APPARATUS AND METHOD FOR PROCESSING OR IMAGING A SAMPLE

Abstract

The invention relates to an apparatus and method for exposing a sample. The apparatus comprises a source for electromagnetic radiation or particles having energy, an exposing unit for exposing said sample to said electromagnetic radiation or particles, and a substrate holding device for holding said sample at least during said exposing.

The exposing unit comprises a component for manipulating and/or blocking at least part of the electromagnetic radiation or charged particles. The component comprises a cooling arrangement which is arranged for substantially maintaining the component at a predetermined first temperature.

The substrate holding device comprises a temperature stabilizing arrangement which is arranged to substantially stabilize the temperature of a sample arranged on said substrate holding device. The temperature stabilizing arrangement comprises a phase change material having a phase change at a second temperature, which is at or near the first temperature.

Claims

1. Apparatus for exposing a sample, wherein said apparatus comprises a source for electromagnetic radiation or particles having energy, an exposing unit for exposing said sample to said electromagnetic radiation or particles, wherein the exposing unit comprises a component for at least partially and/or temporally manipulating and/or blocking at least part of the electromagnetic radiation or charged particles, wherein the component comprises a cooling arrangement which is arranged for substantially maintaining the component at a predetermined first temperature, and a substrate holding device for holding said sample at least during said exposing, wherein the substrate holding device comprises a temperature stabilizing arrangement which is arranged to substantially stabilize the temperature of a sample arranged on said substrate holding device, wherein the temperature stabilizing arrangement comprises a phase change material having a phase change at a second temperature, wherein the cooling arrangement and the temperature stabilizing arrangement are arranged such that the second temperature is at or near the first temperature.

2. Apparatus according to claim 1, wherein the cooling arrangement and the temperature stabilizing arrangement are arranged such that a difference between the first temperature and the second temperature is not more than 4 C., preferably not more than 2 C.

3. Apparatus according to claim 1, wherein the first temperature is lower than the second temperature.

4. Apparatus according to claim 1, wherein the first temperature is substantially equal to the second temperature, preferably wherein the first temperature and the second temperature are substantially equal to room temperature, in particular to room temperature in a Fabrication Plant (Fab).

5. Apparatus according to claim 1, wherein the phase change material comprises an Eutectic metal alloy.

6. Apparatus according to claim 1, wherein the cooling arrangement comprises conduits for guiding a cooling fluid through the conduits, wherein the conduits are arranged in thermal contact with the component.

7. Apparatus according to claim 6, wherein the cooling arrangement is arranged such that a difference between a temperature of the cooling fluid and the second temperature is not more than 4 C., preferably not more than 2 C.

8. Apparatus according to claim 6, wherein the cooling arrangement comprises a temperature control system which is arranged the control the temperature of the cooling fluid with respect to the temperature of the substrate holding device.

9. Apparatus according to claim 8, wherein the apparatus comprises temperature sensors for measuring the temperature of the substrate holding device and the temperature of the exposing unit, in particular the part of the exposing unit which is arranged adjacent the substrate holding device.

10. Apparatus according to claim 8, wherein the cooling arrangement comprising a cooling device for cooling the cooling fluid to a temperature below the first temperature, and a heating device for heating the cooling fluid, wherein the heating device is arranged in the conduits at an upstream position with respect to the component.

11. Apparatus according to claim 1, wherein the component comprises a projection lens for projecting the electromagnetic radiation or particles onto the sample.

12. Apparatus according to claim 11, wherein the cooling arrangement comprises conduits for guiding a cooling fluid through the conduits, wherein the conduits are arranged in thermal contact with the component, wherein the conduits are arranged for transporting the cooling fluid through or around the projection lens.

13. Apparatus according to claim 1, wherein the component comprises a modulation device for modulating the electromagnetic radiation or particles.

14. Apparatus according to claim 13, wherein the cooling arrangement comprises conduits for guiding a cooling fluid through the conduits, wherein the conduits are arranged in thermal contact with the component, wherein the conduits are arranged for transporting the cooling fluid through or around the modulation device.

15. Apparatus according to claim 14, wherein the modulation device comprises a beam blanking assembly comprising a beam deflector for deflecting a beam of electromagnetic radiation or particles and a beam stop for blocking said beam of electromagnetic radiation or particles, wherein the conduits are arranged for transporting the cooling fluid through or around the beam stop.

16. Apparatus according to claim 1, wherein the source is a source for charged particles and the exposing unit comprises a charged particle optical system for projecting one or more charged particle beams onto said sample.

17. Apparatus according to claim 16, wherein the source is arranged to provide multiple charged particle beams and wherein the charged particle optical system is arranged for projecting one or more of said multiple charged particle beams onto said sample, wherein at least a first part of the conduits is arranged in an area between two charged particle beams.

18. Apparatus according to claim 1, wherein the exposing unit comprises one or more temperature sensors, preferably wherein one of said one or more temperature sensor is arranged at a side of said exposing unit which faces the substrate holding device.

19. Method for exposing a sample using an apparatus according to claim 1, wherein a conditioning of the temperature stabilizing arrangement is performed prior to the processing or imaging of the sample, wherein the conditioning comprises the step of solidifying at least part of the liquid phase change material of said temperature stabilizing arrangement.

20. Method according to claim 19, wherein the conditioning further comprises the step of setting the temperature of the temperature stabilizing arrangement at the second temperature prior to the processing or imaging of the sample.

21. (canceled)

22. Method according to claim 19, wherein a temperature of the apparatus during operation is in a temperature range from 19 C. to 22 C., preferably wherein the first temperature and the second temperature are also arranged in the temperature range from 19 C. to 22 C.

23. Use of an apparatus according to claim 1 for exposing a sample, in particular for processing or imaging a sample.

24. Method according to claim 19, wherein the cooling arrangement of the apparatus comprises conduits for guiding a cooling fluid through the conduits, wherein the conduits are arranged in thermal contact with the component, wherein the cooling arrangement further comprises: a cooling device for cooling the cooling fluid to a temperature below the first temperature, and a heating device for heating the cooling fluid, wherein the heating device is arranged in the conduits at an upstream position with respect to the component. wherein the method comprises the step of controlling at least one of the heating device and the cooling device to establish a temperature difference between the substrate holding device and the exposing unit, in particular the part of said exposing unit which faces the substrate holding device, which temperature difference is less than 4 C., preferably less than 2 C., more preferably less than 1 C.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0108] The invention will be elucidated on the basis of an exemplary embodiment shown in the attached drawings, in which:

[0109] FIG. 1 is a schematic top view of a substrate holding device;

[0110] FIG. 2 is a schematic partial cross section along the line A-A in FIG. 1;

[0111] FIGS. 3A, 3B and 3C schematically show steps of a method for manufacturing a substrate holding device;

[0112] FIGS. 4A and 4B are schematic partial cross sections of a second and a third exemplary embodiment of a substrate holding device;

[0113] FIG. 5 is a schematic partial cross section of a fourth exemplary embodiment of a substrate holding device;

[0114] FIG. 6 is a schematic partial top view of the base plate of the substrate holding device of FIG. 5;

[0115] FIG. 7 is a schematic partial cross section of a fifth exemplary embodiment of a substrate holding device;

[0116] FIG. 8 is a schematic partial cross section of a sixth exemplary embodiment of a substrate holding device;

[0117] FIGS. 9A, 9B and 9C schematically show steps of an alternative method for manufacturing a substrate holding device according to the sixth embodiment as shown in FIG. 8;

[0118] FIG. 10 is a schematic partial cross section of a seventh exemplary embodiment of a substrate holding device;

[0119] FIG. 11 schematically shows an apparatus for processing or imaging a sample, wherein said apparatus comprises a substrate holding device of the invention;

[0120] FIG. 12 schematically shows a cross section of an embodiment of a projection lens system assembly, for example for use in the apparatus as schematically shown in FIG. 11;

[0121] FIG. 13 schematically shows a cooling device for use in a projection lens system as schematically shown in FIG. 12; and

[0122] FIG. 14 schematically shows a part of an apparatus comprising a projection lens system comprising a cooling arrangement, and a substrate holding device comprising a temperature stabilizing arrangement.

DETAILED DESCRIPTION OF THE INVENTION

[0123] FIG. 1 shows a top view of a first example of a substrate holding device according to the present invention, and FIG. 2 shows a partial cross section of the first example along the line A-A in FIG. 1. The substrate holding device 1 comprises a holding plate 2 having a first side 3 for holding a substrate (not shown). The substrate holding device 1 further comprises a base plate 4 which is arranged at a distance from the holding plate 2 and at a second side 6 of said holding plate 2 which faces away from the first side 3. In between the base plate 4 and the holding plate 2, a gap 5 is provided which extends in a direction substantially parallel to the first side 3 of the holding plate 2. An array of supports 7 is arranged in between the holding plate 2 and the base plate 4, which define the distance between the holding plate 2 and the base plate 4, and thus define the width w of the gap 5. The holding plate 2, the base plate 4 and the supports 7 provide a frame for providing a heat absorbing material in the gap 5, which in use is arranged for removing heat from a substrate arranged on the first side 3 of the substrate holding device 1.

[0124] The holding plate 2 comprises, for example, a Si plate. The base plate 4 comprises, for example, a plate of Si-Carbide which has a coefficient of expansion which is substantially the same as the coefficient of expansion of Si. In addition, Si-Carbide is substantially inert and allows using a large range of heat absorbing materials. Furthermore, Si-Carbide has a high thermal conductivity which allows cooling the substrate holding device 1 via the base plate 4, and provides a substantial constant temperature along the base plate 4.

[0125] The supports 7 comprise, for example, Titanium supports, which are non-magnetic. Non-magnetic supports are advantageous when using the substrate holding device 1 in a charged particle processing or imaging apparatus. Although the supports 7 may be clamped between the holding plate 2 and the base plate 4, it is preferred that the supports 7 are fixedly attached to the second side 6 of the holding plate 2 and/or to the base plate 4, as will be explained in more detail below with reference to FIGS. 2, 3A, 3B and 3C.

[0126] According to the present invention, an array droplets 8 of a heat absorbing material are arranged in between the holding plate 2 and the base plate 4. The liquid and/or solid droplets 8 are arranged to bridge the gap 5 between the base plate 4 and the holding plate 2; thus the droplets 8 are arranged to contact both the base plate 4 and the holding plate 2. The droplets 8 are arranged spaced apart from each other, are arranged adjacent to each other in a direction along the gap 5, and are arranged substantially spaced apart from the supports 7. The droplets 8 are confined by the holding plate 2 and the base plate 4 in a direction substantially perpendicular to the first side 3 of the holding plate 2. In addition, the droplets 8 are arranged to enable an expansion of said droplets 8 in a direction along the gap 5 between the base plate 4 and the holding plate 2. As schematically shown in FIG. 2, the droplets 8 are arranged in (thermal) contact with the holding plate 2 and the base plate 4. Preferably the droplets 8 comprise a material having a melting temperature or a melting range at or near a temperature of a substrate processing apparatus at least during processing of said substrate, or at or near a temperature of a substrate imaging apparatus at least during imaging of said substrate. Heat removal is provided by the use of a phase transition, in particular the melting, of the droplets 8. Since the droplets 8 are arranged to enable expansion of said droplets 8 in a direction along the gap 5, contraction or expansion of the droplets 8 when going from solid to liquid and vice versa has substantially no effect on the dimensions of the assembly comprising said holding plate 2, said base plate 4 and the supports 7.

[0127] The heat absorbing material is preferably arranged in an array of flat droplets 7 with a diameter of approximately 15 mm and a thickness of approximately 0.8 mm. Using droplets 7 with a diameter of approximately 15 mm allows to provide an array of supports 7 in between said droplets, which supports 7 are arranged close enough to each other to provide a highly flat first side 3 of the holding plate 2. In this particular example, the supports 7 are arranged in order to provide a gap 5 with a width w of approximately 0.8 mm.

[0128] In this first example, the base plate 4 is provided with an array of pockets 9, which are arranged as shallow indentations or cavities in the surface of the base plate 4 facing the gap 5. The pockets 9 of this first example are substantially shaped as a conical frustum. For example, the descending slope 91 of said cone may be approximately 15 degrees, and at the center of the pockets 9 a substantially flat area is arranged. The droplets 8 are arranged to contact both the base plate 4 and the holding plate 23. The cone shaped edges 91 of the pockets 9 will substantially fix the position of the droplets 8 of heat absorbing material. In addition the cone shaped edges 91 of the pockets 9 and the surface tension in the liquid phase of the droplets 8 provides a positioning force to keep the liquid droplets 8 substantially in the pockets 9. No other parts are required to fix the location of the droplets 8. This allows to arrange the droplets 8 in the substrate holding device 1 of this first example more close to each other, which provides a suitable coverage of the area of the base plate 4 and the holding plate 2 with heat absorbing material. Due to the substantially flat area in the center of the pockets 9, the pockets 9 in the substrate holding device 1 of the first example are shallow which reduces the required amount of heat absorbing material.

[0129] As shown in FIG. 2, the base plate 4 is provided with an array of holes 41 and a first end of each support 7 of a series of supports is arranged in one of said holes 41 and is fixed in said hole 41 via a glue connection. A second end of each support 7, opposite said first end, is fixed to the holding plate 2 by means of a glue connection.

[0130] FIGS. 3A, 3B and 3C schematically show steps of a method for assembling a substrate holding device 1, in particular for assembling a substrate holding device according to the embodiment of FIG. 2. But also the substrate holding device according to the embodiments as described below with reference to FIGS. 4A, 4B, 5, 7 and 10 can be assembled in this way.

[0131] First, as shown in FIG. 3A, a base plate 4 is provided, which comprises an array of pockets 9. Adjacent to these pockets 9, holes 41 are provided for mounting the supports 7 therein. In addition a holding plate 2 is provided with a series of supports 7, which are fixed to the second side 6 of said holding plate 2 facing away from the first side 3 for, at least in use, holding a substrate. The supports 7 are arranged to extend substantially perpendicular to the second side 6, and are fixed to said second side 6 via glue connections 71.

[0132] Subsequently, droplets 8 of liquid heat absorbing material are arranged in the pockets 9, as schematically shown in FIG. 3B. In each pocket 9 of substantially the same size, substantially the same volume of heat absorbing material is dispensed. Preferably the heat absorbing material exhibits more cohesion than adhesion with the surfaces of the holding plate 2 and/or the base plate 2 which are facing the gap 5. Due to the surface tension, the liquid droplets 8 assume a, more or less, spherical shape.

[0133] Next, the holding plate 2 with the supports 7 is moved towards the base plate 4, and the supports 7 are positioned in the holes 41. The holding plate 2 is moved downwards until the desired distance w between the holding plate 2 and the base plate 4 has been reached. In this position, the droplets 8 are flattened in between the base plate 4 and the holding plate 2 as shown in FIG. 3C. De surface tension of the heat absorbing material provides and maintains that the droplets 8 contact both the holding plate 2 and the base plate 4.

[0134] Subsequently, one or more of said the supports 7 are fixed in the corresponding hole 41 via a glue connection, which glue connection is provided in a circumferential gap between the hole 41 and the support 7 extending into said hole 41.

[0135] Before use, the assembled substrate holding device 1 is arranged in a cold environment, at a temperature below the freezing temperature of the heat absorbing phase change material, and the liquid droplets 8 will solidify, substantially in the shape as shown in FIG. 3C. Thus the solid droplets 8 bridge the gap 5 between the base plate 4 and the holding plate 2. Now the substrate holding device 1 is ready for use.

[0136] In the previous first example, the pockets 9 for holding the solid and/or liquid droplets 8 are arranged in the base plate 4, as described above. However, in a second example of the substrate holding device 1, the pockets 9 are arranged in de holding plate 2, in combination with a baseplate 4 with a substantially flat surface facing the gap 5, as schematically shown in FIG. 4A.

[0137] Alternatively, in a third example of the substrate holding device 1, both the surface of the baseplate 4 and the holding plate 2 facing the gap 5 are provided with pockets 92, 93, as schematically shown in FIG. 4B. In this embodiment, the indentations or cavities in the surface of the base plate 4 and the holding plate 2 facing the gap 5 which form the pockets 92, 93 can be more shallow and less deep, compared to the pockets 9, 9 of substrate holding device 1, 1 according to the first and second example.

[0138] FIG. 5 is a schematic partial cross section of a fourth exemplary embodiment of a substrate holding device 11. FIG. 6 is a schematic partial top view of the base plate 14 of the substrate holding device of FIG. 5. In this fourth example, the base plate 14 is provided with an array of pockets 19, which are substantially shaped as a cone. For example, the descending slope of said cone may be approximately 15 degrees. The droplets 18 are arranged in said pockets 19 and are arranged to bridge the gap between the base plate 14 and the holding plate 12. The cone shape of the pockets 91 will substantially fix the position of the liquid and/or solid droplets 18 of heat absorbing material. In addition the cone shape of the pockets 19 and the surface tension of the heat absorbing material in the liquid phase provides a force to keep the liquid droplets 18 substantially in the center of the pockets 19. No other parts are required to fix the location of the droplets 18.

[0139] Also in this fourth example, the base plate 14 is provided with an array of holes 141 and each support 17 of a series of supports is on one side arranged in one of said holes 141 and is fixed in said hole 141 via a glue connection. The other side of the supports 17 is fixed to the holding plate 12.

[0140] In addition, the base plate 14 may be provided with venting holes 142 which debouche substantially in the center of the pockets 19. The venting holes 142 are arranged to prevent the inclusion of air underneath the droplets 18.

[0141] FIG. 7 is a schematic partial cross section of a fifth exemplary embodiment of a substrate holding device 21. In this fifth example, the base plate 24 is provided with an array of pockets 29, which are substantially shaped as a straight cylinder with a substantially circular bottom area. The droplets 28 are arranged in the pockets 29 and contact both circular bottom area of the pockets 29 in the base plate 24 and the holding plate 22. In order to allow the droplets 28 to expand at least in a direction along the gap 25, the volume of the droplets 28 is arranged such that the diameter of the droplets 28 in a direction parallel to the bottom area of the pockets 29, is smaller than the diameter of the cylindrical pockets 29. The cylindrical pockets 29 will substantially establish the position of the droplets 28 of heat absorbing material, both in the solid and in the liquid phase. No other parts are required to substantially fix the location of the droplets 28. An advantage of this example is, that the surface of the base plate 24 where no pocket 29 is arranged can be arranged close to the holding plate 22. Thus the holding plate 22 can be connected to the base plate 24 with very short supports 27, or even with no supports at all, which yields a very rigid substrate holding device 21.

[0142] In the sixth example of a substrate holding device 31, as schematically shown in FIG. 8, the droplets 38 are arranged inside an O-ring 39 which is made from a flexible or elastic material, such as rubber, for example Viton. Each one of said droplets 38 is arranged inside an O-ring 39, which provides a lateral containment of the droplets 38 and allows contraction and expansion of said droplets 38 in a direction along the gap 35 due to the flexible or elastic material of said O-ring 39.

[0143] Preferably the thickness of the O-rings 39 is less than the width w of the gap 35 between the holding plate 32 and the base plate 34. This allows to assemble the substrate holding device 31 comprising the holding plate 32, the base plate 34 and the supports 37 and to obtain a gap 35 with the required width w without interference of the O-rings 39. It is avoided that the O-rings 39 contact both the holding plate 32 and the base plate 34 or are compressed in between the holding plate 32 and the base plate 34, since this may have a negative influence on the flatness of the first side 33 of the holding plate 32.

[0144] As indicated in FIG. 8, the gap 35 is substantially open at a surrounding side edge 310 of the substrate holding device 31. The gap 35 may even be substantially open along substantially the complete surrounding side edge 310 of the substrate holding device 31. Thus the gap 35 comprises an open connection to the outside of the substrate holding device 31. The air pressure or vacuum pressure inside the gap 35 is substantially equal to the air pressure or vacuum pressure outside the substrate holding device 31.

[0145] In FIGS. 9A, 9B and 9C schematically show steps of a method for building a substrate holding device 31 according to the embodiment of FIG. 8, with this difference that in this example the supports 37 are arranged in an array of holes 341 of the base plate 34.

[0146] First a base plate 34 comprising an array of holes 341 is provided. A series of supports 37 are provided and each support 37 of said series of supports is arranged in one of said holes 341 and is fixed in said hole 341, preferably via a glue connection.

[0147] Subsequently, assemblies of O-rings 39 with a solid pill or droplet 38 of heat absorbing material inside, are arranged in between the supports 37, as schematically shown in FIG. 9A. It is noted that the thickness d of the assemblies 38, 39 is less than the height h of which the supports 37 project out of the base plate 34.

[0148] Next, the holding plate 32 is arranged on top of the supports 37 and is fixed to said supports 37, preferably via a glue connection. As schematically indicated in FIG. 9B, the holding plate 32 is arranged on top of the supports 37 with a gap above the assembly of O-ring 39 and solid droplet 38 of heat absorbing material.

[0149] Subsequently the solid droplet 38 of heat absorbing material is melted, for example by arranging the assembly in an oven at a temperature above the melting temperature. Due to the surface tension in the liquid droplet 38 of heat absorbing material, the liquid droplet 38 will assume a more spherical shape, as schematically indicated in FIG. 9C, and contacts the second side 36 of the holding plate 32. The droplets 38 are now arranged to bridge the gap 35 between the base plate 34 and the holding plate 32.

[0150] Next the assembled substrate holding device 31 is arranged in a cold environment at a temperature below the freezing temperature of the heat absorbing material, and the liquid droplets 38 will solidify, substantially in the shape as shown in FIG. 9C. Thus the solid droplets 38 fill the gap 35 and contact both the base plate 34 and the holding plate 32. Now the substrate holding device 31 is ready for use.

[0151] FIG. 10 is a schematic partial cross section of a seventh exemplary embodiment of a substrate holding device 51. In this seventh example, the base plate 54 is provided with an array of pockets 59, which are substantially shaped as a straight cylinder with a substantially circular bottom surface 591. The pocket 59 comprises a first or upper pocket part 592 with a first diameter, and a second or lower pocket part 593 with a second diameter which is smaller than the first diameter. The second pocket part 593 is arranged substantially centrally in the first pocket part 592. This yields a rim or step 61 arranged inside said pocket 59, which extends along the circumferential sidewall of said pocket 59.

[0152] Each pocket 59 of said array of pockets comprises an elastic member, in particular an elastic cover plate 60, which spans said pocket 59 and is arranged spaced apart from a bottom surface 591 of said pocket 59. The elastic cover plate 60 has a diameter which is smaller than the first diameter, but larger than the second diameter. Accordingly, the circumferential edge of the elastic cover plate 60 rests on top of said rim or step 61. The elastic cover plate 60 provides a means for taking up any residual expansion in the direction substantially perpendicular to the gap 55, by a bending or flexing of at least the central part of the cover plate 60 towards the bottom surface 591 of the pocket 59. Preferably, the elastic cover plate 60 is a Titanium plate.

[0153] Each pocket 59 comprises a droplet 58 from said array of droplets, which droplet 58 is arranged between said elastic cover plate 60 and the second side 56 of the holding plate 52. The droplet 58 of a PCM is substantially centrally arranged on top of the elastic cover plate 60.

[0154] As shown schematically in FIG. 10, the cover plate 60 is arranged inside the corresponding pocket 59, below the surface 63 of the base plate 54 surrounding the pocket, which provides a means for fixing the location of the droplets 58 in the gap 55 between the base plate 54 and the holding plate 52. In order to increase the heat transport between the elastic holding plate 60 and the base plate 54, a heat conducting paste is preferably arranged between the circumferential edge of the elastic holding plate 60 and the rim or step 61.

[0155] In addition, each pocket 59 comprises a ring or a loop 62 which is arranged to surround a droplet 58 in said pocket 59. Preferably the ring is made from a synthetic material or a rubber material, such as Viton. The ring or loop 62 is arranged in said pocket 59, preferably on top of said elastic cover plate 60, and acts as a confinement member for a droplet 58 of PCM in said pocket 59. The thickness of said ring or loop 62 is less than the distance between the holding plate 52 and the elastic cover plate 60. Accordingly, the ring or loop 62 is not in direct contact with both the cover plate 60 and the holding plate 52. The ring or loop 62 comprises a substantially rectangular cross-section in a direction substantially perpendicular the first side 53 of the holding plate 52. A substantially flat upper surface of said ring or loop 62 is arranged facing the second side 56 of the holding plate 52. When using a PCM with a high density, such as metallic-like materials having a Gallium-like substance behavior, the ring or loop 62 is pushed upwards by the PCM, which will push the ring or loop 62 towards the second side 56 of the holding plate 52. The flat upper surface of the ring or loop 62 is pushed against the second side 56 of the holding plate 52 and provides a seal for containing the PCM inside the ring or loop 62.

[0156] In the example shown in FIG. 10, the base plate 54 is provided with venting holes 542 which debouche in a bottom surface 591 of said pockets 59, preferably in the center of said pockets 59. Due to the venting holes 591, the pressure inside the lower part 593 of the pockets 59 between the bottom surface 591 and the elastic cover plate 60 is substantially equal to the pressure which surrounds the substrate holding device 51.

[0157] Also in this seventh example, the base plate 54 is provided with an array of holes 541, and the holding plate 52 is provided with an array of supports 57. Each support 57 is arranged in a corresponding one of said holes 541 and is fixed in said hole 541 via a glue connection.

[0158] It is noted that the above presented examples all describe a substrate holding device which, according to the present invention, is suitable for holding an array of droplets of a heat absorbing material, preferably a Phase Change Material (PCM), more preferably a metallic like PCM. Examples of such materials are presented in the table below:

TABLE-US-00001 Melting Temperature Metal Alloys F. C. 44.7 Bi/22.6 Pb/19.1 In/8.3 Sn/5.3 Cd 117 Eut. 47 Eut. 49.3 Bi/20.8 In/17.9 Pb/11.5 Sn/.5 Cd 129-133 54-56 47.5 Bi/25.4 Pb/12.6 Sn. 9.5 Cd/5 In 134-149 57-65 49 Bi/21 In/18 Pb/12 Sn 136 Eut. 58 Eut. 49 Bi/18 Pb/18 In/15 Sn 136-156 58-69 48 Bi/25.6 Pb/12.7 Sn/9.6 Cd/4 In 142-149 61-65 61.72 In/30.78 Bi/7.5 Cd 143 Eut. 61.5 Eut. 52 Bi/26 Pb/22 In 156-158 68-69 50 Bi/27 Pb/13 Sn/10 Cd 158 Eut. 70 Eut. 50.5 Bi/27.8 Pb/12.4 Sn/9.3 Cd 158-165 70-73 50 Bi/34.5 Pb/9.3 Sn/6.2 Cd 158-173 70-78 42 Bi/35 Pb/13 Sn/10 Cd 158-176 70-80 41 Bi/36 Pb/13 Sn/10 Cd 158-185 70-85 42.5 Bi/37.7 Pb/12 Sn/5.1 Cd 158-194 70-90 46 Pb/30.7 Bi/18.2 Sn/5.1 Cd 158-253 70-123 42 Bi/37 Pb/12 Sn/9 Cd 160-190 71-88 66.3 In/33.7 Bi 162 Eut. 72 Eut. 40 Bi/33.4 Pb/13.3 Sn/13.3 Cd 162-235 72-113 50 Bi/39 Pb/7 Cd/4 Sn 165-200 73-93 50 Bi/39 Pb/8 Cd/3 Sn 170-180 77-82 48.5 Bi/41.5 In/10 Cd 171 Eut. 77.5 Eut. 54.1 Bi/29.6 In/16.3 Sn 178 Eut. 81 Eut. 50.4 Bi/39.2 Pb/8 Cd/1.4 In/1 Sn 178-185 81-85 52 Bi/31.6 Pb/15.4 Sn/1 Cd 181-198 83-92 51.08 Bi/39.8 Pb/8.12 Cd/1 In 188-196 87-91 51.45 Bi/31.35 Pb/15.2 Sn/2 In 190-200 87-93 46.7 Bi/39.3 Pb/12.4 Sn/1.6 In 190-230 88-110 51.6 Bi/40.2 Pb/8.2 Cd 197 Eut. 92 Eut. 44 In/42 Sn/14 Cd 200 Eut. 93 Eut. 50 Bi/31 Pb/19 Sn 200-210 93-99 52 Bi/30 Pb/18 Sn 220 Eut. 95 Eut. 50 Bi/28 Pb/22 Sn 202-225 95-108 * Eutectic (Eut.)When a alloy melts at a single point, like pure metals.

[0159] FIG. 11 shows a simplified diagram of an apparatus for processing or imaging a sample 130. Said apparatus comprises a module 201 comprising a source for electromagnetic radiation or particles having energy, a module 204 comprising an exposing unit for exposing said sample 103 to said electromagnetic radiation or particles having energy, and a substrate holding device 209 according to the invention.

[0160] In particular, FIG. 11 schematically represents a multi-beam charged particle lithography system, comprising:

[0161] an illumination optics module 201 including the charged particle beam source 101 and beam collimating system 102,

[0162] an aperture array and condenser lens module 202 including aperture array 103 and condenser lens array 104,

[0163] a beam switching module 203 including beam blanker array 105, and

[0164] projection optics module 204 including beam stop array 108, beam deflector array 109, and projection lens arrays 110.

[0165] In the example shown in FIG. 11, the modules are arranged in an alignment inner sub-frame 205 and an alignment outer sub frame 206. A frame 208 supports the alignment sub-frames 205 and 206 via vibration damping mounts 207.

[0166] The modules 201, 202, 203, 204 together form a charged particle optical unit for generating multiple charged particle beams, modulating said charged particle beams, and directing said charged particle beams towards the first side 209 of a substrate holding device 209.

[0167] The substrate holding device 209 is arranged on top of a chuck 201. On the first side 209 of the substrate holding device 209, a target, for example a wafer 130, can be arranged.

[0168] The substrate holding device 209 and chuck 210 are arranged on a short stroke stage 211 which is arranged for driving said chuck 210 over a small distance along all six degrees of freedom. The short stroke stage 211 is mounted on top of a long stroke stage 212 which is arranged for driving said short stroke stage 211 and the chuck 210 along two orthogonal directions (X and Y) in an at least substantially horizontal plane.

[0169] The lithography apparatus 200 is arranged inside a vacuum chamber 230, which includes a mu metal ( metal) shielding layer or layers 215. The shielding 215 is in a convenient manner arranged as a lining of the vacuum chamber 230. The machine rests on a base plate 220 supported by frame members 221.

[0170] The position of the wafer 130 and substrate holding device 209 with respect to the charged particle optical unit 201, 202, 203, 204 is measured with a measuring device 250 which is attached to the alignment sub-frame 205, which measuring device 250 monitors the position of the chuck 210 with respect to the measuring device 250. The measuring device 250 comprises, for example, an interferometer system and the chuck 210 is then provided with a mirror 251 for reflecting the light beams 252 from the interferometer system.

[0171] FIG. 12 shows a cross sectional view of an embodiment of an improved projection lens assembly 300, for example for use in the projection optics module 204 of the multi-beam charged particle lithography system of FIG. 11. The projection lens assembly 300 comprises a housing having an electrically conductive circumferential wall 330, preferably made from a metal. The projection lens assembly 300 further comprises a cover element 310, and a support element 340 at the downstream end of said housing. A passage for charged particle beams extends from the through opening 313 in the cover element 310, through the interior of the projection lens assembly towards the first electrode 301, through the support element 340 and finally debouches in second electrode 302. A multitude of charged particle beams may traverse said through-opening before impinging on a target 370 arranged on top of a substrate holding device, preferably but not necessary a substrate holding device 1 as described in the examples one to six above. In the embodiment shown, the support element 340 extends substantially parallel to both the first and the second electrode 301, 302. Preferably, the support element 340 extends radially away from the lens-hole arrays in first and second electrodes 301, 302.

[0172] To avoid formation of electrical fields between the target 370 and the projection lens assembly 300, both may be connected to ground and/or conductively connected to each other. A structurally robust projection lens assembly according to the invention may be placed integrally in a known lithography system or may be swapped out or removed for maintenance purposes.

[0173] The multitude of charged particle beams first passes through the through passage 313 in the cover element 310. Once the charged particle beams have traversed the through opening 313 they arrive at the beam stop array 308. The beam stop array 308 is arranged to block charged particle beams which have been deflected by the beam blanker array 105 of the beam switching module 203. The charged particle beams which are deflected by the beam blanker array 105 (see for example FIG. 11) are blocked by the beam stop array 308 and do not reach the target 370. Accordingly the charged particle beams can be individually modulated by the beam blanker array to allow the individual charged particle beams to impinge on the target 370 or not. The beams that are not deflected by the beam blanker array travel through the beam stop array 308 and are projected onto the surface of the target 370 by electrostatic lenses provided by the first and second electrodes 301, 302. Using this modulation and a relative movement of the target 370 with respect to the exposing unit comprising the projection lens assembly 300, allows the writing of a pattern onto the surface of the target 370.

[0174] In some projection lens systems, a deflector unit is arranged between the beam stop array 308 and the first and second electrodes 301, 302, which deflector unit is arranged to provide a scanning deflection of the beams that have passed the beam stop array 308 over de surface of the sample 370. Preferably, the deflector unit comprises an X- and a Y-deflector to deflect the beams in orthogonal directions perpendicular to the optical axis OA of the projection lens system 300.

[0175] As indicated above, the beam stop array 308 is a component for at least partially and/or temporally blocking at least part of the charged particles of the multiple charged particle beams. In order to remove the heat generated by the blocking of the charged particle beams, the beam stop array 308 component is provided with conduits 309. In use, a cooling fluid is guided through the conduits 309, wherein the conduits 309 are arranged in thermal contact with the beam stop array 308. At least a first part 307 of the conduits is arranged an area between two charged particle beams, as schematically indicated in FIG. 13. The central axis of said first part 307 of the conduits extend in a direction substantially perpendicular to a central axis or optical axis OA of the projection lens system 300.

[0176] As indicated in FIGS. 12 and 13, at least a second part 306 of the conduits is arranged to extend so that a central axis of said second part 306 of the conduits extend in a direction substantially parallel to a central axis or optical axis OA of the projection lens system 300. Accordingly, the first part 307 of the conduits can be arranged at or near a first end 303 of the projection lens system 300 that, in use, is arranged close to the substrate 370. The second part 306 of the conduits provide an extension of the conduits away form said first end 303 of the projection lens system 300, which allows to provide an input connection 304 and/or an output connection 305 for the fluid suitably spaced apart from the first end 303, and to arranged the first end 303 of the projection lens system 300 very close to the substrate 370.

[0177] It is noted that a cooling unit as shown in FIG. 13, can also be used for cooling active components for at least partially or temporally manipulating charged particle beams, such as but not limited to electrostatic deflectors or lenses, to move heat generated by the electronic components arranged on or in such active components. The active components, for example the first and second electrodes 301, 302, can be arranged in between the conduits 307.

[0178] FIG. 14 shows a cross sectional view of an embodiment of a part of an assembly comprising an exposing unit for exposing a sample 470, and a substrate holding device 480 for holding said sample 470 at least during said exposing. The assembly shown in FIG. 14 is suitable, for example, for use in the projection optics module 204 of the multi-beam charged particle lithography system of FIG. 11.

[0179] The exposing unit comprises projection lens assembly 400 comprises a housing having an electrically conductive circumferential wall 430, preferably made from a metal. Just as the projection lens assembly 300 shown in FIG. 12, the projection lens assembly 400 comprises a cover element 410, a through opening 413 in the cover element 410, a beam stop array 408, a support element 440, a first electrode 401, a second electrode 402.

[0180] In addition the projection lens assembly 400 comprises components for at least partially and/or temporally manipulating and/or blocking at least part of the charged particle beams. One such component is the beam stop array 408, which is arranged to block charged particle beams which have been deflected by the beam blanker array 105 of the beam switching module 203 shown in FIG. 11. The beam stop array 408 comprises a cooling arrangement which is arranged for substantially maintaining the beam stop array 408 at a predetermined first temperature. In the example shown in FIG. 14, the cooling arrangement also cools the other parts of the projection lens assembly, and in use, substantially the whole projection lens assembly is at said first temperature. The projection lens assembly comprises a first temperature sensor T1, which is arranged at the support element 440, for example, which first temperature sensor T1 is arranged for measuring the temperature of the projection lens assembly, in particular the part of said projection lens assembly facing the substrate holding device 480.

[0181] The cooling arrangement comprises a substantially closed circuit of conduits or ducts for a cooling fluid, in particular a cooling liquid, such as highly pure water. The cooling arrangement further comprises a cooling device 450 for cooling the cooling fluid to a temperature below the first temperature. The cooling device 450 comprises a heat exchange circuit 451 which, in use, is coupled to a Fab coolant circuit.

[0182] Downstream of the cooling device 450, a heating device 470 is arranged in the closed circuit. The heating device 470 is arranged for heating the cooling liquid. The combination of the cooling device 450 and heating device 470 provides a means for accurately controlling the temperature of the cooling fluid. The heating device is arranged in the conduits at an upstream position with respect to the projection lens assembly 400.

[0183] As indicated above, the beam stop array 408 is a component for at least partially and/or temporally blocking at least part of the charged particles of the multiple charged particle beams. In order to remove the heat generated by the blocking of the charged particle beams, the beam stop array 408 component is provided with conduits 409 which are part of the cooling arrangement. In use, the cooling fluid coming from the cooling device 450 and from the heating device 470 is arranged to flow through the conduits 406 towards the conduits 409, wherein the conduits 409 are arranged in thermal contact with the beam stop array 408. Subsequently the cooling fluid flows back to the cooling device 450 via the conduits 406, 405. As indicated in FIG. 14, the conduits 409 are arranged inside the projection lens system 400 at or near a first end 403 of the projection lens system 400 that, in use, is arranged close to the substrate 470.

[0184] Furthermore, the closed circuit comprises one or more temperature sensors for measuring the temperature of the cooling fluid in the conduits 404, 406, 409, 406, 405. In the particular example shown in FIG. 14:

[0185] a second temperature sensor T2 is arranged in the conduits between the cooling device 450 and the heating device 470;

[0186] a third temperature sensor T3 is arranged in the conduits between the heating device 470 and the beam stop array 408; and

[0187] a fourth temperature sensor T4 is arranged in the conduits downstream of the beam stop array 408.

[0188] The temperature sensors T1, T2, T3 and T4 provide an input for a temperature control system 490 which is arranged to control the flow of Fab cooling liquid through the heat exchange circuit 451 in the cooling device 450 and/or to control the heating of the cooling fluid by the heating device 470. The temperature control system 490 is arranged to control the heating device 470 and/or the cooling device 450 to establish a temperature difference between the substrate holding device 480 and the projection lens system 400, in particular the first end 403 of the projection lens system 400 which faces the substrate holding device 480, which temperature difference is preferably in a range of 1 C. to 1.5 C.

[0189] The sample 470 is arranged on top of a substrate holding device 480 for holding said sample 470 at least during an exposure. The substrate holding device 480 comprises a holding plate 481, wherein the holding plate comprises a first side for holding a substrate 470, and a base plate 482. In between the holding plate 481 and the base plate 482, a temperature stabilizing arrangement is arranged which comprises a phase change material 483 having a phase change at a second temperature. The substrate holding device 480 is preferably, but not necessary, a substrate holding device as described in the examples one to six above.

[0190] In the example shown in FIG. 14, both the substrate holding device 480 and the projection lens system 400 are each provided with an arrangement for controlling its temperature. In particular, since the projection lens system 400 is arranged to expose a sample 470 using charged particle beams having energy, the projection lens system 400, in particular the beam stop array 408 and/or the sample 470 will absorb at least part of the energy. By providing both the projection lens system 400 and the substrate holding device 480 with their own cooling arrangement and temperature stabilizing arrangement, an accurate temperature control of the substrate 470 can be obtained, which temperature control allows to:

[0191] at least substantially maintain the temperature of the projection lens system 400, in particular the beam stop array 408 thereof, at the first temperature, preferably using the readily available Fab coolant, and

[0192] to maintain the temperature of the substrate 470 at the second temperature using a phase change material having a phase change at a second temperature.

[0193] Preferably, the cooling arrangement and the temperature stabilizing arrangement are arranged such that the second temperature is at or near the first temperature, at least during an exposure of said substrate by said charged particle beams.

[0194] It is to be understood that the above description is included to illustrate the operation of the preferred embodiments and is not meant to limit the scope of the invention. From the above discussion, many variations will be apparent to one skilled in the art that would yet be encompassed by the spirit and scope of the present invention.

[0195] For example, although the shape and diameter of the pockets in the above described examples are substantially the same for all pockets shown, the base plate can also be provided with pockets with different sizes and/or with different shapes. In particular the pockets along an edge of the substrate holding device may be smaller than the pockets to obtain a better coverage of heat absorbing material along the edge of the substrate holding device.

[0196] Furthermore, a large number of heat absorbing materials can be used. As already indicated, the heat absorbing material is preferably selected in order to have a melting temperature or a melting range at or near an operating temperature of the substrate processing apparatus in which the substrate holding device is used. Such heat absorbing materials are also known under the name of Phase Change Materials, or PCM in short.

[0197] In summary, the present invention relates to an apparatus and method for exposing a sample. The apparatus comprises a source for electromagnetic radiation or particles having energy, an exposing unit for exposing said sample to said electromagnetic radiation or particles, and a substrate holding device for holding said sample at least during said exposing. The exposing unit comprises a component for manipulating and/or blocking at least part of the electromagnetic radiation or charged particles. The component comprises a cooling arrangement which is arranged for substantially maintaining the component at a predetermined first temperature. The substrate holding device comprises a temperature stabilizing arrangement which is arranged to substantially stabilize the temperature of a sample arranged on said substrate holding device. The temperature stabilizing arrangement comprises a phase change material having a phase change at a second temperature, which is at or near the first temperature.

[0198] In addition or alternatively, the invention relates to a substrate holding device comprising a holding plate, a base plate, an array of supports, and an array of droplets of a heat absorbing material. The holding plate comprises a first side for holding a substrate. The base plate is arranged at a distance from the holding plate and provides a gap between the base plate and the holding plate at a side of the holding plate opposite to the first side. The array of supports is arranged in between the holding plate and the base plate. The array of liquid and/or solid droplets is arranged in between the holding plate and the base plate, and the droplets are arranged to contact both the base plate and the holding plate. The droplets are arranged spaced apart from each other and from the supports, and are arranged adjacent to each other in a direction along the gap.