groove comprises a middle step and at least one group of edge steps; the number of the middle steps is one, the number of the edge steps is n1 groups, and each group of the edge steps are two same steps that are symmetrically arranged on two sides of the middle step; when one group of edge steps are provided, a width W1 of any one of the edge steps is 5%-40% of a total width W of the steps; the total width of the steps is a sum of widths of all the edge steps and a width of the middle step; a ratio of a height H1 of any one of the edge steps to a height H2 of the middle step is 1:1-1:3; when two groups of edge steps are provided, widths of the two groups of edge steps are the same, and a sum of widths of two edge steps on the same side is 28%-32% of the total width W of the steps; a height of the two groups of edge steps is the same as that of the middle step; when three groups of edge steps are provided, widths of the three groups of edge steps are the same, and a sum of widths of three edge steps on the same side is 28%-32% of the total width W of the steps; and a height of the three groups of edge steps is the same as that of the middle step.

2. The tuning fork crystal oscillator plate according to claim 1, wherein the step-shaped sinking groove has one group of edge steps, two groups of edge steps, or three groups of edge steps.

3. The tuning fork crystal oscillator plate according to claim 1, wherein when one group of edge steps are provided, and a width W1 of one edge step is 10%-30% of the total width W of the steps; a ratio of a height H1 of the edge step to a height H2 of the middle step is 1:1-1:2; when two groups of edge steps are provided, widths of the two groups of edge steps are the same, and a sum of widths of two edge steps on the same side is 30% of the total width W of the steps; a height of the two groups of edge steps is the same as that of the middle step; when three groups of edge steps are provided, widths of the three groups of edge steps are the same, and a sum of widths of three edge steps on the same side is 30% of the total width W of the steps; and a height of the three groups of edge steps is the same as that of the middle step.

4. A piezoelectric device, comprising the tuning fork crystal oscillator plate according to claim 1.

5. A manufacturing method for the tuning fork crystal oscillator plate according to claim 1, comprising the following steps: S1: plating metal films on front and back surfaces of a quartz plate interdigital; S2: performing photolithography and corrosion on a first layer of grooves; S21: performing front and back surface coating of a photosensitive photoresist material on the quartz plate interdigital plated with the metal films; S22: performing pattern exposure and development on a position that is of the quartz plate coated with the photosensitive photoresist material and that is correspondingly subject to the photolithography and corrosion of the first layer of grooves to expose a required pattern; S23: performing metal etching on the exposed area by using an etching solution to expose a surface of the to-be-corroded quartz plate; S24: stripping and removing the photoresist on the surface of the quartz plate; S25: corroding by using a corrosive solution to corrode the area exposed by metal etching downwards to corrode out an initial profile morphology of the first layer of grooves; S3: performing photolithography and corrosion on a second layer of grooves; S31: performing front and back surface coating of a photosensitive photoresist material on the quartz plate interdigital subjected to the photolithography and corrosion of the first layer of grooves; S32: performing pattern exposure and development on a position that is of the quartz plate coated with the photosensitive photoresist material and that is correspondingly subject to the photolithography and corrosion on the second layer of grooves to expose a required pattern; S33: performing metal etching on the exposed area by using an etching solution to expose a surface of the to-be-corroded quartz plate; S34: stripping and removing the photoresist on the surface of the quartz plate; S35: corroding a surface of the to-be-corroded quartz plate exposed by the metal etching downwards by using a corrosive solution; wherein in this case, the first layer of groove structure and the second layer of groove structure are both corroded to form a step-shaped sinking groove structure; when the step-shaped sinking groove has n steps and n is greater than 3, repeating step S3 n2 times; and S4: removing the metal on the surface of the quartz plate by using an etching solution to obtain the tuning fork crystal oscillator plate.

6. The manufacturing method for the tuning fork crystal oscillator plate according to claim 5, wherein in the step S1, the metal film is plated by magnetron sputtering or evaporation plating, chromium is used as a bottom layer, the metal film has a thickness of 5-50 nm, and a top layer is made of gold and has a thickness greater than 100 nm; and in the step S23 and the step S33, the performing metal etching on the exposed area by using an etching solution is to perform metal etching by sequentially using a gold etching solution and a chromium etching solution.

7. The manufacturing method for the tuning fork crystal oscillator plate according to claim 5, wherein in the step S25 and the step S35, when the corrosive solution is used for corrosion, a flow rate of the corrosive solution is 8-20 L/min, a corrosion temperature is 30-90 C., and the corrosion is performed for 15-130 min.

8. The manufacturing method for the tuning fork crystal oscillator plate according to claim 5, wherein in the step S25 and the step S35, when the corrosion is performed by using the corrosive solution, a flow rate of the corrosive solution is 15-20 L/min, and a corrosion temperature is 50-70 C.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) In order to more clearly illustrate the technical solutions in the embodiments of the present invention or in the prior art, the drawings required to be used in the description of the embodiments or the prior art are briefly introduced below. It is obvious that the drawings in the description below are some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings according to the drawings provided herein without creative efforts.

(2) FIG. 1 is a design diagram of a tuning fork crystal oscillator plate (where electrodes are not shown) in the conventional technology;

(3) FIG. 2 is a schematic diagram of a cross-sectional structure and an electric field of a vibrating arm of a tuning fork crystal oscillator plate after corrosion in the conventional technology;

(4) FIG. 3 is a schematic diagram of an electric field distribution of a non-grooved vibrating arm in the conventional technology;

(5) FIG. 4 is a stress analysis diagram of the vibrating arm in FIG. 3;

(6) FIG. 5 is an analysis diagram of the electric field drive and vibration direction of the vibrating arm of the structure shown in FIG. 2;

(7) FIG. 6 is a schematic diagram of the stretching vibration in the X direction of the structure shown in FIG. 2;

(8) FIG. 7 is a schematic diagram of the force analysis and vibration of the structure shown in FIG. 2;

(9) FIG. 8 is a design diagram of a tuning fork crystal oscillator plate according to Embodiment 3 of the present invention;

(10) FIG. 9 is a comparison diagram of the electric field distribution between the design diagram in Embodiment 3 of the present invention and the design diagram of the tuning fork crystal oscillator plate in the conventional technology;

(11) FIG. 10 is a cross-sectional structural diagram and an electric field distribution diagram of a vibrating arm of a tuning fork crystal oscillator plate manufactured in Embodiment 3 of the present invention;

(12) FIG. 11 is a force analysis diagram of the vibrating arm of the tuning fork crystal oscillator plate manufactured in Embodiment 3 of the present invention;

(13) FIG. 12 is a comparison diagram of the displacement distributions of the tuning fork crystal oscillator plate in Embodiment 3 of the present invention and the conventional technology;

(14) FIG. 13 is a comparison diagram of the charge distributions of the tuning fork crystal oscillator plate in Embodiment 3 of the present invention and the conventional technology;

(15) FIG. 14 is a comparison diagram of the impedance analysis of the tuning fork crystal oscillator plate in Embodiment 3 of the present invention and the conventional technology; and

(16) FIG. 15 is a cross-sectional view of a single vibrating arm in Embodiments 3 to 8 of the present invention.

(17) In the drawings:

(18) 1: vibrating arm; 2: middle step; 3: edge step; 4: base; 5: step-shaped sinking grooves; 6: electrode.

DETAILED DESCRIPTION OF EMBODIMENTS

(19) In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following describes the technical solutions of the present invention in detail. It is clear that the described embodiments are merely some but not all of embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

(20) Embodiment 1: A tuning fork crystal oscillator plate provided by the present invention has a base 4 and a pair of vibrating arms 1 extending out of the base 4, wherein a front surface and a back surface of each vibrating arm 1 are separately provided with step-shaped sinking grooves 5 formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves 5 along a length direction of the vibrating arms 1. the step-shaped sinking groove 5 is provided with n steps, and the n steps are formed by n times of photolithography and corrosion, where n is a natural number and is greater than or equal to 2; and outer surfaces of the step-shaped sinking groove 5 are all plated with electrodes 6.

(21) According to the tuning fork crystal oscillator plate and the manufacturing method therefor provided by the present invention, the manufactured piezoelectric oscillator plate is provided with step-shaped sinking grooves 5 formed by photolithography and corrosion on both front and back surfaces of the vibrating arm 1, the step-shaped sinking groove 5 is subjected to photolithography and corrosion along a length direction of the vibrating arm 1, and the step-shaped sinking groove 5 structure not only increases the area of a polarized electric field, but also facilitates the improvement of vibration impedance; in addition, the step-shaped sinking groove 5 is formed by multiple times of photolithography and corrosion, so that the corrosion edges and corners in the X direction caused by one-time corrosion can be improved, the bilateral symmetry of the sinking groove in the X direction can be ensured, the vibration symmetry of two arms of the tuning fork can be improved, the stretching vibration in the X direction can be avoided, and the impedance can be further reduced; and the step-shaped sinking groove can improve the precision of frequency and reduce the energy consumption when being applied to a piezoelectric device.

(22) In an optional implementation, the step-shaped sinking groove 5 comprises a middle step 2 and at least one group of edge steps 3; the number of the middle steps 2 is one, the number of the edge steps 3 is n1 groups, and each group of the edge steps 3 are two same steps that are symmetrically arranged on two sides of the middle step 2.

(23) In an optional implementation, the step-shaped sinking groove 5 has one group of edge steps 3, two groups of edge steps 3, or three groups of edge steps 3.

(24) In an optional implementation, when one group of edge steps 3 are provided, a width W1 of any one of the edge steps 3 is 5%-40% of a total width W of the steps; a ratio of a height H1 of any one of the edge steps 3 to a height H2 of the middle step 2 is 1:1-1:3; the total width of the steps is a sum of widths of all the edge steps 3 and a width of the middle step 2;

(25) when two groups of edge steps 3 are provided, widths of the two groups of edge steps 3 are the same, and a sum of widths of two edge steps 3 on the same side is 28%-32% of the total width W of the steps; a height of the two groups of edge steps 3 is the same as that of the middle step 2; when three groups of edge steps 3 are provided, widths of the three groups of edge steps 3 are the same, and a sum of widths of three edge steps 3 on the same side is 28%-32% of the total width W of the steps; and a height of the three groups of edge steps 3 is the same as that of the middle step 2.

(26) In an optional implementation, when one group of edge steps 3 are provided, and a width W1 of one edge step 3 is 10%-30% of the total width W of the steps; a ratio of a height H1 of the edge step 3 to a height H2 of the middle step 2 is 1:1-1:2; when two groups of edge steps 3 are provided, widths of the two groups of edge steps 3 are the same, and a sum of the widths of two edge steps 3 on the same side is 30% of the total width W of the steps; a height of the two groups of edge steps 3 is the same as that of the middle step 2; when three groups of edge steps 3 are provided, widths of the three groups of edge steps 3 are the same, and a sum of widths of three edge steps 3 on the same side is 30% of the total width W of the steps; and a height of the three groups of edge steps 3 is the same as that of the middle step 2.

(27) Embodiment 2: A piezoelectric device provided by the present invention comprises the tuning fork crystal oscillator plate.

(28) The piezoelectric device provided by the present invention comprises the tuning fork crystal oscillator plate in the present invention, the manufactured piezoelectric oscillator plate is provided with step-shaped sinking grooves 5 formed by photolithography and corrosion on both front and back surfaces of the vibrating arm 1, the step-shaped sinking groove 5 is subjected to photolithography and corrosion along a length direction of the vibrating arm 1, and the step-shaped sinking groove 5 structure not only increases the area of a polarized electric field, but also facilitates the improvement of vibration impedance; in addition, the step-shaped sinking groove 5 is formed by multiple times of photolithography and corrosion, so that the corrosion edges and corners in the X direction caused by one-time corrosion can be improved, the bilateral symmetry of the sinking groove in the X direction can be ensured, the vibration symmetry of two arms of the tuning fork can be improved, the stretching vibration in the X direction can be avoided, and the impedance can be further reduced; and therefore, the piezoelectric device provided by the present invention has the advantages of high frequency accuracy and low energy consumption.

(29) Embodiment 3: The tuning fork crystal oscillator plate is manufactured by taking FIG. 8 as a design diagram, wherein the step-shaped sinking groove 5 has a structure as shown in FIG. 15(a), one group of edge steps 3 are provided, and a width W1 of one edge step 3 is 20% of the total width W of the steps; a ratio of a height H1 of the edge step 3 to a height H2 of the middle step 2 is 1:1.5; and the manufacturing method for the tuning fork crystal oscillator plate specifically comprises the following steps: S1: plating metal films on front and back surfaces of a quartz plate interdigital; S2: performing photolithography and corrosion on a first layer of grooves; S21: performing front and back surface coating of a photosensitive photoresist material on the quartz plate interdigital plated with the metal films; S22: performing pattern exposure and development on a position that is of the quartz plate coated with the photosensitive photoresist material and that is correspondingly subject to the photolithography and corrosion of the first layer of grooves to expose a required pattern; S23: performing metal etching on the exposed area by using the gold etching solution and chromium etching solution to expose a surface of the to-be-corroded quartz plate; S24: stripping and removing the photoresist on the surface of the quartz plate; S25: corroding by using a corrosive solution to corrode the area exposed by metal etching downwards, wherein when the corrosive solution is used for corrosion, a flow rate of the corrosive solution is 18 L/min, a corrosion temperature is 60 C., and the corrosion is performed for 60 min; corroding out an initial profile morphology of the first layer of grooves; S3: performing photolithography and corrosion on a second layer of grooves; S31: performing front and back surface coating of a photosensitive photoresist material on the quartz plate interdigital subjected to the photolithography and corrosion of the first layer of grooves; S32: performing pattern exposure and development on a position that is of the quartz plate coated with the photosensitive photoresist material and that is correspondingly subject to the photolithography and corrosion on the second layer of grooves to expose a required pattern; S33: performing metal etching on the exposed area by using the gold etching solution and chromium etching solution to expose a surface of the to-be-corroded quartz plate; S34: stripping and removing the photoresist on the surface of the quartz plate; S35: corroding a surface of the to-be-corroded quartz plate exposed by the metal etching downwards by using a corrosive solution; wherein when the corrosive solution is used for corrosion, a flow rate of the corrosive solution is 18 L/min, a corrosion temperature is 60 C., and the corrosion is performed for 90 min, and in this case, the first layer of groove structure and the second layer of groove structure are both corroded to form a step-shaped sinking groove 5 structure; when the step-shaped sinking groove 5 has n steps and n is greater than 3, repeating step S3 n times; and S4: removing the metal on the surface of the quartz plate by using an etching solution to obtain the tuning fork crystal oscillator plate.

(30) Finite element analysis calculations are performed on the tuning fork crystal oscillator plates manufactured in Embodiment 3:

(31) FIG. 9 is a schematic diagram of the electric field distribution, where FIG. 9(a) is a schematic diagram of the electric field distribution of the structure shown in FIG. 1, and FIG. 9(b) is a schematic diagram of the electric field distribution of the structure shown in FIG. 8.

(32) FIG. 10 shows a schematic diagram of a cross-sectional structure and an electric field distribution diagram of the vibrating arm 1 of the tuning fork quartz crystal oscillator plate obtained in Embodiment 3; it can be observed from FIG. 10 that the bilateral symmetry of the corrosion groove has been greatly improved compared to that of FIG. 2, and the symmetry along the X direction can be ensured.

(33) FIG. 11 shows stress and vibration analysis for the structure in Embodiment 3; as shown in FIG. 11, under the driving action of the electric field l (an X-direction electric field), the deflection angle of the stress T2 in the vibration direction becomes very small, and the stress T1 in the X-direction also tends to be symmetrical and does not generate the stretching vibration shown in FIG. 7.

(34) FIG. 12 is a comparison diagram of the displacement distribution, where FIG. 12(a) is the displacement distribution diagram for the structure shown in FIG. 2, and FIG. 12(b) is the displacement distribution diagram for the structure shown in FIG. 9; it can be observed from the finite element analysis calculation results for FIG. 12(a) that the vibration displacement of the rectangular groove in the X direction in the FIG. 12(a) is 5.8e-5 mm, and the vibration displacement of the stepped sinking groove in the FIG. 12(b) is 5.6e-4 mm, so that the vibration displacement is significantly increased by one order of magnitude, which indicates that the vibration impedance is reduced.

(35) FIG. 13 is a comparison diagram of the charge distributions, where FIG. 13(a) is the charge distribution diagram for the structure shown in FIG. 2, and FIG. 13(b) is the charge distribution diagram for the structure shown in FIG. 10; FIG. 14 is a comparison diagram of the impedance analysis, where FIG. 14(a) is an impedance analysis diagram of the structure shown in FIG. 2, and FIG. 14(b) is an impedance analysis diagram of the structure shown in FIG. 10; the magnitude of the impedance can be seen by the charge distribution diagram of FIG. 13 and the impedance analysis diagram of FIG. 14, where the impedance of the structure shown in FIG. 2 is 35 K, while the impedance of the structure shown in FIG. 9 is 18.6 K, and the overall impedance is reduced by half. Therefore, the stepped sinking groove is very beneficial to the vibration impedance of the tuning fork by increasing the polarization area of an electric field and the symmetrical corrosion groove.

(36) Embodiment 4: The step-shaped sinking groove 5 has a structure as shown in FIG. 15(b), one group of edge steps 3 are provided, and a width W1 of one edge step 3 is 5% of the total width W of the steps; a ratio of a height H1 of the edge step 3 to a height H2 of the middle step 2 is 1:1; and the manufacturing steps are the same as those in Embodiment 3; this embodiment differs from Embodiment 3 in that: the specific corrosion parameters (flow rate of corrosive solution, corrosion temperature, and corrosion time) in this embodiment are shown in Table 1 below; and the tuning fork crystal oscillator plate is obtained.

(37) Embodiment 5: The step-shaped sinking groove 5 has a structure as shown in FIG. 15(c), one group of edge steps 3 are provided, and a width W1 of one edge step 3 is 30% of the total width W of the steps; a ratio of a height H1 of the edge step 3 to a height H2 of the middle step 2 is 1:2; and the manufacturing steps are the same as those in Embodiment 3; this embodiment differs from Embodiment 3 in that: the specific corrosion parameters (flow rate of corrosive solution, corrosion temperature, and corrosion time) in this embodiment are shown in Table 1 below; and the tuning fork crystal oscillator plate is obtained.

(38) Embodiment 6: The step-shaped sinking groove 5 has a structure as shown in FIG. 15(d), one group of edge steps 3 are provided, and a width W1 of one edge step 3 is 30% of the total width W of the steps; a ratio of a height H1 of the edge step 3 to a height H2 of the middle step 2 is 1:3; and the manufacturing steps are the same as those in Embodiment 3; this embodiment differs from Embodiment 3 in that: the specific corrosion parameters (flow rate of corrosive solution, corrosion temperature, and corrosion time) in this embodiment are shown in Table 1 below; and the tuning fork crystal oscillator plate is obtained.

(39) Embodiment 7: The step-shaped sinking groove 5 has a structure as shown in FIG. 15(e), two groups of edge steps 3 are provided, the width W1 of the edge step 3 is equal to W2, and the sum of W1 and W2 is 20% of the total width W of the steps; the height H1 of the edge step 3 is equal to H2, and the height H3 of the middle step 2 is equal to H1; and the manufacturing steps are the same as those in Embodiment 3; this embodiment differs from Embodiment 3 in that: since three groups of edge steps 3 are provided, the step S3 is required to be repeated once again to perform photolithography and corrosion on the third layer of grooves, and the specific corrosion parameters (flow rate of corrosive solution, corrosion temperature, and corrosion time) in this embodiment are shown in Table 1 below; and the tuning fork crystal oscillator plate is obtained.

(40) Embodiment 8: The step-shaped sinking groove 5 has a structure as shown in FIG. 15(f), three groups of edge steps 3 are provided, the width W1 of the edge step 3 is equal to W2 and W3, and the sum of W1, W2 and W3 is 30% of the total width W of the steps; the height H1 of the edge step 3 is equal to H2 and H3, and the height H4 of the middle step 2 is equal to H1; and the manufacturing steps are the same as those in Embodiment 3; this embodiment differs from Embodiment 3 in that: since three groups of edge steps 3 are provided, the step S3 is required to be repeated twice again to perform photolithography and corrosion on the third layer of grooves and the fourth layer of grooves, and the specific corrosion parameters (flow rate of corrosive solution, corrosion temperature, and corrosion time) in this embodiment are shown in Table 1 below; and the tuning fork crystal oscillator plate is obtained.

(41) In the Embodiment 3 to Embodiment 8 and the conventional technology shown in FIG. 1: (1) the total width W of the steps is the same and is the same as the width of the groove in the conventional technology; and (2) the total depth of the steps (i.e., the depth of the middle steps) is the same and is the same as the depth of the groove in the conventional technology.

(42) The vibration impedance of the tuning fork crystal oscillator plates in Embodiments 3 to 8 and in the conventional technology is calculated by using finite element analysis, and the results are shown in the following Table 1:

(43) TABLE-US-00001 TABLE 1 Impedance calculation results for the oscillator plates in Embodiments 3 to 8 and in the conventional technology Corrosion parameters (flow rate of corrosive solution, corrosion temperature, corrosion time) Design First layer of Second layer Third layer of Fourth layer of Impedance, Embodiments parameters grooves grooves grooves grooves k One Embodiment 3 W1 = 20%*W The flow rate is The flow rate is 18.6 group H1:H2 = 1:1.5 18 L/min 18 L/min of edge The temperature The temperature steps is 60 C. is 60 C. The time is 60 The time is 90 min min Embodiment 4 W1 = 5%*W The flow rate is The flow rate is 30 H1:H2 = 1:1 18 L/min 18 L/min The temperature The temperature is 60 C. is 60 C. The time is 80 The time is 80 min min Embodiment 5 W1 = 30%*W The flow rate is The flow rate is 28 H1:H2 = 1:2 20 L/min 20 L/min The temperature The temperature is 60 C. is 60 C. The time is 50 The time is 100 min min Embodiment 6 W1 = 40%*W The flow rate is The flow rate is 31 H1:H2 = 1:3 15 L/min 15 L/min The temperature The temperature is 70 C. is 70 C. The time is 40 The time is 120 min min Two Embodiment 7 W1 = W2, The flow rate is The flow rate is The flow rate is 25 groups W1 + W2 = 15 L/min 15 L/min 15 L/min of edge 30%*W The temperature The temperature The temperature steps H1 = H2 = H3 is 60 C. is 60 C. is 60 C. The time is 50 The time is 50 The time is 50 min min min Three Embodiment 8 W1 = W2 = W3, The flow rate is The flow rate is The flow rate is The flow rate is 18.5 groups W1 + W2 + 15 L/min 15 L/min 15 L/min 15 L/min of edge W3 = 30%*W The temperature The temperature The temperature The temperature steps H1 = H2 = is 60 C. is 60 C. is 60 C. is 60 C. H3 = H4 The time is 40 The time is 40 The time is 40 The time is 40 min min min min One groove Structure The flow rate is 35 shown in FIG. 15 L/min 1 The temperature (conventional is 60 C. technology) The time is 160 min

(44) It can be seen from Table 1 that the vibration impedance of the tuning fork crystal oscillator plate manufactured in the present invention is significantly lower than that of the tuning fork crystal oscillator plate in the conventional technology, and especially, in Embodiment 3, Embodiment 7 and Embodiment 8, the vibration impedance has a large reduction range, which has significant advantages, and when the tuning fork crystal oscillator plate is applied to a piezoelectric device, the frequency accuracy can be greatly improved and the energy consumption can be greatly reduced.

(45) The foregoing descriptions are merely specific implementations of the present invention, but are not intended to limit the protection scope of the present invention. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in the present invention shall fall within the protection scope of the present invention.