Thermal Process Device With Non-Uniform Insulation

Abstract

A thermal process device for heat treating a product or plurality of products includes a thermal processing chamber having opposed distal ends and at least one controllable heating zone. At least one buffer zone disposed is at each of the distal ends, the buffer zones and at least one heating zone of the thermal processing chamber forming a heating element assembly having an inner and outer surface. At least one layer of insulating material is disposed along the at least one buffer and heating zones of the thermal processing chamber and forming part of the heating element assembly, the at least one layer of insulating material having a controlled efficiency being applied non-uniformly across an axial length of the heating assembly.

Claims

1. A thermal process device for heat treating a product or plurality of products, the device comprising: a thermal processing chamber having opposed distal ends and at least one controllable heating zone; at least one buffer zone disposed at each of the distal ends, the buffer zones and at least one heating zone of the thermal processing chamber forming a heating element assembly having an inner and outer surface; and at least one layer of insulating material disposed along the at least one buffer and heating zones of the thermal processing chamber and forming part of the heating element assembly, the at least one layer of insulating material having a controlled efficiency being applied non-uniformly across an axial length of the heating assembly.

2. The thermal processing device according to claim 1, wherein a portion of the at least one layer of insulating material located at the at least one buffer zone has a maximized efficiency and a portion of the at least one layer of insulating material at the at least one heating zone has a lower efficiency to achieve a desired cooling rate.

3. The thermal processing device according to claim 1, wherein the efficiency of the insulating material is controlled by varying the thickness of the layer of insulating material.

4. The thermal processing device according to claim 1, wherein the efficiency of the insulating material is controlled by using insulating material with different grades of thermal conductivity.

5. The thermal processing device according to claim 1, wherein the efficiency of the insulating material is controlled by using differing arrangements of multiple layers of the insulating material.

6. The thermal processing device according to claim 5, wherein the multiple layers have the same thickness.

7. The thermal processing device according to claim 5, wherein the multiple layers have different thicknesses.

8. The thermal processing device according to claim 7, wherein the thickness of at least one of the layers varies along a length of the processing chamber.

9. The thermal processing device according to claim 8, wherein at least one layer at the at least one heating zone has a thickness that is less than a layer at the at least one buffer zone.

10. The thermal processing device according to claim 4, wherein the insulating material has at least one first insulation portion and a second insulation portion, wherein the insulating material in the at least one insulation portion is different than the material in the second insulation portion.

11. The thermal processing device according to claim 1, further comprising an outer shell disposed about the outer surface of the heating element assembly.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1 is a perspective view of the thermal process device.

[0011] FIG. 2. is a cross-sectional view of the thermal processing chamber of FIG. 1.

[0012] FIG. 3 is a cross-sectional view of the thermal processing chamber with non-uniform insulation.

DETAILED DESCRIPTION

[0013] Referring to FIGS. 1-3, a thermal process device 10 for heat treating a product or plurality of products includes a thermal processing chamber 12. The products to be treated may include semiconductor wafers, for example, for curing or doping or in the annealing of steel.

[0014] As shown in FIG. 2, chamber 12 has controllable heating zone 14 located in a central portion of the chamber. It should be appreciated that heating zone 14 can be a single or plural heating zones (14-14). Chamber 12 has an outer surface 24 and distal, opposed ends 18, 20. At least one buffer zone 16 is disposed at each of the distal ends 18, 20 of chamber 12. Together the buffer zones 16 and heating zones 14 of thermal processing chamber 12 form a heating element assembly 22. Thermal processing chamber 12 and heating element assembly 22 can be substantially cylindrical.

[0015] Referring to FIGS. 2 and 3, heating assembly 22 includes layers of insulating material 28 and 34. The insulating material can have a controlled efficiency as described further herein. Insulating material layer 34 is located between the outer surface 24 of processing chamber 12 and inner surface 26 of the outer layer 28. Thus, heating assembly 22 has an inner layer 34 and an outer layer 28 of insulation. It should be appreciated that a single or plurality of layers can be provided in the heating assembly 22.

[0016] As shown in FIG. 3, an outer shell 30 may disposed about the outer layer 28 of the heating element assembly 22. The layers of insulating material, for example, layer 34 can be applied non-uniformly across the length of the heating assembly. Non-uniformly means having one or more layers of material having the same or with different grades of thermal conductivity, the one or more layers having the same or different thicknesses, a layer having different thicknesses or different grades of thermal conductivity varying along its length, a layer or layers having different materials with different grades of thermal conductivity side-by-side along its length, the different portions having the same or different thicknesses, by using insulating material with different grades of thermal conductivity, by using differing arrangements of multiple layers of the insulating material, and a combination of all the above.

[0017] As shown in FIG. 2, the insulating layer(s) of the heating assembly can have a first insulation portion 38 with maximised efficiency in the buffer zones 16 and a second insulation portion 40 that has a lower efficiency can applied in the heating zones 14 in order to achieve the desired cooling rate. It should be appreciated that although only two side-by-side insulation portions are shown, numerous different insulation portions can be placed at various positions to form the non-uniform insulating layer as described above, depending on the heating and buffer zones.

[0018] Referring again to FIG. 3, insulating material 34 can have more than one layer. For example, insulating material 34 can have multiple layers 36 and 37. It should be appreciated that although two layers are shown, multiple layers can be provided. Layers 36 and 37 can have the same or different thicknesses. Also, the layers each can have the same thicknesses or a thickness that varies along the length of the assembly. For example, layer 36 of insulating material 34 can have a thickness at heating zone(s) 14 and second insulation portion 40 that is less than the thickness of layer 36 at first insulation portions 38. Thus, the efficiency of the insulation can for example, but not limited to, be controlled by varying the thickness, thermal conductivity grade of the insulation or differing arrangements of multiple layers of the insulating material in any combination along the axial length of the process chamber 12 as described supra.

[0019] The thermal process device can be any sort of multi-zone cooling process and could be used for a horizontal thermal processing chamber with a fluidic cooling system, as well as a vertical chamber.

[0020] Although the present embodiments have been described in relation to particular aspects therefore, many other variations and modifications and other uses will become apparent to those skilled in the art. It is preferred therefore, that the present embodiments be not limited by the specific disclosure herein, but only by the appended claims.