SUBSTRATE HANDLING SYSTEM OF A LITHOGRAPHY APPARATUS AND METHOD THEREOF

Abstract

A substrate handling system comprising a substrate holder comprising a main body with a main body surface, and a plurality of burls projecting from the main body surface to support the substrate spaced apart from the main body surface, clamping means, the clamping means being configured to clamp and/or unclamp the substrate onto the substrate holder, and conveying means, the conveying means being configured to load and/or unload the substrate onto the substrate holder, wherein the conveying means is further configured to physically contact the substrate during the clamping and/or unclamping to the substrate holder. It is also described methods for clamping and unclamping a substrate, a computer program, a computer-readable medium and a lithography apparatus.

Claims

1. A substrate handling system comprising: a substrate holder comprising a main body with a main body surface, and a plurality of burls projecting from the main body surface to support a substrate spaced apart from the main body surface, clamping means, the clamping means being configured to clamp and/or unclamp the substrate onto the substrate holder, and conveying means, the conveying means being configured to load and/or unload the substrate onto the substrate holder, wherein the conveying means is further configured to physically contact the substrate during the clamping and/or unclamping to the substrate holder.

2. The system of claim 1, wherein the conveying means is further configured to position the substrate in a vibration position during the unclamping, wherein in the vibration position the substrate is located separately from the plurality of burls, and wherein the conveying means comprises force feedback sensor means.

3. The system of claim 2, wherein the conveying means is configured to position the substrate in the vibration position when the force feedback sensor means detects a force caused by the unclamping.

4. The system of claim 2, wherein the conveying means comprises a conveying means controller, and wherein the conveying means is configured to position the substrate in the vibration position when the conveying means controller detects a force caused by the unclamping, and wherein the conveying means comprises a plurality of pins and motor means.

5. The system of claim 4, wherein the motor means comprises a servo actuator configured to provide at least 100 Hz of force feedback control.

6. The system of claim 4, wherein the plurality pins are coated with a damping material.

7. The system of claim 1, further comprising gas dispenser means configured to dispense at least one gas to at least the main body surface.

8. The system of claim 1, further comprising damping means for damping the contact of the substrate with the plurality of burls wherein the damping means comprises a gas damper and/or a magnetic damper, and wherein the conveying means is further configured to detect a reduction of vibrations of the substrate during the clamping, and separating the conveying means from the substrate.

9. The system of claim 2, wherein the force feedback sensor means is configured to detect a reduction of vibrations.

10. The system of claim 4, wherein the conveying means controller is configured to detect a reduction of vibrations.

11. A method for unclamping a substrate, the method comprising: unclamping the substrate and bringing into contact conveying means to the substrate during the unclamping and, during the unclamping, moving to a vibration position the substrate by the conveying means, wherein in the vibration position, the substrate is separated from a plurality of burls.

12. The method according to claim 11, further comprising, before moving the substrate to the vibration position, detecting a release of the substrate, wherein the detection is performed by using force feedback measurement or by a conveying means controller.

13. The method according to claim 11, wherein a speed of moving to the vibration position is equal or greater than 10 mm/s.

14. A method for clamping a substrate comprising clamping the substrate and bringing into contact conveying means to the substrate during the clamping.

15. A method according to claim 14, further comprising detecting a reduction of vibrations of the substrate by the conveying means, and separating the conveying means from the substrate, wherein the reduction of vibrations of the substrate is detected by a force feedback measurement or by a conveying means controller.

16-17. (canceled)

18. A lithography apparatus comprising: a substrate handling system comprising a substrate holder comprising a main body with a main body surface, and a plurality of burls projecting from the main body surface to support a substrate spaced apart from the main body surface; and instructions to cause the substrate handling system to execute the steps of: unclamping a substrate and bringing into contact conveying means to the substrate during the unclamping, and, during the unclamping, moving to a vibration position the substrate by the conveying means, wherein in the vibration position, the substrate is separated from the plurality of burls.

19. The system of claim 1, wherein the conveying means is further configured to position the substrate in a vibration position during the unclamping, and wherein in the vibration position the substrate is located separately from the plurality of burls.

20. The system of claim 1, wherein the conveying means is further configured to position the substrate in a vibration position during the unclamping, and wherein the conveying means comprises force feedback sensor means.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings, in which:

[0048] FIG. 1 depicts a lithographic system comprising a lithographic apparatus and a radiation source;

[0049] FIG. 2 depicts in cross-section a substrate holder and substrate in a conventional lithographic apparatus.

[0050] FIG. 3 depicts in cross-section the working operation of the conveying means during the loading.

[0051] FIGS. 4a and 4b depict in cross-section the wear or erosion of the plurality of burls of the substrate holder of FIG. 2 due to the clamping and unclamping of a substrate.

[0052] FIG. 5 depicts in cross-section the working operation during clamping of the substrate handling system of the present invention.

[0053] FIG. 6 depicts in cross-section the working operation during unclamping of the substrate handling system of the present invention.

[0054] FIG. 7 depicts another embodiment of the substrate handling system of the present invention.

[0055] FIGS. 8a and 8b depict another embodiment of the conveying means of the substrate handling system of the present invention.

[0056] FIGS. 9a and 9b respectively depict a flow diagram of the method for reducing the wear or erosion during clamping and unclamping of the present invention.

DETAILED DESCRIPTION

[0057] FIG. 1 shows a lithographic system comprising a radiation source SO and a lithographic apparatus LA. The radiation source SO is configured to generate an EUV radiation beam B and to supply the EUV radiation beam B to the lithographic apparatus LA. The lithographic apparatus LA comprises an illumination system IL, a support structure MT configured to support a patterning device MA (e.g., a mask), a projection system PS and a substrate holder WT configured to support a substrate W.

[0058] The illumination system IL is configured to condition the EUV radiation beam B before the EUV radiation beam B is incident upon the patterning device MA. Thereto, the illumination system IL may include a facetted field mirror device 10 and a facetted pupil mirror device 11. The faceted field mirror device 10 and faceted pupil mirror device 11 together provide the EUV radiation beam B with a desired cross-sectional shape and a desired intensity distribution. The illumination system IL may include other mirrors or devices in addition to, or instead of, the faceted field mirror device 10 and faceted pupil mirror device 11.

[0059] After being thus conditioned, the EUV radiation beam B interacts with the patterning device MA. As a result of this interaction, a patterned EUV radiation beam B′ is generated. The projection system PS is configured to project the patterned EUV radiation beam B′ onto the substrate W. For that purpose, the projection system PS may comprise a plurality of mirrors 13,14 which are configured to project the patterned EUV radiation beam B′ onto the substrate W held by the substrate holder WT. The projection system PS may apply a reduction factor to the patterned EUV radiation beam B′, thus forming an image with features that are smaller than corresponding features on the patterning device MA. For example, a reduction factor of 4 or 8 may be applied. Although the projection system PS is illustrated as having only two mirrors 13,14 in FIG. 1, the projection system PS may include a different number of mirrors (e.g. six or eight mirrors).

[0060] The substrate W may include previously formed patterns. Where this is the case, the lithographic apparatus LA aligns the image, formed by the patterned EUV radiation beam B′, with a pattern previously formed on the substrate W.

[0061] A relative vacuum, i.e. a small amount of gas (e.g. hydrogen) at a pressure well below atmospheric pressure, may be provided in the radiation source SO, in the illumination system IL, and/or in the projection system PS.

[0062] The radiation source SO may be a laser produced plasma (LPP) source, a discharge produced plasma (DPP) source, a free electron laser (FEL) or any other radiation source that is capable of generating EUV radiation.

[0063] FIG. 2 depicts a substrate holder WT forming part of the lithography apparatus LA. Substrate holder WT has the same shape in plan as a substrate, e.g. circular, and is substantially the same size as a substrate, e.g. 300 mm or 450 mm in diameter. Substrate holder WT comprises a main body 21 having a main body surface 22 and a plurality of burls 20 projecting from the main body surface 22. At least one section 210 of the main body surface 22 located between the plurality of burls 20 may be configured to clamp and/or unclamp the substrate W. In an embodiment, burls 20 have a height in the range of from 100 μm to 500 μm, e.g. about 150 μm. A substrate W can be supported by the distal end surfaces of burls 20, which conform to a substantially flat support plane to support the substrate W in a flat state. For example, main body 21 and burls 20 may be formed of SiSiC, a ceramic material having silicon carbide (SiC) grains in a silicon matrix.

[0064] A plurality of through-holes are formed in the main body 21. Through-holes 89 allow the conveying means (not shown in FIG. 2) to project through the substrate holder WT to receive the substrate W and allow the space between the substrate W and the substrate holder WT to be evacuated by connection to a clamp under pressure. Other structures, e.g. to control gas flow and/or thermal conductivity between the substrate holder WT and the substrate W, can be provided.

[0065] In one embodiment wherein the substrate holder WT is configured to perform a vacuum clamp of the substrate W to the plurality of burls 20, an edge seal 85 is provided near the periphery of substrate holder WT. Therefore, the clamping means are configured to provide a vacuum clamp by modifying the pressure on the surrounding areas of the substrate W. The substrate W is clamped to the substrate holder WT by connecting clamp openings 89 to a clamp under-pressure so that spaces 201 is at a lower pressure than the space 202 above substrate W. Thus, the clamping means is configured to modify the pressure in spaces 201 and 202. Hence atmospheric pressure above the substrate W holds it firmly onto substrate holder WT.

[0066] Therefore, the clamping force, in this case vacuum force, may be generated in the main body surface, more particularly in the spaces 201 between the plurality of burls 20 of the main body surface. Sections 210 represents the area of the main body surface the clamping force may be performed. Thus, at least one section 210 of the main body surface 22 located between the plurality of burls 20 is configured to clamp and/or unclamp the substrate. Edge seals 85a, 85b project upwardly from the substrate holder WT to minimize the gap between the substrate holder WT and substrate W to minimize the flow of air from the surroundings into the space underneath substrate W and hence reduce the load on the clamp under-pressure. Burls 20 can be provided in the region between edge seals 85a, 85b.

[0067] Edge seal 85 is a pair of projecting edge seal ridges 85a, 85b around the outside of substrate holder WT. Edge seal ridges 85a, 85b have a height slightly shorter, e.g. by about 10 μm, than that of the burls 20 so that they do not contact the substrate W but reduce the gas flow into the space 201 between the substrate W and substrate holder WT so as to improve vacuum clamping. Burls 20 can be provided in the region between edge seal ridges 85a, 85b; in FIG. 2 none are shown but it is possible to have one or more rows of burls in this region. The substrate holder WT can also be provided with electronic components, e.g. heaters and sensors, to control the temperature of the substrate holder WT and substrate W.

[0068] Openings 81 and 82 are configured to house the conveying means (not shown in FIG. 2) which are intended to load and unload the substrate W on the substrate holder WT.

[0069] As alternative of providing a vacuum clamping, the substrate holder is configured to electrostatically clamp the substrate W to the plurality of burls 20. In this case, a voltage, provided by the clamping means, is applied to the main body surface 22. More particularly, the clamping means provides an electrostatic force to the spaces between the plurality of burls of the main body surface. Sections 210 represent the area of the main body surface the clamping force may be performed. Thus, at least one section 210 of the main body surface 22 located between the plurality of burls 20 is configured to clamp and/or unclamp the substrate. This sections 210 may be also named as free area of burls 210. The at least one section 210 of the main body surface 22 located between the plurality of burls 20 or the free area of burls electrostatically attracts and clamps the substrate W. Therefore, the at least one section 210 of the main body surface 22 located between the plurality of burls 20 or the free area of burls is configured to electrostatically clamp and/or unclamp the substrate. In the embodiment of FIG. 2, it could be also used this electrostatically clamping scheme.

[0070] The at least one section of the main body surface located between the plurality of burls may be understood as the section or area of the main body surface where the plurality of burls are not projected from the main body surface. In other words, the at least one section of the main body surface located between the plurality of burls is the section or area of the main body surface where the plurality of burls are absent.

[0071] FIG. 3 shows how the substrate W is loaded on the substrate table WT. It can also be appreciated that the conveying means is in an extended position or a first position. After receiving the substrate W by the conveying means 30, the conveying means 30 may be moved to a retracted position or second position to place the substrate on the plurality of burls 20. In FIG. 4b, the conveying means are in the retracted position, or second position, and housed inside the substrate holder WT. Then, before the exposure the substrate W is clamped, and after the exposure the substrate W is unclamped in order to be unloaded from the substrate table WT.

[0072] Especially during unclamping but also during clamping, the substrate may suffer high friction wearing the plurality of burls, and more particularly, the burls located under the outer part of the substrate as it is shown in FIG. 4b. Because of the stiff and undamped wafer-clamp system, this change on the wafer shape is accompanied by multiple wafer oscillations as it is shown in FIG. 4a, which may lead to deformation issues in the surface of the substrate W. If the substrate W is a wafer, this will be lead to an overlay issues between its layers.

[0073] In FIGS. 5 and 6, it is shown a substrate handling system 100 according to one embodiment of the present invention which prevents the wear shown in FIGS. 4a and 4b. In this embodiment, the substrate W is a wafer, however this example does not limit to the invention for this type of substrates. Further, substrate handling system 100 is configured to electrostatically clamp and/or unclamp the substrate W.

[0074] The substrate handling system 100 of FIGS. 5 and 6 comprises a substrate holder WT. The substrate holder WT comprises a main body 21 with a main body surface 22. Further, the substrate holder WT comprises a plurality of burls 20 projecting from the main body surface 22 to support the substrate W spaced apart from the main body surface 22. The at least one section 210 of the main body surface 22 located between the plurality of burls 20 may be configured to clamp and/or unclamp the substrate.

[0075] Further the substrate handling system 100 comprises clamping means, the clamping means being configured to clamp and/or unclamp the substrate onto the substrate holder WT, and it 100 also comprises conveying means 30 configured to load and/or unload the substrate W onto the substrate holder WT and to detect vibrations on the substrate W. The conveying means 30 is configured to physically contact the substrate W during the electrostatically clamping and/or unclamping to the substrate holder WT.

[0076] As it is shown in FIG. 5, the conveying means is positioned in a contact position or third position. This contact position is different than the extended position and retracted position of the prior art respectively shown in FIGS. 3 and 4b.

[0077] Advantageously, the present invention reduces the vibrations on the substrate W during clamping and/or unclamping. During the electrostatically clamping, as it is show in the right side of FIG. 5, the conveying means 30 is configured to keep in physically contact with the substrate W and to gently push against backside as it is shown in the left part of FIG. 5.

[0078] During the electrostatically unclamping, i.e., during the ramp-down of the clamping voltage as it is shown in the right side of FIG. 6, the conveying means 30 is configured to contact with the substrate W and to gently push against backside. Further, the conveying means 30 is further configured to detect the release of the substrate by measuring the vibrations on it, also during the ramp-down of the clamping voltage, and then the conveying means 30 is configured to push up the substrate W, so the substrate edge vibrations occur in free space rather than on the plurality of burls 20. In one embodiment the release of the substrate starts when the clamping voltage is reduced.

[0079] More particularly, the conveying means 30 is configured to position the substrate W in a vibration position 110 or forth position during the unclamping, wherein in said vibration position 110 the substrate is located separately from the plurality of burls 20. It may also be said that the substrate is located in the free space from the plurality of burls 20, as it is shown in FIG. 6. The speed of the movement to the vibration position is 10 mm/s or more. Once the substrate W is totally released, for example, the clamping voltage is zero volts, the conveying means are configured to maintain the substrate W in the vibration position until a reduction of vibration is detected and/or the vibrations have stopped, i.e., until the unclamping is finished.

[0080] FIG. 7 describes a further embodiment of the substrate handling system 100 according to the present invention. As it can be appreciated, this embodiment comprises some of the elements of the system of FIGS. 5 and 6 and for the sake of simplicity, they will not be explained again.

[0081] The conveying means 30 of the substrate handling system 100 of FIG. 7 comprises three pins 31, three electrical motors 40, one force feedback sensor 50 and a conveying means controller or motor controller 41. Also in this embodiment, the electrical motors 40 are configured to position the substrate W through the pins 31 in the vibration position 110 when the force feedback sensor 50 detects any force or vibration caused by the unclamping.

[0082] In other embodiment, the motor controller 41 is configured to detect any force or vibration caused by the electrically unclamping and to send an instruction to the electrical motors 40 to position the substrate W through the pins 31 in the vibration position 110.

[0083] Further, it is also proposed to introduce additional damping into the pins, either by making the pins out of damping material like PEEK, or by introducing electromagnetic damping to the actuation part of the pin, or by servo-actuation configured to provide at least 100 Hz of force feedback control. Alternatively, dedicated actuated damping pins, rings, or other shapes/structures could be used for this purpose.

[0084] These embodiments may also be performed either with backfill gas between the plurality of burls 20. For that purpose, in the embodiment of FIG. 7, the substrate handling system 100 further comprises a gas dispenser 60. The gas dispenser 60 is configured to dispense at least one gas to at least the main body surface. In other words, the gas dispenser 60 is configured to fill the volume 70 between the clamping surface and the substrate with hydrogen 61. Advantageously, the backfill gas 61 could be beneficial to give some additional damping just after unclamping.

[0085] In an alternative embodiment the conveying means may be an external device. FIG. 8a depicts an aerial view said embodiment. The conveying means comprises a external robot 80 with a griping hand 81 configured to load and unload the substrate W onto the substrate holder WT. In other embodiment, the external robot is configured to load and unload the substrate onto the pins 31. In an additional embodiment, the external robot 80 is configured to load and unload the substrate onto the plurality of burls 20.

[0086] In the embodiment of FIG. 8a, it is also depicted in dashed lines the location of the griping hand 81 in flush with the substrate W, i.e., it may be located in a parallel plane or in the same plane of the substrate. In this embodiment, the external robot 80 is configured to grip the substrate W from said planes. Additionally, the griping hand 81 may grip by physical contact, preferably using at least one wedge, or by electrostatic force the substrate W.

[0087] In the embodiment of FIG. 8b, the griping hand 81 is located above the substrate W. In this embodiment the external robot 80 is configured to grip the substrate W from said position. In particular, the griping hand 81 may also grip by physical contact, preferably using at least one wedge, or by electrostatic force the substrate W.

[0088] In any of the embodiments wherein the conveying means 30 comprises the external robot 80, the external robot 80 may be used in any of the handling system depicted in FIGS. 5 to 7. In particular as it is shown in FIG. 8b, the external robot is 80 may be connected to the motor controller 41 and to the force feedback sensor 50. The motor controller 41 is also configured to detect any force or vibration caused by the unclamping and to send an instruction to the external robot 80 to position the substrate in a vibration position 110 during the unclamping. As in the previous embodiments, in said vibration position 110, the substrate is located separately with respect to the plurality of burls 20.

[0089] Further the motor controller 41 is also configured to detect any force or vibration caused by the clamping and to send an instruction to the external robot 80 to contact the substrate reducing the vibrations on the substrate W. Advantageously, the external robot 80 allows to perform more complicated clamping schemes (e.g. differential forces over time in different positions) without overcomplicating primary function of substrate holder WT.

[0090] In any of the embodiments of FIGS. 5 to 8b, the conveying means 30, either the pins 31 or the external robot 80 with a griping hand 81, is configured to keep the substrate W at zero normal load force during the clamping.

[0091] FIG. 9a depicts a flow diagram of a method 300 for unclamping a substrate W. The method 300 is performed during the electrical unclamping as it is represented in the right part of the FIG. 9a. The method 300 comprises electrically unclamping 301 the substrate W and bringing 301 into contact conveying means 30 to the substrate W during said unclamping. This means during the ramp down of the clamping voltage, the conveying means 30 are brought in to contact with the substrate W. Further, the release of the substrate W is detected 302 by using force feedback measurement or by the conveying means controller 40. Once it is released during the unclamping, i.e., the clamping voltage is close to 0 V but it still clamped, the substrate W is moved 303 to a vibration position 110 the substrate by the conveying means 30, wherein in said vibration position 110, the substrate W is separated from the plurality of burls 20.

[0092] FIG. 9b depicts a flow diagram of a method 400 for reducing clamping a substrate W. The method 400 is performed during the electrical clamping as it is represented in the right part of the FIG. 9b. The method 400 comprises the step 401 of electrically clamping the substrate W and simultaneously bringing into contact the conveying means 30 to the substrate W during the clamping. This means during the ramp up of the clamping voltage, the conveying means are brought in to contact with the substrate W. Further, the reduction of vibrations is detected 402 by using force feedback measurement or by the conveying means controller 40. Once it is detected during the clamping, i.e., the clamping voltage is close to optical clamping voltage, the conveying means 30 are separated 403 from the substrate W.

[0093] Although specific reference may be made in this text to the use of lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc.

[0094] Although specific reference may be made in this text to embodiments of the invention in the context of a lithographic apparatus, embodiments of the invention may be used in other apparatus. Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or mask (or other patterning device). These apparatus may be generally referred to as lithographic tools. Such a lithographic tool may use vacuum conditions or ambient (non-vacuum) conditions.

[0095] Although specific reference may have been made above to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention, where the context allows, is not limited to optical lithography and may be used in other applications, for example imprint lithography.

[0096] Where the context allows, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustical or other forms of propagated signals (e.g. carrier waves, infrared signals, digital signals, etc.), and others. Further, firmware, software, routines, instructions may be described herein as performing certain actions. However, it should be appreciated that such descriptions are merely for convenience and that such actions in fact result from computing devices, processors, controllers, or other devices executing the firmware, software, routines, instructions, etc. and in doing that may cause actuators or other devices to interact with the physical world.

[0097] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Thus it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the clauses set out below. Other aspects of the invention are set-out as in the following numbered clauses.

1. A substrate handling system comprising

[0098] a substrate holder comprising a main body with a main body surface, and a plurality of burls projecting from the main body surface to support the substrate spaced apart from the main body surface,

[0099] clamping means, the clamping means being configured to clamp and/or unclamp the substrate onto the substrate holder, and

[0100] conveying means, the conveying means being configured to load and/or unload the substrate onto the substrate holder,

wherein the conveying means is further configured to physically contact the substrate during the clamping and/or unclamping to the substrate holder.
2. The system of clause 1, wherein the conveying means is further configured to position the substrate in a vibration position during the unclamping, wherein in said vibration position the substrate is located separately from the plurality of burls.
3. The system of any of the previous clauses, wherein the conveying means comprises force feedback sensor means.
4. The system of clause 3, wherein the conveying means is configured to position the substrate in the vibration position when the force feedback sensor means detects a force caused by the unclamping.
5. The system of any of the previous clauses wherein the conveying means comprises a conveying means controller, and
wherein the conveying means is configured to position the substrate in the vibration position when the conveying means controller detects a force caused by the unclamping.
6. The system of any of the previous clauses wherein the conveying means comprises a plurality of pins and motor means.
7. The system of clause 6 wherein the motor means comprises a servo actuator configured to provide at least 100 Hz of force feedback control.
8. The system of any of the clauses 6 or 7, where the plurality pins are coated with a damping material, preferably, the damping material is Polyether ether ketone.
9. The system of any of the previous clauses further comprising gas dispenser means configured to dispense at least one gas to at least the main body surface, preferably, the gas is hydrogen or nitrogen.
10. The system of any of the previous clauses further comprising damping means for damping the contact of the substrate with the plurality of burls, preferably, the damping means comprises a gas damper and/or a magnetic damper.
11. The system of any of the previous clauses wherein the conveying means is further configured to detect a reduction of vibrations of the substrate during the clamping, and separating the conveying means from the substrate.
12. The system of clauses 3 and 11 wherein the force feedback sensor means is configured to detect the reduction of vibrations.

[0101] 13. The system of clauses 5 and 11 wherein the conveying means controller is configured to detect the reduction of vibrations.

14. A method for unclamping a substrate comprising

[0102] unclamping the substrate and bringing into contact conveying means to the substrate during the unclamping and,

[0103] during the unclamping, moving to a vibration position the substrate by the conveying means, wherein in said vibration position, the substrate is separated from the plurality of burls.

15. The method according to clause 14 comprising, before moving the substrate to the vibration position, detecting a release of the substrate.
16. The method according to clause 15, where the detection is performed by using force feedback measurement or by a conveying means controller.
17. The method according to any of the clauses 14 to 16, wherein the speed of the movement to the vibration position is equal or greater than 10 mm/s.
18. A method for clamping a substrate comprising clamping the substrate and bringing into contact conveying means to the substrate during the clamping.
19. A method according to clause 18, further comprising detecting a reduction of vibrations of the substrate by the conveying means, and separating the conveying means from the substrate.
20. The method according to any of the clauses 18 or 19, wherein the reduction of vibrations of the substrate is detected by a force feedback measurement or by a conveying means controller.
21. A computer program comprising instructions to cause the system of any of the clauses 1 to 13 to execute the steps of any of the methods of any of the clauses 14 to 20.
22. A computer-readable medium having stored thereon the computer program of clause 21.
23. A lithography apparatus comprising the system of any of the clauses 1 to 13 and/or the computer-readable medium of clause 22.