ELECTRONIC DEVICE INSPECTION SOCKET, AND DEVICE AND METHOD FOR MANUFACTURING SAME

Abstract

To guarantee positioning of an elastic pin during manufacturing without using a guide member, and to prevent contamination from a guide member in a final product. An electronic device inspection socket having a plurality of elastic pins each having the center portion embedded in, and having respective ends projecting from, an insulator which changes, through solidification, from a fluid state to a solid but deformable state, wherein the leading ends of the elastic pins are portions received by a plurality of recesses provided to a device for manufacturing the electronic device inspection socket, and the insulator is a portion formed after being injected in a fluid state between said respective ends in a state where said respective ends are received in the recesses and being solidified.

Claims

1. An electronic device inspection socket comprising: an insulator which changes, through solidification, from a fluid state to a solid but deformable state; and a plurality of elastic pins each having a center portion embedded in the insulator and having respective ends projecting from the insulator, wherein leading ends of the elastic pins are portions received by a plurality of recesses provided to a device for manufacturing the electronic device inspection socket, and the insulator is a portion solidified after being injected in a fluid state between the respective ends in a state where the respective ends are received in the recesses.

2. The electronic device inspection socket according to claim 1, wherein the insulator is a thermosetting resin.

3. The electronic device inspection socket according to claim 1, wherein each of the elastic pins is made of gold, platinum, copper, silver, a copper alloy, or a copper-silver alloy.

4. A device for manufacturing an electronic device inspection socket having a plurality of elastic pins each having a center portion embedded in, and having respective ends projecting from, an insulator which changes, through solidification, from a fluid state to a solid but deformable state, the device comprising: a first plate in which a plurality of recesses configured to receive leading ends of first ends of the plurality of elastic pins are formed; a second plate which is arranged opposite to the first plate and in which a plurality of recesses configured to receive leading ends of second ends of the plurality of elastic pins are formed; a movement unit which relatively moves a distance between the first plate and the second plate; and an injection unit that injects the insulator in a fluid state between the first plate and the second plate.

5. A method for manufacturing an electronic device inspection socket having a plurality of elastic pins each having a center portion embedded in, and having respective ends projecting from, an insulator which changes, through solidification, from a fluid state to a solid but deformable state, the method comprising: a step of receiving leading ends of the elastic pins in a plurality of recesses provided to a device for manufacturing an electronic device inspection socket; a step of injecting the insulator in a fluid state between the respective ends in a state where the respective ends are received by the recesses; and a step of removing the leading ends from the device for manufacturing an electronic device inspection socket after the insulator is solidified.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0067] FIG. 1 is a perspective view and a cross-sectional view of an electronic device inspection socket 300 according to an embodiment of the present invention.

[0068] FIG. 2 is a front view and a side view of an elastic pin 100 illustrated in FIG. 1.

[0069] FIG. 3 is an explanatory view of a manufacturing device 400 of the electronic device inspection socket 300 illustrated in FIG. 1.

REFERENCE SIGNS LIST

[0070] 100 elastic pin [0071] 110 center portion [0072] 120, 130 end [0073] 200 support member [0074] 300 electronic device inspection socket [0075] 400 manufacturing device [0076] 410, 430 recess [0077] 420 first plate [0078] 440 second plate [0079] 450 movement unit [0080] 460 injection unit [0081] 470 nozzle