Potential-separating optical signal transmitting device

Abstract

A potential-separating optical signal transmission device comprises a printed circuit board-based transmitter device with a signal input, a transmission signal conditioning circuit and an optical signal transmitter, a printed circuit board-based receiver device with an optical signal receiver, a received signal processing circuit and a signal output, an optical transmission path between the signal transmitter and the signal receiver, a shield assembly for each transmitter and receiver device, an implementation of the shield assemblies by means of metallic layers in and/or on at least one printed circuit board, and a substantially rigid, transparent transfer rod as an optical transmission path, the ends of said transfer rod being arranged within the respective shield assembly of the transmitter and receiver device in front of the signal transmitter and signal receiver, respectively, and being mechanically held by the at least one printed circuit board.

Claims

1.-12. (canceled)

13. A potential-separating optical signal transmission apparatus, comprising: a printed circuit board-based transmitter device (1) with a signal input (2), a transmission signal conditioning circuit (3), and an optical signal transmitter (4); a printed circuit board-based receiver device (5) with an optical signal receiver (6), a received signal processing circuit (7), and a signal output (8); an optical transmission path (9) between the optical signal transmitter (4) and the optical signal receiver (6) in form of a substantially rigid, transparent transfer rod (10); and shield assemblies (13, 14), including a transmitter shield assembly (13) for the transmitter device (1) and a receiver shield assembly (14) for the receiver device (5), the shield assemblies (13, 14) being implemented by metallic layers (37 to 42) in and/or on at least one printed circuit board (15, 16, 17), wherein a first end (43) of the transfer rod is arranged shortly in front of or within the transmitter shield assembly (13) in front of the optical signal transmitter (4), wherein a second end (44) of the transfer rod is arranged shortly in front of or within the receiver shield assembly (14) in front of the optical signal receiver (6), and wherein the transfer rod (10) is mechanically held by the at least one printed circuit board (15, 16, 17).

14. The signal transmission apparatus according to claim 13, wherein the signal transmission apparatus with the transmitter device (1), the optical transmission path (9) and the receiver device (5) is implemented by combining three printed circuit boards which sit on top of one another, namely a base printed circuit board (15) including a majority of electronic circuit components (18) thereon, a frame printed circuit board (16) for laterally framing the circuit components (18), and a cover printed circuit board (17) for covering the frame printed circuit board (16), the circuit components (18) and the transfer rod (10).

15. The signal transmission apparatus according to claim 13, wherein the signal transmission apparatus with the transmitter device (1), the optical transmission path (9) and the receiver device (5) is implemented by combining two printed circuit boards which sit on top of one another, namely a base printed circuit board (15) including a majority of electronic circuit components (18) thereon and a one-piece cap printed circuit board (50) which has a circumferential frame flange (51) for laterally framing the circuit components (18) and a cover wall (52) for covering the circuit components (18) and the transfer rod (10).

16. The signal transmission apparatus according to claim 14, wherein the metallic layers (37 to 42) of the shield assemblies (13, 14) for the transmitter (1) and receiver device (5) are arranged one of in and on the base (15), one of the frame (16) and cover printed circuit board (17) and the base (15) and cap printed circuit board (50) in such a manner that around the transmitter (1) and receiver device (5) with their respective electronic circuit components (18) in each case at least one of single-layer and multi-layer is formed, which is penetrated by the transparent transfer rod (10) on a side of one of the transmitter (1) and receiver device (5).

17. The signal transmission apparatus according to claim 16, wherein the multi-layer shielding is a two-layer shielding.

18. The signal transmission apparatus according to claim 14, wherein the base printed circuit board (15) and cover printed circuit board (16) are provided with metallic layers (37, 38, 41, 42) arranged parallel to the main planes (HE) thereof and the frame printed circuit board (16) is provided with an edge metallization comprising metallic layers (39, 40).

19. The signal transmission apparatus according to claim 15, wherein the base printed circuit board (15) and cover wall (52) of the cap printed circuit board (50) are provided with metallic layers (37, 38, 41, 42,) arranged parallel to the main planes (HE) thereof and the frame flange (51) of the cap printed circuit board (50) is provided with an edge metallization comprising metallic layers (39, 40).

20. The signal transmission apparatus according to claim 13, wherein the transparent transfer rod (10) has at least one of the following properties: made of one of the group consisting of a highly transparent synthetic resin and glass, length between 10 mm and 100 mm, diameter 1 mm to 4 mm, distance of the signal input and output surfaces on a head side to the optical signal transmitter (4) and signal receiver (6) between 0.1 mm and 1 mm, and one of optical preparation and finishing of the signal input and output surfaces on the head side.

21. The signal transmission apparatus according to claim 20, wherein the transparent transfer rod (10) is made of quartz glass.

22. The signal transmission apparatus according to claim 20, wherein the transparent transfer rod (10) has a length of 20 mm.

23. The signal transmission apparatus according to claim 20, wherein the transparent transfer rod (10) has a diameter of 2 mm.

24. The signal transmission apparatus according to claim 20, wherein the distance of the signal input and output surfaces on the head side to the optical signal transmitter (4) and signal receiver (6) is 0.5 mm.

25. The signal transmission apparatus according to claim 14, wherein the transfer rod (10) is arranged in a recess (35) of the frame printed circuit board (16) and is held via projections (36) of the frame printed circuit board (16) by a press fit.

26. The signal transmission apparatus according to claim 13, wherein the transfer rod (10) lies in an alignment recess (33) in a surface of the base printed circuit board (15).

27. The signal transmission apparatus according to claim 13, wherein the optical signal transmitter (4) is designed as an LED.

28. The signal transmission apparatus according to claim 27, wherein ageing of the optical signal transmitter (4) can be compensated for by adapting the LED current by means of an ageing compensation circuit based on a reference transmission path with a semiconductor-based light emitter.

29. The signal transmission apparatus according to claim 28, wherein the reference transmission path with the semiconductor-based light emitter is a reference LED transmission path.

30. The signal transmission apparatus according to claim 13, wherein the optical signal receiver (6) is designed as one of the group consisting of a CCD, phototransistor, photodiode and photoresistor.

31. The signal transmission apparatus according to claim 13, wherein one of the base (15), frame (16) and cover printed circuit board (17) and the base (15) and cap printed circuit board (50) are mechanically connected to one another in a sandwich structure.

32. The signal transmission apparatus according to claim 31, wherein one of the base (15), frame (16) and cover printed circuit board (17) and the base (15) and cap printed circuit board (50) are mechanically connected to one another by means of one of the group consisting of soldering pins, soldered edge metallizations, press-fit pins, adhesions, pressings, screwing, riveting and welding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG. 1 and FIG. 2 show rough overview block diagrams of a potential-separating optical signal transmission apparatus for current or voltage signals,

[0046] FIG. 3 shows an exploded view of the signal transmission apparatus in a first embodiment,

[0047] FIG. 4 shows a schematic horizontal section of the frame printed circuit board of this signal transmission apparatus,

[0048] FIG. 5 shows a schematic vertical section of the signal transmission apparatus along the section line V-V according to FIG. 4,

[0049] FIG. 6 shows a perspective view of a signal transmission apparatus in a second embodiment,

[0050] FIG. 7 shows a perspective view of the base printed circuit board of the signal transmission apparatus according to FIG. 6 with the cover printed circuit board lifted off,

[0051] FIG. 8 shows a perspective view of the underside of the cap printed circuit board of the signal transmission apparatus according to FIG. 6,

[0052] FIG. 9 shows a schematic sectional horizontal section of the cap printed circuit board according to FIG. 8 in the region of its frame flange, and

[0053] FIGS. 10 and 11 show schematic vertical sections of the signal transmission apparatus according to FIG. 6 along the section lines X-X and XI-XI according to FIG. 9.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0054] As can be seen from FIG. 1, a potential-separating optical signal transmission apparatus has a transmitter device 1 with a signal input 2, an input ground connection GNDin, a transmission signal conditioning circuit 3 and an optical signal transmitter 4 in the form of an LED. On the receiver side, a receiver device 5 is provided with an optical signal receiver 6 in the form of a photodiode, a received signal processing circuit 7, a signal output 8 and an output ground connection GNDout. An optical transmission path 9 is provided between the signal transmitter 4 and the signal receiver 6, which is implemented by an essentially rigid, transparent transfer rod 10.

[0055] The signal input 2 is configured for a current signal lin. Accordingly, an input resistor 12 is connected between the signal input 2 and the input ground connection GNDin the signal transmission apparatus.

[0056] As shown in dashed lines in FIG. 1, shields 13, 14 are arranged around the transmitter device 1 and receiver device 5 respectively, each of which is designed as a double shielding including an inner shield 13i, 14i and an outer shield 13a, 14a. This double shielding is particularly advantageous for the current signal input 2 shown, as in this case the input ground GNDin, to whose potential the inner shield 13i is connected, changes its potential in relation to the environment and potential differences arise accordingly. Effective shielding is provided by the outer shield 13a, whose potential SCREENin is electrically stable with respect to the environment. This ensures good shielding, in particular when the current input is inserted into a typical automation current loop, which may consist of other signal sinks (current inputs of other components). The corresponding potential ratios and shielding properties are achieved on the receiver side with the inner shield 14i at output ground GNDout and the outer shield 14a at the potential SCREENout.

[0057] As only indicated in FIG. 1, the transfer rod 10 penetrates through the two double shields 13, 14 through narrow openings (see FIG. 4 at 44, 45) in order to minimize the impact on the shielding properties.

[0058] In FIG. 2, the signal transmission apparatus is shown in a configuration in which the signal input 2 is designed for voltage signals Uin. Accordingly, the input resistor 12 of the embodiment according to FIG. 1 can be omitted. Although two double shields 13, 14 are again shown in the embodiment according to FIG. 2, a single shielding with the shields 13i, 14i is often sufficient for voltage signal transmission. To avoid repetition, please refer to the description of FIG. 1 with regard to FIG. 2. Components that correspond to each other in the two drawings are labelled with the same reference signs.

[0059] FIGS. 3 to 5 now illustrate the specific structure of a potential-separating optical signal transmission apparatus, which is designed as a 2-channel transformer in the specific embodiment example. As can be seen from FIG. 3, the apparatus is characterized by the combination of three printed circuit boards which sit on top of each other, namely, viewed from bottom to top, a base printed circuit board 15, a frame printed circuit board 16 sitting on it and a cover printed circuit board 17 closing the whole at the top. On the base printed circuit board 15, all electronic components 18, which are not to be named individually, are usually placed according to SMD technology in the usual manner on corresponding conductor tracks and form the transmission signal conditioning circuit 3.1, 3.2 and the received signal processing circuit 7.1, 7.2 of the two channels. Furthermore, the input-side plug-in sockets 19 and output-side plug-in sockets 20 for the respective connection cables of the signal transmission apparatus are mounted and electrically connected on the base printed circuit board 15. FIG. 3 also shows a lower housing part 21 which, together with other housing parts omitted in the drawing, forms a housing of the signal transmission apparatus for receiving the printed circuit boards 15, 16, 17.

[0060] The frame printed circuit board 16 has four larger apertures 22, 23, 24, 25, the outline of which is adapted to the mounting space of the electronic components 18 of the transmission signal conditioning circuits 3.1, 3.2 and received signal processing circuits 7.1, 7.2 in such a manner that these circuits are positioned in these apertures 22, 23, 24, 25. The thickness of the frame printed circuit board 16 is such that the electronic components 18 do not protrude beyond the upper side of the frame printed circuit board 16. This allows the cover printed circuit board 17 to be placed flat on the frame printed circuit board 16 and the board assembly to be joined together in a hermetically sealed and mechanically stable manner using appropriate connectors, such as solder pins (not shown) in solder openings 26. By varnishing the outer surfaces and edges, a kind of sealing of the volumes containing the circuits 3.1, 3.2, 7.1, 7.2 can be achieved. The two smaller apertures 27, 28 in the frame printed circuit board 16 and thus congruent apertures 29, 30 in the cover printed circuit board 17 accommodate the two larger-volume, potential-separating transformers 31, 32, which are also located on the base printed circuit board 15, when assembled. These transformers transport electrical energy and are therefore used for the potential-separated power supply. For example, the transmitter can be supplied with power in a potential-separated manner if power is supplied via the receiver side. Accordingly, the reverse case is also possible, i.e. the potential-separated power supply of the receiver when the power is supplied via the transmitter side. The transformers are not included in FIGS. 1, 2, 4 and 5.

[0061] The specific configuration of the optical transmission paths 9.1, 9.2 with the two transfer rods 10.1, 10.2 of the two channels of the transmission apparatus is now described in more detail with reference to FIGS. 3 to 5. The LED signal transmitters 4.1 of the two channels (in FIG. 3, the LED signal transmitter 4.2 is concealed behind the transformer 31) and their signal receivers 6.1, 6.2 are arranged on the base printed circuit board 15 at the opposite ends of an alignment recess 33.1, 33.2 in each case in the surface of the base printed circuit board 15. The alignment recesses 33.1, 33.2 are dimensioned such that the respective transfer rod 10.1, 10.2 made of natural quartz glass, which measures approximately 20 mm in length and approximately 2 mm in diameter, comes to lie therein with its lower circular arc cross-section such that its optical axis 34 is precisely aligned with the signal output or input zones of the signal transmitters 4.1, 4.2 or signal receivers 6.1, 6.2. However, the actual mounting of the transfer rods 10.1, 10.2 is performed by the frame printed circuit board 16 with its recesses 35.1, 35.2 connecting the apertures 22, 24 and 23, 25 respectively, the inwardly projecting projections 36 (see FIG. 5) of which hold the respective transfer rod 10.1, 10.2 under a press fit.

[0062] From a synopsis of FIGS. 3 to 5, the double shields 13, 14 mentioned in connection with FIGS. 1 and 2 can now be explained in more detail. The respective transmission signal conditioning circuits 3.1, 3.2 and received signal processing circuits 7.1, 7.2 are surrounded on all sides by double shields 13.1, 14.1, which are configured by corresponding metallic layers in or on the base printed circuit boards 15, frame printed circuit boards 16 and cover printed circuit boards 17. The upper and undersides of the cover printed circuit board 17, which run parallel to the main board plane HE, each have hatched zones with a metallic layer 37 and 38, which coincide with the position of the circuits 3.1, 3.2, 7.1, 7.2. The layer 37 located on the upper side forms a section of the corresponding outer shield 14, the layer 38 located on the underside forms a section of the corresponding inner shield 13 of the two-layer shielding assemblies.

[0063] Further sections of the shields are formed at the bottom of the frame printed circuit board 16 by covering the vertical edges 47 of the apertures 22, 23, 24, 25 with a metallic layer 39 as a corresponding section of the inner shield 13i, 14i with respect to the main plane HE. Outer edges 48 of the frame printed circuit board 16 can also be coated with metallic layers 40 to form corresponding sections of the outer shield 13a, 14a.

[0064] To complete the inner shield 13i, 14i and outer shield 13a, 14a, two metallic layers 41 (for the inner shield 13) and 42 (for the outer shield 14) are again integrated in the base printed circuit board 15 by embedding them in an inner layer of the printed circuit board in congruent overlap with the zones marked with hatching on the cover printed circuit board 17 in FIG. 3. The various metallic layers 37 to 42 thus form two-layer shield assemblies around the transmission signal conditioning circuits 3.1, 3.2 and received signal processing circuits 7.1, 7.2 due to their mutual spatial allocation, which are only interrupted in the optical transmission paths 9.1, 9.2 by the transfer rods 10.1, 10.2 protruding with their ends 43, 44 through the metallic layers 39, 40 on the frame printed circuit board 16 via narrow openings 45, 46. Narrow gaps can also be formed in the shielding assemblies at the transitions of the metallic layers 38 to 42 between the various printed circuit boards 15, 16, 17, the negative effect of which can, however, be compensated for by overlapping the layers 37 to 42 in two adjacent printed circuit boards 15, 16, 17.

[0065] Finally, it should be pointed out that between the regions of the double-layered shields 13, 14 formed around the circuits 3.1, 3.2, 7.1, 7.2, a strip is formed between the transmitting and receiving sides of the transmission apparatus without metallic components, which strip is bridged only by the transfer rods 10.1, 10.2 in addition to the printed circuit board material and which strip plays a decisive role in determining the insulation distance of the apparatus.

[0066] A second embodiment of the signal transmission apparatus is now explained in more detail with reference to FIGS. 6 to 11, which second embodiment differs from the first embodiment essentially in the structure of the PCB-based housing. The basic circuit properties, as explained with reference to FIGS. 1 and 2, also apply to the second embodiment and therefore do not need to be repeated.

[0067] The main difference in the second embodiment can be seen in FIGS. 6 to 8. A base printed circuit board 15 is still provided, which is equipped with electronic components 18 on the upper and undersides to form the transmission signal conditioning circuit 3.1, 3.2 and the received signal processing circuit 7.1, 7.2 of the two channels, as explained in the first embodiment example. Furthermore, the input-side plug-in sockets 19 and output-side plug-in sockets 20 for the respective connection cables of the signal transmission apparatus are again mounted and electrically connected on the base printed circuit board 15. The lower part of the housing shown in FIG. 3 is omitted in FIGS. 7 and 8 for the sake of clarity.

[0068] In the second embodiment, instead of the frame printed circuit board 16 and cover printed circuit board 17, a one-piece cap printed circuit board 50 consisting of a thicker printed circuit board blank is provided, which has a circumferential frame flange 51 (analogous to the frame board 16 in the first embodiment) for laterally framing the circuit components 18 and a cover wall 52 (analogous to the cover board 17 in the first embodiment) for covering the circuit components 18 and the transfer rods 10.

[0069] As can be seen in particular from FIG. 8, the frame flange 51 delimits four larger recesses 53, 54, 55, 56 in the cap printed circuit board 50, the outline and height of which above the cover wall 52 is adapted to the mounting space of the electronic components 18 on the base printed circuit board 15 in such a manner that the circuits 3.1, 3.2, 7.1, 7.2 are positioned therein. Accordingly, the cap printed circuit board 50 can be placed flat on the base printed circuit board 15 and positioned precisely via centering holes 57 in the base printed circuit board 15 and cap printed circuit board 50 to accommodate guide pins for congruent guidance during the manufacturing process, for example in mounting, soldering or testing apparatuses. The cap printed circuit board 15 is also provided with apertures 59, 60 to accommodate the potential-separating transformers 31, 32 located on the base printed circuit board 15. The cap printed circuit board 50 can be connected to the base printed circuit board 15 by soldering via metallized surfaces 58, metallized holes 58a and the edge metallization in the form of the metallic layers 39, 40.

[0070] In the second embodiment, the optical transmission paths 9.1, 9.2 with the two transfer rods 10.1, 10.2 are arranged in the frame flange 51 in the same manner as in the first embodiment in the frame plate 16, as can be seen from a comparison of FIGS. 4 and 5 on the one hand with FIGS. 9 to 11 on the other hand. In this respect, reference can be made to the description of the first embodiment in order to avoid repetition, wherein corresponding components are provided with identical reference signs. It is merely pointed out that the transfer rod 10 (in both embodiments) can be designed to be shorter and its ends 43, 44 are already positioned in front of the shields 13.1, 14.1, as shown dashed in FIG. 9.

[0071] The double shields 13, 14 mentioned in connection with FIGS. 1 and 2 are also implemented in the second embodiment, analogous to the first embodiment, on the base printed circuit board 15, on the frame flange 51 and on the cover wall 52 of the cap printed circuit board 50 by means of metallic layers 37 to 42, as explained with reference to FIGS. 3 to 5. Their positioning and function essentially correspond to those of the first and second embodiments, so that for the description of the shielding of the second embodiment, as shown in FIGS. 6 to 10, reference can again be made to the relevant explanations of the first embodiment, using identical reference signs for identical components. It is merely noted for the sake of good order thatas can be seen in FIG. 10the metallic layer 37 is applied to the upper side and the metallic layer 38 to the underside of the cover wall 52 of the cap printed circuit board 50. The metallic layers 39, 40 are arranged on the side edges 61, 62 of the frame flange 51, which run perpendicular to the main plane HE. The two metallic layers 41, 42 extend in the same manner in the base printed circuit board 15.

[0072] With regard to the vertical section according to FIG. 11, it should be noted that the latter shows the central region of the optical transmission path 9 with the transfer rod 10, the base printed circuit board 15 and the cap printed circuit board 50 in the second embodiment example, which, analogous to the first embodiment example, has no shielding surfaces for optimum electrical isolation between the receiver and transmitter.