ROOM TEMPERATURE METHOD FOR THE PRODUCTION OF ELECTROTECHNICAL THIN LAYERS, THE USE OF SAME, AND A THIN LAYER HEATING SYSTEM OBTAINED IN THIS MANNER

Abstract

Electrotechnical thin layers which can be used as a heating resistor and/or substrate for conductive layers are produced, in established methods, at high prices and extremely slowly. This problem is solved by virtue of a redox-reactively-deposited base layer which contains graphite, is formed at room temperature and on which, in the same sense, a metal forms a micrometer-scale metal layer within minutes to a few seconds by means of a redox reaction, at room temperature and during the definitive curing process. The double layer made available in this manner is highly flexible, allows soldering on copper layers, and can be used particularly advantageously as a thin-layer heating system.

Claims

1. A room temperature method of producing electrotechnical thin layers, by providing electrically conductive and/or semiconductive, inorganic agglomerates in a dispersion over an area and curing them to form a layer, characterized in that the curing is conducted at room temperature and the curing is accelerated by contacting with at least one reagent.

2. The method as claimed in claim 1, wherein a PV layer sequence is formed.

3. The method as claimed in claim 1, wherein the at least one base layer applied is a layer comprising agglomerates of at least one chain-forming element, the chain-forming element being selected from the group consisting of boron, aluminum, gallium, indium, carbon, silicon, germanium, tin, lead, phosphorus, arsenic, antimony, sulfur, selenium, tellurium, bromine, iodine.

4. The method as claimed in claim 3, wherein the base layer is provided in the form of a predominantly aqueous dispersion and is cured by accompanying reaction.

5. The method as claimed in claim 3, wherein the base layer is provided in the form of an aqueous suspension, adjusted to a reactive pH and applied and is subjected to at least preliminary curing at room temperature.

6. The method as claimed in claim 3, wherein the base layer is provided in the form of an aqueous carbon suspension comprising at least one type of the carbon polymorphs of soot, graphite, activated carbon, tar, conductive black, furnace black, carbon black, lamp black, ESD black, is adjusted to a reactive pH and is cured as an oxidative or reductive layer.

7. The method as claimed in claim 3, wherein the pH is adjusted by addition of at least one compound, the compound being selected from the group consisting of sodium hydroxide solution, potassium hydroxide solution, calcium hydroxide, barium hydroxide, ammonia, hydrochloric acid, sulfuric acid, nitric acid, hydrogen peroxide, phosphoric acid, ascorbic acid, citric acid, tartaric acid, carboxylic salts, carboxylic acids, amines, amino acids.

8. The method as claimed in claim 1, wherein the layer, prior to application, as a free-flowing mixture or solution, is admixed with at least one metal from the group consisting of Li, Na, K, Be, Mg, Ca, Sr, Ba, B, Al, Ga, In, Tl, Si, Ge, Sn, Pb, As, Sb, Se, Te, Ti, Zr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Hg, Au, Ag, Pt, Pd, Cd, with at least partial dissolution of the metal at an appropriate pH setting.

9. The method as claimed in claim 1, wherein the base layer used is a layer in the form of a free-flowing mixture or solution, which is applied in a thin layer and finally cured by accompanying reaction, assisted by at least one measure, said at least one measure being selected from the group consisting of UV exposure, contacting with CO2, contacting with acidic gases, contacting with basic gases, contacting with oxidative gases, contacting with reducing gases, contacting with acid chlorides, contacting with urea solutions, contacting with metal oxide dispersion, contacting with metal carbonyls, contacting with metal complexes, contacting with metal compounds, contacting with metal salts, contacting with water.

10. A room temperature method of producing electrotechnical thin layers, especially a base layer, as claimed in claim 1, wherein electrically conductive and/or semiconductive, inorganic agglomerates in a dispersion are provided over an area and cured to form a layer, characterized in that the curing is conducted at room temperature, the curing is accelerated by contacting with at least one reagent, the at least one base layer applied is a layer including agglomerates of at least one chain-forming element, the chain-forming element consisting of carbon, in which case the base layer as a predominantly aqueous carbon suspension comprising at least microscale graphite with an amorphous carbon component and optionally up to 49% of additions of soot, activated carbon, tar, conductive black, furnace black, carbon black, lamp black, ESD black, is admixed with at least one metal powder, which is no more than a microscale powder, of a base-soluble metal, preferably of at least one metal from the group consisting of silicon, aluminum, gallium, indium, magnesium, calcium, barium, iron, cobalt, nickel, copper, zinc, more preferably silicon, aluminum and iron, the suspension is adjusted to a reactive pH greater than 7 and applied as a reductive layer and is subjected to preliminary curing at least to form a stabilizing marginal shell, wherein the suspension applied in a thin layer is cured at least by accompanying UV exposure.

11. The method as claimed in claim 1, wherein, at room temperature, for production of a conductive electrotechnical thin layer, an inorganic agglomerate in a dispersion is provided over an area and cured to form a layer, characterized in that a dispersion of a metal or a metal compound is provided on a reductive or oxidative base layer, the curing is conducted at room temperature, wherein the curing is accelerated by contacting with the at least one metal compound to deposit the metal or a metal oxide.

12. The method as claimed in claim 11, wherein a base layer is provided in the form of a basic reductive layer comprising carbon, silicon, aluminum and iron.

13. The method as claimed in claim 11, wherein the dispersion used is an aqueous, slightly acidic copper solution, preferably a fresh, slightly acidic copper sulfate solution, with deposition of a copper layer.

14. The method as claimed in claim 11, wherein a metal layer of thickness up to 100 micrometers, preferably 0.5 to 80 micrometers, more preferably 32.5 micrometers, is deposited within not more than 5 minutes, preferably 1 to 2 minutes, more preferably within 30 seconds.

15. The method as claimed in claim 1, wherein a copper layer of thickness at least 0.5 micrometer with a conductivity around 100 ohms per centimeter, preferably of 0.5 to 10 ohms per centimeter, more preferably of 21.5 ohms per centimeter, is deposited.

16. The method as claimed in claim 15, wherein a further electrotechnical layer is deposited or formed atop the copper layer.

17. The method as claimed in claim 11, wherein a cover layer is applied and cured in defined regions atop a base layer and then a metal layer is formed as electrode layer in the regions that are still exposed.

18. The method as claimed in claim 1, wherein a base layer is electrostatically charged in a preparatory measure, preferably electrostatically charged in frictional contact with a polymer layer, more preferably electrostatically charged in frictional contact with a nylon brush roll.

19. The method as claimed in claim 11, wherein the method is conducted in a printing machine.

20. (canceled)

21. An electrotechnical double layer, preferably thin-layer heater, obtained according to claim 1, having a cured basic reductive base layer atop an optional carrier, comprising carbon in the form of graphite and optionally up to 49% of further carbon polymorphs and/or carbon products, at least partly dissolved iron and/or aluminum of purity 96%, with 4% typical impurities such as silicon, boron, aluminum, phosphorus, magnesium, calcium, zinc, cured waterglass, metal silicates; and a metal layer reductively deposited thereon, preferably composed of copper, in which case the metal layer has a metallic conductivity of 2.52.475 ohms per centimeter, and optionally, preferably in the case of copper layers, the double layer has a diode Zener voltage preferably in the region of 2.7 1 volts, the double layer has a capacitance preferably in the region of 4039.98 microfarads, more preferably with up to 25% of the resistance across the double layer being purely of capacitative nature and making no contribution to the impedance at high frequency.

Description

BRIEF DESCRIPTION OF THE FIGURES

[0056] The figures illustrate, with reference to diagrams,

[0057] FIG. 1: an advantageous embodiment, shown in top view, of a preparatively reductively deposited and at least partly cured base layer;

[0058] FIG. 2: an advantageous embodiment, shown in top view, of a covering layer which prevents the formation of a metal layer in the dark-colored regions.

DETAILED ELUCIDATION OF THE INVENTION WITH REFERENCE TO WORKING EXAMPLES

[0059] In an advantageous embodiment, and aqueous graphite dispersion was provided. In this dispersion, the microscale graphite contained a proportion of up to 49% of further carbon products such as amorphous graphite, activated carbon, conductive black, soot, lubricating graphite with oil residues/soot components and/or tar components. A microscale metal powder mixture of industrial aluminum and industrial iron was mixed into the aqueous graphite dispersion at around 50 percent by weight. The pH was adjusted to from 12 to 14 with partial dissolution of the metal powder, and the reacting mixture was homogenized in a cooled stirrer system, optionally adjusted in terms of flowability with silica, and printed onto a flexible paper sheet by means of a roll or screen system in predefined regions as illustrated in FIG. 1 and subjected to at least partial preliminary curing within up to 10 secondsoptionally with UV exposure. Pull-out characteristics, flowability and homogeneity can be adjusted via modifiers and auxiliaries such as emulsifiers, defoamers, thixotropic agents, basic buffer systems, adhesion promoters with siloxane copolymer, especially perpolymerized siloxane copolymers.

[0060] The base layer obtained, in the case of pure graphite, has conductivities in the range from mega- to teraohms per centimeter; additions of conductive black, optionally in combination with conductive metal oxides and/or established electrolytes, are able to lower the conductivity by several orders of magnitude to the kiloohm range. According to the planned use as an AC or DC heating layer, the resistance can be set at an extremely high level (for AC) or else at a low level (for DC). In each case, the layer that has been rendered reductive and basic is found to be usable advantageously as base layer for a metallically conductive layer. After application of a cover layer according to FIG. 2, in the regions outlined in white in FIG. 2, it is possible by contacting with a freshly produced copper solution with a low sulfuric acid content to generate a highly conductive metal layer of a few micrometers in thickness within seconds to minutes. The copper layer obtained in the form of globular agglomerates, after 30 seconds to a few minutes, has a thickness of micrometers, adheres firmly and durably on the base layer and has conductivities of 0.05 to 5 ohms per centimeter. Additional contacts and/or circuits can be applied to the finally dried and rinsed copper layer by conventional solder bonding. The inventors assume that the freshly reductive layer can be a reasonable explanation for the rapid copper-plating: by virtue of the graphite, the reducing conditions are stored in solid solution and can actively and effectively accelerate the copper-plating during the final curing. Copper layers in the micrometer range can thus be produced within seconds, which is otherwise possible only with deposition rates of micrometers per hour in alternative chemical methods.

INDUSTRIAL APPLICABILITY

[0061] Electrotechnical thin layers usable as heating resistance and/or substrate for conductor layers are produced at high cost and extremely slowly in the established methods.

This problem is solved by a redox-reactively deposited, graphite-containing base layer formed at room temperature, on which a metal, by redox reaction, forms a metal layer on the micrometer scale within minutes or a few seconds in a corresponding manner at room temperature during the final curing.
The double layer thus obtainable is highly flexible, allows soldering to copper layers, and can be used particularly advantageously as a thin-layer heater.