Abstract
A component carrier including a stack having at least one electrically conductive layer structure and a plurality of electrically insulating layer structures. Methods are presented for manufacturing the component carrier where the at least one electrically conductive layer structure is arranged with a vertical connection structure continuously extending vertically through at least two of the plurality of electrically insulating layer structures.
Claims
1. A component carrier, comprising: a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures; wherein the at least one electrically conductive layer structure comprises a vertical connection structure continuously extending vertically through at least two of the plurality of electrically insulating layer structures.
2. The component carrier according to claim 1, wherein the at least one electrically conductive layer structure comprises at least one further vertical connection structure continuously extending vertically through at least two of said plurality of electrically conductive layer structures.
3. The component carrier according to claim 2, wherein the vertical connection structure and the further vertical connection structure are electrically connected with each other.
4. The component carrier according to claim 3, wherein the vertical connection structure and the further vertical connection structure comprise a different width.
5. The component carrier according to claim 2, wherein the vertical connection structure and the further vertical connection structure are offset one to each other along the stack thickness direction.
6. The component carrier according to claim 5, wherein the vertical connection structure, the further vertical connection structure and at least one further element of the at least one electrically conductive layer structure form a bifurcated electrically conductive network structure.
7. The component carrier according to claim 6, wherein the bifurcated electrically conductive network structure comprises at least two extremities on one side and one extremity at another, opposed, side.
8. The component carrier according to claim 7, wherein the bifurcated electrically conductive network structure comprises at least three extremities on one side and one extremity at another, opposed, side.
9. The component carrier according to claim 5, wherein at least two of the vertical connection structure, the further vertical connection structure, and the at least one further element are connected by one or more rectangular forms.
10. The component carrier according to claim 1, wherein the vertical connection structure is formed on or above a core layer structure.
11. The component carrier according to claim 1, wherein the vertical connection structure is formed in a coreless stack.
12. The component carrier according to claim 1, wherein a free end of the vertical connection structure is exposed with respect to one of the stack surfaces.
13. The component carrier according to claim 1, wherein the vertical connection structure is connected to a horizontal trace of the at least one electrically conductive layer structure.
14. The component carrier according to claim 13, wherein said trace is arranged at a vertical level in between vertical levels of opposing vertical ends of said vertical connection structure and/or said further vertical connection structure.
15. The component carrier according to claim 1, wherein the vertical connection structure is composed of at least two stacked sub-portions with an interface in between.
16. The component carrier according to claim 15, wherein a lateral misalignment between said continuously vertically extending sub-portions is so that the center lines of each sub-portion are positioned inside of a virtual circle of a diameter in a range from 2 m to 10 m.
17. The component carrier according to claim 1, wherein the vertical connection structure is made of a homogeneous material.
18. A method of manufacturing a component carrier, comprising: providing a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures; and forming the at least one electrically conductive layer structure with a vertical connection structure continuously extending vertically through at least two of said plurality of electrically insulating layer structures.
19. The method according to claim 18, further comprising: plating the vertical connection structure.
20. The method according to claim 18, further comprising: embedding, in particular by laminating, the at least one electrically conductive layer structure at least partially in at least one of the electrically insulating layer structures.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0078] The aspects defined above, and further aspects of the present disclosure are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.
[0079] FIG. 1A and FIG. 1B respectively show a component carrier according to an exemplary embodiment.
[0080] FIG. 2 shows a conventional circuit board.
[0081] FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H, FIG. 3I, FIG. 3J, and FIG. 3K show a first method of manufacturing a component carrier according to an exemplary embodiment.
[0082] FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H, FIG. 4I, FIG. 4J, and FIG. 4K show a second method of manufacturing a component carrier according to an exemplary embodiment.
[0083] FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, FIG. 5F, FIG. 5G, FIG. 5H, FIG. 5I, FIG. 5J, and FIG. 5K show a third method of manufacturing a component carrier according to an exemplary embodiment.
DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
[0084] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.
[0085] FIG. 1A and FIG. 1B respectively show a component carrier 100 according to an exemplary embodiment of the present disclosure.
[0086] As illustrated in FIG. 1A the component carrier 100 comprises a stack 101 having a plurality of electrically conductive layer structures 104 and a plurality of electrically insulating layer structures 102. The at least one electrically conductive layer structure 104 comprises a plurality of vertical connection structures 150, 151 that continuously extend vertically through a plurality of the electrically insulating layer structures 102 and comprise (substantially) continuous sidewalls, respectively. The vertical connection structures 150 are formed as pillars and are made of a homogeneous material, for example a plated metal such as copper.
[0087] The stack 101 comprises a core layer structure 103 with a vertical through-connection 155, which is electrically connected at the top and the bottom side to a respective vertical connection structure 150. Hereby, the vertical connection structures 150 respectively comprise a larger (or smaller) width than the vertical through connection 155. Above and below the core layer structure 103, there are arranged (symmetrically) the plurality of electrically insulating layer structures 102, through which the vertical connection structures 150 extend up to a respective layer stack/component carrier main surface, also through an outer layer 108, e.g. a surface finish or a solder resist. At the main surface, the vertical connection structures 150 respectively terminate with an exposed free end 156 (with respect to one of the stack surfaces). The exposed free end 156 is flush with the main surface of the component carrier. Additionally and/or alternatively, the exposed free end 156 may protrude out and/or be indented in the main surface of the component carrier (not shown).
[0088] Further electrically conductive layer structures 104 are arranged in between (in particular embedded) the electrically insulating layer structures 102 and are illustrated in FIG. 1A as metal pads between the vertical connection structures 150. Alternatively, there may be some portions inside the component carrier 100, which are free from further electrically conductive layer structures 104 arranged in between the electrically insulating layer structures 102 (not shown). The electrically conductive layer structure 104 further comprises a further vertical connection structure 151 continuously extending vertically through a plurality of said plurality of electrically conductive layer structures 102, in this example the vertical connection structure 150 and the further vertical connection structure 151 are oriented in parallel and (offset one to each other along the stack thickness direction z). In this example, the terms vertical connection structure 150 and the further vertical connection structure 151 can be exchangeable.
[0089] The vertical connection structure 150 is connected to a horizontal trace 134 of the electrically conductive layer structure 104 (which trace 134 extends in the horizontal direction in between the vertical connection structures 150 and forms part of a discontinuous electrically conductive layer structure. Said trace 134 is arranged at a vertical level in between vertical levels of opposing sub-portions 131, 132 of the vertical connection structure 150.
[0090] Additionally or alternatively, the vertical connection structure 150 is composed of the at least two stacked sub-portions 131, 132 with an interface 133 in between, wherein said interface 133, being an interface surface, is at the same vertical level as an interface between two adjacent electrically insulating layer structures 102. In the present example, the trace 134 and the interface 133 can be arranged at a similar location.
[0091] A lateral misalignment between said continuously vertically extending sub-portions 131, 132 is so that the center lines of each sub-portion 131, 132 are positioned inside of a virtual circle of a diameter not more than 5 m. Further, lateral steps between the adjacent sub-portions 131, 132 of the continuously vertically extending connection structure 150 are below 2 m.
[0092] It can be further seen that a part of the upper continuously vertically extending sub-portions 132 extends (protrudes) partially into the core layer structure 103. The protruding part can be for example an embedded metal trace inside the core material. Such a structure can be a relic from the manufacturing process and can be formed by a two-step process of drilling and plating. Such a structure can also be formed on purpose, e.g., to enhance stability. Furthermore, as can be seen by FIG. 1A and FIG. 1B, at least two, in particular a plurality, of electrically insulating layer structures 102, 112 are in direct contact with at least two, in particular four, side wall (portions) of the vertical connection structure 150 and/or the further vertical connection structure 151. FIG. 1B shows two component carriers 100 according to a further exemplary embodiment of the present disclosure. Both component carriers 100 have been manufactured on a temporary carrier (see FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H, FIG. 4I, FIG. 4J, FIG. 4K and FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, FIG. 5F, FIG. 5G, FIG. 5H, FIG. 5I, FIG. 5J, FIG. 5K), in particular on the two opposed main surfaces of the temporary carrier. Thus, in comparison to the example of FIG. 1A, the layer stacks 101 are not arranged (and formed) on the opposed main surfaces of a core layer structure 103 but on the temporary carrier.
[0093] FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H, FIG. 3I, FIG. 3J, and FIG. 3K show a first method of manufacturing a component carrier 100, which includes a core layer structure 103, according to an exemplary embodiment of the present disclosure.
[0094] As illustrated in FIG. 3A there is provided the core layer structure 103 (e.g., a fully cured (reinforced) resin or inorganic structure) with a vertical through-connection 155 (a filled through via). On the upper main surface and the lower main surface of the core layer structure 103, there is arranged respectively an electrically conductive layer structure 104, for example formed by patterning a continuous electrically conductive layer. It can be seen that some of the electrically conductive layer structures 104 comprise a larger width (in the horizontal direction) than others. The electrically conductive layer structure can be provided by (copper) plating.
[0095] As shown in FIG. 3B the above-mentioned electrically conductive layer structures 104 with a larger width are enlarged in the vertical direction by providing further electrically conductive material on top, e.g. by plating. Plating can be done according to established procedures, for example including providing a mask, development of the mask, plating, stripping of the mask etc. Thereby, the vertical connections structures 150 and the further vertical connection structures 151 are formed.
[0096] As illustrated in FIG. 3C the electrically conductive layer structures 104 at the upper and lower main surface of the core layer structure 103 are fully embedded (e.g., by lamination) in an electrically insulating material 102, e.g., an organic material, preferably glass reinforced, such as ABF (organic resins+glass spheres) as well as prepreg (organic resins+glass fabrics) as well as pure resin systems (organic resins only) or photoimageable dielectric material.
[0097] As shown in FIG. 3D a part of the electrically insulating material 102 is removed (e.g., by grinding or etching (e.g., by dry etching, in particular plasma etching) to thereby expose the upper surfaces of the electrically conductive layer structures 104 that are formed as the vertical connection structures 150 and the further vertical connection structures 151. The roughness of the vertical connection structures 150 and the further vertical connection structures 151 can be increased in this process. This measure can ensure a higher level of connection to the plating on topas there is more surface to be connected.
[0098] As illustrated in FIG. 3E a second electrically conductive layer structure 114 is arranged on the electrically insulating material/layer structure 102, so that a portion of the first electrically conductive layer structure 104 (in the form of metal traces) is covered in the vertical direction. Hereby, the second electrically conductive layer structure 114 is offset with respect to the vertical connection structures 150 and the further vertical connection structures 151. The second electrically conductive layer structure 114 can be formed for example by a patterned foil or by plating.
[0099] As shown in FIG. 3F the vertical connection structures 150 and the further vertical connection structures 151 are further enlarged in the vertical direction by further electrically conductive material, e.g., by plating, so that they are higher in the vertical direction z than the second electrically conductive layer structures 114.
[0100] As illustrated in FIG. 3G the second electrically conductive layer structures 114 and the enlarged vertical connection structures 150 and the further vertical connection structures 151 at the upper and lower main surface of the core layer structure 103 are fully embedded (encapsulated) or molded in a second electrically insulating material 112.
[0101] As shown in FIG. 3H a part of the second electrically insulating material 112 is removed (e.g., by grinding or etching (see above)) to thereby expose only the upper surfaces of the vertical connection structures 150 and the further vertical connection structures 151.
[0102] As illustrated in FIG. 3I a third electrically conductive layer structure 124 is arranged on the second electrically insulating material/layer structure 112, so that a portion of the second electrically conductive layer structure 114 (in the form of metal traces) is covered in the vertical direction. In this step, also the vertical connection structures 150 and the further vertical connection structures 151 are enlarged to the same height as the metal traces (by plating). Usually, every plating sequence (also within one plating step if pulse plating is applied) one can see a kind of layer structure. Thus, the enlargement by plating can be reflected in the final product by such plating layer structures.
[0103] As shown in FIG. 3J an outer layer 108 (e.g., a solder resist) is arranged between the vertical connection structures 150, the further vertical connection structures 151, and the metal traces of the third electrically conductive layer structure 124, but so that the surfaces of said structures 124, 150, 151 are still exposed.
[0104] As illustrated in FIG. 3K an electronic component 180 (e.g., a semiconductor element) is mounted on top of the upper main surface of the final component carrier 100. An electric connection (here solder-balls) 181 is provided between the free (exposed) ends 156 of each of the vertical connection structures 150, 151 and the electronic component 180, respectively, so that an electric connection between the layer stack 101 and the electronic component 180 is established.
[0105] FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H, FIG. 4I, FIG. 4J, and FIG. 4K show a second method of manufacturing a component carrier 100 according to an exemplary embodiment of the present disclosure.
[0106] The steps in FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H and FIG. 4I are comparable to those described for FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H, FIG. 3I, FIG. 3J, and FIG. 3K, with the difference being that a temporary carrier 170 is used instead of a core layer structure 103 as a support during the layer build-up. While in the example of FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F, FIG. 3G, FIG. 3H, FIG. 3I, FIG. 3J, and FIG. 3K layer stacks are build-up directly above and below the core layer structure 103, in the example of FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, FIG. 4G, FIG. 4H and FIG. 4I, the layer stacks are arranged only temporarily on the temporary carrier 170.
[0107] As illustrated in FIG. 4J the temporary carrier 170 is removed and two separate component carriers 100 are provided (see also FIG. 1B). Since there is no core layer structure 103, the vertical connection structures 150, 151 are through-connections that electrically connect the upper main surface to the lower main surface and continuously extend through the complete respective stack 101 (in the vertical direction). Further possible process steps can include, e.g., providing a surface finish (see specification above).
[0108] As shown in FIG. 4K, like in the example of FIG. 3K, an electronic component 180 is mounted on the final component carrier 100 (in the present example there are two final component carriers 100) and is electrically connected to the vertical connection structures 150, 151. At the lower main surfaces of the component carriers 100, there remain free (exposed) ends 156 of the vertical connection structures 150, 151.
[0109] FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, FIG. 5F, FIG. 5G, FIG. 5H, FIG. 5I, FIG. 5J, and FIG. 5K show a third method of manufacturing a component carrier 100 according to an exemplary embodiment of the present disclosure.
[0110] FIG. 5A, FIG. 5B, FIG. 5C, and FIG. 5D are comparable to the examples described for FIG. 4A, FIG. 4B, FIG. 4C, and FIG. 4D, respectively. However, the difference being that the vertical connection structures 150, 151 at the upper main surface of the temporary carrier 170 and those at the lower main surface of the temporary carrier 170 are not arranged one above the other in the vertical direction (z) but are instead offset in the vertical direction with respect to each other. The same holds also true for the metal traces of the electrically conductive layer structures 104.
[0111] As illustrated in FIG. 5E a second electrically conductive layer structure 114 is formed on top of the electrically insulating material 102. Hereby, said second electrically conductive layer structure 114 does not only comprise the above-described metal traces but also a significantly longer (in the horizontal direction) metal trace, here termed further element 105. Said further element 105 is formed on and electrically connected to the free end 156 of the vertical connection structure 150 (on the upper and the lower main surface of the temporary carrier 170, respectively).
[0112] As shown in FIG. 5F the vertical connection structures 150 are further built or constructed by electrically conductive material (e.g., by plating). With respect to the further element 105, at the extremities (in the horizontal direction) of the further element 105, the electrically conductive material is provided so that two further vertical connection structures 151 are formed. In other words, there is formed a bifurcated electrically conductive network 106 with the original vertical connection structure 150 in the middle, and two further vertical connection structures 151 to the left and right side (in the horizontal direction) of the vertical connection structure 150. Said two further vertical connection structures 151 are connected to the vertical connection structure 150 in a rectangular manner, i.e., the further element 105 or horizontal metal trace is arranged in an angle of 90 with respect to the vertical connection structure 150, while the two further vertical connection structures 151 are respectively connected to the further element 105 metal trace in a further angle of 90 (thereby forming a trident shape).
[0113] The bifurcated structure is bifurcated along one of the axis, but it can for example be also in the orthogonal direction with other two connections in a form of a cross or even a star with six connections etc. The left side further element 105 and the right side further element 105 may have the same thickness or a different thickness. Further element 105 can also bear a different thickness of when is part of a Power Distribution Network (PDN), e.g., where a thicker copper is required to transport higher level of currents.
[0114] As illustrated in FIG. 5G the enlarged vertical connection structures 150, 151 and the network structure 106 are fully embedded or molded in a second electrically insulating material 112, e.g. a prepreg.
[0115] As shown in FIG. 5H a part of the second a part of the second electrically insulating material 112 is removed (e.g., by grinding or etching) to thereby expose only the upper surfaces of the vertical connection structures 150 and the further vertical connection structures 151 (including the network structure 106).
[0116] As illustrated in FIG. 5I a third electrically conductive layer structure 124 is arranged on the second electrically insulating material/layer structure 112, so that a portion of the second electrically conductive layer structure 114 (in the form of metal traces) is covered in the vertical direction. In this step, also the vertical connection structures 150 and the further vertical connection structures 151 are enlarged to the same vertical height as the metal traces of the third electrically conductive layer structure 124.
[0117] As shown in FIG. 5J the temporary carrier 170 is removed, so that two final component carriers 100 can be provided. Before (or after) separation, an outer layer 108 (e.g., a solder resist) is formed on the outer main surface. In particular, three structures can be identified in the final component carriers 100: i) the vertical connection structures 150 continuously extending through the whole layer stack vertically; ii) the bifurcated network structure 106 in form of a trident, with vertical connection structure 150 in the middle/center, the further vertical connection structures 151 to the left and right side, and the further element 105 as a horizontal connection metal trace; and iii) further metal structures (traces) 107 of the electrically conductive layer structure 104 and/or the third electrically conductive layer structure 124, wherein a portion of said metal structures 107 is located below the further element 105 (of the network structure 106) in the vertical direction. Another portion of the metal structures 107 is located between the vertical connection structure 150 and the further vertical connection structure 151 of the network structure 106. At least two sides of these smaller electrically conductive structures 107 between the vertical connection structures 150, 151 face sides of the vertical connection structure 150 and/or the bifurcated electrically conductive network structure 106.
[0118] As illustrated in FIG. 5K, like in the examples of FIG. 3K and FIG. 4K, an electronic component 180a, 180b is mounted on the final component carrier 100 (in the present example there are two final component carriers 100) and electrically coupled at connections or bumps 181a, 181b to the vertical connection structures 150, 151. At the lower main surfaces of the component carriers 100, there remain free (exposed) ends 156 of the vertical connection structures 150, 151. In this example, due to the network structure 106, a complex (yet design-flexible) electrical connection (e.g., a circuit/power network) is enabled. It can be further seen that the distance (bump pitch) between the electric connections (solder bumps) 181 of the left side of the electronic component 180 is larger than at the right side of the electronic component 180.
[0119] It should be noted that the term comprising does not exclude other elements or steps and the article a or an does not exclude a plurality. Also, elements described in association with different embodiments may be combined.
[0120] Implementation of the disclosure is not limited to the preferred embodiments shown in the figures described above. Instead, a multiplicity of variants are possible which variants use the solutions shown and the principle according to the disclosure even in the case of fundamentally different embodiments.
REFERENCE SIGNS
[0121] 100 Component carrier [0122] 101 Stack [0123] 102 Electrically insulating layer structure(s) [0124] 103 Core layer structure [0125] 104 Electrically conductive layer structure [0126] 105 Further element, horizontal trace [0127] 106 Bifurcated electrically conductive network [0128] 108 Outer layer, e.g. surface finish, solder resist [0129] 112 Electrically insulating layer structure (second layer) [0130] 114 Electrically conductive layer structure (second layer) [0131] 124 Electrically conductive layer structure (third layer) [0132] 131 First sub-portion [0133] 132 Second sub-portion [0134] 133 Interface [0135] 134 Horizontal trace [0136] 150 Vertical connection structure [0137] 151 Further vertical connection structure [0138] 155 Vertical through-connection [0139] 156 Free end [0140] 170 Temporary carrier [0141] 180 Electronic component [0142] 181 Electrical connection, bump
