FABRICATION METHOD OF STRONTIUM NIOBIUM OXYNITRIDE FILM HAVING SMALL CARRIER DENSITY AND ITS USE
20180030602 ยท 2018-02-01
Inventors
Cpc classification
C23C14/3407
CHEMISTRY; METALLURGY
C25B9/17
CHEMISTRY; METALLURGY
C25B11/051
CHEMISTRY; METALLURGY
C25B11/075
CHEMISTRY; METALLURGY
Y02E60/36
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
C23C14/3414
CHEMISTRY; METALLURGY
International classification
C25B1/00
CHEMISTRY; METALLURGY
C23C14/00
CHEMISTRY; METALLURGY
Abstract
The present invention provides a method for growing a strontium niobium oxynitride film, the method comprising: (a) growing, on a strontium titanate substrate, by a sputtering method, the strontium niobium oxynitride film having carrier density of not more than 110.sup.18 cm.sup.3. The spirit of the present invention includes: (I) strontium niobium oxynitride having carrier density not more than 110.sup.18 cm.sup.3, (II) a strontium niobium oxynitride film having carrier density not more than 110.sup.18 cm.sup.3, (III) a photosemiconductor substrate comprising the strontium niobium oxynitride film, (IV) a hydrogen generation device comprising the photosemiconductor substrate, and (V) a hydrogen generation method using the photosemiconductor substrate. The present invention provides a fabrication method of a strontium niobium oxynitride film having small carrier density and its use.
Claims
1. A method for growing a strontium niobium oxynitride film, the method comprising: (a) growing, on a strontium titanate substrate, by a sputtering method, the strontium niobium oxynitride film having carrier density of not more than 110.sup.18 cm.sup.3.
2. The method according to claim 1, wherein a target used in the sputtering method is formed of strontium niobate; and the strontium niobium oxynitride film is grown in an atmosphere containing nitrogen.
3. The method according to claim 2, wherein the strontium niobate is represented by the chemical formula Sr.sub.2Nb.sub.2O.sub.7.
4. The method according to claim 2, wherein the atmosphere further contains oxygen.
5. The method according to claim 2, wherein the atmosphere further contains argon.
6. The method according to claim 4, wherein the atmosphere further contains argon.
7. The method according to claim 1, wherein the strontium titanate substrate has a single orientation plane; and the strontium niobium oxynitride film has a single orientation plane.
8. The method according to claim 7, wherein the single orientation plane of the strontium titanate substrate is an orientation plane of a (001) plane; and the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (001) plane.
9. The method according to claim 7, wherein the single orientation plane of the strontium titanate substrate is an orientation plane of a (110) plane; and the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (110) plane.
10. The method according to claim 7, wherein the single orientation plane of the strontium titanate substrate is an orientation plane of a (111) plane; and the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (111) plane.
11. The method according to claim 1, wherein the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum.
12. A strontium niobium oxynitride having carrier density of not more than 110.sup.18 cm.sup.3.
13. The strontium niobium oxynitride according to claim 12, wherein the carrier density is not more than 110.sup.17 cm.sup.3.
14. A strontium niobium oxynitride film having carrier density of not more than 110.sup.18 cm.sup.3.
15. The strontium niobium oxynitride film according to claim 14, wherein the carrier density is not more than 110.sup.17 cm.sup.3.
16. The strontium niobium oxynitride film according to claim 14, wherein the strontium niobium oxynitride film has a single orientation plane.
17. The strontium niobium oxynitride film according to claim 16, wherein the single orientation plane is an orientation plane of a (001) plane.
18. The strontium niobium oxynitride film according to claim 16, wherein the single orientation plane is an orientation plane of a (110) plane.
19. The strontium niobium oxynitride film according to claim 16, wherein the single orientation plane is an orientation plane of a (111) plane.
20. A semiconductor photoelectrode comprising: a strontium titanate substrate; and a strontium niobium oxynitride film grown on the strontium titanate substrate, wherein the strontium niobium oxynitride film has carrier density of not more than 110.sup.18 cm.sup.3.
21. The semiconductor photoelectrode according to claim 20, wherein the carrier density is not more than 110.sup.17 cm.sup.3.
22. The semiconductor photoelectrode according to claim 20, wherein the strontium titanate substrate has a single orientation plane; and the strontium niobium oxynitride film has a single orientation plane.
23. The semiconductor photoelectrode according to claim 20, wherein the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum.
24. A hydrogen generation device, comprising: a semiconductor photoelectrode according to claim 20; a counter electrode electrically connected to the semiconductor photoelectrode; a liquid in contact with the strontium niobium oxynitride film and the counter electrode; and a container containing the semiconductor photoelectrode, the counter electrode, and the liquid, wherein the liquid is water or an electrolyte aqueous solution; and hydrogen is generated on a surface of the counter electrode when the strontium niobium oxynitride film is irradiated with light.
25. The hydrogen generation device according to claim 24, wherein the carrier density is not more than 110.sup.17 cm.sup.3.
26. The hydrogen generation device according to claim 24, wherein the strontium titanate substrate has a single orientation plane; and the strontium niobium oxynitride film has a single orientation plane.
27. The hydrogen generation device according to claim 26, wherein the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0019]
[0020]
[0021]
[0022]
[0023]
[0024]
[0025]
DETAILED DESCRIPTION OF THE EMBODIMENT
[0026] Hereinafter, the embodiment of the present invention will be described with reference to the drawings.
[0027] (Embodiment)
[0028]
[0029] The strontium niobium oxynitride film 120 is formed on the surface of the substrate 110. Desirably, the strontium niobium oxynitride film 120 has an orientation plane. More preferably, the strontium niobium oxynitride film 120 has an orientation plane of a (001) plane.
[0030] (Fabrication Method)
[0031] A fabrication method according to the present embodiment will be described below.
[0032] While the temperature of the substrate 110 is maintained at not less than 500 degrees Celsius and not more than 750 degrees Celsius, the strontium niobium oxynitride film 120 is grown on the substrate 110. The substrate 110 is formed of strontium titanate, as described above. It is desirable that the substrate 110 is formed of single-crystal strontium titanate. It is desirable that the grown strontium niobium oxynitride film 120 has an orientation plane.
[0033] It is desirable that the substrate 110 has a principal surface of a (001) plane, a (110) plane, or a (111) plane. In other words, it is desirable that the surface of the substrate 110 formed of strontium titanate is oriented in a [001] direction, a [110] direction, or a [111] direction. It is more desirable that the substrate 110 comprises strontium titanate having only an (001) orientation plane, only an (110) orientation plane, or only an (111) orientation plane on the surface thereof.
[0034] The present inventors found that a strontium niobium oxynitride film grown by a sputtering method has significantly lower carrier density than a strontium niobium oxynitride film grown by a pulse laser deposition method. Specifically, the strontium niobium oxynitride film grown by a laser deposition method has high carrier density of not less than 110.sup.21 cm.sup.3 (See NPL2), whereas the strontium niobium oxynitride film grown by a sputtering method has low carrier density of not more than 110.sup.18 cm.sup.3, as demonstrated in the inventive examples which will be described later. In one embodiment, the strontium niobium oxynitride film grown by a sputtering method has low carrier density of not more than 110.sup.17 cm.sup.3. As will be described later, the low carrier density improves hydrogen generation efficiency.
[0035] In the sputtering method, it is desirable that a target formed of strontium niobate represented by the chemical formula Sr.sub.2Nb.sub.2O.sub.7 is used. Sputtering is carried out in an atmosphere of a mixture of argon and nitrogen. It is desirable that the atmosphere further contains oxygen. In this way, the strontium niobium oxynitride film 120 is grown on the substrate 110.
[0036] When the substrate 110 has an orientation plane of a (001) plane, the strontium niobium oxynitride film 120 also has an orientation plane of a (001) plane. It is more desirable that the strontium niobium oxynitride film 120 has a (001) orientation only. Likewise, when the substrate 110 has an orientation plane of a (110) plane, the strontium niobium oxynitride film 120 also has an orientation plane of a (110) plane. In this case, it is more desirable that the strontium niobium oxynitride film 120 has a (110) orientation only. When the substrate 110 has an orientation plane of a (111) plane, the strontium niobium oxynitride film 120 also has an orientation plane of a (111) plane. In this case, it is more desirable that the strontium niobium oxynitride film 120 has a (111) orientation only.
[0037] The strontium niobium oxynitride film 120 grown in this way has low carrier density of not more than 1.010.sup.13 cm.sup.3, as described above.
[0038]
[0039]
[0040] It is desirable that the counter electrode 630 is formed of a material having a small overvoltage on the hydrogen generation reaction. Alternatively, it is desirable that the counter electrode 630 may be formed of a semiconductor photoelectrode capable of generating hydrogen. In particular, an example of the material of the counter electrode 630 is platinum, gold, silver, nickel, ruthenium oxide represented by the chemical formula RuO.sub.2, iridium oxide represented by the chemical formula IrO.sub.2, or a p-type semiconductor. Two or more materials may be used for the counter electrode 630.
[0041] The liquid 640 is water or an electrolyte aqueous solution. The electrolyte aqueous solution is acidic or alkaline. An example of the electrolyte aqueous solution is a sulfuric acid aqueous solution, a sodium sulfate aqueous solution, a sodium carbonate aqueous solution, a phosphate buffer solution, or a borate buffer solution. The liquid 640 may be constantly stored in the container 610 or may be supplied only in use.
[0042] The container 610 contains the semiconductor photoelectrode 100, the counter electrode 630, and the liquid 640. It is desirable that the container 610 is transparent. In particular, it is desirable that at least a part of the container 610 is transparent so that light can travel from the outside of the container 610 to the inside of the container 610. A user of the hydrogen generation device 600 prepares such a hydrogen generation device 600.
[0043] When the strontium niobium oxynitride film 120 is irradiated with light, oxygen is generated on the surface of the strontium niobium oxynitride film 120. Light such as sunlight travels through the container 610 and reaches the strontium niobium oxynitride film 120. Electrons and holes are generated respectively in the conduction band and valence band of the part of the strontium niobium oxynitride film 120 in which the light has been absorbed. Since the strontium niobium oxynitride film 120 is an n-type semiconductor, the holes migrate to the surface of the strontium niobium oxynitride film 120.
[0044] Water is split on the surface of the strontium niobium oxynitride film 120 as shown in the following reaction formula (1) to generate oxygen. On the other hand, electrons migrate from the strontium niobium oxynitride film 120 to the counter electrode 630 through the conducting wire 650. Hydrogen is generated as shown in the following reaction formula (2) on the surface of the counter electrode 630.
4h.sup.++2H.sub.2O.fwdarw.O.sub.2+4H.sup.+(1) [0045] (h.sup.+ represents a hole)
4e.sup.+4H.sup.+.fwdarw.2H.sub.2(2)
[0046] There is a depletion layer having a band bending on a solid-liquid interface formed on the surface of the strontium niobium oxynitride film 120. Theoretically, a depletion layer extends with a decrease in carrier density. Therefore, in a case where carrier density is low, electrons and holes generated in the conduction band and the valence band respectively are easily separated due to the internal electric field of the depletion layer. Since the semiconductor photoelectrode 100 according to the embodiment has low carrier density of less than 1.010.sup.18 cm.sup.3, a hydrogen generation device comprising the semiconductor photoelectrode 100 according to the embodiment has high hydrogen generation efficiency.
EXAMPLES
[0047] Hereinafter, the present invention will be described in more detail with reference to the following examples.
Inventive Example 1
[0048] In the inventive example 1, a semiconductor photoelectrode 100 shown in
[0049] First, a strontium niobium oxynitride film 120 having a thickness of 100 nanometers was grown by a reactive sputtering method on a perovskite strontium titanate substrate 110 having a (001) orientation only. In the reactive sputtering method, the temperature of the strontium titanate substrate 110 was maintained at 650 degrees Celsius. The material of the sputtering target was strontium niobate represented by the chemical formula Sr.sub.2Nb.sub.2O.sub.7. The sputtering was carried out in an atmosphere of a mixture of argon, oxygen, and nitrogen. The total pressure in the chamber used for the sputtering was 0.5 Pa. The flow rate of argon was 5 sccm. The flow rate of oxygen was 0.05 sccm. The flow rate of nitrogen was 10 sccm. In this way, the strontium niobium oxynitride film 120 was grown epitaxially.
[0050] Then, the carrier density of the strontium niobium oxynitride film 120 was calculated through the Hall effect measurement based on the Van der Pauw method. As a result, the strontium niobium oxynitride film 120 according to the inventive example 1 had carrier density of 5.510.sup.15 cm.sup.3.
[0051] The semiconductor photoelectrode 100 was subjected to an X-ray diffraction analysis.
Inventive Example 2
[0052] In the inventive example 2, the semiconductor photoelectrode 100 shown in
[0053] First, a strontium niobium oxynitride film 120 having a thickness of 100 nanometers was grown by a reactive sputtering method on a perovskite strontium titanate substrate 110 having a (001) orientation only. In the reactive sputtering method, the temperature of the strontium titanate substrate 110 was maintained at 650 degrees Celsius. The material of the sputtering target was strontium niobate represented by the chemical formula Sr.sub.2Nb.sub.2O.sub.7. The sputtering was carried out in an atmosphere of a mixture of argon and nitrogen. The total pressure in the chamber used for the sputtering was 0.5 Pa. The flow rate of argon was 5 sccm. The flow rate of nitrogen was 10 sccm. In this way, the strontium niobium oxynitride film 120 was grown.
[0054] Then, the carrier density of the strontium niobium oxynitride film 120 was calculated through the Hall effect measurement based on the Van der Pauw method. As a result, the strontium niobium oxynitride film 120 according to the inventive example 2 had carrier density of 1.710.sup.17 cm.sup.3.
[0055] The semiconductor photoelectrode 100 was subjected to an X-ray diffraction analysis.
[0056] The following Table 1 shows the results of the inventive examples 1-2.
TABLE-US-00001 TABLE 1 Inventive Inventive example 1 example 2 Substrate SrTiO.sub.3 substrate having a (001) orientation only Growth temperature (Celsius) 650 650 Film thickness (nanometer) 100 100 Argon flow rate (sccm) 5 5 Oxygen flow rate (sccm) 0.05 0 Nitrogen flow rate (sccm) 10 10 Orientation (001) only (001) only Carrier density (cm.sup.3) 5.5 10.sup.15 1.7 10.sup.17
Inventive Example 3
[0057] In the inventive example 3, an experiment similar to the inventive example 1 was conducted, except that the perovskite strontium titanate substrate 110 has not a (001) orientation only, but a (110) orientation only.
Inventive Example 4
[0058] In the inventive example 4, an experiment similar to the inventive example 1 was conducted, except that the perovskite strontium titanate substrate 110 has not a (001) orientation only, but a (111) orientation only.
[0059] The following Table 2 shows the results of the inventive examples 3-4.
TABLE-US-00002 TABLE 2 Inventive Inventive example 3 example 4 Substrate SrTiO.sub.3 substrate SrTiO.sub.3 substrate having a (110) having a (111) orientation only orientation only Growth temperature (Celsius) 650 650 Film thickness (nanometer) 100 100 Argon flow rate (sccm) 5 5 Oxygen flow rate (sccm) 0.05 0.05 Nitrogen flow rate (sccm) 10 10 Orientation (110) only (111) only Carrier density (cm.sup.3) 2.1 10.sup.15 1.8 10.sup.15
INDUSTRIAL APPLICABILITY
[0060] The strontium niobium oxynitride film according to the present invention can be used as a semiconductor photoelectrode used in a hydrogen generation device for generating hydrogen through light irradiation.
REFERENTIAL SIGNS LIST
[0061] 100 Semiconductor photoelectrode [0062] 110 Strontium titanate substrate [0063] 111 Ohmic electrode [0064] 120 Strontium niobium oxynitride film [0065] 600 Hydrogen generation device [0066] 610 Container [0067] 630 Counter electrode [0068] 640 Liquid [0069] 650 Conducting wire
CONCLUSION
[0070] The inventions derived from the above disclosure will be listed below. [0071] 1. A method for growing a strontium niobium oxynitride film, the method comprising:
[0072] (a) growing, on a strontium titanate substrate, by a sputtering method, the strontium niobium oxynitride film having carrier density of not more than 110.sup.13 cm.sup.3. [0073] 2. The method according to Item 1, wherein
[0074] a target used in the sputtering method is formed of strontium niobate; and
[0075] the strontium niobium oxynitride film is grown in an atmosphere containing nitrogen. [0076] 3. The method according to Item 2, wherein
[0077] the strontium niobate is represented by the chemical formula Sr.sub.2Nb.sub.2O.sub.7. [0078] 4. The method according to Item 2, wherein
[0079] the atmosphere further contains oxygen. [0080] 5. The method according to Item 2, wherein
[0081] the atmosphere further contains argon. [0082] 6. The method according to Item 4, wherein
[0083] the atmosphere further contains argon. [0084] 7. The method according to Item 1, wherein
[0085] the strontium titanate substrate has a single orientation plane; and
[0086] the strontium niobium oxynitride film has a single orientation plane. [0087] 8. The method according to Item 7, wherein
[0088] the single orientation plane of the strontium titanate substrate is an orientation plane of a (001) plane; and
[0089] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (001) plane. [0090] 9. The method according to Item 7, wherein
[0091] the single orientation plane of the strontium titanate substrate is an orientation plane of a (110) plane; and
[0092] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (110) plane. [0093] 10. The method according to Item 7, wherein
[0094] the single orientation plane of the strontium titanate substrate is an orientation plane of a (111) plane; and
[0095] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (111) plane. [0096] 11. The method according to Item 1, wherein
[0097] the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum. [0098] 12. A strontium niobium oxynitride having carrier density of not more than 110.sup.18 cm.sup.3. [0099] 13. The strontium niobium oxynitride according to Item 12, wherein
[0100] the carrier density is not more than 110.sup.17 cm.sup.3. [0101] 14. A strontium niobium oxynitride film having carrier density of not more than 110.sup.18 cm.sup.3. [0102] 15. The strontium niobium oxynitride film according to Item 14, wherein
[0103] the carrier density is not more than 110.sup.17 cm.sup.3. [0104] 16. The strontium niobium oxynitride film according to Item 14, wherein
[0105] the strontium niobium oxynitride film has a single orientation plane. [0106] 17. The strontium niobium oxynitride film according to Item 16, wherein
[0107] the single orientation plane is an orientation plane of a (001) plane. [0108] 18. The strontium niobium oxynitride film according to Item 16, wherein
[0109] the single orientation plane is an orientation plane of a (110) plane. [0110] 19. The strontium niobium oxynitride film according to Item 16, wherein
[0111] the single orientation plane is an orientation plane of a (111) plane. [0112] 20. A semiconductor photoelectrode comprising:
[0113] a strontium titanate substrate; and
[0114] a strontium niobium oxynitride film grown on the strontium titanate substrate,
[0115] wherein
[0116] the strontium niobium oxynitride film has carrier density of not more than 110.sup.18 cm.sup.3. [0117] 21. The semiconductor photoelectrode according to Item 20, wherein
[0118] the carrier density is not more than 110.sup.17 cm.sup.3. [0119] 22. The semiconductor photoelectrode according to Item 20, wherein
[0120] the strontium titanate substrate has a single orientation plane; and
[0121] the strontium niobium oxynitride film has a single orientation plane. [0122] 23. The semiconductor photoelectrode according to Item 22, wherein
[0123] the single orientation plane of the strontium titanate substrate is an orientation plane of a (001) plane; and
[0124] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (001) plane. [0125] 24. The semiconductor photoelectrode according to Item 22, wherein
[0126] the single orientation plane of the strontium titanate substrate is an orientation plane of a (110) plane; and
[0127] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (110) plane. [0128] 25 The semiconductor photoelectrode according to Item 22, wherein
[0129] the single orientation plane of the strontium titanate substrate is an orientation plane of a (111) plane; and
[0130] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (111) plane. [0131] 26. The semiconductor photoelectrode according to Item 20, wherein
[0132] the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum. [0133] 27. A hydrogen generation device, comprising:
[0134] a semiconductor photoelectrode according to Item 20;
[0135] a counter electrode electrically connected to the semiconductor photoelectrode;
[0136] a liquid in contact with the strontium niobium oxynitride film and the counter electrode; and
[0137] a container containing the semiconductor photoelectrode, the counter electrode, and the liquid, wherein
[0138] the liquid is water or an electrolyte aqueous solution; and
[0139] hydrogen is generated on a surface of the counter electrode when the strontium niobium oxynitride film is irradiated with light. [0140] 28. The hydrogen generation device according to Item 27, wherein
[0141] the carrier density is not more than 110.sup.17 cm.sup.3. [0142] 29. The hydrogen generation device according to Item 27, wherein
[0143] the strontium titanate substrate has a single orientation plane; and
[0144] the strontium niobium oxynitride film has a single orientation plane. [0145] 30. The hydrogen generation device according to Item 29, wherein
[0146] the single orientation plane of the strontium titanate substrate is an orientation plane of a (001) plane; and
[0147] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (001) plane. [0148] 31. The hydrogen generation device according to Item 29, wherein
[0149] the single orientation plane of the strontium titanate substrate is an orientation plane of a (110) plane; and
[0150] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (110) plane. [0151] 32. The hydrogen generation device according to Item 29, wherein
[0152] the single orientation plane of the strontium titanate substrate is an orientation plane of a (111) plane; and
[0153] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (111) plane. [0154] 33. The hydrogen generation device according to Item 27, wherein
[0155] the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum. [0156] 34. A method for generating hydrogen, comprising:
[0157] (a) preparing a hydrogen generation device, comprising:
[0158] a semiconductor photoelectrode according to claim 16;
[0159] a counter electrode electrically connected to the semiconductor photoelectrode;
[0160] a liquid in contact with the strontium niobium oxynitride film and the counter electrode; and
[0161] a container containing the semiconductor photoelectrode, the counter electrode, and the liquid,
[0162] wherein
[0163] the liquid is water or an electrolyte aqueous solution; and
[0164] (b) irradiating the strontium niobium oxynitride film with light to generate hydrogen on a surface of the counter electrode. [0165] 35. The method according to Item 34. wherein
[0166] the carrier density is not more than 110.sup.17 cm.sup.3. [0167] 36. The method according to Item 34, wherein
[0168] the strontium titanate substrate has a single orientation plane; and
[0169] the strontium niobium oxynitride film has a single orientation plane. [0170] 37. The method according to Item 36, wherein
[0171] the single orientation plane of the strontium titanate substrate is an orientation plane of a (001) plane; and
[0172] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (001) plane. [0173] 38. The method according to Item 36, wherein
[0174] the single orientation plane of the strontium titanate substrate is an orientation plane of a (110) plane; and
[0175] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (110) plane. [0176] 39. The method according to Item 36, wherein
[0177] the single orientation plane of the strontium titanate substrate is an orientation plane of a (111) plane; and
[0178] the single orientation plane of the strontium niobium oxynitride film is an orientation plane of a (111) plane. [0179] 40. The method according to Item 34, wherein
[0180] the strontium titanate substrate is doped with at least one selected from the group consisting of niobium and lanthanum.