Receiving device for handling structured substrates

Abstract

A mounting apparatus for handling of a structured substrate which has structures. The mounting apparatus having a soft material layer for accommodating the structured substrate on a receiving surface. The structures of the structured substrate are able to be taken at least partially into the material layer. Fixing means for fixing of the structured substrate on the receiving surface are provided.

Claims

1. A mounting apparatus for handling a structured substrate which has structures, said mounting apparatus comprising: a soft material layer having a receiving surface for accommodating the structured substrate, said material layer comprised of a polymer having a modulus of elasticity that is less than 100 GPa, the structures of the structured substrate being taken at least partially into the material layer, and fixing means for fixing the structured substrate on the receiving surface, wherein the receiving surface is exposed to a volumetric flow passing through the material layer at least on one effective contact surface with the structured substrate.

2. The mounting apparatus as claimed in claim 1, wherein the receiving surface of the material layer has a surface energy of less than 0.1 J/m.sup.2.

3. The mounting apparatus as claimed in claim 1, wherein said fixing means includes a pressurization apparatus controlled by a software-supported control apparatus for pressurization of the material layer with negative pressure and/or overpressure.

4. A method for handling a structured substrate having structures, said method comprising: accommodating the structured substrate on a receiving surface of a soft material layer comprised of a polymer having a modulus of elasticity that is less than 100 GPa, the structures of the structured substrate being taken at least partially into the soft material layer, and fixing the structured substrate on the material layer with a controllable fixing means, wherein the receiving surface is exposed to a volumetric flow passing through the soft material layer at least on one effective contact surface with the structured substrate.

5. The method as claimed in claim 4, wherein after a processing step, detaching the structured substrate from the soft material layer by deactivation of the controllable fixing means.

6. The method as claimed in claim 5, wherein the processing step includes a processing of a back side of the structured substrate facing away from the structures.

7. The method as claimed in claim 5, wherein deactivation of the controllable fixing means includes pressure equalization or pressurization on the receiving surface.

8. A use of a mounting apparatus as claimed in claim 1 for handling of structured substrates.

9. The use of the mounting apparatus as claimed in claim 8, wherein the structured substrates are semiconductor substrates having a thickness d less than 100 m.

10. The use of a mounting apparatus as claimed in claim 8, wherein the mounting apparatus is used in a debonder.

11. A mounting apparatus for handling a structured substrate having structures on one side thereof, said mounting apparatus comprised of: a mounting layer having a receiving surface, said mounting layer formed of a soft polymer material having a modulus of elasticity that is less than 100 GPa, and fixing means for fixing said one side of said structured substrate onto said receiving surface of said mounting layer, said fixing means operable to draw, at least partially, said structures on said one side of said substrate into said mounting layer, wherein the receiving surface is exposed to a volumetric flow passing through the material layer at least on one effective contact surface with the structured substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows a cross sectional view of a structured substrate,

(2) FIG. 2 shows a cross sectional view of a mounting apparatus according to the invention,

(3) FIG. 3 shows a cross sectional view of a mounting apparatus according to the invention with a fixed structured substrate prior to a processing step,

(4) FIG. 4 shows a cross sectional view of a mounting apparatus according to the invention with a fixed structured substrate after a processing step and

(5) FIG. 5 shows a cross sectional view of a mounting apparatus according to the invention with a fixed structured substrate during a debond process.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(6) In the figures, advantages and features of the invention are labeled with the reference numbers which identify them according to embodiments of the invention. Components or features with the same function or function with the same effect are labeled with identical reference numbers.

(7) The figures do not show the features of the invention to scale, in order to be able to represent the function of the individual features. The ratios of the individual components are in part not proportional.

(8) FIG. 1 shows a structured substrate 1 comprised of a substrate 2 of thickness d and corresponding structures 3 of height h. The structures 3 can be chips, printed conductors, bumps, MEMS devices or any other type of structure which is raised off the surface of the front 2v of the substrate 2.

(9) FIG. 2 shows a mounting apparatus 4 consisting of a material layer 5 with a receiving surface 5o for accommodating the structured substrate 1 (see FIG. 1) and a base body 6 with a base body surface 6o, comprised of several openings 7.

(10) The mounting apparatus 4 preferably has the shape of a round cylinder with openings 7 which are arranged concentrically to the mounting apparatus 4 according to FIG. 2, on a round ring with a diameter D2, or are distributed arbitrarily or uniformly over the surface. The mounting apparatus 4 in the preferred shape of a round cylinder, which is shown in the embodiment, has a diameter D1. In particular, the ratio of the diameter D2 to D1 is greater than 0.9 and less than 1, preferably greater than 0.95 and less than 1.

(11) According to one aspect of the invention, there are at least three openings 7, preferably at least ten openings 7, even more preferably at least 20 openings 7. Furthermore, cross channels on the surface 6o of the base body 6 are conceivable which can be evacuated via the openings 7, and thus provide for the uniform distribution of the vacuum in the material layer 5. In the material layer 5, advantageously a negative pressure of less than 1 bar, more preferably of less than 800 mbar, still more preferably less than 500 mbar, most preferably less than 200 mbar, most preferably of all less than 100 mbar absolute, can be produced.

(12) The openings 7 on the side of the base body 6 which faces away from the material layer 5 are connected or can be connected to a pressurization apparatus, which is not shown. The pressurization apparatus applies on the openings 7 a negative pressure, which pressure is distributed as uniformly as possible over the openings 7 when a structured substrate 1 is taken onto the mounting apparatus 4, so that the substrate 1 is fixed on the receiving surface 5o. Preferably, the entire volume of the porous or at least gas-permeable material layer 5 is evacuated via the openings 7 so that a uniform negative pressure arises between the structured substrate 1 which is to be fixed and the material layer 5. The structures 3 are pressed into the material layer 5 by the microstructure of the material layer 5. In doing so, the structures 3 preferably sink entirely into the material layer 5 so that the front 2v of the substrate touches the receiving surface 5o. It is also conceivable, for the structures 3 of the structured substrate 1, especially in addition or alternatively to pressurization, to be pressed into the material layer 5 by a force which is acting from the outside on the back 2r of the substrate.

(13) After processing of the back 2r of the substrate 2, e.g., back-grinding to a thickness d of the substrate less than 100 m, preferably less than 50 m, preferably less than 20 m, the structured substrate can be removed again from the mounting apparatus 4 by its being fixed on the back 2r, 2r of the substrate in a manner known to one skilled in the art, and by the structures 3 of the structured substrate 1, 1 being pulled out of the material layer 5, and thus detached by a correspondingly applied force normally to the back 2r, 2r of the substrate.

(14) In a second embodiment according to FIG. 5, the embodiment of the mounting apparatus 4 is used for debonding. A substrate 1 is connected to a carrier substrate 8 via an adhesive layer 9. In order to detach the carrier substrate 8 from the substrate 1, the substrate 1 is fixed with the mounting apparatus 4. The carrier substrate 8 is debonded (detached) from the substrate by a shearing force t with a second fixing apparatus 10.

(15) When a vacuum has been applied in the material layer 5 via the openings 7, before removing the structured substrate 1 the material layer 5 is first ventilated. Preferably, an overpressure is produced in the material layer 5 via the openings 7 so that the release and/or removal of the structures 3 of the structured substrate 1, 1 from the material layer 5 is supported by the overpressure.

REFERENCE NUMBER LIST

(16) 1, 1 structured substrate 2, 2 substrate 2v front of substrate 2r, 2r back of substrate 3 structures 4 mounting apparatus 5 material layer 5o receiving surface 6 base body 6o surface of base body 7 openings 8 carrier substrate 9 adhesive 10 fixing apparatus D, d thickness h height D1 diameter D2 diameter t shearing force