RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS

Abstract

A resin composition for molding includes an epoxy resin, a curing agent, and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

Claims

1. A resin composition for molding, which is used in sealing of an electronic component in a high frequency device, comprising: an epoxy resin; a curing agent; and an inorganic filler containing calcium titanate particles, wherein a content of the calcium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, and a total content of the calcium titanate particles and strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, and the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles.

2. The resin composition for molding according to claim 1, wherein the curing agent includes an active ester compound.

3. (canceled)

4. The resin composition for molding according to claim 1, wherein the inorganic filler contains alumina particles.

5. The resin composition for molding according to claim 1, wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.

6. The resin composition for molding according to claim 1, wherein a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.

7. (canceled)

8. The resin composition for molding according to claim 1, which is used in an antenna-in-package.

9. An electronic component apparatus comprising: a support member; an electronic component placed on the support member; and a cured product of the resin composition for molding according to claim 1 which seals the electronic component.

10. The electronic component apparatus according to claim 9, wherein the electronic component includes an antenna.

11. A resin composition for molding comprising: an epoxy resin; a curing agent; and an inorganic filler containing calcium titanate particles, and a total content of the calcium titanate particles and strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler, wherein the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles, and a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.

12. The resin composition for molding according to claim 11, which is used in a high frequency device.

13. The resin composition for molding according to claim 11, wherein the curing agent includes an active ester compound.

14. The resin composition for molding according to claim 11, wherein the inorganic filler contains alumina particles.

15. The resin composition for molding according to claim 11, wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.

16. The resin composition for molding according to claim 11, which is used in an antenna-in-package.

17. An electronic component apparatus comprising: a support member; an electronic component placed on the support member; and a cured product of the resin composition for molding according to claim 11 which seals the electronic component.

18. The electronic component apparatus according to claim 17, wherein the electronic component includes an antenna.

19. A resin composition for molding comprising: an epoxy resin; a curing agent, including an active ester compound; and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, wherein a total content of the calcium titanate particles and the strontium titanate particles is 30% by volume or more and less than 60% by volume with respect to the entire inorganic filler.

20. The resin composition for molding according to claim 19, wherein the inorganic filler further contains at least one selected from the group consisting of silica particles and alumina particles.

21. The resin composition for molding according to claim 19, wherein a total content of the inorganic filler is 40% by volume to 85% by volume with respect to the entire resin composition for molding.

22. The resin composition for molding according to claim 19, which is used in a high frequency device.

23. The resin composition for molding according to claim 19, wherein the inorganic filler contains alumina particles.

24. The resin composition for molding according to claim 19, wherein a relative dielectric constant of the entire inorganic filler at 10 GHz is 80 or less.

25. The resin composition for molding according to claim 19, which is used in an antenna-in-package.

26. An electronic component apparatus comprising: a support member; an electronic component placed on the support member; and a cured product of the resin composition for molding according to claim 19 which seals the electronic component.

27. The electronic component apparatus according to claim 26, wherein the electronic component includes an antenna.

Description

EXAMPLES

[0151] Hereinafter, the above-described embodiment will be described in detail using examples, but the scope of the above-described embodiment is not limited to these examples.

<Preparation of Resin Composition for Molding>

[0152] The components shown below are mixed at the formulation ratios (parts by mass) shown in Tables 1 to 3 to prepare resin compositions for molding of examples and a comparative example. These resin compositions for molding are solids at normal temperature and pressure.

[0153] In the tables, blanks mean that the component is not contained.

[0154] In addition, the content (“total content (% by volume)” in the tables) of an inorganic filler with respect to an entire resin composition for molding, the total content (“specific content (% by volume)” in the tables) of specific fillers with respect to an entire resin composition for molding, the total content (“specific proportion (% by volume)” in the tables) of specific fillers with respect to the entire inorganic filler used, and the relative dielectric constant (“dielectric constant of entire filler” in the tables) of the entire inorganic filler at 10 GHz are also shown in the tables. [0155] Epoxy resin 1: Triphenylmethane-type epoxy resin, epoxy equivalent of 167 g/eq (Mitsubishi Chemical Corporation, product name “1032H60”) [0156] Epoxy resin 2: Biphenyl-type epoxy resin, epoxy equivalent of 192 g/eq (Mitsubishi Chemical Corporation, product name “YX-4000”) [0157] Epoxy resin 3: O-cresol novolac-type epoxy resin, epoxy equivalent of 200 g/eq (“N500P” manufactured by DIC CORPORATION) [0158] Epoxy resin 4: Biphenyl aralkyl-type epoxy resin, epoxy equivalent of 274 g/eq (Nippon Kayaku Co., Ltd., product name “NC-3000”) [0159] Curing agent 1: Active ester compound, DIC CORPORATION, product name “EXB-8” [0160] Curing agent 2: Phenol curing agent, phenol aralkyl resin, hydroxyl equivalent of 205 g/eq (Meiwa Plastic Industries, Ltd., product name “MEH7851 series”) [0161] Inorganic filler 1: Calcium titanate particles, non-calcined specific filler, volume average particle diameter of 4 μm, polyhedron shape [0162] Inorganic filler 2: Calcium titanate particles, non-calcined specific filler, volume average particle diameter of 0.2 μm, polyhedron shape [0163] Inorganic filler 3: Strontium titanate particles, non-calcined specific filler, volume average particle diameter of 5 μm, polyhedron shape [0164] Inorganic filler 4: Barium titanate particles, non-calcined other fillers, volume average particle diameter of 6.6 μm, spherical shape [0165] Inorganic filler 5: Alumina particles, other fillers, volume average particle diameter of 5.7 μm, spherical shape [0166] Inorganic filler 6: Alumina particles, other fillers, volume average particle diameter of 0.7 μm, spherical shape [0167] Inorganic filler 7: Silica particles, other fillers, volume average particle diameter of 31 μm, spherical shape [0168] Inorganic filler 8: Silica particles, other fillers, volume average particle diameter of 6.6 μm, spherical shape [0169] Inorganic filler 9: Silica particles, other fillers, volume average particle diameter of 0.5 μm, spherical shape [0170] Curing promoter: Triphenylphosphine/1,4-benzoquinone adduct [0171] Coupling agent: N-phenyl-3-aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name “KBM-573”) [0172] Releasing agent: Montanic acid ester wax (Clariant Japan K.K., product name “HW-E”) [0173] Stress relaxation agent: Polyether-based silicone compound (Momentive Performance Materials, product name “SIM768E”) [0174] Coloring agent: Carbon black (Mitsubishi Chemical Corporation, product name “MA600”)

[0175] The volume average particle diameter of the above-described inorganic fillers is a value obtained through the following measurement.

[0176] Specifically, an inorganic filler is first added to a dispersion medium (water) in a range of 0.01 mass % to 0.1 mass %, and the mixture is dispersed in a bath-type ultrasonic cleaner for 5 minutes.

[0177] 5 mL of the obtained dispersion was injected into a cell, and the particle size distribution was measured at 25° C. using a laser diffraction-scattering type particle size distribution measurement device (HORIBA, Ltd., LA920).

[0178] The particle diameter at an integrated value of 50% in the obtained particle size distribution was set to a volume average particle diameter.

<Evaluation of Resin Composition for Molding>

(Relative Dielectric Constant and Dielectric Loss Tangent)

[0179] Each resin composition for molding was added to a vacuum hand press machine, molded under the conditions of a mold temperature of 175° C., a molding pressure of 6.9 MPa, and a curing time of 600 seconds, and post-cured at 175° C. for 6 hours to obtain a plate-like cured product (a length of 12.5 mm, a width of 25 mm, and a thickness of 0.2 mm). This plate-like cured product was used as a test piece to measure a relative dielectric constant and a dielectric loss tangent at a temperature of 25±3° C. and 10 GHz using a dielectric constant measurement device (Agilent Technologies, product name “Network Analyzer N5227A”). The results are shown in the tables (the “relative dielectric constant” and the “dielectric loss tangent” in the tables).

(Fluidity: Spiral Flow)

[0180] Each resin composition for molding was molded using a mold for measuring a spiral flow according to EMMI-1-66 under the conditions of a mold temperature of 180° C., a molding pressure of 6.9 MPa, and a curing time of 120 seconds to obtain a flow distance (cm). The results are shown in the tables (“flow distance (cm)” in the tables).

(Gel Time)

[0181] The measurement of the gel time using Curelastometer of JSR Trading Co., Ltd. was performed on 3 g of each resin composition for molding at a temperature of 175° C., and the time until a torque curve rose was regarded as gel time. The results are shown in the tables (“gel time (seconds)” in the tables).

(Moldability)

[0182] The moldability was evaluated as follows.

[0183] Specifically, each resin composition for molding was molded using Apic Yamada Press (G-Line Press) under the conditions of 180° C., 6.9 MPa, and 90 s to produce a molded product having a thickness of 0.5 mm. A flow mark was visually observed on the obtained molded product. The evaluation criteria are as follows. The results are shown in the tables.

[0184] A: There is no flow mark that can be visually observed.

[0185] B: Flow marks where slight shading can be observed in an area less than one-third of a molded product from an air vent are generated.

[0186] C: Flow marks are generated in an area less than one-third of a molded product from an air vent.

[0187] D: Flow marks are generated in an area greater than or equal to one-third of a molded product from an air vent.

TABLE-US-00001 TABLE 1 Item Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Composition Epoxy resin 1 70.1 70.1 70.1 70.1 70.1 Epoxy resin 2 29.9 29.9 29.9 29.9 29.9 29.9 29.9 Epoxy resin 3 70.1 Epoxy resin 4 70.1 Curing agent 1 119.0 119.0 119.0 119.0 106.0 86.0 119.0 Curing agent 2 Curing promoter 4.3 4.0 4.3 4.3 4.0 4.0 4.0 Coupling agent 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Releasing agent 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Stress relaxation agent 10.0 10.0 10.0 5.0 10.0 10.0 10.0 Coloring agent Inorganic filler l 510.0 551.0 793.0 599.0 523.0 478.0 630.0 Inorganic filler 2 128.0 158.0 199.0 251.0 150.0 137.0 158.0 Inorganic filler 3 Inorganic filler 4 Inorganic filler 5 608.0 827.0 946.0 1574.0 784.0 718.0 Inorganic filler 6 Inorganic filler 7 Inorganic filler 8 435.0 Inorganic filler 9 Total 1488.3 1778 2180.3 2661.3 1686 1542 1465 Filler Total content (% by volume) 60 65 70 75 65 65 65 Specific content (% by volume) 30 29.25 35 25.5 29.25 29.25 32.5 Specific proportion (% by volume) 50 45 50 34 45 45 50 Dielectric constant of entire filler 20.5 18.8 20.5 15.2 18.8 18.8 18.3 Evaluation Relative dielectric constant 15.4 15.3 17.6 14.7 15.0 14.8 15.1 Dielectric loss tangent 0.007 0.006 0.007 0.006 0.006 0.006 0.006 Flow distance (cm) 150 130 120 100 160 165 >200 Gel time (seconds) 53 58 62 70 55 60 75 Moldability A A B B A A B

TABLE-US-00002 TABLE 2 Item Example 8 Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 Composition Epoxy resin 1 70.1 70.1 70.1 70.1 70.1 70.1 Epoxy resin 2 29.9 29.9 29.9 25.0 29.9 29.9 29.9 Epoxy resin 3 Epoxy resin 4 75.0 Curing agent 1 119.0 119.0 119.0 119.0 119.0 119.0 Curing agent 2 80.3 Curing promoter 4.0 4.0 3.0 3.5 4.0 4.0 4.3 Coupling agent 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Releasing agent 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Stress relaxation agent 10.0 10.0 10.0 10.0 10.0 10.0 Coloring agent 6.6 Inorganic filler 1 551.0 551.0 630.0 465.0 530.0 648.0 Inorganic filler 2 158.0 158.0 158.0 200.0 152.0 163.0 Inorganic filler 3 902.0 Inorganic filler 4 Inorganic filler 5 752.0 752.0 635.0 794.0 547.0 648.0 Inorganic filler 6 75.0 Inorganic filler 7 435.0 Inorganic filler 8 Inorganic filler 9 44.0 Total 1747 1778 1464 1531.5 1708 1691 1707.9 Filler Total content (% by volume) 65 65 65 65 65 60 65 Specific content (% by volume) 29.25 32.5 32.5 32.5 29.25 33 29.25 Specific proportion (% by volume) 45 50 50 50 45 55 45 Dielectric constant of entire filler 18.6 18.8 18.3 18.6 18.8 23.3 18.8 Evaluation Relative dielectric constant 15.2 15.4 15.0 15.0 15.3 15.9 16.0 Dielectric loss tangent 0.006 0.007 0.006 0.020 0.006 0.007 0.009 Flow distance (cm) 130 130 >200 180 140 140 130 Gel time (seconds) 55 60 75 50 55 53 59 Moldability A A B B B B A

TABLE-US-00003 TABLE 3 Comparative Example Example Example Example Item 15 16 17 1 Composition Epoxy resin 1 70.1 70.1 70.1 70.1 Epoxy resin 2 29.9 29.9 29.9 29.9 Epoxy resin 3 Epoxy resin 4 Curing agent 1 119.0 119.0 119.0 119.0 Curing agent 2 Curing promoter 4.3 4.3 4.0 4.0 Coupling agent 8.0 8.0 8.0 8.0 Releasing agent 1.0 1.0 1.0 1.0 Stress relaxation agent 10.0 10.0 10.0 10.0 Coloring agent Inorganic filler 1 255.0 1019.0 Inorganic filler 2 128.0 256.0 Inorganic filler 3 1021.0 Inorganic filler 4 1492.0 Inorganic filler 5 852.0 1216.0 1134.0 Inorganic filler 6 900.0 Inorganic filler 7 Inorganic filler 8 Inorganic filler 9 Total 1477.3 2733.3 2397 2634 Filler Total content (% by volume) 60 75 70 70 Specific content (% by volume) 18 37.5 39 0 Specific proportion (% by volume) 30 50 56 0 Dielectric constant of entire filler 13.9 20.6 21.9 26.9 Evaluation Relative dielectric constant 11.6 18.6 19.8 14.0 Dielectric loss tangent 0.006 0.007 0.0072 0.040 Flow distance (cm) 140 100 80 180 Gel time (seconds) 53 65 60 60 Moldability A C C D

[0188] As shown in the tables, the resin compositions for molding of the examples have a long flow distance and favorable moldability compared to the resin composition for molding of the comparative example, and both a high relative dielectric constant and a low dielectric loss tangent in a cured product after molding are achieved.

[0189] The disclosure of Japanese Patent Application No. 2020-206030 filed Dec. 11, 2020 is incorporated in the present specification as a whole by reference.

[0190] All of the references, the patent application, and the technical standard described in the present specification are incorporated in the present specification by reference to the same extent as in a case where incorporation of individual documents, patent application, and technical standard by reference is specifically and individually written.